CN204857784U - LED packaging structure convenient to heat dissipation - Google Patents
LED packaging structure convenient to heat dissipation Download PDFInfo
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- CN204857784U CN204857784U CN201520539062.XU CN201520539062U CN204857784U CN 204857784 U CN204857784 U CN 204857784U CN 201520539062 U CN201520539062 U CN 201520539062U CN 204857784 U CN204857784 U CN 204857784U
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- heat
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- dispel
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Abstract
The utility model discloses a LED packaging structure convenient to heat dissipation, including base member, chip, flexure strip, be equipped with hemispherical silica gel lens on this base member, this chip is arranged in the space of silica gel lens and base member formation, be equipped with the heat dissipation space in this base member, the heat dissipation is placed in the space to this flexure strip, and this flexure strip will dispel the heat the space and divide into a gas space, the 2nd gas space, and a gas space and space that the chip is located and exterior space feed through, be equipped with magnetostrictive thin film on this flexure strip, be equipped with the coil on this base member, the central line of this coil and the perpendicular or bevel in plane at magnetostrictive thin film place, this coil and external power supply electrical connection. The utility model discloses can dispel the heat to the chip, realize the air convection, greatly improve LED packaging structure's heat dispersion and radiating efficiency, prolong its life, can adjust the luminous angle of chip, enlarge the light emitting area, improve display quality.
Description
Technical field
The utility model relates to LED encapsulation structure technical field, particularly relates to a kind of LED encapsulation structure being convenient to dispel the heat.
Background technology
LED is called as forth generation light source, the significant progress that LED illumination technology has obtained, the raising of epitaxy technology makes the cost of LED chip greatly reduce, LED has and holds the superior quality come, such as luminous efficiency is high, bright, be the green light source of a new generation, LED has a extensive future illumination application.LED light source, have energy-conserving and environment-protective, safety, life-span length, low-power consumption, low-heat, high brightness, light beam concentrate, etc. feature, be applied in the fields such as various instruction, display, decoration, backlight, general lighting.
In Chinese Patent Application No.: disclose the encapsulation of a kind of cooling LED in CN201320715357.9; It comprises base, layer, insulating barrier and fin, base is fixed with layer, insulating barrier is fixed with at the two ends of layer, transparent mounting cover is provided with between insulating barrier, layer between two insulating barriers is fixed with LED, with corresponding to LED the bottom of base be provided with at least one elongated slot that Open Side Down, the fin of at least three is installed at each elongated slot internal fixtion.The heat of the chip of this technical scheme can not be discharged from radiating groove, and radiating effect is desirable not enough, needs further to be improved.
Utility model content
In order to solve the technical problem existed in background technology, the utility model proposes a kind of LED encapsulation structure being convenient to dispel the heat, good heat dissipation effect.
Be convenient to a LED encapsulation structure of dispelling the heat, comprise matrix, chip, flexure strip, this matrix is provided with hemispheric silica-gel lens, and this chip is placed in the space that silica-gel lens and matrix formed;
Be provided with heat-dissipating space in this matrix, this flexure strip is placed in heat-dissipating space, and heat-dissipating space is divided into first gas compartment, second gas compartment by this flexure strip, and this first gas compartment is communicated with space residing for chip and space outerpace;
This flexure strip is provided with magnetostrictive thin film, and this matrix is provided with coil, and the center line of this coil and the plane orthogonal at magnetostrictive thin film place or oblique, this coil is electrically connected with external power source.
Coil produces magnetic field when being energized, and magnetostrictive thin film drives flexure strip to deform under the action of a magnetic force, and when flexure strip is to lower process, in first gas compartment, pressure reduces, and space residing for chip and extraneous air enter in first gas compartment; When electric current is reverse, flexure strip upwardly, in first gas compartment, pressure increases, first gas space inside divides gas to enter space residing for chip, gas is discharged in addition, this makes it possible to dispel the heat to chip, realizes cross-ventilation, the heat dispersion of very big raising LED encapsulation structure and radiating efficiency, extend its useful life.
Silica-gel lens can adjust the lighting angle of chip, expands light-emitting area, improves display quality.
Preferably, this matrix is also provided with " U " type tube connector, this first gas compartment is by this tube connector and ft connection; Increasing " U " type tube connector avoids the impurity such as extraneous rainwater to enter space residing for chip, ensures result of use and the useful life of chip.
Preferably, this tube connector is provided with wind gathering plate, and this wind gathering plate is vertically arranged, and the surface of this wind gathering plate is provided with groove, and this groove is communicated with tube connector; The size design of wind gathering plate is a little bigger, be convenient to air like this and enter tube connector, when especially blowing, clearly, by increasing wind gathering plate, being convenient to extraneous a large amount of air and entering in first gas compartment through tube connector, being conducive to chip cooling; Multiple tube connector, wind gathering plate can be set, be placed in the different azimuth of matrix, facilitate air to enter like this, conveniently dispel the heat.
