CN101640378A - Novel low-cost horizontal array liquid refrigeration semiconductor laser and manufacturing method thereof - Google Patents
Novel low-cost horizontal array liquid refrigeration semiconductor laser and manufacturing method thereof Download PDFInfo
- Publication number
- CN101640378A CN101640378A CN200910023746A CN200910023746A CN101640378A CN 101640378 A CN101640378 A CN 101640378A CN 200910023746 A CN200910023746 A CN 200910023746A CN 200910023746 A CN200910023746 A CN 200910023746A CN 101640378 A CN101640378 A CN 101640378A
- Authority
- CN
- China
- Prior art keywords
- piece
- refrigeration module
- little
- liquid refrigerating
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a novel low-cost horizontal array liquid refrigeration semiconductor laser and a manufacturing method thereof. The laser comprises a lower liquid refrigeration block, a seal ring, an anode lead strip, an anode connecting strip, micro-refrigeration modules, a cathode connecting strip, an insulating strip, a cathode lead strip and a return water block. Each group of water feeding holes on the upper end face of the lower liquid refrigeration block is respectively provided with the micro-refrigeration module, the anode connecting strip is clamped between the micro-refrigeration module and the lower liquid refrigeration block, and the cathode connecting strip and the return water block are sequentially stacked on the upper face of each micro-refrigeration module. The semiconductor laser has advantages of strong heat emission capability, high replaceability, low use-cost, long service life and high reliability and can realize high-power output of laser light.
Description
Technical field
The invention belongs to laser and make the field, relate to a kind of semiconductor laser, especially a kind of novel low-cost horizontal array liquid refrigeration semiconductor laser and preparation method thereof.
Background technology
Along with improving constantly of stability, conversion efficiency and the power output of semiconductor laser, the application of high power semiconductor lasers in industry, medical treatment and military affairs is more extensive, and the market demand is huge, and development prospect is more wide.
Along with the continuous fast development of the application of each laser, the requirement of each field noise spectra of semiconductor lasers is also more and more higher, and this just needs high power semiconductor lasers further to improve on Output optical power, conversion efficiency, reliability and stability.The performance of laser is except outside the Pass having with chip, also with the heat radiation of laser with encapsulate relevant.Reliability and stability in order to improve laser reduce production costs, and the encapsulating structure of designed for greater reliability and radiator structure efficiently can be taken into account simultaneously simple again and the low-cost design principle is that semiconductor laser design production will be pursued.
At present, horizontal-array high-power semiconductor laser capable has the conduction cooling type (as Michael Leers, Konstantin Boucke, Manfred Gotz, et al., Thermal resistance in dependenceof diode laser packages, In:Mark S.Zediker eds.Proceedings of 56 SPIE, 2008.6876 (687609)), (martial virtue is brave, Yan Diyong, Tang Chun for conduction liquid feeding system cold mould, Gao Songxin, high-average power face battle array diode laser analysis of heat transmission, the light laser and the particle beams, V13 (5), 2001.9) and micro channels liquid refrigeration mode (Rushikesh M.Patel, David K.Wagner, Allen D.Danner, Kam Fallahpour, Richard S.Stinnett, " Use of micro-channelcooling for high-power two-dimensional laser diode arrays ", SPIE, vol.634:466-474 (1992)) three kinds of packing forms.
For conduction cooling horizontal-array high-power semiconductor laser capable product, owing to adopt passive radiating mode, laser causes laser temperature too high when living heat is big easily, the wave length shift that causes laser, life-span and reliability decrease, therefore, power expansion is restricted.
For conduction liquid feeding system cold mould high power semiconductor lasers, the laser output of laser is vertically upward, the heat radiation of whole laser is to conduct heat on the insulating barrier of heat conduction by the metal electrode that connects chip of laser, conducted heat on the liquid chiller by insulating barrier, the heat of laser conducts the most at last again.This type of laser has following some deficiency:
1) therefore the process of moulding because a plurality of crust bars of employing directly once reflux can't carry out wearing out separately before the assembling to each chip, after can only assembling entire device is carried out integral body and wears out.Like this, if wherein some or several crust bars burn, short circuit or cisco unity malfunction, entire device also will all lose efficacy.
2) production technology of moulding because a plurality of crust bars of employing once reflux, therefore chip-count can not be too many, otherwise be difficult to guarantee accurately location and luminous consistency, so chip-count can only be limited in 3-4 usually, this has just limited the power expansion of horizontal array semiconductor laser.
3) influence of heat intersection and accumulation is serious, and distance is very near each other owing to the chip that welds, and can produce hot hot cross influence; And coolant is that heat is taken away in series connection, and this can make the next laser of being accumulated to of a laser heat, causes the temperature distributing disproportionation on a plurality of lasers even, thereby causes output wavelength inconsistent.
In sum, although this type of laser can wear out separately, radiating effect is still not good, and the power expansion of laser still is restricted.
