CN201927886U - Horizontal array large-power semiconductor laser with substitutable chip - Google Patents
Horizontal array large-power semiconductor laser with substitutable chip Download PDFInfo
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- CN201927886U CN201927886U CN2010202233041U CN201020223304U CN201927886U CN 201927886 U CN201927886 U CN 201927886U CN 2010202233041 U CN2010202233041 U CN 2010202233041U CN 201020223304 U CN201020223304 U CN 201020223304U CN 201927886 U CN201927886 U CN 201927886U
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Abstract
The utility model discloses a horizontal array large-power semiconductor laser with a substitutable chip, comprising a refrigerator which is internally provided with a liquid channel, wherein a horizontal installation surface is arranged on the upper end surface of the refrigerator, a plurality of parallel and independent laser chip installation components are arranged on the horizontal installation surface, each laser chip installation component consists of a chip, a lower insulating sheet, an anode heat sink, an upper insulating sheet, a chip cathode connecting sheet and an electrode connecting sheet, which are sequentially stacked and fixed from top to bottom, the anode surface of the chip is connected with the anode heat sink, the cathode surface of the chip is connected with the electrode connecting sheet, and fixed plates are arranged at the upper ends of the plurality of laser chip installation components. In the utility model, a plurality of laser chips (bar chip) as a core, a laser chip installation component array is arranged in a horizontal direction, and the plurality of laser chip installation components commonly use one refrigerator, so that the heat resistance can be lowered, the heat dissipation capability can be improved, the output optical power of a laser is increased, and the laser beam quality can be greatly improved under the condition that an external alignment system is additionally arranged.
Description
Technical field
The utility model belongs to laser and makes the field, relates to a kind of semiconductor laser, especially a kind of horizontal-array high-power semiconductor laser capable of replacing chip.
Background technology
Along with improving constantly of semiconductor laser power output, conversion efficiency and stability, high power semiconductor lasers is in industry, and the application in medical treatment and the military affairs is more extensive, and the market demand is huge, and development prospect is more wide.At present, the subject matter that high power semiconductor lasers faced remains Output optical power, conversion efficiency, reliability, stability difference and the cost of laser than problems such as height, and these deficiencies have seriously restricted its application space.Outside the Pass the performance of laser is removed and to be had with chip, also with the heat radiation of laser with encapsulate relevant.Reliability and stability in order to improve laser reduce production costs, and it is necessary designing high-quality high-efficiency heat radiation structure.This also has higher requirement to encapsulating structure design simply, efficiently and cheaply and manufacturing.
At present, horizontal-array high-power semiconductor laser capable has had commercially produced product to occur.But still there is the defective of following several respects in existing product:
1) heat-sinking capability is poor: for conduction cooling type large power semiconductor laser array (E.Deichsel; D.
J.Meusel, etc., High Reliable qcw Laser Bars andStacks, Proceedings of SPIE, 2008.6876 (68760K)), this laser send only straight up.Distance between a plurality of crust bars is very near, can produce more heat when under high repetition pattern, working, these heats only rely on the metal heat sink of both sides to derive, heat dissipation path is long, is easy to cause the active area in the chip to produce hot concentrating, and makes the thermal change of laser get inhomogeneous, the wave length shift that finally causes laser, spectrum widening, stability descends, and poor reliability, useful life shorten.And a plurality of crust bars will make light-emitting area be in same horizontal level in the horizontal direction, and manufacture difficulty is very big.
2) replaceability is poor: for conduction cooling type large power semiconductor laser array and liquid refrigerating horizontal-array high-power semiconductor laser capable array (a kind of high power semiconductor lasers, China's utility model patent, publication number CN101071933, open November 14 2007 date), because the horizontal array structure is welded together by a plurality of crust bars, in case therefore power output and output beam that crust bar burns, short circuit or cisco unity malfunction just directly have influence on whole laser can not be replaced.Simultaneously, unspoiled crust bar also can slattern thereupon in the array, and therefore, manufacturing cost is very high.
3) can't carry out separately each chip aging: because existing horizontal array product adopts directly once the reflux method of moulding of a plurality of crust bars to make, therefore can't carry out wearing out separately to each chip before the assembling, after can only assembling entire device be carried out integral body and wear out.Like this, if wherein some or several crust bars burn, short circuit or cisco unity malfunction, entire device also will all lose efficacy.
