CN201113214Y - Side-surrounding pump module for rod-shaped laser medium - Google Patents
Side-surrounding pump module for rod-shaped laser medium Download PDFInfo
- Publication number
- CN201113214Y CN201113214Y CNU2007200732895U CN200720073289U CN201113214Y CN 201113214 Y CN201113214 Y CN 201113214Y CN U2007200732895 U CNU2007200732895 U CN U2007200732895U CN 200720073289 U CN200720073289 U CN 200720073289U CN 201113214 Y CN201113214 Y CN 201113214Y
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- Prior art keywords
- heat sink
- core
- frame
- described heat
- laser medium
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- 238000005086 pumping Methods 0.000 claims abstract description 33
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000012809 cooling fluid Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 3
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 239000012141 concentrate Substances 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 230000003595 spectral effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
A side-surrounding pumping module for a rod-shaped laser medium comprises a quasi-microchannel liquid cooling heat sink and a bar packaged on the quasi-microchannel liquid cooling heat sink. The pumping light source of micro-channel refrigeration surrounds the rod-shaped solid laser medium, is uniformly distributed and directly irradiates. The utility model can concentrate the pumping power as high as possible; a uniform pumping optical field can be formed; the rapid cooling and constant temperature control of the pumping source can be realized, and the stable high-efficiency spectral coupling between the pumping source and the laser medium is ensured. The utility model discloses a modular can pile up, rotate so that improve pumping power by multiples, and obtain more even gain from the long stick.
Description
Technical field
The utility model relates to laser, and particularly a kind of side surrounding pumping module that is used for rod-shaped laser medium is particularly useful for assembling a large amount of high power laser diode linear array (being commonly called as " crust bar "), equably the side pumped solid laser medium.
Background technology
How to assemble the high power laser diode linear array (hereinafter to be referred as " crust bar ") of larger amt and form suitable optical field distribution, how to realize the quick cooling and the thermostatic control of pump light source, to improve the pump light gross power, keeping spectrum-stable and irradiation even, is the key problem of profile pump technology in the high-power all-solid-state laser.Crust bar size of devices is not little, and rod-shaped laser medium diameter limited, around it, arrange a lot of crust bars to become a great problem.Introduce the optical system of compression beam spreading and can allow that pumping source needn't squeeze near the very little space laser medium, but structure is very complicated, not only cost rises, and reliability reduces, and the uniformity of irradiation degenerates.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, a kind of side surrounding pumping module that is used for rod-shaped laser medium is provided, this pump module allows that crust bar output cavity face is very near from laser medium, allow and assemble a lot of crust bars around laser bar, realize high-power uniform pumping, can realize the quick cooling and the thermostatic control of pumping source simultaneously.That this pump module also has is integrated, modularization, firm antidetonation, reliable and stable, simple in structure and low cost and other advantages.
Technical solution of the present utility model is as follows:
A kind of side surrounding pumping module that is used for rod-shaped laser medium is the elementary cell that constitutes pumping source, and its characteristics comprise the heat sink dish piece of a ring-type with cooling fluid microchannel and are encapsulated in a plurality of crust bars on the heat sink dish piece inwall of this ring-type equably.
Describedly heat sinkly constitute by heat sink core and heat sink frame, this heat sink core is that a central shaft is to the annular block that has a cylindrical polygon through hole and that have a heat sink core opening, carve on the excircle of this heat sink core and be provided with many cooling fluid microchannel grooves, each plane of this polygon through-hole wall constitutes the platform of the described crust bar of encapsulation; Described heat sink frame is the dish piece that the center has the manhole that axial and a described heat sink core profile match, this manhole also has a heat sink frame opening to lead to the external of heat sink frame, the thickness of the dish piece of this heat sink frame is identical with the thickness of heat sink core annular block, this heat sink frame also is provided with the cooling passage that connects described microchannel groove and extraneous liquid coolant sources, described heat sink core is packed in the manhole of described heat sink frame after the combination, described heat sink core opening and described heat sink frame opening overlaid are for the electrode outlet line support is set.