For the large power semiconductor laser array that uses the micro channels liquid refrigerator, though adopt active heat removal, heat-sinking capability strengthens, and the power of laser is greatly improved, because the micro channels liquid refrigerator is own not enough, makes its cost very high.Difficulty of processing is very big, and the higher price of such horizontal array laser that causes of cost is very high.Particularly, this type of laser has the defective of following several respects:
1) operation and maintenance cost height.Because the cooling fluid of this refrigerator directly contacts with the electronic device both positive and negative polarity, therefore when work, must use high-quality deionized water, to prevent the both positive and negative polarity conducting as coolant.Deionized water cost height, and the necessary in use low conductivity that keeps deionized water, so the operation and maintenance cost is very high.
2) difficulty of processing is big.The micro channels liquid refrigerator is by the stacked machine-shaping of which floor very thin copper sheet, and inner microchannel is approximately 300 microns.In manufacture process, need process accurately each layer copper sheet, so that the microchannel after stacked is in the strong turbulent flow of the out-of-date formation heat-sinking capability of flow of liquid.Therefore, the accurate processing of microchannel refrigerator is a difficult point.
3) manufacturing cost height.Because the Precision Machining difficulty of microchannel refrigerator is quite big, its manufacturing cost also is very high.
4) useful life is short.In the process of laser works, if when having impurity in the coolant (being generally deionized water), these impurity are easy to attached on the inwall of microchannel, thereby cause the electrochemical corrosion of microchannel tube wall, may be when serious with the tube wall eating thrown of microchannel refrigerator, the fail safe of laser is caused greatly influence.These all badly influence the useful life of laser.
5) seal request height.Because the flowing space of coolant is very narrow and small in the refrigerator of microchannel, therefore be easy to generate unnecessary pressure and fall, air-proof condition is abominable.
Summary of the invention
The objective of the invention is to overcome the shortcoming of above-mentioned prior art, a kind of novel low-cost horizontal array liquid refrigeration semiconductor laser and preparation method thereof is provided, this semiconductor laser is assembled by the refrigeration unit of a plurality of individual packages, the shared big liquid refrigerating piece of a plurality of refrigeration units, refrigeration in parallel, can effectively improve heat-sinking capability, and the heat radiation between each refrigeration unit can not interact.Can effectively increase the Output optical power of laser, reduce thermal resistance, improve the beam quality of laser.
The objective of the invention is to solve by the following technical programs:
This novel low-cost horizontal array liquid refrigeration semiconductor laser comprises little refrigeration module, negative pole brace and the backwater piece of liquid refrigerating piece, positive strap, microarray strip down.The described upper surface of liquid refrigerating piece down is provided with two groups or more paddle hole, described every group of paddle hole comprises an over entry hole and a water-exit vertically hole, the described over entry hole following liquid refrigerating piece horizontal blasthole interior with being located at down the liquid refrigerating piece communicates, and the described water-exit vertically hole following liquid refrigerating piece horizontal apopore interior with being located at down the liquid refrigerating piece communicates; Described little refrigeration module is provided with refrigeration module blasthole and refrigeration module apopore; On the described down liquid refrigerating piece upper surface with respect to every group of paddle hole, be provided with two or more than two separate little refrigeration module side by side, be equipped with positive strap between each little refrigeration module and the following liquid refrigerating piece, be equipped with the negative pole brace above each little refrigeration module, described negative pole brace is provided with the backwater piece; The refrigeration module blasthole of each little refrigeration module and refrigeration module apopore are communicated with the over entry hole and the water-exit vertically hole of every group of paddle hole on the following liquid refrigerating piece respectively.
Above-mentioned little refrigeration module comprises copper brace and little liquid refrigerating chip, little liquid refrigerating chip is the polygon sheet, the middle part of little liquid refrigerating chip vertically offers fixing hole, the both sides of fixing hole are respectively equipped with refrigeration module blasthole and refrigeration module apopore, be provided with radiating fin in the described refrigeration module blasthole, described little liquid refrigerating chip is provided with chip installation area at the end near the refrigeration module blasthole, the chip installation area of described little liquid refrigerating chip is provided with heat sink and chip, heat sink positive pole-face with chip is fitted, the negative pole face of described chip and copper brace are fitted, and also are provided with insulating trip between described copper brace and the little liquid refrigerating chip.
The upper end open place in the over entry hole on the above-mentioned liquid refrigerating piece down is provided with deep gouge, also can be provided with circle and wait other shape deep gouges, and described deep gouge is provided with waterproof grommet.
Above-mentioned negative pole brace 18 all is fixed on the following liquid refrigerating piece 22 with positive strap 20, described negative pole brace 18 is connected with positive strap 20 under adjacent little refrigeration module 27, make every group of negative pole brace 18 of each little refrigeration module 27 upper and lower sides and the electrical connection form that positive strap 20 forms series connection, described negative pole brace 18 is drawn by negative pole leader 28; Described positive strap 20 is drawn by anodal leader 21.