4) chip-count is restricted: because existing patented product adopts once the reflux method of moulding of a plurality of crust bars to make, therefore number of chips can not be too big when producing, otherwise be difficult to guarantee installation accuracy and luminous consistency, so number of chips is controlled in the 3-4 usually, this has just limited the power expansion of horizontal array semiconductor laser.
5) cost height: because existing horizontal array product adopts once the reflux method of moulding of a plurality of crust bars to make, if whole aging in some or several crust bars burn, short circuit or cisco unity malfunction, entire device just can't be worked.Therefore the manufacturing cost of laser is very high.
6) useful life is short: in the process of laser works, the heat radiating effect that the existing level array product produces is not high, easily making laser produce more serious heat concentrates, cause that laser output wavelength drifts about, spectrum widening, stability descend, and finally causes the reliability of laser and useful life short.
The utility model content
The purpose of this utility model is to overcome the shortcoming of above-mentioned prior art, a kind of horizontal-array high-power semiconductor laser capable of replacing chip is provided, this semiconductor laser is made up of a plurality of independently chip installation components, the shared refrigerator of a plurality of chip installation components, and the heat radiation between each chip installation component can not interact.
The purpose of this utility model is achieved through the following technical solutions:
The horizontal-array high-power semiconductor laser capable of this replacing chip, be provided with the refrigerator of fluid passage in comprising, the upper surface of described refrigerator is a horizontal mounting surface, a plurality of being parallel to each other and chip of laser installation component independently arranged on the horizontal mounting surface, described chip of laser installation component is by chip and stack gradually fixing following insulating trip from bottom to top, positive pole is heat sink, go up insulating trip, chip negative pole brace and electrode connecting piece forms, the positive pole-face of described chip is connected with electrode connecting piece with anodal heat sink connection the, the negative pole face of chip; The upper end of described a plurality of chip of laser installation components is provided with fixed head, and described fixed head connects as one a plurality of chip of laser installation components.
Above-mentioned refrigerator is the strip block, and the inner shaft of refrigerator is to offering one or more of fluid passages.
The shape of cross section of aforesaid liquid passage is rectangle, circle or oval.
Above-mentioned refrigerator is made by the high material of thermal conductivity.
Above-mentioned refrigerator is made by copper, aluminium or copper-tungsten material.
Vertically be provided with many group screws on the horizontal mounting surface of above-mentioned refrigerator, the all corresponding through hole that is provided with on described following insulating trip, anodal heat sink, last insulating trip, chip negative pole brace and the electrode connecting piece, correspondence is provided with fixing hole on the fixed head, has bolt to pass on the fixing hole; A plurality of chip of laser installation components are fixed on the horizontal mounting surface by the cooperation of the screw of through hole on bolt, fixing hole, each parts and horizontal mounting surface.
Above-mentioned anodal heat sink be copper, copper-tungsten or ceramic material.
Electrode connecting piece on the above chip of laser installation component is made up of two copper sheet amalgamations, electrode connecting piece on the adjacent chip of laser installation component interconnects, and is on the electrode connecting piece on the chip of laser installation component in two outsides vertically to be provided with extraction electrode; The two ends of described fixed head are provided with the electrode draw-in groove.
The said fixing plate is the insulation material.
The utility model specifically has following some beneficial effect:
(1) replaceability is strong: owing to adopt each chip to encapsulate the manufacturing process of assembling then separately, each laser is independent mutually, and can be replaced rapidly under the condition of damaging, and therefore can directly not have influence on the operate as normal of other lasers.
(2) recoverability is strong: because each independent luminous chip of laser installation component of the present utility model is separate, can be replaced separately when damaging, so reparation property is strong, whole use cost is reduced.
(3) output wavelength of laser is alternative strong: because the utility model is in preparation process, can to each independently semiconductor laser chip carry out independent aging and test, so can carry out the selection of wavelength, thereby improve the consistent wavelength of laser.
(4) heat-sinking capability is strong: the utility model adopts the active heat removal mode of liquid refrigerating, chip is little apart from the spacing between the refrigerator, the heat-sinking capability that this can improve array greatly can make the power of laser expand greatly, satisfies side pump and special purpose to powerful requirement.
Description of drawings
Fig. 1 disassembles schematic diagram for structure of the present utility model;
Fig. 2 is a complete assembling schematic diagram of the present utility model.