Described heat sink frame is that profile is circular or rectangle or other polygonal dish piece.
The thickness of the highly heat-conductive material layer between groove bottom, described microchannel and the polygon via bottoms, promptly the distance to crust bar substrate is hundred micron dimensions.
Described heat sink frame also is provided with a plurality of rotational symmetric location structure for the pump module assembling, and this location structure is many to mutually nested detent and positioning convex, or many to mutually nested positioning through hole and inserted link.
Described crust bar crust bar has 1 centimetre of the length of standard, is encapsulated in width and is on 2 millimeters the high heat conductive insulating pottery, is encapsulated on the inwall platform of polygon through hole of described heat sink core again.
Technique effect of the present utility model with respect to prior art, the utlity model has three big advantages:
The first, to assemble the crust bar of maximum quantity and evenly arrange around the cylindrical sides of rod-shaped laser medium, ten minutes is pump-coupling closely, thereby can concentrate high as far as possible pump power, forms pumping light field very uniformly;
The second, cooling fluid is close to the crust bar and is formed the turbulent flow that window is walked heat, by the best Heat Conduction Material thin layer refrigeration crust bar of thick only hundreds of micron, can realize cooling and thermostatic control fast, guarantees high efficiency spectrum coupling stable between pumping source and the laser medium;
The 3rd, pump module of the present invention be with can pile up, rotatable dish piece is the module of elementary cell, is convenient to according to the length of rod-shaped laser medium pump module be piled up, and improves pump power exponentially, be convenient to obtain more uniform gain from long rod.
Description of drawings
Fig. 1 is the structure cutaway view that the present invention is used for the side surrounding pumping module embodiment of rod-shaped laser medium
Fig. 2 is the structure chart of heat sink core 1
Fig. 3 the utility model pump module is used for the status architecture schematic diagram of pumping rod-shaped laser medium.
Embodiment
The utility model is described in further detail below in conjunction with embodiment and accompanying drawing, but should not limit protection scope of the present invention with this.
See also Fig. 1 earlier, Fig. 1 is the structure cutaway view of the embodiment of the present invention's side surrounding pumping module of being used for rod-shaped laser medium, as seen from the figure, the utility model is used for the side surrounding pumping module of rod-shaped laser medium, comprises the heat sink dish piece of a ring-type with cooling fluid microchannel and is encapsulated in crust bar 3 on the heat sink dish piece of this ring-type.
The heat sink dish piece of described ring-type is made of heat sink core 1 and heat sink frame 2, this is heat sink, and core 1 is that central shaft is to the annular block that has a cylindrical polygon through hole and that have a heat sink core opening 103, carve on the excircle of this is heat sink core 1 and be provided with many cooling fluid microchannel grooves 101, each plane of this polygon through-hole wall constitutes the platform 102 of the described crust bar 3 of encapsulation; Described heat sink frame 2 is dish pieces that the center has the manhole that axial and described heat sink core 1 profile match, this manhole also has a heat sink frame opening 203 to lead to the external of heat sink frame 2, the thickness of the dish piece of this is heat sink frame 2 is identical with the thickness of heat sink core 1 annular block, this is heat sink, and frame 2 also is provided with the cooling passage 202 of the liquid coolant sources that connects the described microchannel groove 101 and the external world, described heat sink core 1 is packed in the manhole of heat sink frame 2 after the combination, described heat sink core opening 103 and heat sink frame opening 203 overlaids are for electrode outlet line support 4 is set.
Described heat sink frame 2 is that profile is circular or rectangle or other polygonal dish piece.
The thickness of the highly heat-conductive material layer between groove 101 bottoms, described microchannel and the polygon via bottoms, promptly the distance to crust bar substrate is hundred micron dimensions.
Described heat sink frame 2 also is provided with the location structure of assembling for a plurality of identical pump modules of the utility model 201, and this location structure 201 is many to mutually nested detent and positioning convex, or many to mutually nested positioning through hole and inserted link.
