CN110429040A - Optical detection pretreatment method of semiconductor packaging device - Google Patents
Optical detection pretreatment method of semiconductor packaging device Download PDFInfo
- Publication number
- CN110429040A CN110429040A CN201910723623.4A CN201910723623A CN110429040A CN 110429040 A CN110429040 A CN 110429040A CN 201910723623 A CN201910723623 A CN 201910723623A CN 110429040 A CN110429040 A CN 110429040A
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- China
- Prior art keywords
- solution
- packing device
- area
- semiconductor packing
- transparent film
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2644—Adaptations of individual semiconductor devices to facilitate the testing thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
The invention provides an optical detection pretreatment method of a semiconductor packaging device, which comprises the following steps: a1, providing a flexible transparent film, coating the semiconductor packaging device with the flexible transparent film, vacuumizing to make the flexible transparent film tightly attached to the outer surface of the semiconductor packaging device without gap and fixed, and realizing vacuum film coating; a2, providing a solution storage system, the solution storage system comprises a solution preparing area, a solution standing area and a solution transmission channel connecting the solution preparing area and the solution standing area, placing the semiconductor packaging device coated with the film in vacuum in the solution standing area, preparing a transparent solution with a certain refractive index in the solution preparing area, and the transparent solution flows to the solution standing area through the solution transmission channel and completely coats the semiconductor packaging device. By the method, the problems of deformation and distortion can be well solved, and the semiconductor packaging device is not damaged.
Description
Technical field
The present invention relates to the field of optical detection of semiconductor packing device, and in particular to a kind of light of semiconductor packing device
Learn detection pre-treating method.
Background technique
Existing Systems for optical inspection, sample to be observed are directly exposed in air, in the optics of semiconductor packing device
In detection, especially when observing special-shaped sample or surface irregularity sample, due to the folding by air and sample encapsulating material
The influence of rate difference is penetrated, the image of observation is easily deformed and is distorted, and influences observation effect and observed efficiency.Existing scheme is will to want
The sample of observation is carrying out grinding and buffing perpendicular to observed direction, is guaranteeing that sample surfaces are smooth, folding is solved from observed direction
Penetrate rate difference problem.But the program is time-consuming and laborious, and can damage object surface to be observed.
Summary of the invention
For this purpose, the present invention provides a kind of optical detection pre-treating method of semiconductor packing device, in this way, can
Very good solution above-mentioned the problem of deforming and being distorted, and it is lossless to semiconductor packing device.
To achieve the above object, technical solution provided by the invention is as follows:
A kind of optical detection pre-treating method of semiconductor packing device, includes the following steps:
A1 provides a flexible transparent film, which is coated semiconductor packing device, and take out true
Sky makes the gapless outer surface for being tightly attached to semiconductor packing device of flexible transparent film and fixation, realizes vacuum coated；
A2 provides a solution storage system, which includes preparing solution area, solution left standstill area and connection
Semiconductor packing device after vacuum coated is placed in solution left standstill by the solution Transfer pipe in preparing solution area and solution left standstill area
In area, allotment has the clear solution of certain refractive index in preparing solution area, which flow to through solution Transfer pipe
Solution left standstill area, and the semiconductor packing device is coated completely.
Further, the flexible transparent film is flexible flexible transparent film.
Further, the flexible transparent film with a thickness of micron order.
Further, the flexible transparent film is flexible transparent film piece or flexible transparent film bag.
Further, further include step A12 between step A1 and step A2: a transmission system is provided, after vacuum coated
Semiconductor packing device be fixed in transmission system, transmission system drive semiconductor packing device moved, rotated or turned over
Turn；In step A2, semiconductor packing device is placed in solution left standstill area by transmission system.
The technical solution provided through the invention, has the following beneficial effects:
Semiconductor packing device to be detected is placed in the clear solution with certain refractive index through vacuum coated, thoroughly
Bright solution coats semiconductor packing device completely, so that surface is smooth liquid level, when carrying out optical detection, imaging clearly has
Effect avoids image from deforming and be distorted；And flexible transparent film can be effectively isolated device and clear solution, prevent device quilt
Corrosion or pollution, realize the lossless of device.Meanwhile different refractivity can be deployed by the preparing solution area of solution storage system
Clear solution, the refractive index of clear solution can realize discontinuity or successional change, and then realize under detection different refractivity
Image (luminescent images of appearance images or semiconductor packing device), optical detection is more comprehensively.
Detailed description of the invention
Fig. 1 show the flow diagram of the optical detection pre-treating method of semiconductor packing device in embodiment.
Specific embodiment
To further illustrate that each embodiment, the present invention are provided with attached drawing.These attached drawings are that the invention discloses one of content
Point, mainly to illustrate embodiment, and the associated description of specification can be cooperated to explain the operation principles of embodiment.Cooperation ginseng
These contents are examined, those of ordinary skill in the art will be understood that other possible embodiments and advantages of the present invention.In figure
Component be not necessarily to scale, and similar component symbol is conventionally used to indicate similar component.