Preferably, this groove becomes dome shape to arrange, and the junction of this groove and tube connector is positioned on the center line of groove; According to above-mentioned design, be convenient to air and enter in tube connector.
Preferably, the top of this wind gathering plate is provided with rain visor; The impurity such as rainwater are avoided to enter.
Preferably, this second gas compartment and ft connection; On flexure strip during lower process, can continuous compression second gas compartment, allow second gas compartment and ft connection, reduce resistance to compression pression, also can dispel the heat to flexure strip simultaneously.
Preferably, the inner surface of this silica-gel lens is provided with phosphor powder layer; If fluorescent material is directly coated in chip surface, easy and chip heating interferes with each other, fluorescent material easy sedimentation when applying, skewness on chip, and, fluorescent material directly sticks the surface in chip, have a strong impact on LED light-out effect, fluorescent material is placed on the inner surface of silica-gel lens, form long-distance fluorescent powder, the problem that the heat generation density that can solve is large, and not free settling.
In the utility model, by the design of flexure strip, first gas compartment, second gas compartment, magnetostrictive thin film, coil, tube connector, wind gathering plate etc., can dispel the heat to chip, realize cross-ventilation, the heat dispersion of very big raising LED encapsulation structure and radiating efficiency, extend its useful life; By the design of silica-gel lens, can adjust the lighting angle of chip, expand light-emitting area, improve display quality, the design of phosphor powder layer, avoid fluorescent material directly to contact with chip and cause the problems such as heat generation density is large, free settling; Structure is simple, easy to use.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
It should be noted that, when not conflicting, the combination that the embodiment in the application and the feature in embodiment can be mutual; And the utility model is elaborated below with reference to the accompanying drawings in conjunction with the embodiments.
With reference to Fig. 1:
A kind of LED encapsulation structure being convenient to dispel the heat that the utility model proposes, comprise matrix 1, chip 2, flexure strip 4, this matrix 1 is provided with hemispheric silica-gel lens 3, and this chip 2 is placed in the space that silica-gel lens 3 and matrix 1 formed;
Be provided with heat-dissipating space in this matrix 1, this flexure strip 4 is placed in heat-dissipating space, and heat-dissipating space is divided into first gas compartment 5, second gas compartment 6 by this flexure strip 4, and this first gas compartment 5 is communicated with space residing for chip 2 and space outerpace;
This flexure strip 4 is provided with magnetostrictive thin film 13, and this matrix 1 is provided with coil 12, and the center line of this coil 12 and the plane orthogonal at magnetostrictive thin film 13 place or oblique, vertically arrange in the present embodiment, this coil 12 is electrically connected with external power source.
Coil 12 produces magnetic field when being energized, magnetostrictive thin film 13 drives flexure strip 4 to deform under the action of a magnetic force, when flexure strip 4 is to lower process, in first gas compartment 5, pressure reduces, and space and extraneous air residing for chip 2 enter in first gas compartment 5; When electric current is reverse, flexure strip 4 upwardly, in first gas compartment 5, pressure increases, in first gas compartment 5, portion gas enters space residing for chip 2, gas is discharged in addition, this makes it possible to dispel the heat to chip, realizes cross-ventilation, the heat dispersion of very big raising LED encapsulation structure and radiating efficiency, extend its useful life.
Silica-gel lens 3 can adjust the lighting angle of chip 2, expands light-emitting area, improves display quality.
This matrix 1 is also provided with " U " type tube connector 7, this first gas compartment 5 is by this tube connector 7 and ft connection; Increasing " U " type tube connector 7 avoids the impurity such as extraneous rainwater to enter space residing for chip 2, ensures result of use and the useful life of chip 2.
This tube connector 7 is provided with wind gathering plate 8, and this wind gathering plate 8 is vertically arranged, and the surface of this wind gathering plate 8 is provided with groove 9, and this groove 9 is communicated with tube connector 7; The size design of wind gathering plate 8 is a little bigger, be convenient to air like this and enter tube connector 7, when especially blowing, clearly, by increasing wind gathering plate 8, being convenient to extraneous a large amount of air and entering in first gas compartment 5 through tube connector 7, being conducive to chip 2 and dispelling the heat; Multiple tube connector 7, wind gathering plate 8 can be set, be placed in the different azimuth of matrix 1, facilitate air to enter like this, conveniently dispel the heat; 2 tube connectors, 7,2 wind gathering plates 8 are set in the present embodiment.
