CN204857785U - Heat dissipation LED packaging structure - Google Patents
Heat dissipation LED packaging structure Download PDFInfo
- Publication number
- CN204857785U CN204857785U CN201520540111.1U CN201520540111U CN204857785U CN 204857785 U CN204857785 U CN 204857785U CN 201520540111 U CN201520540111 U CN 201520540111U CN 204857785 U CN204857785 U CN 204857785U
- Authority
- CN
- China
- Prior art keywords
- space
- extension
- heat
- silica gel
- radiating part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a heat dissipation LED packaging structure, including the base member, install the chip on this base member, be equipped with a plurality of through -holes that run through its upper and lower surface on this base member, the lower surface of this base member is equipped with the radiating part, is equipped with the heat dissipation space in this radiating part, and space and through -hole intercommunication should dispel the heat, LED packaging structure still includes extension, the extending direction of this extension and the plane bevel or the perpendicular setting at radiating part place, be equipped with the heat exchange space in this extension, this heat exchange space and heat dissipation space and outside intercommunication. The utility model discloses in, lead to radiating part, extension, the design of the portion of bending etc. Improved the radiating effect of chip greatly, also avoid impurity such as external rainwater to get into, through the design of a silica gel euphotic layer, second silica gel euphotic layer, phosphor powder etc. Can adjust LED packaging structure's luminous angle, enlarge the light emitting area, improve display quality.
Description
Technical field
The utility model relates to LED encapsulation structure technical field, particularly relates to a kind of cooling LED encapsulating structure.
Background technology
LED is called as forth generation light source, the significant progress that LED illumination technology has obtained, the raising of epitaxy technology makes the cost of LED chip greatly reduce, LED has and holds the superior quality come, such as luminous efficiency is high, bright, be the green light source of a new generation, LED has a extensive future illumination application.LED light source, have energy-conserving and environment-protective, safety, life-span length, low-power consumption, low-heat, high brightness, light beam concentrate, etc. feature, be applied in the fields such as various instruction, display, decoration, backlight, general lighting.
In Chinese Patent Application No.: disclose the encapsulation of a kind of cooling LED in CN201320715357.9; It comprises base, layer, insulating barrier and fin, base is fixed with layer, insulating barrier is fixed with at the two ends of layer, transparent mounting cover is provided with between insulating barrier, layer between two insulating barriers is fixed with LED, with corresponding to LED the bottom of base be provided with at least one elongated slot that Open Side Down, the fin of at least three is installed at each elongated slot internal fixtion.The heat of the chip of this technical scheme can not be discharged from radiating groove, and radiating effect is desirable not enough, needs further to be improved.
Utility model content
In order to solve the technical problem existed in background technology, the utility model proposes a kind of cooling LED encapsulating structure, good heat dissipation effect.
A kind of cooling LED encapsulating structure, comprise matrix, this matrix is provided with chip, this matrix is provided with some through holes running through its upper and lower surface;
The lower surface of this matrix is provided with radiating part, is provided with heat-dissipating space in this radiating part, and this heat-dissipating space is communicated with through hole;
LED encapsulation structure also comprises extension, the bearing of trend of this extension and the plane oblique or vertical at radiating part place, is equivalent to the size increasing radiating part if be arranged in parallel, also allows the impurity such as extraneous rainwater be more prone to enter heat-dissipating space simultaneously; Exchange heat space is provided with, this exchange heat space and heat-dissipating space and ft connection in this extension;
The heat that chip sends carries out exchange heat through through hole, heat-dissipating space, exchange heat space and the external world, realizes cross-ventilation, greatly improves heat dispersion and the radiating efficiency of LED encapsulation structure, extends its useful life.
By the design of extension, avoid the impurity such as extraneous rainwater directly to enter heat-dissipating space, ensure the result of use of chip.
Preferably, the quantity of this extension is 2, is distributed in the two ends of radiating part; The heat of the heat that chip sends is dispelled the heat by 2 extensions, improves radiating efficiency; Allow air enter from an extension, discharge from another extension, form exchange heat circulation, improve radiating efficiency; Certain extension quantity can also design more.