The middle part of above-mentioned negative pole brace and little refrigeration module is equipped with bolt hole, be provided with one group of vertical bolt hole between the upper surface of described down liquid refrigerating piece and lower surface, be provided with the backwater intercommunicating pore in the described backwater piece, the lower surface of backwater piece is provided with backwater piece inlet opening and backwater piece apopore, backwater piece inlet opening and backwater piece apopore communicate with the backwater intercommunicating pore, also be provided with backwater piece fixing threaded hole on the lower surface of backwater piece, described backwater piece, little refrigeration module and negative pole brace by bolt on following liquid refrigerating piece.
A kind of preparation method of above-mentioned laser specifically may further comprise the steps:
1) on little liquid refrigerating chip of little refrigeration module, makes cold module apopore and fixing hole, and when processing refrigeration module blasthole, process fin simultaneously;
2) the little liquid refrigerating chip behind the cleaning, drying is done electroplating processes, with anticorrosion
4) adopt paster technique with the positive pole of chip be welded to heat sink on; With reflux technique heat sink, chip and insulating trip and little liquid refrigerating chip and copper brace are welded together again;
5) aperture of the horizontal blasthole of liquid refrigerating piece and the horizontal apopore of following liquid refrigerating piece should be greater than the aperture of refrigeration module blasthole and refrigeration module apopore at present for perforate on following liquid refrigerating piece, perforate;
6) the over entry hole that earlier each waterproof grommet is placed on down the liquid refrigerating piece is respectively located, then each positive strap is placed on down on the liquid refrigerating piece, put little refrigeration module of microarray strip more in the above, respectively each negative pole brace and backwater piece are overlayed successively the top of little refrigeration module then, anodal leader is clipped under the positive strap on the limit, the negative pole leader is clipped under the negative pole brace on the limit, wherein, a previous negative pole brace and a back positive strap link together, separate next negative pole brace with insulating trip afterwards, form the electrical connection of series connection, the negative pole of last little refrigeration module is directly drawn by the negative pole leader, and is fixed on down the reliability to guarantee to be electrically connected on the liquid refrigerating piece with fixed screw.At last, total connects with bolt, makes described laser.
Above-mentioned heat sink material is copper, copper-tungsten or the high material of other thermal conductivitys.
Above-mentioned steps 4) in, described connection chip and heat sink material are scolder
Above-mentioned steps 4) in,, adopt slicken solder to connect chip and little liquid refrigerating chip if the chip installation area of little liquid refrigerating chip does not have step.
The present invention has following beneficial effect:
(1). heat-sinking capability is strong: the present invention adopts the active heat removal mode, liquid directly dashes to heat sink below, laser generates heat position, rapidly heat is taken away, and has improved the heat-sinking capability of array laser greatly, the expansion of power be can easily realize, side pump or special purpose satisfied powerful requirement.
(2). replaceability is strong: owing to adopt each laser (little refrigeration module of microarray strip) to encapsulate the manufacturing process of assembling then separately, each laser can be made separately, independent mutually, if damaging, single laser can be replaced rapidly, therefore can not have influence on the operate as normal of other lasers.
(3). use cost is low: because the horizontal array structure, each independent luminous semiconductor laser can be replaced separately when damaging, and the use cost of whole horizontal array laser is reduced.
(4). can realize the high-power output of laser: because the form of little refrigerator employing radiating fin in the little refrigeration module that adopts, refrigerating capacity improves greatly, the number of the laser of horizontal array can increase greatly, can realize bigger laser power output like this, can under the pattern of continuous (CW) and quasi-continuous (QCW), work.
(5). the life-span is long, reliability is high: have the advantages that according to semiconductor laser provided by the present invention the life-span is long, reliability is high, stability is high and small.
Description of drawings
Fig. 1 is the schematic diagram of disassembling of the present invention;
Fig. 2 is embodiment one structural representation of little refrigeration module 27 of microarray strip 2 of the present invention;
Fig. 3 is the structural representation of liquid refrigerating piece 22 down of the present invention;
Fig. 4 is the cutaway view of liquid refrigerating piece 22 down of the present invention;
Fig. 5 is the structure cutaway view of backwater piece 17 of the present invention;
Fig. 6 is embodiment two structural representations of little refrigeration module 27 of microarray strip 2 of the present invention;
Fig. 7 is an overall structure schematic diagram of the present invention;
Fig. 8 is a heat radiation schematic diagram of the present invention.
Wherein: 1 is heat sink; 2 is chip; 3 is the refrigeration module blasthole; 4 is radiating fin; 5 is fixing hole; 6 is insulating trip; 7 is little liquid refrigerating chip; 8 is the copper brace; 9 is the refrigeration module apopore; 10 is rubber seal; 11 are the following horizontal blasthole of liquid refrigerating piece; 12 are the following horizontal apopore of liquid refrigerating piece; 13 is the brace fixing hole; 14 is the water-exit vertically hole; 15 is the bolt hole; 16 are the over entry hole; 17 is the backwater piece; 18 is the negative pole brace; 19 is insulating trip; 20 are positive strap; 21 is anodal leader; 22 are following liquid refrigerating piece; 23 is waterproof grommet; 24 is backwater piece delivery port; 25 is backwater piece fixing threaded hole; 26 is backwater piece water inlet; 27 is little refrigeration module; 28 is the negative pole leader; 29 is deep gouge; 30 is the backwater intercommunicating pore; 31 is heat.