Wherein: 1 is refrigerator; 2 are following insulating trip; 3 is anodal heat sink; 4 is chip; 5 is last insulating trip; 6 is chip negative pole brace; 7 is electrode connecting piece; 8 is extraction electrode; 9 is fixing hole; 10 is the refrigerator delivery port; 11 is the refrigerator water inlet; 12 is the electrode draw-in groove; 13 is fixed head; 14 is horizontal mounting surface; 15 is screw.
Embodiment
Below in conjunction with accompanying drawing the utility model is done and to be described in further detail:
Referring to Fig. 1, the horizontal-array high-power semiconductor laser capable of replacing chip of the present utility model, comprise a refrigerator 1 of making the strip block, the inner shaft of refrigerator 1 is to offering the one or more of fluid passages that are parallel to each other, fluid passage is respectively equipped with refrigerator water inlet 11 and refrigerator delivery port 10 at the two ends of refrigerator 1, the shape of cross section of fluid passage is rectangle, circle or oval.When refrigerator 1 inside was provided with many fluid passages, many fluid passages also can public one group of intake-outlet, and many group intake-outlets also can be set at the two ends of refrigerator 1 respectively.In order to improve radiating effect, this refrigerator 1 is made by the high material of thermal conductivity, as materials such as copper, aluminium or copper-tungstens.Refrigerator 1 upper surface is a horizontal mounting surface 14, array is placed with a plurality of being parallel to each other and chip of laser installation component (being to have three chip of laser installation component situations among the figure) independently on the horizontal mounting surface 14, wherein the chip of laser installation component by the chip 4 that is used for laser and stack gradually from bottom to top fixing following insulating trip 2, anodal heat sink 3, go up insulating trip 5, chip negative pole brace 6 and electrode connecting piece 7 and form, the positive pole-face of chip 4 is connected with anodal heat sink 3, and the negative pole face of chip 4, electrode connecting piece 7 and extraction electrode 8 are connected.The chip of laser installation component upper end of a plurality of arrays is provided with a fixed head 13 jointly.Vertically be provided with many group screws 15 on the horizontal mounting surface 14 of refrigerator 1, following insulating trip 2, anodal heat sink 3, go up all corresponding through hole that is provided with on insulating trip 5, chip negative pole brace 6, electrode connecting piece 7, extraction electrode 8 and the fixed head 13, correspondence is provided with fixing hole 9 on the fixed head 13, have bolt to pass on the fixing hole 9, a plurality of chip of laser installation components are fixed on the horizontal mounting surface 14 by the cooperation of the screw 15 of through hole on bolt, fixing hole 9, each parts and horizontal mounting surface 14.Thereby can a plurality of chip of laser installation components be connected as one by fixed head 13 and bolt.Above-mentioned positive pole is heat sink 3 can be set to illustrate laminated structure with step with compensation because the different thickness differences that cause of chip 4 with the thickness of last insulating trip 5, when chip 4 and last insulating trip 5 are same thickness, anodal heat sink 3 are set to not have the laminated structure of step, and this positive pole is heat sink 3 to adopt copper, copper-tungsten or ceramic materials.
As Fig. 1 and Fig. 2, electrode connecting piece 7 on the chip of laser installation component is made up of two copper sheet amalgamations, electrode connecting piece 7 on the adjacent chip of laser installation component interconnects, and is on the chip of laser installation component top electrode brace 7 in two outsides vertically to be provided with extraction electrode 8; The two ends of fixed head 13 are provided with electrode draw-in groove 12.When fixed head 13 was installed, extraction electrode 8 passed from electrode draw-in groove 12, reaches the two ends, top of fixed head 13, and fixed head 13 is made by the transparent insulation material, is convenient to observe the state of each chip of laser installation component.
Manufacture method of the present utility model is specific as follows:
1) processing as shown in Figure 1 anodal heat sink 3;
2), adopt paster technique or reflux technique chip 4 to be mounted on the upper side of positive pole heat sink 3 at the upper side metal-coated membrane of the heat sink 3 subsides chips of positive pole;
3) the good chip 4 of each paster is tested separately, to the chip 4 of each test passes carry out respectively 48 hours aging; Once test again after aging;
4) in the chip 4 of test passes, result according to thermal simulation is mated, select Wavelength matched chip 4, adopt paster technique or reflux technique, with electrode connecting piece 7, chip negative pole brace 6, go up insulating trip 5, anodal heat sink 3, insulating trip 2 and refrigerator 1 weld together down, realize the interconnected of chip 4 and electrode connecting piece 7, positive pole heat sink 3, form the chip of laser installation component of fastening electrical connection;
5) be arranged side by side many group chip of laser installation components, will organize (the utility model is an example with 3 lasers) chip of laser installation component correspondence more and be placed on the horizontal mounting surface 14 of refrigerator 1;
6) fixed head 13 is placed on above the whole chip of laser installation component array;
7) utilize at last bolt with refrigerator 1, down insulating trip 2, anodal heat sink 3, chip 4, go up insulating trip 5, chip negative pole brace 6, electrode connecting piece 7, extraction electrode 8 and fixed head 13 and link together, form fastening electrical connection; Make 1 * N horizontal-array high-power semiconductor laser capable (N＞1).
