CN201327828Y - Multi-chip surface-mounted LED module packaging structure - Google Patents
Multi-chip surface-mounted LED module packaging structure Download PDFInfo
- Publication number
- CN201327828Y CN201327828Y CNU2008202375971U CN200820237597U CN201327828Y CN 201327828 Y CN201327828 Y CN 201327828Y CN U2008202375971 U CNU2008202375971 U CN U2008202375971U CN 200820237597 U CN200820237597 U CN 200820237597U CN 201327828 Y CN201327828 Y CN 201327828Y
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- Prior art keywords
- led
- led chips
- light
- metal base
- metab
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Abstract
The utility model provides a multi-chip surface-mounted LED module packaging structure. A circuit and a terminal pad are printed on an aluminum nitride ceramic base plate, a plurality of LED chips are directly pasted on the front side of the aluminum nitride ceramic base plate, and the LED chips are electrically connected with the aluminum nitride ceramic base plate through a wire; a metal base is covered on the circumference of the LED chips, a bright silver layer is electrically plated on the full surface of the metal base, a glass lens is covered on the metal base, and a fluorescent coating is coated on the surface of the LED chips. The LED chips emit blue light when working, which excites the fluorescent coating to emit white light; the bright silver is plated on the full surface of the metal base to reflect the light emitted from the LED chips, reduce light absorption and emit white light through the convergence of the glass lens. The packaging structure has the advantages that the LED structure is easy to realize, the cost is low, the reliability is improved, the light energy conversion efficiency of the LED is greatly enhanced, and the structure is simple, thereby being favorable for mass production.
Description
Technical field
The utility model relates to a kind of surface mount LED module package structure of multicore sheet.
Background technology
Progressively exploitation is ripe for LED crystal grain technology, but it is not well developed all the time and uses in lighting field; Trace it to its cause, a subject matter in application facet is: the power of single great power LED (more than the 3W) is limited by the manufacturing process technology of semi-conducting material, can't significantly improve power, with the increase of power, corresponding technology and equipment requirements are also high, the cost price costliness; And single low-power LED technology is ripe already, and the manufacturing scale is big, and unit price is cheap, and cost is low.
Summary of the invention
The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of surface mount LED module package structure of multicore sheet is provided.
The purpose of this utility model is achieved through the following technical solutions:
The surface mount LED module package structure of multicore sheet, characteristics are: be printed with circuit and pad on the aluminium nitride ceramics substrate, the plurality of LEDs chip directly is bonded in the front of aluminium nitride ceramics substrate, by gold thread led chip and aluminium nitride ceramics substrate is electrically connected; Be stamped metab at the led chip periphery, the full electroplating surface silver lustre of metab layer is stamped glass lens on metab.
Further, the surface mount LED module package structure of above-mentioned multicore sheet is coated with fluoresent coating on the described led chip.
The substantive distinguishing features of technical solutions of the utility model and progressive being mainly reflected in:
Substrate is an aluminium nitride ceramics material, and thermal conductivity is good, and the plurality of LEDs chip directly is bonded on the aluminium nitride ceramics substrate body; Led chip work the time is sent blue light, excites on it fluorescent agent coat to send white light; The full surface plating of metab silver lustre, the light that the reflection led chip sends reduces light and is absorbed, and converges the ejaculation white light by glass lens.Its LED good heat dissipation effect has improved reliability, promotes the light energy use efficiency of LED, has reduced designing requirement, and change is simple, expands easily, is convenient to standardized designs, and follow-up simple and convenient assembly is easy to large-scale production, and market prospects are wide.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: structural representation of the present utility model;
The local enlarged diagram of Fig. 2: Fig. 1.
