CN201327844Y

CN201327844Y - Package structure of surface-mount LED module

Info

Publication number: CN201327844Y
Application number: CNU2008202173753U
Authority: CN
Inventors: 彭明春; 陈勇; 汤永长
Original assignee: SUZHOU GOTEK OPTRONICS TECHNOLOGY Co Ltd
Current assignee: SUZHOU GOTEK OPTRONICS TECHNOLOGY Co Ltd
Priority date: 2008-12-02
Filing date: 2008-12-02
Publication date: 2009-10-14
Anticipated expiration: 2018-12-02

Abstract

The utility model provides a package structure of a surface-mount LED module. A line and a bonding pad are printed on an aluminum nitride ceramic base plate, an LED chip is directly bonded on the front surface of the aluminum nitride ceramic base plate, and the LED chip and the aluminum nitride ceramic base plate are electrically connected through a metal wire; a metal base is covered at the periphery of the LED chip, the entire surface of the metal base is plated with silver lustre coating, a glass lens is covered on the metal base, and the cavity formed by the glass lens and the metal base is filled with transparent silicone. When working, the LED chip gives off blue light to stimulate fluorescent agent to give off white light; the silver lustre coating plated on the entire surface of the metal base is used for reflecting the light given off by the LED chip, reducing the light absorption, and gathering and emitting white light through the glass lens. The LED has good dissipation effect, thereby improving the reliability and increasing the light-energy conversion rate of the LED. The package structure has simple structure, which is easy to be produced on a large scale.

Description

Surface mount LED module package structure

Technical field

The utility model relates to a kind of surface mount LED module package structure.

Background technology

Progressively exploitation is ripe for LED crystal grain, but it is not well developed all the time and uses; Trace it to its cause, in a subject matter of application facet be: its encapsulating structure is subjected to the restriction of the heat dispersion and the electrical property of material.

At present, general encapsulating structure is to be based upon on the printed circuit substrate, and common printed wiring board can't further improve on heat conductivility, and the high density of power-limiting led chip is integrated.On the traditional structure, the luminous energy that LED sends has been absorbed a loss part on self internal structure; The light that sends is not assembled concentrated, causes other light scattering losses.

Summary of the invention

The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of surface mount LED module package structure is provided.

The purpose of this utility model is achieved through the following technical solutions:

Surface mount LED module package structure, characteristics are: be printed with circuit and pad on the aluminium nitride ceramics substrate, led chip directly is bonded in the front of aluminium nitride ceramics substrate, by gold thread led chip and aluminium nitride ceramics substrate is electrically connected; Be stamped metab at the led chip periphery, the full electroplating surface silver lustre of metab layer is stamped glass lens on metab, fills transparent silica gel in glass lens and the formed chamber of metab.

Further, above-mentioned surface mount LED module package structure, the baseplane of described glass lens scribbles fluorescer.

The substantive distinguishing features of technical solutions of the utility model and progressive being mainly reflected in:

Substrate is an aluminium nitride ceramics material, and thermal conductivity is good, and led chip directly is bonded on the aluminium nitride ceramics substrate body; Send blue light during led chip work, white light is sent in the fluorescence excitation agent; The full surface plating of metab silver lustre, the light that the reflection led chip sends reduces light and is absorbed, and converges the ejaculation white light by glass lens.Its LED good heat dissipation effect has improved reliability, promotes the light energy use efficiency of LED, has reduced designing requirement, and change is simple, expands easily, is convenient to standardized designs, and follow-up simple and convenient assembly is easy to large-scale production, and market prospects are wide.

Description of drawings

Below in conjunction with accompanying drawing technical solutions of the utility model are described further:

Fig. 1: structural representation of the present utility model.