Operation principle of the present utility model is as follows
With the horizontal-array high-power semiconductor laser capable structure chart with three chip of laser installation components illustrated in figures 1 and 2 is example, the chip 4 (being the p-n junction semi-conducting material) that is connected on each the chip of laser installation component on the refrigerator 1 passes through electrode connecting piece 7 and extraction electrode 8 and power connection, chip 4 just converts electric energy to luminous energy, emits with the form of laser.The heat that produces during laser works conducts to down insulating trip 2 vertically downward by positive pole heat sink 3, these heats conduct on the horizontal mounting surface 14 of refrigerator 1 of the bottom from following insulating trip 2 again, these heats dispel the heat by refrigerator 1, the cooling fluid that flows through refrigerator 1 enters fluid passage in the refrigerator 1 by refrigerator water inlet 11, flowed out by refrigerator delivery port 10 then, the heat that sends when cooling fluid is worked chip 4 is taken out of.
The utility model is a core with a plurality of independently high power semiconductor lasers chips (crust bar), be arranged in chip of laser installation component array in the horizontal direction, the shared refrigerator of a plurality of chip of laser installation components, can improve heat-sinking capability, increase the Output optical power of laser, reduce thermal resistance, can improve laser beam quality greatly adding under the condition of colimated light system.
Claims (9)
1. the horizontal-array high-power semiconductor laser capable of a replacing chip, be provided with the refrigerator (1) of fluid passage in comprising, it is characterized in that: the upper surface of described refrigerator (1) is horizontal mounting surface (14), a plurality of being parallel to each other and chip of laser installation component independently arranged on the horizontal mounting surface (14), described chip of laser installation component is by chip (4) and stack gradually fixing following insulating trip (2) from bottom to top, anodal heat sink (3), last insulating trip (5), chip negative pole brace (6) and electrode connecting piece (7) are formed, the positive pole-face of described chip (4) is connected with anodal heat sink (3), and the negative pole face of chip (4) is connected with electrode connecting piece (7); The upper end of described a plurality of chip of laser installation components is provided with fixed head (13), and described fixed head (13) connects as one a plurality of chip of laser installation components.
2. the horizontal-array high-power semiconductor laser capable of replacing chip according to claim 1, it is characterized in that: described refrigerator (1) is the strip block, and the inner shaft of refrigerator (1) is to offering one or more of fluid passages.
3. the horizontal-array high-power semiconductor laser capable of replacing chip according to claim 2, it is characterized in that: the shape of cross section of described fluid passage is rectangle, circle or oval.
4. the horizontal-array high-power semiconductor laser capable of replacing chip according to claim 1, it is characterized in that: described refrigerator (1) is made by the high material of thermal conductivity.
5. the horizontal-array high-power semiconductor laser capable of replacing chip according to claim 4, it is characterized in that: described refrigerator (1) is made by copper, aluminium or copper-tungsten material.
6. the horizontal-array high-power semiconductor laser capable of replacing chip according to claim 1, it is characterized in that: vertically be provided with many group screws (15) on the horizontal mounting surface (14) of described refrigerator (1), the all corresponding through hole that is provided with on described following insulating trip (2), anodal heat sink (3), last insulating trip (5), chip negative pole brace (6) and the electrode connecting piece (7), fixed head (13) is gone up correspondence and is provided with fixing hole (9), and fixing hole has bolt to pass on (9); A plurality of chip of laser installation components are fixed on the horizontal mounting surface (14) by the cooperation of the screw (15) of through hole on bolt, fixing hole (9), each parts and horizontal mounting surface (14).
7. the horizontal-array high-power semiconductor laser capable of replacing chip according to claim 1 is characterized in that: described positive pole is heat sink (3) is copper, copper-tungsten or ceramic material.