The implication of each Reference numeral sees the following form among the figure:
| Reference numeral | Implication | Reference numeral | Implication | Reference numeral | Implication |
| 1 | The aluminium |
2 | |
3 | |
| 4 | Fluoresent coating | 5 | |
6 | Led chip |
Embodiment
As shown in Figure 1 and Figure 2, surface mount LED module package structure, be printed with circuit and pad on aluminium nitride ceramics substrate 1, plurality of LEDs chip 6 directly is bonded in the front of aluminium nitride ceramics substrate 1, by gold thread 5 led chip 6 and aluminium nitride ceramics substrate 1 is electrically connected; Be coated with fluoresent coating 4 on the led chip 6; Be stamped metab 2 at led chip 6 peripheries, metab 2 full electroplating surface silver lustre layers, metab 2 is fixing with aluminium nitride ceramics substrate 1 bonding, and metab 2 end faces have the depression cushion cap, and glass lens 3 is embedded on the depression cushion cap of metab 2.The back up pad of aluminium nitride ceramics substrate 1 provides follow-up SMT technological requirement function.Spray one deck fluoresent coating 4 thick films by electrophoresis or Electrostatic Absorption mode on the led chip; Send blue light during led chip 6 work, fluorescence excitation coating 4 is sent white light; Metab 2 full surface plating silver lustres, the light that reflection led chip 6 sends reduces light and is absorbed, and converges the ejaculation white light by glass lens 3.Its LED radiating effect is fast, and volume is little, and good reliability is easy to assembly, is convenient to standardized designs, is beneficial to large-scale production.
The substrate of the surface mount LED module package structure of above-mentioned multicore sheet is aluminium nitride ceramics substrate (ALN), and its material is high heat conduction aluminium nitride ceramics (conductive coefficient is 170W/mK, 25 ℃), and thermal conductivity is better; Upper and lower surface printed circuit and pad provide the electric circuit function.Plurality of LEDs chip 6 evenly bonds thereon, and the spread heat of sending when making led chip 6 work is unlikely to local overheating.Metab 2 materials are fine copper, the electroplating surface silver lustre, and its internal structure design adds the conical reflecting face, the light that led chip 6 is sent is transmitted into the top as far as possible; Select copper material for use, play good heat radiating function; Its end face depression suspended deck structure plays the effect of Locating Glass lens 3.Directly spray one deck fluoresent coating 4 on the led chip 6, maximally utilise the light-emitting area on led chip 6 surfaces, the blue-light excited fluoresent coating 4 that sends from led chip 6 sends white light; Fluoresent coating 4 thickness are little, but the utilance height, reduced the consumption of fluorescer, saved expensive fluorescent material; White light pools certain angle by glass lens 3 to be launched, to reduce the effect of light scattering.Separate, improve job stability and reliability; Simple for structure, technology is simple.
In sum, the utility model structure uniqueness, the low-power LED chip price is cheap, can significantly promote the luminous power of LED light emitting module after the combination, and volume is little, and production process is simple.Compare with traditional structure, reduced cost, change is simple, expands easily, is convenient to standardized designs, is beneficial to large-scale production, has brought very good economic benefit to production application.
More than, content of the present utility model has been done further detailed description by embodiment by the accompanying drawing illustrated embodiment.But this should be interpreted as that the scope of the utility model theme only limits to above example.Under the situation that does not break away from the above-mentioned technological thought of the utility model, various replacements or the change of making according to ordinary skill knowledge and customary means, all should be included in the protection range of the present utility model.
Claims (2)
1. the surface mount LED module package structure of multicore sheet, it is characterized in that: on aluminium nitride ceramics substrate (1), be printed with circuit and pad, plurality of LEDs chip (6) directly is bonded in the front of aluminium nitride ceramics substrate (1), by gold thread (5) led chip (6) and aluminium nitride ceramics substrate (1) is electrically connected; Be covered with metab (2) at led chip (6) periphery, the full surface electrical of metab (2) is coated with the silver lustre layer, is stamped glass lens (3) on metab (2).
2. the surface mount LED module package structure of multicore sheet according to claim 1 is characterized in that: be coated with fluoresent coating (4) on the described led chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202375971U CN201327828Y (en) | 2008-12-24 | 2008-12-24 | Multi-chip surface-mounted LED module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202375971U CN201327828Y (en) | 2008-12-24 | 2008-12-24 | Multi-chip surface-mounted LED module packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201327828Y true CN201327828Y (en) | 2009-10-14 |
Family
ID=41179792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202375971U Expired - Fee Related CN201327828Y (en) | 2008-12-24 | 2008-12-24 | Multi-chip surface-mounted LED module packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201327828Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598072A (en) * | 2018-07-02 | 2018-09-28 | 江西科技师范大学 | A kind of UV-LED light source module preparation methods based on integrated bracket |
-
2008
- 2008-12-24 CN CNU2008202375971U patent/CN201327828Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598072A (en) * | 2018-07-02 | 2018-09-28 | 江西科技师范大学 | A kind of UV-LED light source module preparation methods based on integrated bracket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091014 Termination date: 20111224 |