Now in conjunction with the drawings and specific embodiments, the present invention is further described.
Shown in referring to Fig.1, the present embodiment provides a kind of inspections of the optics of semiconductor packing device (such as LED chip packaging)
Pre-treating method is surveyed, is included the following steps:
A1 provides a flexible transparent film, which is coated semiconductor packing device, and take out true
Sky makes the gapless outer surface for being tightly attached to semiconductor packing device of flexible transparent film and fixation, realizes vacuum coated；
A2 provides a solution storage system, which includes preparing solution area, solution left standstill area and connection
Semiconductor packing device after vacuum coated is placed in solution left standstill by the solution Transfer pipe in preparing solution area and solution left standstill area
In area, allotment has the clear solution of certain refractive index in preparing solution area, which flow to through solution Transfer pipe
Solution left standstill area, and the semiconductor packing device is coated completely.
The processing before optical detection is carried out to semiconductor packing device using above-mentioned steps, so that surface is smooth liquid
Face, when carrying out optical detection, imaging clearly effectively avoids image from deforming and be distorted；And flexible transparent film can be effective
Isolating device and clear solution prevent device to be corroded or pollute, and realize the lossless of device.Meanwhile it can be stored by solution and be
The clear solution of the preparing solution area allotment different refractivity of system, the refractive index of clear solution can realize discontinuity or successional
Change, and then realizes the image (luminescent images of appearance images or semiconductor packing device) under detection different refractivity, optics
Detection is more comprehensively.
Specifically, the clear solution can be one-component, also transparency liquid can be deployed with multicomponent.Its refractive index can
Be it is fixed, also using different refractive index solution or use different solvent and solute, obtain the saturating of different refractivity
Bright solution.It is replaced by the clear solution of different fixed refractions, realizes the clear solution of cladding semiconductor packing device
The interruption of refractive index sexually revise；It or is to wrap the clear solution continuous transmission of different refractivity to solution left standstill area
Semiconductor packing device is covered, realizes the sequential change of the refractive index of the clear solution of cladding semiconductor packing device, to meet
Different observation conditions and observation object requirement.
Further, in the present embodiment, the flexible transparent film is flexible flexible transparent film, is being taken out
When vacuum, the outer surface of semiconductor packing device can be preferably fitted in, is more suitable for the semiconductor packages device of polymorphic structure
Part.Of course, in other embodiments, it can also be using inelastic flexible transparent film etc..
Further preferably, in the present embodiment, the flexible transparent film with a thickness of micron order, using the soft of micron order thickness
Property transparent membrane, thickness is thin, and compactness is good, use in the prior art transparent PE film, PET film etc. or other such as dip dyeing, spray
The removable transparent membrane that the modes such as painting, vapor deposition, sputtering are generated in product surface.Of course, in other embodiments, if soft
Property transparent membrane toughness meet enough, being preferably also is flexible transparent film using nanometer grade thickness.
Further, in the present embodiment, the flexible transparent film be flexible transparent film piece or flexible transparent film bag,
Sheet and bag shaped structure can be good at being coated, and more preferably, flexible transparent film is soft using bag shaped structure
Property transparent film bag is coated, more convenient operation.
Further, further include step A12 between step A1 and step A2 in the present embodiment: a transmission system is provided, it will
Semiconductor packing device after vacuum coated is fixed in transmission system, and transmission system drives semiconductor packing device to be moved
It moves, be rotated or turned over；In step A2, semiconductor packing device is placed in solution left standstill area by transmission system.Pass through power train
Dynamic semiconductor packing device is commanded to be acted, it can be achieved that each position of semiconductor packing device can be at different angles
Now in the detection zone of Systems for optical inspection.Specifically, existing manipulator can be used to realize in transmission system.Of course,
In other embodiments, semiconductor packing device can also be directly arranged in the solution left standstill area of solution storage system.
Specifically, semiconductor packing device is described using LED chip packaging as specific embodiment in the present embodiment
This programme can also use other classes of course, in other embodiments, the type of semiconductor packing device is not limited to this
The semiconductor packing device of type.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
It is white, it is not departing from the spirit and scope of the present invention defined by the appended claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (5)
1. a kind of optical detection pre-treating method of semiconductor packing device, which comprises the steps of:
A1 provides a flexible transparent film, which is coated semiconductor packing device, and vacuumized, made
Vacuum coated is realized in the gapless outer surface for being tightly attached to semiconductor packing device of flexible transparent film and fixation；
A2 provides a solution storage system, which includes preparing solution area, solution left standstill area and connection solution
The solution Transfer pipe for deploying area and solution left standstill area, is placed in solution left standstill area for the semiconductor packing device after vacuum coated
Interior, allotment has the clear solution of certain refractive index in preparing solution area, which flow to molten through solution Transfer pipe
Liquid stands area, and coats the semiconductor packing device completely.