Described crust bar 3 has 1 centimetre of the length of standard, is encapsulated in width and is on 2 millimeters the high heat conductive insulating pottery, is encapsulated on the inwall platform 102 of polygon through hole of described heat sink core 1 again.
The utility model pump power according to actual needs and allow the space size of arranging is designed to assemble N side pumping module that clings to bar., minimum laser rod diameter 2 millimeter wide about 2 millimeters, 0.5 millimeter of the thinnest cooling fluid bed thickness and 0.5 millimeter these dimension limit of the thinnest coolant jacket thickness of pipe wall by crust bar substrate as can be known, the value of N can reach 5 at least.
Be that example describes now with the pump module of assembling 9 crust bars.
Fig. 1 is that the utility model is used for the example structure schematic diagram of rod-shaped laser medium around side pumping module, comprising: heat sink core 1, heat sink frame 2, crust bar 3 and be total electrode 4 of crust bar group power supply.Heat sink core 1 adopts the stable highly heat-conductive material of physical and chemical performance, as red copper; Be designed to the annular block, the length of this annular block is slightly larger than the length of 1 centimetre of linear array of crust bar 3, and the center of heat sink core 1 has the through hole of nonagon, promptly causes nine planes, and each plane all provides the platform 102 of packaged high-power crust bar.Heat sink frame 2 adopts physical and chemical performance to stablize, have enough rigidity intensity, easy material processed, as brass; Heat sink frame 2 is got contour structures such as rectangle or circle, and the center has the manhole that matches with core sag 1; The installation and positioning structure (as the location hole in the present embodiment 201) of necessity when heat sink frame 2 has also designed cooling passage 202 that the liquid coolant sources in the microchannel 101 that connects core sag 1 and the external world links to each other and stack module.Heat sink core 1 and 2 combinations of heat sink frame constitute the accurate microchannel 101 of yardstick in hundred micron dimensions.The thickness of the highly heat-conductive material layer between groove 101 bottoms, accurate microchannel and the nonagon via bottoms promptly arrives the distance of clinging to the bar substrate, is controlled in the hundreds of micron.
Fig. 2 has disclosed the structure of heat sink core 1 with the machine drawing form.Its left figure is the half sectional view of right figure, can see clearly Chu, and the nonagon through hole that is positioned at heat sink core 1 center provides 9 platforms 102, is used for packaged high-power crust bar; On heat sink core 1, be carved with many cooling fluid microchannel grooves 101 around its circumference.
Crust bar 3 has 1 centimetre of the length of standard, is encapsulated in width and is about on 2 millimeters the high heat conductive insulating pottery.In the present embodiment, such crust bar has 9, is encapsulated in respectively on the wall of nonagon endoporus at heat sink core 1 center, promptly on 9 platforms 102.
So constitute whole pump module, its center has a polygonal through hole, for the rod-shaped laser medium 5 that is equipped with cooling fluid sleeve pipe 6 is installed.Therefore, this polygonal inscribed circle diameter should be designed to be slightly larger than the external diameter of laser bar cooling fluid sleeve pipe 6.
Fig. 3 has represented that the utility model pump module is used for the structural representation of the performance of pumping rod-shaped laser medium.Rod-shaped laser medium 5 and cooling fluid sleeve pipe 6 thereof are installed in the center polygon through hole of the utility model pump module, and its axis overlaps fully with the axis of polygon through hole.9 high-power crust bars 3 evenly are arranged on 9 platforms 102 around the heat sink core 1 of rod-shaped laser medium 5 and cooling fluid sleeve pipe 6 thereof, press close to the pumping laser rod.
