CN103165807A - Light-emitting diode (LED) light emitting module and manufacturing method thereof - Google Patents
Light-emitting diode (LED) light emitting module and manufacturing method thereof Download PDFInfo
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- CN103165807A CN103165807A CN2013100994690A CN201310099469A CN103165807A CN 103165807 A CN103165807 A CN 103165807A CN 2013100994690 A CN2013100994690 A CN 2013100994690A CN 201310099469 A CN201310099469 A CN 201310099469A CN 103165807 A CN103165807 A CN 103165807A
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- installing zone
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- emitting module
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Abstract
The invention relates to the technical field of lamps, in particular to a light-emitting diode (LED) light emitting module and a manufacturing method thereof. The LED light emitting module comprises a radiator and LED chips; an installation area is arranged on the radiator in advance; a positive electrode patch and a negative electrode patch are arranged in the installation area; the LED chips are arranged in the installation area, and positive electrode pins of the LED chips are connected with the positive electrode patches; and negative electrode pins of the LED chips are connected with the negative electrode patches. The manufacturing method for the LED light emitting module comprises the following steps of: arranging the installation area on the radiator in advance; arranging the positive electrode patch and the negative electrode patch in the installation area; arranging the LED chips in the installation area; connecting the positive electrode pins of the LED chips and the positive electrode patches; and connecting the negative electrode pins of the LED chips and the negative electrode patches. By the provided LED light emitting module and the provided manufacturing method for the LED light emitting module, the radiation efficiency of the LED light emitting module can be improved.
Description
Technical field
The present invention relates to technical field of lamps, in particular to LED light emitting module and preparation method thereof.
Background technology
The LED light emitting module is the luminous component of LED light fixture.
In correlation technique, the LED light emitting module comprises LED light source assembly and heat sink assembly, and described LED light source assembly is comprised of aluminium base and the LED chip that is welded on aluminium base.Described aluminium base is bonded on radiator by heat-conducting glue.When the LED chip electrified light emitting, follow that LED chip is luminous can produce a large amount of heat, if the heat that produces in time can not be dissipated useful life that will affect light emitting module and the brightness of light emitting module.
But at first the heat that produces on the LED chip in correlation technique is delivered to aluminium base, then is delivered on heat sink assembly by heat-conducting glue and dispels the heat, and causes the radiating efficiency of LED light emitting module lower.
Summary of the invention
The object of the present invention is to provide LED light emitting module and preparation method thereof, to solve the above problems.
A kind of LED light emitting module is provided in an embodiment of the present invention, has comprised: radiator and LED chip;
Be preset with installing zone on described radiator; Be provided with positive electrode paster and negative electrode paster in described installing zone;
Described LED chip is arranged in described installing zone, and the anodal pin of described LED chip is connected with described positive electrode paster, and the negative pole pin of described LED chip is connected with described negative electrode paster.
The manufacture method of LED light emitting module is characterized in that, comprising:
Default installing zone on radiator;
Positive electrode paster and negative electrode paster are set in described installing zone;
LED chip is arranged in described installing zone, and the anodal pin of described LED chip is connected with described positive electrode paster, the negative pole pin of described LED chip is connected with described negative electrode paster.
LED light emitting module by above-described embodiment and preparation method thereof, LED chip is arranged in the default installing zone of radiator, be that LED chip is set directly on radiator, and be provided with positive electrode paster and negative electrode paster on radiator, and the anodal pin of LED chip is connected with the positive electrode paster, the negative pole pin of LED chip is connected with the negative electrode paster, by positive electrode paster and negative electrode paster, LED chip is connected with power supply, and then makes LED chip work luminous.Because LED chip is set directly on radiator, the heat that produces when LED chip work is luminous can directly dissipate by radiator, overcome the lower technical problem of radiating efficiency of LED light emitting module in the correlation technique, and then can make LED light emitting module of the invention process and the radiating efficiency of the LED light emitting module that makes by the LED light emitting module manufacture method that the embodiment of the present invention provides improves.