The implication of each Reference numeral sees the following form among the figure:

Reference numeral	Implication	Reference numeral	Implication	Reference numeral	Implication
Reference numeral	Implication	Reference numeral	Implication	Reference numeral	Implication	1	The aluminium nitride ceramics substrate	2	Metab	3	Glass lens
4	Led chip	5	Gold thread	6	Transparent silica gel	1	The aluminium nitride ceramics substrate	2	Metab	3	Glass lens

Embodiment

Surface mount LED module package structure is printed with circuit and pad on aluminium nitride ceramics substrate 1 as shown in Figure 1, and led chip 4 directly is bonded in the front of aluminium nitride ceramics substrate 1, and the plurality of LEDs chip can bond; By welding gold thread 5 led chip 4 and aluminium nitride ceramics substrate 1 electrode are electrically connected; Be stamped metab 2 at led chip 4 peripheries, metab 2 is fixing with aluminium nitride ceramics substrate 1 bonding, metab 2 full electroplating surface silver lustre layers, metab 2 end faces have the depression cushion cap, glass lens 3 is embedded on the depression cushion cap of metab 2, the baseplane of glass lens 3 scribbles fluorescer, and thermolysis can be provided, and inner silver coating plays the reflection ray effect; In glass lens 3 and metab 2 formed chambers, fill transparent silica gel 6, and play the effect of adhesive glass lens 3.The back up pad of aluminium nitride ceramics substrate 1 provides follow-up SMT technological requirement function.Send blue light during led chip 4 work, white light is sent in the fluorescence excitation agent; Metab 2 full surface plating silver lustres, the light that reflection led chip 4 sends reduces light and is absorbed, and converges the ejaculation white light by glass lens 3.Its LED radiating effect is fast, and volume is little, and good reliability is easy to assembly, is convenient to standardized designs, is beneficial to large-scale production.

The substrate of above-mentioned surface mount LED module package structure is aluminium nitride ceramics substrate (ALN), and material is high heat conduction aluminium nitride ceramics (conductive coefficient is 170W/mK, 25 ℃), and thermal conductivity is better; Upper and lower surface printed circuit and pad provide the electric circuit function.Metab 2 materials are fine copper, the electroplating surface silver lustre, and its internal structure design adds the conical reflecting face, the light that led chip 4 is sent is transmitted into the top as far as possible; Select copper material for use, can play good heat radiating function; Its end face depression suspended deck structure plays the effect of Locating Glass lens 3.Fluorescer on glass lens 3 coated on bottom side, the blue light that sends from led chip 4 arrives on the glass lens 3 bottom surface fluorescers, and white light is sent in the fluorescence excitation agent; White light pools certain angle by glass lens 3 to be launched, to reduce the effect of light scattering.Transparent silica gel 6 has been filled in metab 2 inside, squeezes inner residual air, has completely cut off steam and dust; Led chip 4 and external environment condition are completely cut off separate, improve job stability and reliability; Transparent silica gel 6 body light transmissions are better, and play the glass lens effect that is bonding to; Simple for structure, technology is simple.

In sum, the utility model structure uniqueness, the LED good heat dissipation effect, good reliability can significantly promote the light transfer ratio of LED, and volume is little, and production process is simple.Compare with the traditional handicraft structure, reduced designing requirement, change is simple, expands easily, is convenient to standardized designs, is beneficial to large-scale production, has brought very good economic benefit to production application.

What need understand is: though the foregoing description is to the utility model detailed explanation of contrasting; but these explanations are just illustrative to the utility model; rather than to restriction of the present utility model; any innovation and creation that do not exceed in the utility model connotation all fall in the protection range of the present utility model.

Claims

1. surface mount LED module package structure, it is characterized in that: on aluminium nitride ceramics substrate (1), be printed with circuit and pad, led chip (4) directly is bonded in the front of aluminium nitride ceramics substrate (1), by gold thread (5) led chip (4) and aluminium nitride ceramics substrate (1) is electrically connected; Be stamped metab (2) at led chip (4) periphery, the full electroplating surface silver lustre layer of metab (2) is stamped glass lens (3) on metab (2), fill transparent silica gel (6) in glass lens (3) and the formed chamber of metab (2).

2. surface mount LED module package structure according to claim 1 is characterized in that: the baseplane of described glass lens (3) scribbles fluorescer.