Heat sink frame 2 has the passage 202 of cooling fluid, not only is communicated with accurate microchannel 101, and can connect with the cooling passage 202 of adjacent block, so that the need of stack module.Cooling fluid flows into the accurate microchannel 101 that is engraved on the heat sink core 1 by cooling passage 202, sees through the high heat conduction thin layer of hundreds of micron thickness, removes refrigeration and thermostatic control crust bar 3.Cooling fluid can be with pure deionized water, or have certain solution of good heat conductivility, anti-freezing property and bacteriostasis property, and pressure and flow by the control of circulation fluid cooling system, are implemented the adjusting and the thermostatic control of temperature usually simultaneously.Cooling fluid sleeve pipe 6 generally adopts quartz or glass material for rod-shaped laser medium provides the cooling fluid circulation, and outer surface is coated with the anti-reflection film at the pump light wavelength.
The utility model is used for the side surrounding pumping module of rod-shaped laser medium, can pile up arbitrarily easily as required, can improve pump power exponentially.Allow adjacent block around the different angle of axis tilt, might obtain gain more uniformly from long rod.
Claims (6)
1, a kind of side surrounding pumping module that is used for rod-shaped laser medium, be the elementary cell that constitutes pumping source, it is characterized in that comprising the heat sink dish piece of a ring-type with cooling fluid microchannel and many of being encapsulated in equably on the heat sink dish piece inwall of this ring-type cling to bars (3).
2, side surrounding pumping module according to claim 1, it is characterized in that described heat sink dish piece is made of heat sink core (1) and heat sink frame (2), this heat sink core (1) is that a central shaft is to having an annular block polygon through hole and that have the cylindrical of a heat sink core opening (103), carve on the excircle of this heat sink core (1) and be provided with many cooling fluid microchannel grooves (101), each plane of this polygon through-hole wall constitutes the platform (102) of the described crust bar of encapsulation (3); Described heat sink frame (2) is the dish piece that the center has the manhole that axial and described heat sink core (a 1) profile match, this manhole also has a heat sink frame opening (203) to lead to the external of heat sink frame (2), the thickness of the dish piece of this heat sink frame (2) is identical with the thickness of the annular block of described heat sink core (1), this heat sink frame (2) also is provided with the cooling passage (202) that connects described microchannel groove (101) and extraneous liquid coolant sources, described heat sink core (1) is packed in the manhole of described heat sink frame (2) after the combination, described heat sink core opening (103) and described heat sink frame opening (203) communicate, for electrode outlet line support (4) is set.
3, side surrounding pumping module according to claim 1 is characterized in that described heat sink frame (2) is that profile is circular or rectangle or other polygonal dish piece.
4, side surrounding pumping module according to claim 1 is characterized in that bottom the described microchannel groove (101) and the thickness of the highly heat-conductive material layer between the polygon via bottoms, and promptly the distance to crust bar substrate is hundred micron dimensions.
5, side surrounding pumping module according to claim 1, it is characterized in that described heat sink frame (2) also is provided with a plurality of rotational symmetric location structure (201) for the pump module assembling, this location structure (201) is many to mutually nested detent and positioning convex, or many to mutually nested positioning through hole and inserted link.
6, according to each described side surrounding pumping module of claim 1 to 5, it is characterized in that described crust bar (3) has 1 centimetre of the length of standard, be encapsulated in width and be on 2 millimeters the high heat conductive insulating pottery, be encapsulated in together again on the inwall platform (102) of polygon through hole of described heat sink core (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200732895U CN201113214Y (en) | 2007-08-03 | 2007-08-03 | Side-surrounding pump module for rod-shaped laser medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200732895U CN201113214Y (en) | 2007-08-03 | 2007-08-03 | Side-surrounding pump module for rod-shaped laser medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201113214Y true CN201113214Y (en) | 2008-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200732895U Expired - Fee Related CN201113214Y (en) | 2007-08-03 | 2007-08-03 | Side-surrounding pump module for rod-shaped laser medium |
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| CN (1) | CN201113214Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102545034A (en) * | 2011-04-21 | 2012-07-04 | 北京国科世纪激光技术有限公司 | Lateral pump module of semiconductor module |
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2007
- 2007-08-03 CN CNU2007200732895U patent/CN201113214Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102545034A (en) * | 2011-04-21 | 2012-07-04 | 北京国科世纪激光技术有限公司 | Lateral pump module of semiconductor module |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080910 |