Embodiment
Below in conjunction with accompanying drawing the present invention is done and to describe in further detail:
Referring to Fig. 1 and Fig. 7, (Fig. 7 is the integral outer structural representation that the present invention has assembled; Fig. 1 is that each parts of Fig. 7 are disassembled schematic diagram) laser of the present invention mainly is to be assemblied by down little refrigeration module 27, negative pole brace 18 and the backwater piece 17 of liquid refrigerating piece 22, positive strap 20, microarray strip 2, also includes some accessories in addition as rubber seal 10, insulating trip 19, waterproof grommet 23 and necessary bolt or screw.
Referring to Fig. 3 and Fig. 4, the upper surface of following liquid refrigerating piece 22 is provided with two groups or more paddle hole (having provided the situation of three groups of paddle holes among the figure), and every group of paddle hole comprises an over entry hole 16 and a water-exit vertically hole 14.The inside of following liquid refrigerating piece 22 also offers the parallel water hole of twice, they are respectively horizontal blasthole 11 of following liquid refrigerating piece and the horizontal apopore 12 of following liquid refrigerating piece, each over entry hole 16 all be located at down liquid refrigerating piece 22 in the horizontal blasthole 11 of following liquid refrigerating piece communicate, all interior with being located at the down liquid refrigerating piece 22 horizontal apopore 12 of following liquid refrigerating piece in each water-exit vertically hole 14 communicates.In order to increase the turbulent extent of cooling water in the duct, the upper end open place in over entry hole 16 is provided with deep gouge 29, and deep gouge 29 can be arranged to rectangle, as shown in FIG., also can be designed to other shapes according to the design needs.As water hole 16, and deep gouge 29 is provided with waterproof grommet 23 to the bore of deep gouge 29 much larger than vertical, and deep gouge 29 edges are processed with step, and waterproof grommet 23 is installed on the step.Also be provided with one group of vertical bolt hole 15 between the upper surface of following liquid refrigerating piece 22 and lower surface, the lower end of screw thread fixing hole 15 is provided with counterbore and is used for the construction bolt head, the position of screw thread fixing hole 15 is between the over entry hole 16 of every group of paddle hole and water-exit vertically hole 14, and following liquid refrigerating piece 22 is provided with step on the face at 14 places, water-exit vertically hole.
Referring to Fig. 2 and Fig. 6, little refrigeration module 27 is provided with refrigeration module blasthole 3 and refrigeration module apopore 9, as Fig. 2 is embodiment one concrete structure of little refrigeration module 27: little refrigeration module 27 comprises copper brace 8 and little liquid refrigerating chip 7, little liquid refrigerating chip 7 is the polygon sheet, the middle part of little liquid refrigerating chip 7 vertically offers fixing hole 5, the both sides of fixing hole 5 are respectively equipped with refrigeration module blasthole 3 and refrigeration module apopore 9, and are provided with radiating fin 4 in the refrigeration module blasthole 3.Little liquid refrigerating chip 7 is being provided with chip installation area near an end of refrigeration module blasthole 3, and the chip installation area of described little liquid refrigerating chip 7 is provided with heat sink 1 and chip 2 since be provided with among this embodiment heat sink 1, so be provided with a step at chip installation area.Heat sink 1 fits with the positive pole-face of chip 2, and the negative pole face of chip 2 and 8 applyings of copper brace also are provided with insulating trip 6 between copper brace 8 and the little liquid refrigerating chip 7.As Fig. 6 is the structural representation of the embodiment two of little refrigeration module 27, and it is heat sink 1 that this structure that different with Fig. 2 is has been saved, and at chip installation area step need not be set like this, and the positive pole-face of chip 2 directly is affixed on on the liquid chiller 7.Whether specifically be provided with heat sinkly 1, it is fixed to come according to user's needs.
Referring to Fig. 5, be provided with backwater intercommunicating pore 30 in the backwater piece 17, backwater connecting hole 30 is blind holes, its openend is blocked with stopper usually and is prevented from cooling water flow out of (not drawing among the figure).The lower surface of backwater piece 17 is provided with backwater piece inlet opening 26 and backwater piece apopore 24, and backwater piece inlet opening 26 and backwater piece apopore 24 communicate with backwater intercommunicating pore 30, also are provided with backwater piece fixing threaded hole 25 on the lower surface of backwater piece 17.
The shape of negative pole brace 18 is according to little refrigeration module 27 designs, and it is according to refrigeration module blasthole 3 and the refrigeration module apopore 9 and the corresponding through hole that offers of bolt hole of little refrigeration module 27.Positive strap 20 is a small pieces sheet metal, and its refrigeration module apopore 9 corresponding to little refrigeration module 27 offers through hole.