2. the optical detection pre-treating method of semiconductor packing device according to claim 1, it is characterised in that: described soft
Property transparent membrane be flexible flexible transparent film.
3. the optical detection pre-treating method of semiconductor packing device according to claim 1 or 2, it is characterised in that: institute
State flexible transparent film with a thickness of micron order.
4. the optical detection pre-treating method of semiconductor packing device according to claim 1, it is characterised in that: described soft
Property transparent membrane be flexible transparent film piece or flexible transparent film bag.
5. the optical detection pre-treating method of semiconductor packing device according to claim 1, it is characterised in that: step A1
Further include step A12 between step A2: a transmission system being provided, the semiconductor packing device after vacuum coated is fixed on biography
In dynamic system, transmission system drives semiconductor packing device to carry out movement, be rotated or turned over；In step A2, semiconductor packages device
Part is placed in solution left standstill area by transmission system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910723623.4A CN110429040B (en) | 2019-08-07 | 2019-08-07 | Optical detection pretreatment method of semiconductor packaging device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910723623.4A CN110429040B (en) | 2019-08-07 | 2019-08-07 | Optical detection pretreatment method of semiconductor packaging device |
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| CN110429040A true CN110429040A (en) | 2019-11-08 |
| CN110429040B CN110429040B (en) | 2022-05-13 |
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| JP2005123364A (en) * | 2003-10-16 | 2005-05-12 | Toshiba Electronic Engineering Corp | Optical semiconductor device and its manufacturing method |
| CN201221691Y (en) * | 2008-06-12 | 2009-04-15 | 符建 | Light beam-adjustable high power LED light source |
| CN102484079A (en) * | 2009-06-01 | 2012-05-30 | 住友化学株式会社 | Encapsulation process and structure for electronic devices |
| CN102709281A (en) * | 2012-05-21 | 2012-10-03 | 苏州晶品光电科技有限公司 | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source |
| CN103234171A (en) * | 2013-05-09 | 2013-08-07 | 杭州电子科技大学 | Optical coupling agent of light-emitting diode (LED) device |
| CN103234182A (en) * | 2013-05-09 | 2013-08-07 | 杭州电子科技大学 | Method for combining optical coupling agent auxiliary heat-dissipating package with high luminous efficiency light-emitting diode (LED) lamp and lamp |
| CN103943524A (en) * | 2013-01-21 | 2014-07-23 | 源贸科技股份有限公司 | Viewing method for substrate with uneven surface |
| CN104613350A (en) * | 2015-02-12 | 2015-05-13 | 清华大学 | High-power semiconductor illuminating light source |
| US9882133B2 (en) * | 2014-08-20 | 2018-01-30 | Boe Technology Group Co., Ltd. | Electronic package device for testing a package effect of the device, fabrication method thereof and method for testing electronic package device |
| CN110010507A (en) * | 2019-04-04 | 2019-07-12 | 中电海康无锡科技有限公司 | SIP module subregion is electromagnetically shielded packaging method |
-
2019
- 2019-08-07 CN CN201910723623.4A patent/CN110429040B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005123364A (en) * | 2003-10-16 | 2005-05-12 | Toshiba Electronic Engineering Corp | Optical semiconductor device and its manufacturing method |
| CN201221691Y (en) * | 2008-06-12 | 2009-04-15 | 符建 | Light beam-adjustable high power LED light source |
| CN102484079A (en) * | 2009-06-01 | 2012-05-30 | 住友化学株式会社 | Encapsulation process and structure for electronic devices |
| CN102709281A (en) * | 2012-05-21 | 2012-10-03 | 苏州晶品光电科技有限公司 | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source |
| CN103943524A (en) * | 2013-01-21 | 2014-07-23 | 源贸科技股份有限公司 | Viewing method for substrate with uneven surface |
| CN103234171A (en) * | 2013-05-09 | 2013-08-07 | 杭州电子科技大学 | Optical coupling agent of light-emitting diode (LED) device |
| CN103234182A (en) * | 2013-05-09 | 2013-08-07 | 杭州电子科技大学 | Method for combining optical coupling agent auxiliary heat-dissipating package with high luminous efficiency light-emitting diode (LED) lamp and lamp |
| US9882133B2 (en) * | 2014-08-20 | 2018-01-30 | Boe Technology Group Co., Ltd. | Electronic package device for testing a package effect of the device, fabrication method thereof and method for testing electronic package device |
| CN104613350A (en) * | 2015-02-12 | 2015-05-13 | 清华大学 | High-power semiconductor illuminating light source |
| CN110010507A (en) * | 2019-04-04 | 2019-07-12 | 中电海康无锡科技有限公司 | SIP module subregion is electromagnetically shielded packaging method |
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| CN110429040B (en) | 2022-05-13 |
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