CN201221691Y - Light beam-adjustable high power LED light source - Google Patents
Light beam-adjustable high power LED light source Download PDFInfo
- Publication number
- CN201221691Y CN201221691Y CNU2008200887710U CN200820088771U CN201221691Y CN 201221691 Y CN201221691 Y CN 201221691Y CN U2008200887710 U CNU2008200887710 U CN U2008200887710U CN 200820088771 U CN200820088771 U CN 200820088771U CN 201221691 Y CN201221691 Y CN 201221691Y
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- radiator
- light source
- led chip
- curved surface
- led light
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Abstract
The utility model discloses a high-power LED light source with adjustable light beams, which comprises an LED chip, a package substrate, a casing body, a transparent curved-surface lamina, transparent liquid, a radiator and a steering device, wherein the casing body and the steering device are arranged on the radiator, the package substrate is arranged on the steering device, the LED chip is arranged on the package substrate, the transparent curved-surface lamina is arranged at the top of the casing body, and the transparent liquid is filled in the space surrounded by the casing body, the transparent curved-surface lamina and the radiator to form a liquid lens. Light generated by the LED chip emits in a collimation mode through the liquid lens. The steering device can rotate the package substrate and the LED chip, so that the direction and the width of emitted beams can be adjusted. Heat is radiated after being transmitted to the casing body and the radiator by the transparent liquid. The high-power LED light source can realize the adjustable beams of the LED light source, and solves the problem of heat radiation.
Description
Technical field
The utility model relates to lighting source, relates in particular to the adjustable high-power LED light source of a kind of light beam.
Background technology
Led light source is the new generation of green lighting source, and its power consumption has only 1/10th of ordinary incandescent lamp, and the life-span is long more than ten times.In addition, led light source also has advantages such as volume is little, sturdy and durable, rich color.Applications such as illumination of family and public place and automobile have been begun extensively to apply at present.In some applications, need to change the output beam of illuminator, to adapt to different environments for use and purpose, for example automobile headlamp needs dipped headlights and high beam, even need realize that the deflection of light is to improve the security of driving at night along with Vehicular turn.
Present led light source is because the die area of led chip is very little, the light that sends from led chip has very large angle of scattering, the outgoing beam that obtains must utilize lens to focus on, and great power LED utilizes resin material or glass to make lens to be installed on the chip or on the position of chip mostly at present.This method can only be exported fixing light beam, can't realize the direction adjustment of output beam.In addition, because the high-power LED light source can produce a large amount of heats, need be installed on the radiator and dispel the heat, the position of having limited led chip like this changes, and therefore is difficult to realize the adjustment of output beam.
In ideal conditions, the optical material of coupling and suitable encapsulating structure can be given full play to LED luminescent properties efficiently, and most electric energy is converted into light.But, led chip is that InN and sapphire etc. makes by semi-conducting material GaN, and the refractive index of these materials is very high, the light that produces is not easy to shine in the low-refraction air, therefore needs to select suitable refraction materials to improve the outgoing efficient of light source as matching layer.In addition, the PN junction long-term work that temperature has very large influence, particularly led chip to the output intensity and the colour temperature performance of high-power LED light source is in the condition of high temperature, and its optical property can very fast decay.These are to need the key issue that solves in the LED encapsulation.
From the analysis of led light source heat generation characteristic as can be known, the bottleneck of led chip heat radiation is between chip and substrate, because the led chip volume is very little, the contact area between chip and the substrate is very limited, particularly upside-down mounting (flip-chip) structure, have a plurality of dielectric layers between the active area of heating and the substrate, thermal resistance increases sharply, and labor is referring to document " upside-down mounting large power white light LED thermal field analysis and test " (photoelectron laser, vol.16, num.5, pp.511-514,2005).The heat of led chip can not will leave as soon as possible like this, cause the PN junction temperature higher, and other optical materials such as epoxy resin, silica gel and fluorescer etc. are in work under the high temperature for a long time, the performance degradation of whole light source device aging very fast, poor reliability, this encapsulating structure is difficult to be suitable for the high-power LED light source of high power density.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of light beam adjustable high-power LED light source.
The high-power LED light source that light beam is adjustable comprises led chip, base plate for packaging, housing, transparent curved surface thin layer, transparency liquid, radiator and transfer; Radiator is provided with housing, transfer; Transfer is provided with base plate for packaging, and base plate for packaging is provided with led chip, and case top is provided with transparent curved surface thin layer, is filled with transparency liquid in the space that housing, transparent curved surface thin layer and radiator surround, and forms liquid lens.
Described transparent curved surface thin layer is the thin layer of being made by glass or resin transparent material with lens curved surface shape.
Described transparency liquid is silicone oil, acetone, ethanol, freon or argon fluoride.Inner walls is provided with optical mirror, and outer wall is provided with radiating fin.Radiator is finned radiator or heat-pipe type radiator.Transfer is to be rotated or mobile device by the two dimension of motor or Piezoelectric Ceramic.