Description of drawings
Fig. 1 shows the vertical view of the LED light emitting module of the embodiment of the present invention 1;
Fig. 2 shows the structural representation of the embodiment of the present invention 2 radiators;
Fig. 3 shows the vertical view that the embodiment of the present invention 2 radiators, positive electrode paster, negative electrode paster and box dam wall cooperatively interact;
Fig. 4 shows the structure vertical view of the LED light emitting module of the embodiment of the present invention 2;
Fig. 5 is the flow chart of the LED light emitting module manufacture method of the embodiment of the present invention 3.
Description of drawings: 1-radiator, 2-positive electrode paster, 3-negative electrode paster, 4-box dam wall, 5-installing zone, 6-LED chip.
Embodiment
Also by reference to the accompanying drawings the present invention is described in further detail below by specific embodiment.
The embodiment of the present invention 1 provides a kind of LED light emitting module, and as shown in Figure 1, primary structure comprises: comprising: radiator 1 and LED chip 6;
Wherein LED is the abbreviation of Light Emitting Diode, and the Chinese meaning is light-emitting diode.
Be preset with installing zone 5 on radiator 1; Be provided with positive electrode paster 2 and negative electrode paster 3 in installing zone 5;
Find out by above structural design, LED chip 6 is arranged in the default installing zone 5 of radiator 1, be that LED chip 6 is set directly on radiator 1, and be provided with positive electrode paster 2 and negative electrode paster 3 on radiator 1, and the anodal pin of LED chip 6 is connected with positive electrode paster 2, the negative pole pin of LED chip 6 is connected with negative electrode paster 3, by positive electrode paster 2 and negative electrode paster 3, LED chip 6 is connected with power supply, and then makes LED chip 6 work luminous.Because LED chip 6 is set directly on radiator 1, the heat that produces when LED chip 6 work is luminous can directly dissipate by radiator 1, overcome the lower technical problem of radiating efficiency of LED light emitting module in the correlation technique, and then the LED light emitting module radiating efficiency of this enforcement is improved.
The present embodiment 2 provides a kind of preferred embodiment of LED light emitting module on the basis of embodiment 1, as shown in Fig. 2 to 4, the primary structure of described LED light emitting module comprises: radiator 1 and LED chip 6;
As shown in Figure 2, be provided with a plurality of fin on radiator 1, a plurality of fin are arranged side by side, by a plurality of fin of arranging side by side increasing heat radiation area not only, and form the heat radiation that heat dissipation channel is accelerated radiator 1 between adjacent fin.
As shown in Figures 3 and 4, be preset with installing zone 5 on radiator 1, be arranged at intervals with positive electrode paster 2 and negative electrode paster 3 in installing zone 5;
Wherein positive electrode paster 2 can exchange with the position of negative electrode paster 3 on radiator 1.
Particularly, positive electrode paster 2 comprises: pcb board sheet and positive terminal pad; Described positive terminal pad is arranged on described pcb board sheet, and pcb board sheet and described radiator 1 are bonding.
in addition, evenness refers to the difference of highs and lows between wafer surface and datum plane, its numerical value is the smaller the better, in the present embodiment, the evenness of the installing zone 5 of radiator 1 is-0.001～+ 0.001 millimeter, wherein installing zone 5 is used for arranging LED chip 6, evenness by this installing zone 5 is set to-0.001～+ 0.001 millimeter and is conducive to LED chip 6 fixing at installing zone 5, and when the evenness of the installing zone 5 of radiator 1 is-0.001～+ 0.001 millimeter, can make installing zone 5 as bright as a sixpence, be conducive to improve the reflecting rate of this side, reduce light loss.
In order further to improve the reflecting rate for the side that LED chip 6 is installed of radiator 1, reduce light loss in addition, improve the luminance of LED chip 6, silver coated at the installing zone 5 of radiator 1.