Corresponding relation between each parts of the present invention is as follows:
On following liquid refrigerating piece 22 upper surfaces with respect to every group of paddle hole, be provided with two or more than two separate little refrigeration module 27 (being three the situation that is provided with among Fig. 1 and Fig. 7) side by side, be equipped with positive strap 20 between each little refrigeration module 27 and the following liquid refrigerating piece 22, be equipped with negative pole brace 18 above each little refrigeration module 27.Each negative pole brace 18 is provided with backwater piece 17; The refrigeration module blasthole 3 of each little refrigeration module 27 and refrigeration module apopore 9 are communicated with the over entry hole 16 and the water-exit vertically hole 14 of every group of paddle hole on the following liquid refrigerating piece 22 respectively.Simultaneously, the refrigeration module blasthole 3 of each little refrigeration module 27 and refrigeration module apopore 9 also are communicated with backwater piece inlet opening 26 and backwater piece apopore 24 on the backwater piece 17 respectively.Deep gouge 29 on the following liquid refrigerating piece 22 on the over entry hole 16 of every group of paddle hole is in below little refrigeration module 27, and fits by waterproof grommet 23 and little liquid refrigerating chip 7 of little refrigeration module 27.Positive strap 20 is installed on down liquid refrigerating piece 22 on the step on the face at 14 places, water-exit vertically hole, each positive strap 20 and little liquid refrigerating chip 7 following applyings of each little refrigeration module 27 respectively, and first positive strap 20 directly is connected with anodal leader 21, next positive strap is connected with a last negative pole brace, each negative pole brace 18 is fitted with the copper brace 8 on each little refrigeration module 27, and each negative pole brace 18 interconnects with next positive strap 20, be every group of negative pole brace 18 of each little refrigeration module 27 upper and lower sides and the electrical connection form that positive strap 20 forms series connection, the negative pole brace 18 of last little refrigeration module is directly drawn by negative pole leader 28.Each negative pole brace 18 of each positive strap 20 and its correspondence all by screw on one group of brace fixing hole 13 of liquid refrigerating piece 22 sides down, and between every group of positive strap 20 and negative pole brace 18, be provided with the insulating trip 19 that is used to insulate.
Manufacturing process of the present invention is as follows:
(1) on little liquid refrigerating chip 7, makes cold module apopore 9 and fixing hole 5, and when processing refrigeration module blasthole 3, process fin 4 simultaneously;
(2) the little liquid refrigerating chip 7 behind the cleaning, drying is done electroplating processes, with anticorrosion;
(3) adopt paster technique to utilize hard solder (gold-tin alloy) that the positive pole (p face) of chip 2 is welded on heat sink 1; With reflux technique heat sink 1, chip 2 and insulating trip 6 are welded (as shown in Figure 2) with little liquid refrigerating chip 7 and copper brace 8 again; If the chip installation area of little liquid refrigerating chip 7 does not have step, adopt slicken solder to connect chip 2 and little liquid refrigerating chip 7.
(4) perforate on following liquid refrigerating piece 22, the perforate aperture of the horizontal blasthole 11 of liquid refrigerating piece and the horizontal apopore 12 of following liquid refrigerating piece at present should be slightly larger than the aperture of refrigeration module blasthole 3 and refrigeration module apopore 9, guarantee that current are steady;
(5) earlier N waterproof grommet 23 is placed on down 16 places, over entry hole of liquid refrigerating piece 22, then positive strap 20 is placed on down on the liquid refrigerating piece 22, more little refrigeration module 27 of laid parallel N microarray strip 2 in the above.Respectively negative pole brace 18 and backwater piece 17 are overlayed successively the top of little refrigeration module 27 then, anodal leader 21 is clipped in positive strap 20 times on the limit, outwards is fixed on down the edge of liquid refrigerating piece in the positive strap 21 of little liquid refrigerating module 27, a last negative pole brace 18, insulating trip 19 and negative pole leader 28 are had successively; Wherein, separate with insulating trip 19 between negative pole brace 18 and the positive strap 20, and be fixed on down the reliability to guarantee to be electrically connected on the liquid refrigerating piece 22 with fixed screw.At last, total connects with bolt;
(6) test guarantees that the parameters index dispatches from the factory after all qualified.