Preferably, the plane oblique at this extension and radiating part place, be convenient to like this air very smooth through exchange heat space enter heat-dissipating space, arc transition design is carried out in the junction of exchange heat space and heat-dissipating space, improve intake velocity; This extension is arranged to the direction away from chip away from one end of radiating part, such design can allow extraneous air enter heat-dissipating space very smoothly, can understand by reference to the accompanying drawings, if reverse design, can influence each other between 2 extensions, meanwhile, the sidewall of extension also stops outside air to enter exchange heat space smoothly.
Preferably, this extension is placed in the below of radiating part; According to such design, outside air enters on exchange heat space requirement and is advanced into heat-dissipating space, and the impurity such as the rainwater in air can be attached to exchange heat space, effectively avoids it to enter heat-dissipating space.
Preferably, LED encapsulation structure is established and is comprised bending part, and this bending part extends to the direction bending away from chip, and the bearing of trend of this bending part and the plane parallel at radiating part place or oblique are arranged;
Be provided with airspace in this bending part, this exchange heat space is by this airspace and ft connection; Enter exchange heat space for the ease of air, add bending part, also allow bending part by above-mentioned design, when specifically implementing, bending part and radiating part be arranged in parallel, and such outside air is convenient to enter exchange heat space through airspace simultaneously.
Preferably, this matrix is provided with the first silica gel photic zone, and this chip is placed in the space that the first silica gel photic zone and matrix formed, and the space that this through hole is formed with the first silica gel photic zone and matrix is communicated with; By the euphotic design of the first silica gel, can adjust the lighting angle of LED encapsulation structure, expand light-emitting area, improve display quality.
Preferably, this first silica gel photic zone is also provided with the second silica gel photic zone outward, is filled with fluorescent material between this first silica gel photic zone and the second silica gel photic zone; The first silica gel photic zone, the second silica gel photic zone can be allowed to become hemisphere to design; Increase by the second silica gel photic zone can adjust the lighting angle of LED encapsulation structure further; Simultaneously, if fluorescent material is directly coated in chip surface, heating that is easy and chip interferes with each other, fluorescent material easy sedimentation when applying, skewness on chip, and fluorescent material directly sticks the surface in LED chip, have a strong impact on LED light-out effect, fluorescent material is filled between the first silica gel photic zone and the second silica gel photic zone, form long-distance fluorescent powder, the problem that the heat generation density that can solve is large, not free settling.
In the utility model, the design of logical radiating part, extension, bending part etc., substantially increases the radiating effect of chip, also avoids the impurity such as extraneous rainwater to enter; By the design of a silica gel photic zone, the second silica gel photic zone, fluorescent material etc., the lighting angle of LED encapsulation structure can be adjusted, expand light-emitting area, improve display quality; Also avoid fluorescent material directly to contact with chip simultaneously and cause the problems such as heat generation density is large, free settling.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
It should be noted that, when not conflicting, the combination that the embodiment in the application and the feature in embodiment can be mutual; And the utility model is elaborated below with reference to the accompanying drawings in conjunction with the embodiments.
With reference to Fig. 1:
A kind of cooling LED encapsulating structure that the utility model proposes, comprises matrix 1, and this matrix 1 is provided with chip 2, and this matrix 1 is provided with some through holes 3 running through its upper and lower surface; Chip 2 can be arranged at the upper surface of matrix 1;
The lower surface of this matrix 1 is provided with radiating part 4, is provided with heat-dissipating space 5 in this radiating part 4, and this heat-dissipating space 5 is communicated with through hole 3;
LED encapsulation structure also comprises extension 6, the bearing of trend of this extension 6 and the plane oblique or vertical at radiating part 4 place, is equivalent to the size increasing radiating part 4 if be arranged in parallel, also allows the impurity such as extraneous rainwater be more prone to enter heat-dissipating space 5 simultaneously; Exchange heat space 7 is provided with, this exchange heat space 7 and heat-dissipating space 5 and ft connection in this extension 6;
The heat that chip 2 sends carries out exchange heat through through hole 3, heat-dissipating space 5, exchange heat space 6 with the external world, realizes cross-ventilation, greatly improves heat dispersion and the radiating efficiency of LED encapsulation structure, extends its useful life.
By the design of extension 6, avoid the impurity such as extraneous rainwater directly to enter heat-dissipating space 5, ensure the result of use of chip 2, life-span.
In order to improve radiating efficiency further, the quantity of this extension 6 is 2, is distributed in the two ends of radiating part 4; The heat of the heat that chip 2 sends is dispelled the heat by 2 extensions 6, improves radiating efficiency; Allow air enter from an extension 6, discharge from another extension 6, form exchange heat circulation, improve radiating efficiency; Certain extension 6 quantity can also design more.