As shown in Figures 3 and 4, be provided with box dam wall 4 around the edge of installing zone 5, and the box dam wall 4 that forms is closed form, for example box dam wall 4 be shaped as circular or oblong-shaped, in the present embodiment, box dam wall 4 is set to oblong-shaped.
As shown in Figures 3 and 4, LED chip 6 is arranged in installing zone 5, and the anodal pin of LED chip 6 is connected with positive electrode paster 2, and the negative pole pin of LED chip 6 is connected with negative electrode paster 3.LED chip 6 sticks in installing zone 5 by elargol particularly.
Also be coated with the silica gel packaging layer on LED chip 6, and the border of described silica gel packaging layer and box dam wall 4 join.
And be evenly distributed with fluorescent powder grain in the silica gel packaging layer, the light that LED chip 6 sends can excite the fluorescent powder grain that distributes in silica gel luminous, by LED chip 6 light that sends and the coordinating of light that fluorescent powder grain sends carrying out personalized design to the light that the LED light emitting module sends.
The present embodiment 3 provides a kind of manufacture method of LED light emitting module, and as shown in Figure 5, main treatment step comprises:
Step S31: default installing zone on radiator;
Step S32: positive electrode paster and negative electrode paster are set in described installing zone;
Step S33: LED chip is arranged in described installing zone, and the anodal pin of described LED chip is connected with described positive electrode paster, the negative pole pin of described LED chip is connected with described negative electrode paster.
The LED light emitting module radiating efficiency that manufacture method by the present embodiment LED light emitting module makes improves.
The present embodiment 4 provides a kind of preferred embodiment of manufacture method of LED light emitting module on the basis of embodiment 3, main treatment step comprises:
Step S41: make by stretched film and obtain radiator, default installing zone on the radiator that makes;
Step S42: the installing zone of radiator is carried out grinding and polishing, and the evenness that makes installing zone is-0.001～+ 0.001 millimeter.
Described described installing zone is carried out grinding and polishing, making its evenness is after-0.001～+ 0.001 millimeter, before the interval arranges positive electrode paster and negative electrode paster in described installing zone, further comprises: silver coating on described side.
Step S43: the interval arranges positive electrode paster and negative electrode paster in described installing zone;
Step S44: the edge around described installing zone arranges the box dam wall;
Step S45: LED chip is sticked in described installing zone by elargol, and the anodal pin of described LED chip is connected with described positive electrode paster, the negative pole pin of described LED chip is connected with described negative electrode paster.
Step S46: fill the silica gel that is mixed with fluorescent material in described installing zone, form the silica gel packaging layer, and be evenly distributed with fluorescent powder grain in the silica gel packaging layer that forms.Further, the silica gel packaging layer of formation covers described LED chip, and border and the described box dam wall of described silica gel packaging layer join simultaneously.
The above is only the preferred embodiments of the present invention, is not limited to the present invention, and for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a LED light emitting module, is characterized in that, comprising: radiator and LED chip;
Be preset with installing zone on described radiator; Be provided with positive electrode paster and negative electrode paster in described installing zone;
Described LED chip is arranged in described installing zone, and the anodal pin of described LED chip is connected with described positive electrode paster, and the negative pole pin of described LED chip is connected with described negative electrode paster.
2. LED light emitting module according to claim 1, is characterized in that, also comprises: the box dam wall;
Described box dam circummure is around the setting of the edge of described installing zone.
3. LED light emitting module according to claim 2, is characterized in that, also is coated with the silica gel packaging layer on described LED chip, and the border of described silica gel packaging layer and described box dam wall join.
4. LED light emitting module according to claim 1, is characterized in that, the evenness of the installing zone of described radiator is-0.001～+ 0.001 millimeter.
5. LED light emitting module according to claim 1, is characterized in that, the installing zone of described radiator is silver coated.
6. LED light emitting module according to claim 1, is characterized in that, described LED chip is arranged in described installing zone, comprising:
Described LED chip sticks in described installing zone by elargol.