The course of work of the present invention is such:
The p-n junction semiconductive luminescent materials that is connected between the both positive and negative polarity on the chip 2 is coupled with forward bias, and the p district connects positive pole, and the n district connects negative pole.The electric field of forward voltage is opposite with the built-in field direction of p-n junction, it has weakened the inhibition of built-in field to electrons spread motion in the crystal, free electron in the n district is spread to the p district by p-n junction under the effect of forward voltage incessantly, when in the interface, having simultaneously electronics in a large amount of conduction bands and the hole in the valence band, they will produce compound in the injection region, when valence band was arrived in the electron transition in the conduction band, unnecessary energy just emitted with the form of light.Heating during laser works utilizes little refrigeration module 27 shown in Figure 2 to dispel the heat.Referring to Fig. 8, cooling fluid enters into each over entry hole 16 from the horizontal blasthole 11 of following liquid refrigerating piece of following liquid refrigerating piece 22, sudden expansion in deep gouge 29, the cooling fluid large tracts of land contacts little refrigeration module 27 downside of die sites is installed, refrigeration module blasthole 3 from each little refrigeration module 27 absorbs the heat 31 that sends when chip 2 is worked through radiating fin 4 then, upwards flow into the backwater piece inlet opening 26 of backwater piece 17 afterwards, the refrigeration module apopore 9 of flowing through behind backwater intercommunicating pore 30 and backwater piece apopore 24 enters each water-exit vertically hole 14, discharge the horizontal apopore of following liquid refrigerating piece 12 backs that converge to down at last liquid refrigerating piece 22, and heat is taken out of.
In sum, the present invention compares with micro channels liquid refrigeration semiconductor laser array product, the present invention can greatly reduce cost, reduce thermal resistance under the condition that satisfies the requirement of use power and duty ratio, overcome the excessive difficult point of coolant pressure drop simultaneously, satisfying the high-output power that guarantees laser under the prerequisite of beam quality.
Technical scheme of the present invention is not limited to above description to embodiment, also be not limited to the version shown in the Figure of description, any be equal to or be similar to technical scheme of the present invention all will fall into interest field of the present invention, below list the part alternative that the present invention can also adopt:
1. heat sink 1 material is the composite material of copper, copper-tungsten, diamond or diamond and copper
2. the radiating fin 4 of little liquid refrigerating chip 7 can different (comprising netted, round), and the position can be different angles with diagram fin direction.
3. the intake-outlet of entire semiconductor device is not limited to and all is arranged on the liquid refrigerating piece 22, also water inlet can be located at down on the liquid refrigerating piece 22, and delivery port is located on the backwater piece 17.
4. descend the intake-outlet on the liquid refrigerating piece 22 also can be distributed in the left and right sides in the same side.Can have only a water inlet and a delivery port, also more than one intake-outlet can be arranged.
5. descend the cross section of the refrigerating fluid passage (as over entry hole 16, water-exit vertically hole 14, refrigeration module apopore 9, refrigeration module blasthole 3 or the like) on liquid refrigerating piece 22 and the little refrigeration module 27 can be Any shape, as rectangle, ellipse etc.
6. backwater piece 17 can be discrete separately, and is corresponding one by one with little refrigeration module 27, also can be as a whole, and the material of backwater piece 17 can be metal or nonmetallic materials.
Claims (8)
1. novel low-cost horizontal array liquid refrigeration semiconductor laser, comprise liquid refrigerating piece (22) down, positive strap (20), little refrigeration module (27) of microarray strip (2), negative pole brace (18) and backwater piece (17), it is characterized in that: be provided with down horizontal blasthole of liquid refrigerating piece (11) and the horizontal apopore of following liquid refrigerating piece (12) in the liquid refrigerating piece (22) under described, the described upper surface of liquid refrigerating piece (22) down is provided with two groups or more paddle hole, described every group of paddle hole comprises an over entry hole (16) and a water-exit vertically hole (14), described over entry hole (16) communicates with the horizontal blasthole of following liquid refrigerating piece (11), and described water-exit vertically hole (14) communicates with the horizontal apopore of following liquid refrigerating piece (12); Described little refrigeration module (27) is provided with refrigeration module blasthole (3) and refrigeration module apopore (9); On described down liquid refrigerating piece (22) upper surface with respect to every group of paddle hole, be provided with two or more than two separate little refrigeration module (27) side by side, be equipped with positive strap (20) between each little refrigeration module (27) and the following liquid refrigerating piece (22), be equipped with negative pole brace (18) above each little refrigeration module (27), described negative pole brace (18) is provided with backwater piece (17); Upward over entry hole (16) and water-exit vertically hole (14) of every group of paddle hole are communicated with following liquid refrigerating piece (22) respectively for the refrigeration module blasthole (3) of each little refrigeration module (27) and refrigeration module apopore (9).
2. novel low-cost horizontal array liquid refrigeration semiconductor laser according to claim 1, it is characterized in that: described little refrigeration module (27) comprises copper brace (8) and little liquid refrigerating chip (7), little liquid refrigerating chip (7) is the polygon sheet, the middle part of little liquid refrigerating chip (7) vertically offers fixing hole (5), the both sides of fixing hole (5) are respectively equipped with refrigeration module blasthole (3) and refrigeration module apopore (9), be provided with radiating fin (4) in the described refrigeration module blasthole (3), described little liquid refrigerating chip (7) is provided with chip installation area at the end near refrigeration module blasthole (3), the chip installation area of described little liquid refrigerating chip (7) is provided with heat sink (1) and chip (2), fit with the positive pole-face of chip (2) heat sink (1), the negative pole face of described chip (2) and copper brace (8) are fitted, and also are provided with insulating trip (6) between described copper brace (8) and the little liquid refrigerating chip (7).