In order to improve feed rate, the plane oblique at extension 6 and radiating part 4 place in the present embodiment, be convenient to like this air very smooth through exchange heat space 7 enter heat-dissipating space 5, arc transition design is carried out with the junction of heat-dissipating space 5 in exchange heat space 7, improves intake velocity; This extension 6 is arranged to the direction away from chip 2 away from one end of radiating part 4, such design can allow extraneous air enter heat-dissipating space 5 very smoothly, can understand by reference to the accompanying drawings, if reverse design, can influence each other between 2 extensions 6, meanwhile, the sidewall of extension 6 also stops outside air to enter exchange heat space 7 smoothly.
In order to stop impurity to enter, this extension 6 is placed in the below of radiating part 4; According to such design, outside air enters exchange heat space 7 to be needed to be advanced into heat-dissipating space 5, and the impurity such as the rainwater in air can be attached to exchange heat space 7, effectively avoid it to enter heat-dissipating space 5.
Enter heat-dissipating space 5 for the ease of outside air, LED encapsulation structure is established and is comprised bending part 8, and this bending part 8 extends to the direction bending away from chip 2, and the bearing of trend of this bending part 8 and the plane parallel at radiating part 4 place or oblique are arranged;
Be provided with airspace 9 in this bending part 8, this exchange heat space 7 is by this airspace 9 and ft connection; Exchange heat space 7 is entered for the ease of air, add bending part 8, also allow bending part 8 by above-mentioned design, in the present embodiment simultaneously, bending part 8 is arranged with the plane parallel at radiating part 4 place, and such outside air is convenient to enter exchange heat space 7, heat-dissipating space 5 through airspace 9.
In order to adjust the illumination effect of chip 2, this matrix 1 is provided with the first silica gel photic zone 10, and this chip 2 is placed in the space that the first silica gel photic zone 10 and matrix 1 formed, and the space that this through hole 3 is formed with the first silica gel photic zone 10 and matrix 1 is communicated with; By the design of the first silica gel photic zone 10, can adjust the lighting angle of LED encapsulation structure, expand light-emitting area, improve display quality.
This first silica gel photic zone 10 is outer is also provided with the second silica gel photic zone 11, is filled with fluorescent material 12 between this first silica gel photic zone 10 and second silica gel photic zone 11; The first silica gel photic zone 10, second silica gel photic zone 11 one-tenth hemispheres can be allowed to design; Increase by the second silica gel photic zone 11 can adjust the lighting angle of LED encapsulation structure further; Simultaneously, if fluorescent material 12 to be directly coated in chip 2 surface, heating that is easy and chip 2 interferes with each other, fluorescent material 12 easy sedimentation when applying, skewness on chip 2, and fluorescent material 12 directly sticks the surface in chip 2, have a strong impact on LED light-out effect, fluorescent material 12 is filled between the first silica gel photic zone 10 and the second silica gel photic zone 11, form long-distance fluorescent powder, the problem that the heat generation density that can solve is large, and not free settling.
The above; be only the utility model preferably embodiment; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; be equal to according to the technical solution of the utility model and utility model design thereof and replace or change, all should be encompassed within protection range of the present utility model.
Claims (7)
1. a cooling LED encapsulating structure, comprise matrix (1), this matrix (1) is provided with chip (2), it is characterized in that: this matrix (1) is provided with some through holes (3) running through its upper and lower surface;
The lower surface of this matrix (1) is provided with radiating part (4), is provided with heat-dissipating space (5) in this radiating part (4), and this heat-dissipating space (5) is communicated with through hole (3);
LED encapsulation structure also comprises extension (6), the bearing of trend of this extension (6) and the plane oblique or vertical at radiating part (4) place, exchange heat space (7) is provided with, this exchange heat space (7) and heat-dissipating space (5) and ft connection in this extension (6).
2. cooling LED encapsulating structure according to claim 1, is characterized in that: the quantity of this extension (6) is 2, is distributed in the two ends of radiating part (4).
3. cooling LED encapsulating structure according to claim 2, it is characterized in that: the plane oblique at this extension (6) and radiating part (4) place, this extension (6) is arranged to the direction away from chip (5) away from one end of radiating part (4).