This groove 9 one-tenth dome shape is arranged, and this groove 9 is positioned on the center line of groove 9 with the junction of tube connector 7; According to above-mentioned design, be convenient to air and enter in tube connector 7.
The top of this wind gathering plate 8 is provided with rain visor 10; The impurity such as rainwater are avoided to enter.
This second gas compartment 6 and ft connection; On flexure strip 4 during lower process, can continuous compression second gas compartment 6, allow the second gas compartment 6 and ft connection, reduce resistance to compression pression, also can dispel the heat to flexure strip 4 simultaneously.
The inner surface of this silica-gel lens 3 is provided with phosphor powder layer 11; If fluorescent material to be directly coated in chip 2 surface, easy and chip 2 heating interferes with each other, fluorescent material easy sedimentation when applying, skewness on chip 2, and, fluorescent material directly sticks the surface in chip 2, have a strong impact on LED light-out effect, fluorescent material is placed on the inner surface of silica-gel lens 1, form long-distance fluorescent powder, the problem that the heat generation density that can solve is large, and not free settling.
The above; be only the utility model preferably embodiment; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; be equal to according to the technical solution of the utility model and utility model design thereof and replace or change, all should be encompassed within protection range of the present utility model.
Claims (7)
1. be convenient to the LED encapsulation structure of heat radiation for one kind, it is characterized in that: comprise matrix (1), chip (2), flexure strip (4), this matrix (1) is provided with hemispheric silica-gel lens (3), and this chip (2) is placed in the space that silica-gel lens (3) and matrix (1) formed;
This matrix is provided with heat-dissipating space in (1), this flexure strip (4) is placed in heat-dissipating space, heat-dissipating space is divided into first gas compartment (5), second gas compartment (6) by this flexure strip (4), and this first gas compartment (5) is communicated with the residing space of chip (2) and space outerpace;
This flexure strip (4) is provided with magnetostrictive thin film (13), this matrix (1) is provided with coil (12), the center line of this coil (12) and the plane orthogonal at magnetostrictive thin film (13) place or oblique, this coil (12) is electrically connected with external power source.
2. the LED encapsulation structure being convenient to dispel the heat according to claim 1, it is characterized in that: this matrix (1) is also provided with " U " type tube connector (7), this first gas compartment (5) is by this tube connector (7) and ft connection.
3. the LED encapsulation structure being convenient to dispel the heat according to claim 2, it is characterized in that: this tube connector (7) is provided with wind gathering plate (8), this wind gathering plate (8) is vertically arranged, the surface of this wind gathering plate (8) is provided with groove (9), and this groove (9) is communicated with tube connector (7).
4. the LED encapsulation structure being convenient to dispel the heat according to claim 3, it is characterized in that: this groove (9) becomes dome shape to arrange, and this groove (9) is positioned on the center line of groove (9) with the junction of tube connector (7).
5. the LED encapsulation structure being convenient to dispel the heat according to claim 3, is characterized in that: the top of this wind gathering plate (8) is provided with rain visor (10).
6. the LED encapsulation structure being convenient to dispel the heat according to claim 1, is characterized in that: this second gas compartment (6) and ft connection.
7. the LED encapsulation structure being convenient to dispel the heat according to claim 1, is characterized in that: the inner surface of this silica-gel lens (3) is provided with phosphor powder layer (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520539062.XU CN204857784U (en) | 2015-07-22 | 2015-07-22 | LED packaging structure convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520539062.XU CN204857784U (en) | 2015-07-22 | 2015-07-22 | LED packaging structure convenient to heat dissipation |
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| Publication Number | Publication Date |
|---|---|
| CN204857784U true CN204857784U (en) | 2015-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520539062.XU Expired - Fee Related CN204857784U (en) | 2015-07-22 | 2015-07-22 | LED packaging structure convenient to heat dissipation |
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| Country | Link |
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| CN (1) | CN204857784U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190700A (en) * | 2019-03-19 | 2019-08-30 | 乌木马科技（天津）有限公司 | Heavy-duty motor for power plant |
| CN116448951A (en) * | 2023-03-29 | 2023-07-18 | 信扬科技(佛山)有限公司 | Terminal device |
-
2015
- 2015-07-22 CN CN201520539062.XU patent/CN204857784U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190700A (en) * | 2019-03-19 | 2019-08-30 | 乌木马科技（天津）有限公司 | Heavy-duty motor for power plant |
| CN116448951A (en) * | 2023-03-29 | 2023-07-18 | 信扬科技(佛山)有限公司 | Terminal device |
| CN116448951B (en) * | 2023-03-29 | 2024-05-10 | 信扬科技(佛山)有限公司 | Terminal device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151209 Termination date: 20160722 |