3. novel low-cost horizontal array liquid refrigeration semiconductor laser according to claim 1, it is characterized in that: the upper end open place in the over entry hole (16) on the described liquid refrigerating piece (22) down is provided with deep gouge (29), and described deep gouge (29) is provided with waterproof grommet (23).
4. novel low-cost horizontal array liquid refrigeration semiconductor laser according to claim 1, it is characterized in that: described negative pole brace (18) all is fixed on the following liquid refrigerating piece (22) with positive strap (20), described negative pole brace (18) is connected with positive strap (20) under adjacent little refrigeration module (27), make every group of negative pole brace (18) of each little refrigeration module (27) upper and lower sides and the electrical connection form that positive strap (20) forms series connection, described negative pole brace (18) is drawn by negative pole leader (28); Described positive strap (20) is drawn by anodal leader (21).
5. novel low-cost horizontal array liquid refrigeration semiconductor laser according to claim 1, it is characterized in that: the middle part of described negative pole brace (18) and little refrigeration module (27) is equipped with bolt hole, be provided with one group of vertical bolt hole (15) between the upper surface of described down liquid refrigerating piece (22) and lower surface, be provided with backwater intercommunicating pore (30) in the described backwater piece (17), the lower surface of backwater piece (17) is provided with backwater piece inlet opening (26) and backwater piece apopore (24), backwater piece inlet opening (26) and backwater piece apopore (24) communicate with backwater intercommunicating pore (30), also be provided with backwater piece fixing threaded hole (25) on the lower surface of backwater piece (17), described backwater piece (17), little refrigeration module (27) and negative pole brace (18) by bolt on following liquid refrigerating piece (22).
6. the preparation method of the described laser of claim 1 is characterized in that, may further comprise the steps:
1) on little liquid refrigerating chip (7) of little refrigeration module (27), makes cold module apopore (9) and fixing hole (5), and when processing refrigeration module blasthole (3), process fin (4) simultaneously;
2) the little liquid refrigerating chip (7) behind the cleaning, drying is done electroplating processes;
4) adopt paster technique that the positive pole of chip (2) is welded on heat sink (1); With reflux technique heat sink (1) is attached to little liquid refrigerating chip (7) one ends again, and insulating trip (6) is attached to the upper side of little liquid refrigerating chip (7), on insulating trip (6), stick copper brace (8);
5) go up perforate at following liquid refrigerating piece (22), the aperture of the horizontal blasthole of liquid refrigerating piece (11) and the horizontal apopore of following liquid refrigerating piece (12) should be greater than the aperture of refrigeration module blasthole (3) and refrigeration module apopore (9) at present in perforate;
6) the over entry hole (16) that earlier each waterproof grommet (23) is placed on down liquid refrigerating piece (22) is respectively located, then each positive strap (20) is placed on down on the liquid refrigerating piece (22), put little refrigeration module (27) of microarray strip (2) more in the above, respectively each negative pole brace (18) and backwater piece (17) are overlayed successively the top of little refrigeration module (27) then, anodal leader (21) is clipped under the positive strap (20) on the limit, negative pole leader (28) is clipped under the negative pole brace (18) on the limit, wherein, previous negative pole brace (18) links together with a back positive strap that is adjacent (20), form the electrical connection of series connection, the negative pole brace (18) and the positive strap (20) of each little refrigeration module (27) upper and lower sides are separated with insulating trip (19), and be fixed on down upward reliability of liquid refrigerating piece (22) to guarantee to be electrically connected with fixed screw; At last, total connects with bolt, makes described laser.
7. the preparation method of laser according to claim 6 is characterized in that, the material of described heat sink (1) is the composite material of copper, copper-tungsten, diamond or diamond and copper.
8. the preparation method of laser according to claim 6 is characterized in that, in the step 4), if the chip installation area of little liquid refrigerating chip (7) does not have step, adopts slicken solder to connect chip (2) and little liquid refrigerating chip (7).