The utility model is made of led chip, base plate for packaging, housing, transparent curved surface thin layer, transparency liquid, radiator and transfer.Radiator is provided with housing, transfer; Transfer is provided with base plate for packaging, and base plate for packaging is provided with led chip, and case top is provided with transparent curved surface thin layer, is filled with transparency liquid between led chip and the transparent curved surface thin layer, forms liquid lens.The light that led chip produces sends through the liquid lens collimation, and transfer can rotate base plate for packaging and led chip, makes the direction and the width-adjustable of outgoing beam; The heat that led chip produces is sent to housing by transparency liquid and radiator sheds; Can realize led light source output beam direction and width-adjustable and solve heat dissipation problem.
Description of drawings
Fig. 1 is the structural representation of the adjustable high-power LED light source of light beam;
Fig. 2 is the principle schematic that forms liquid lens between led chip of the present utility model and the transparent curved surface thin layer;
Fig. 3 is the principle schematic that converges and spread light beam of the present utility model;
Fig. 4 is a deflected beam principle schematic of the present utility model;
Fig. 5 is a transfer embodiment schematic diagram of the present utility model.
Among the figure: led chip 1, base plate for packaging 2, housing 3, transparent curved surface thin layer 4, transparency liquid 5, radiator 6, transfer 7, support 8, first drive unit 9, second drive unit 10, the 3rd drive unit 11, four-drive device 12, base 13.
The specific embodiment
Describe the specific embodiment of the present utility model in detail below in conjunction with accompanying drawing.
As shown in Figure 1, the adjustable high-power LED light source of light beam comprises led chip 1, base plate for packaging 2, housing 3, transparent curved surface thin layer 4, transparency liquid 5, radiator 6 and transfer 7; Radiator 6 is provided with housing 3, transfer 7; Transfer 7 is provided with base plate for packaging 2, and base plate for packaging 2 is provided with led chip 1, and housing 3 tops are provided with transparent curved surface thin layer 4, is filled with transparency liquid in the space that housing 3, transparent curved surface thin layer 4 and radiator 6 surround, and forms liquid lens.Transparent curved surface thin layer 4 is thin layers with lens curved surface shape of being made by glass or resin transparent material.Transparency liquid 5 is silicone oil, acetone, ethanol, freon or argon fluoride.Housing 3 inwalls are provided with optical mirror, and outer wall is provided with radiating fin.Radiator 6 is finned radiator or heat-pipe type radiator.Transfer 7 is to be rotated or mobile device by the two dimension of motor or Piezoelectric Ceramic.
The light that led chip produces sends through the liquid lens collimation, and transfer can rotate and mobile base plate for packaging and led chip, makes outgoing beam adjustable.Led chip is fixed on the base plate for packaging by methods such as welding bindings, and base plate for packaging is made by the material of high thermal conductivity coefficient, is laid with chip on it to connect required circuit, and base plate for packaging is fixedly installed on the transfer.A confined space by transparent curved surface thin layer, housing and radiator constitute charges into transparency liquid then therein, and led chip and base plate for packaging are immersed in the transparency liquid fully, and transparency liquid is filled between transparent curved surface thin layer and the led chip.Because transparent curved surface thin layer can form the curved surface of lens, so liquid is retrained the shape that forms lens by transparent curved surface thin layer, the function of the refraction realization lens of light process transparency liquid and transparent curved surface thin layer.
The selection of transparency liquid is extremely important, and transparency liquid is a kind of have electrical insulating property, high index of refraction, high boiling non-corrosiveness transparency liquid, as silicone oil, acetone, ethanol, freon or argon fluoride.This liquid has high-permeability at visible light wave range, have simultaneously electrical insulating property, heat endurance, optical stability, refractive index be in 1.3～1.8 between, boiling point is lower than 180 °, circuit and chip do not had corrosivity or the like character.This liquid can not cause short circuit owing to have electrical insulating property.The transparency of liquid has guaranteed that light that led chip the produces liquid that can not be cooled absorbs.Transparency liquid has optical stability, is in high strength blue light or UV-irradiation for a long time, composition and performance change can not take place.Further, select the transparency liquid of high index of refraction to help improving the outgoing efficient of light from led chip, should with the material refractive index basically identical (this optical material is generally selected glass or epoxy resin, and refractive index is about 1.5) of transparent curved surface thin layer.Consider that transparency liquid has certain excursion with the composition different refractivity, therefore refractive index is chosen between 1.3～1.8.In addition, transparency liquid can not have corrosiveness to circuit and chip material.In addition, transparency liquid will have heat endurance, and long-term work is not at high temperature decomposed and never degenerated.The heat that led chip work the time is sent can cause fluid temperature to raise, and the fluid temperature variation can cause the convection current of liquid, takes a large amount of heat to housing by led chip to failing to be convened for lack of a quorum and radiator sheds.Because led chip and base plate for packaging are installed on the transfer, can not heat be sent to housing and radiator by conduction, therefore here transparency liquid is not only the working medium that forms liquid lens, and as heat-transfer working medium led chip is carried out heat loss through convection.