4. the cooling LED encapsulating structure according to Claims 2 or 3, is characterized in that: this extension (6) is placed in the below of radiating part (4).
5. cooling LED encapsulating structure according to claim 1 and 2, it is characterized in that: LED encapsulation structure is established and comprised bending part (8), this bending part (8) extends to the direction bending away from chip (2), and the bearing of trend of this bending part (8) and the plane parallel at radiating part (4) place or oblique are arranged;
Be provided with airspace (9) in this bending part (8), this exchange heat space (7) is by this airspace (9) and ft connection.
6. cooling LED encapsulating structure according to claim 5, it is characterized in that: this matrix (1) is provided with the first silica gel photic zone (10), this chip (2) is placed in the space that the first silica gel photic zone (10) and matrix (1) formed, and the space that this through hole (3) is formed with the first silica gel photic zone (10) and matrix (1) is communicated with.
7. cooling LED encapsulating structure according to claim 6, it is characterized in that: this first silica gel photic zone (10) is also provided with the second silica gel photic zone (11) outward, between this first silica gel photic zone (10) and the second silica gel photic zone (11), be filled with fluorescent material (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520540111.1U CN204857785U (en) | 2015-07-22 | 2015-07-22 | Heat dissipation LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520540111.1U CN204857785U (en) | 2015-07-22 | 2015-07-22 | Heat dissipation LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204857785U true CN204857785U (en) | 2015-12-09 |
Family
ID=54748311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520540111.1U Expired - Fee Related CN204857785U (en) | 2015-07-22 | 2015-07-22 | Heat dissipation LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204857785U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105627225A (en) * | 2016-02-23 | 2016-06-01 | 繁昌县奉祥光电科技有限公司 | LED lamp with dual light sources |
| CN106299086A (en) * | 2016-09-30 | 2017-01-04 | 广州莱迪光电股份有限公司 | A kind of cooling LED encapsulating structure |
| CN106531873A (en) * | 2017-01-05 | 2017-03-22 | 中国计量大学 | LED packaging structure |
-
2015
- 2015-07-22 CN CN201520540111.1U patent/CN204857785U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105627225A (en) * | 2016-02-23 | 2016-06-01 | 繁昌县奉祥光电科技有限公司 | LED lamp with dual light sources |
| CN106299086A (en) * | 2016-09-30 | 2017-01-04 | 广州莱迪光电股份有限公司 | A kind of cooling LED encapsulating structure |
| CN106531873A (en) * | 2017-01-05 | 2017-03-22 | 中国计量大学 | LED packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204857785U (en) | Heat dissipation LED packaging structure | |
| CN203615150U (en) | Light-emitting diode (LED) lamp capable of improving lighting effect | |
| CN204857784U (en) | LED packaging structure convenient to heat dissipation | |
| CN208253403U (en) | A kind of solar LED Lawn lamp | |
| CN202708751U (en) | Uniform-light type light-emitting diode (LED) tube light | |
| CN205081143U (en) | Two -sided luminous UV encapsulation of LED stereoplasm base plate | |
| CN204806000U (en) | High life LED lamp | |
| CN204785723U (en) | LED lamp plate of copper cooling is applied in adoption | |
| CN101571268B (en) | High power LED lamp | |
| CN204651345U (en) | Package structure for LED | |
| CN202546401U (en) | Novel light emitting diode (LED) down light | |
| CN202332969U (en) | Novel LED (light-emitting diode) radiator | |
| CN108036243B (en) | LED ground lamp | |
| CN201448655U (en) | Light-emitting diode structure | |
| CN202188338U (en) | LED (light-emitting diode) lamp | |
| CN206207033U (en) | A kind of lateral direction light emission lamp bar | |
| CN204573674U (en) | LEDbulb lamp | |
| CN208298869U (en) | COB light source with heat dissipation base | |
| CN102635801A (en) | Novel LED (light-emitting diode) down lamp | |
| CN103515369B (en) | A kind of LED module substrate | |
| CN203010337U (en) | Light-emitting diode (LED) warhead candle bulb | |
| CN203260638U (en) | LED luminescent module | |
| CN201992496U (en) | Led mine lamp | |
| CN202487650U (en) | Novel surface mounted light-emitting diode (LED) with radiating fins | |
| CN207051622U (en) | A kind of backlight |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151209 Termination date: 20160722 |