8. the horizontal-array high-power semiconductor laser capable of replacing chip according to claim 1, it is characterized in that: the electrode connecting piece on the chip of laser installation component (7) is made up of two copper sheet amalgamations, electrode connecting piece (7) on the adjacent chip of laser installation component interconnects, and is on the electrode connecting piece (7) on the chip of laser installation component in two outsides vertically to be provided with extraction electrode (8); The two ends of described fixed head (13) are provided with electrode draw-in groove (12).
9. the horizontal-array high-power semiconductor laser capable of replacing chip according to claim 1 is characterized in that: described fixed head (13) is the insulation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202233041U CN201927886U (en) | 2010-06-11 | 2010-06-11 | Horizontal array large-power semiconductor laser with substitutable chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202233041U CN201927886U (en) | 2010-06-11 | 2010-06-11 | Horizontal array large-power semiconductor laser with substitutable chip |
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| CN201927886U true CN201927886U (en) | 2011-08-10 |
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| CN2010202233041U Expired - Fee Related CN201927886U (en) | 2010-06-11 | 2010-06-11 | Horizontal array large-power semiconductor laser with substitutable chip |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841127A (en) * | 2010-06-11 | 2010-09-22 | 西安炬光科技有限公司 | Horizontal-array high-power semiconductor laser capable of replacing chip |
| CN102570291A (en) * | 2011-12-20 | 2012-07-11 | 西安炬光科技有限公司 | Conduction cooling type high-power semiconductor laser and preparation method thereof |
| CN102646923A (en) * | 2012-04-26 | 2012-08-22 | 无锡亮源激光技术有限公司 | High-power water-cooled semiconductor laser |
| CN110445008A (en) * | 2019-08-13 | 2019-11-12 | 尚华 | A kind of changeable type laser element and its array |
| CN117497497A (en) * | 2023-12-29 | 2024-02-02 | 国网浙江省电力有限公司电力科学研究院 | Liquid cooling heat dissipation packaging structure of power module |
-
2010
- 2010-06-11 CN CN2010202233041U patent/CN201927886U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841127B (en) * | 2010-06-11 | 2012-05-09 | 西安炬光科技有限公司 | Horizontal-array high-power semiconductor laser capable of replacing chip |
| CN101841127A (en) * | 2010-06-11 | 2010-09-22 | 西安炬光科技有限公司 | Horizontal-array high-power semiconductor laser capable of replacing chip |
| EP2797186A4 (en) * | 2011-12-20 | 2015-08-12 | Xi An Focuslight Technologies Co Ltd | Conductively cooled high-power semiconductor laser and preparation method thereof |
| CN102570291A (en) * | 2011-12-20 | 2012-07-11 | 西安炬光科技有限公司 | Conduction cooling type high-power semiconductor laser and preparation method thereof |
| WO2013091459A1 (en) * | 2011-12-20 | 2013-06-27 | 西安炬光科技有限公司 | Conductively cooled high-power semiconductor laser and preparation method thereof |
| CN102570291B (en) * | 2011-12-20 | 2014-10-08 | 西安炬光科技有限公司 | Conduction cooling type high-power semiconductor laser and preparation method thereof |
| US9031105B2 (en) | 2011-12-20 | 2015-05-12 | Xi'an Focuslight Technologies, Co., Ltd. | Conduction cooled high power semiconductor laser and method for fabricating the same |
| CN102646923A (en) * | 2012-04-26 | 2012-08-22 | 无锡亮源激光技术有限公司 | High-power water-cooled semiconductor laser |
| CN102646923B (en) * | 2012-04-26 | 2015-09-23 | 无锡亮源激光技术有限公司 | High-power water-cooling formula semiconductor laser |
| CN110445008A (en) * | 2019-08-13 | 2019-11-12 | 尚华 | A kind of changeable type laser element and its array |
| US11224757B2 (en) | 2019-08-13 | 2022-01-18 | Hua Shang | Exchangeable laser unit and array thereof |
| CN117497497A (en) * | 2023-12-29 | 2024-02-02 | 国网浙江省电力有限公司电力科学研究院 | Liquid cooling heat dissipation packaging structure of power module |
| CN117497497B (en) * | 2023-12-29 | 2024-05-10 | 国网浙江省电力有限公司电力科学研究院 | Liquid cooling heat dissipation packaging structure of power module |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20170611 |