As shown in Figure 2.The refractive index that we suppose transparency liquid and transparent curved surface thin layer about equally, when light shone in the air from transparency liquid, light was dredged media from the close media of light to light, the included angle A that vertical line became of light and media plane is less than B.When transparent curved surface thin layer formed a convex surface, all emergent raies all can be partial to the central symmetry axis S of transparent curved surface thin layer, formed the effect of converging, and the transparency liquid that is held in the transparent like this curved surface thin layer forms convex lens.
As shown in Figure 3, when led chip was on the focus of lens (D point position), it was a flat shaped light beam that the scattered light that led chip sends is converged, change the position of led chip, the depth of parallelism of outgoing beam be can change, diffusion light beam and converging beam light beam become be.When the distance of led chip and transparent curved surface thin layer during less than focal length (C point position), the light beam of formation is the diffusion light beam; When the distance of led chip and transparent curved surface thin layer during greater than focal length (E point position), the light beam of formation is a converging beam.
As shown in Figure 4, when the light-emitting area rotational angle F of led chip, light beam can rotate thereupon, produces same F angular deflection.The deflection of led chip and the mobile dependence transfer that needs are realized.
As shown in Figure 5, transfer is to be rotated or mobile device by the two dimension of motor or Piezoelectric Ceramic.Fig. 5 has provided the schematic diagram of a kind of embodiment.Transfer has a support and four drive units that are made of motor or piezoelectric ceramics, and the top of support can be installed led chip and base plate for packaging, and four angles of support have been mounted four drive units respectively, and drive unit is installed on the base.When four drive units produced different stroke respectively, support mounted thereto can produce inclination in various degree and move, and the mounted LEDs chip just can produce needed deflection and mobile on the support like this.
Claims (6)
1. the high-power LED light source that light beam is adjustable is characterized in that comprising led chip (1), base plate for packaging (2), housing (3), transparent curved surface thin layer (4), transparency liquid (5), radiator (6) and transfer (7); Radiator (6) is provided with housing (3), transfer (7); Transfer (7) is provided with base plate for packaging (2), base plate for packaging (2) is provided with led chip (1), housing (3) top is provided with transparent curved surface thin layer (4), is filled with transparency liquid in the space that housing (3), transparent curved surface thin layer (4) and radiator (6) surround, and forms liquid lens.
2. the adjustable high-power LED light source of a kind of beam direction according to claim 1 is characterized in that described transparent curved surface thin layer (4) is the thin layer of being made by glass or resin transparent material with lens curved surface shape.
3. the adjustable high-power LED light source of a kind of beam direction according to claim 1 is characterized in that described transparency liquid (5) is silicone oil, acetone, ethanol, freon or argon fluoride.
4. the adjustable high-power LED light source of a kind of beam direction according to claim 1 is characterized in that described housing (3) inwall is provided with optical mirror, and outer wall is provided with radiating fin.
5. the adjustable high-power LED light source of a kind of beam direction according to claim 1 is characterized in that described radiator (6) is finned radiator or heat-pipe type radiator.
6. the adjustable high-power LED light source of a kind of beam direction according to claim 1 is characterized in that described transfer (7) is to be rotated or mobile device by the two dimension of motor or Piezoelectric Ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200887710U CN201221691Y (en) | 2008-06-12 | 2008-06-12 | Light beam-adjustable high power LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200887710U CN201221691Y (en) | 2008-06-12 | 2008-06-12 | Light beam-adjustable high power LED light source |
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| Publication Number | Publication Date |
|---|---|
| CN201221691Y true CN201221691Y (en) | 2009-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200887710U Expired - Fee Related CN201221691Y (en) | 2008-06-12 | 2008-06-12 | Light beam-adjustable high power LED light source |
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| Country | Link |
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| CN (1) | CN201221691Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105402630A (en) * | 2015-12-15 | 2016-03-16 | 晶科电子（广州）有限公司 | LED module light source |
| CN110429040A (en) * | 2019-08-07 | 2019-11-08 | 厦门华联电子股份有限公司 | Optical detection pretreatment method of semiconductor packaging device |
-
2008
- 2008-06-12 CN CNU2008200887710U patent/CN201221691Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105402630A (en) * | 2015-12-15 | 2016-03-16 | 晶科电子（广州）有限公司 | LED module light source |
| CN110429040A (en) * | 2019-08-07 | 2019-11-08 | 厦门华联电子股份有限公司 | Optical detection pretreatment method of semiconductor packaging device |
| CN110429040B (en) * | 2019-08-07 | 2022-05-13 | 厦门华联电子股份有限公司 | Optical detection pretreatment method of semiconductor packaging device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHANGZHOU TAIHE OPTOELECTRONICS TECHNOLOGY CO., LT Free format text: FORMER OWNER: FU JIAN Effective date: 20100927 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 310012 TO: 213000 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20100927 Address after: 213000 Jiangsu city of Changzhou province university science and Technology Park Chang Wu Road No. 801 (Tianrun building C, 406) Patentee after: Changzhou Taihe Optoelectronic Technology Co., Ltd. Address before: Hangzhou City, Zhejiang Province, Xihu District Zijin building 24-701 310012 Patentee before: Fu Jian |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090415 Termination date: 20130612 |