7. LED light emitting module according to claim 1, is characterized in that, described positive electrode paster comprises: pcb board sheet and positive terminal pad;
Described positive terminal pad is arranged on described pcb board sheet, and described pcb board sheet and described radiator are bonding.
8. LED light emitting module according to claim 3, is characterized in that, is evenly distributed with fluorescent powder grain in described silica gel packaging layer.
9.LED the manufacture method of light emitting module is characterized in that, comprising:
Default installing zone on radiator;
Positive electrode paster and negative electrode paster are set in described installing zone;
LED chip is arranged in described installing zone, and the anodal pin of described LED chip is connected with described positive electrode paster, the negative pole pin of described LED chip is connected with described negative electrode paster.
10. method according to claim 9, is characterized in that, described positive electrode paster and negative electrode paster are set in described installing zone after, described be arranged on LED chip in described installing zone before, further comprise:
Edge around described installing zone arranges the box dam wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013100994690A CN103165807A (en) | 2013-03-26 | 2013-03-26 | Light-emitting diode (LED) light emitting module and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013100994690A CN103165807A (en) | 2013-03-26 | 2013-03-26 | Light-emitting diode (LED) light emitting module and manufacturing method thereof |
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| CN103165807A true CN103165807A (en) | 2013-06-19 |
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| CN2013100994690A Pending CN103165807A (en) | 2013-03-26 | 2013-03-26 | Light-emitting diode (LED) light emitting module and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107394032A (en) * | 2017-07-25 | 2017-11-24 | 湖南粤港模科实业有限公司 | Integrative packaging light source |
| CN112305408A (en) * | 2020-10-23 | 2021-02-02 | Tcl华星光电技术有限公司 | Light-emitting chip patch detection system and detection method thereof |
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| CN201327844Y (en) * | 2008-12-02 | 2009-10-14 | 苏州久腾光电科技有限公司 | Package structure of surface-mount LED module |
| US20120087125A1 (en) * | 2010-10-07 | 2012-04-12 | Foxconn Technology Co., Ltd. | Led lamp having light emitting diodes with reduced number of lenses covered thereon |
| CN102623617A (en) * | 2012-04-12 | 2012-08-01 | 广州市鸿利光电股份有限公司 | Chip on board (COB) aluminum substrate with high reflectivity and good heat dissipation performance and manufacturing process thereof |
| CN102903710A (en) * | 2012-10-31 | 2013-01-30 | 姜绍娜 | High-light-power-density ultraviolet ray LED (Light-emitting Diode) curing light source and preparation method thereof |
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2013
- 2013-03-26 CN CN2013100994690A patent/CN103165807A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201327844Y (en) * | 2008-12-02 | 2009-10-14 | 苏州久腾光电科技有限公司 | Package structure of surface-mount LED module |
| US20120087125A1 (en) * | 2010-10-07 | 2012-04-12 | Foxconn Technology Co., Ltd. | Led lamp having light emitting diodes with reduced number of lenses covered thereon |
| CN102623617A (en) * | 2012-04-12 | 2012-08-01 | 广州市鸿利光电股份有限公司 | Chip on board (COB) aluminum substrate with high reflectivity and good heat dissipation performance and manufacturing process thereof |
| CN102903710A (en) * | 2012-10-31 | 2013-01-30 | 姜绍娜 | High-light-power-density ultraviolet ray LED (Light-emitting Diode) curing light source and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107394032A (en) * | 2017-07-25 | 2017-11-24 | 湖南粤港模科实业有限公司 | Integrative packaging light source |
| CN107394032B (en) * | 2017-07-25 | 2023-07-11 | 湖南粤港模科实业有限公司 | Integrated packaged light source |
| CN112305408A (en) * | 2020-10-23 | 2021-02-02 | Tcl华星光电技术有限公司 | Light-emitting chip patch detection system and detection method thereof |
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Application publication date: 20130619 |