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100237463A CN101640378B (en) | 2009-08-31 | 2009-08-31 | Novel low-cost horizontal array liquid refrigeration semiconductor laser and manufacturing method thereof |
| EP10811090.9A EP2426795B1 (en) | 2009-08-31 | 2010-05-07 | Cooling module for laser, manufacture method thereof and semiconductor laser including the same |
| JP2012515314A JP5611334B2 (en) | 2009-08-31 | 2010-05-07 | Laser cooling module, manufacturing method, and semiconductor laser manufactured by the module |
| US13/378,294 US8737441B2 (en) | 2009-08-31 | 2010-05-07 | Cooling module for laser, fabricating method thereof, and semiconductor laser fabricated from the module |
| PCT/CN2010/000647 WO2011022923A1 (en) | 2009-08-31 | 2010-05-07 | Cooling module for laser, manufacture method thereof and semiconductor laser including the same |
| US14/250,337 US8989226B2 (en) | 2009-08-31 | 2014-04-10 | Cooling module for laser, fabricating method thereof, and semiconductor laser fabricated from the module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100237463A CN101640378B (en) | 2009-08-31 | 2009-08-31 | Novel low-cost horizontal array liquid refrigeration semiconductor laser and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101640378A true CN101640378A (en) | 2010-02-03 |
| CN101640378B CN101640378B (en) | 2011-12-28 |
Family
ID=41615234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100237463A Active CN101640378B (en) | 2009-08-31 | 2009-08-31 | Novel low-cost horizontal array liquid refrigeration semiconductor laser and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101640378B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841127A (en) * | 2010-06-11 | 2010-09-22 | 西安炬光科技有限公司 | Horizontal-array high-power semiconductor laser capable of replacing chip |
| WO2011022923A1 (en) * | 2009-08-31 | 2011-03-03 | 西安炬光科技有限公司 | Cooling module for laser, manufacture method thereof and semiconductor laser including the same |
| CN105048287A (en) * | 2015-08-12 | 2015-11-11 | 西安炬光科技股份有限公司 | Horizontal-array high-power semiconductor laser |
| CN109565148A (en) * | 2016-08-30 | 2019-04-02 | Nec显示器解决方案株式会社 | Light supply apparatus, projection display device and the method for cooling down semiconductor light-emitting elements |
| CN110401108A (en) * | 2019-07-31 | 2019-11-01 | 江苏天元激光科技有限公司 | A kind of high-power horizontal array column semiconductor laser |
| CN111342337A (en) * | 2020-03-16 | 2020-06-26 | 石家庄麦特达电子科技有限公司 | Microchannel semiconductor laser |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1365169A (en) * | 2001-06-21 | 2002-08-21 | 中国科学院长春光学精密机械与物理研究所 | Active large passage diamond thick film heat sink and its preparation |
| CN1564404A (en) * | 2004-04-13 | 2005-01-12 | 西南科技大学 | Silicon chip microtunnel cooled large power laser LED array |
| JP4283738B2 (en) * | 2004-07-08 | 2009-06-24 | 浜松ホトニクス株式会社 | Semiconductor laser device |
| CN1671020A (en) * | 2004-08-27 | 2005-09-21 | 中国科学院长春光学精密机械与物理研究所 | Combined type heat sink for high power vertical cavity surface-emitting laser and preparation thereof |
| JP4929612B2 (en) * | 2005-04-12 | 2012-05-09 | ソニー株式会社 | Semiconductor laser device and heat sink |
-
2009
- 2009-08-31 CN CN2009100237463A patent/CN101640378B/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011022923A1 (en) * | 2009-08-31 | 2011-03-03 | 西安炬光科技有限公司 | Cooling module for laser, manufacture method thereof and semiconductor laser including the same |
| US8737441B2 (en) | 2009-08-31 | 2014-05-27 | Xi'an Focuslight Technologies Co., Ltd. | Cooling module for laser, fabricating method thereof, and semiconductor laser fabricated from the module |
| CN101841127A (en) * | 2010-06-11 | 2010-09-22 | 西安炬光科技有限公司 | Horizontal-array high-power semiconductor laser capable of replacing chip |
| CN105048287A (en) * | 2015-08-12 | 2015-11-11 | 西安炬光科技股份有限公司 | Horizontal-array high-power semiconductor laser |
| CN109565148A (en) * | 2016-08-30 | 2019-04-02 | Nec显示器解决方案株式会社 | Light supply apparatus, projection display device and the method for cooling down semiconductor light-emitting elements |
| CN109565148B (en) * | 2016-08-30 | 2021-09-10 | Nec显示器解决方案株式会社 | Light source device, projection type display device, and method for cooling semiconductor light emitting element |
| CN110401108A (en) * | 2019-07-31 | 2019-11-01 | 江苏天元激光科技有限公司 | A kind of high-power horizontal array column semiconductor laser |
| CN111342337A (en) * | 2020-03-16 | 2020-06-26 | 石家庄麦特达电子科技有限公司 | Microchannel semiconductor laser |
| CN111342337B (en) * | 2020-03-16 | 2021-09-10 | 石家庄麦特达电子科技有限公司 | Microchannel semiconductor laser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101640378B (en) | 2011-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101640378B (en) | Novel low-cost horizontal array liquid refrigeration semiconductor laser and manufacturing method thereof | |
| CN101640379B (en) | Novel low-cost stack-up array liquid refrigeration semiconductor laser and manufacturing method thereof | |
| JP5611334B2 (en) | Laser cooling module, manufacturing method, and semiconductor laser manufactured by the module | |
| CN101640372B (en) | Novel single bar liquid refrigeration laser and manufacturing method thereof | |
| CN110957632B (en) | Micro-channel heat sink for improving semiconductor laser array spectrum half-width | |
| CN101841127B (en) | Horizontal-array high-power semiconductor laser capable of replacing chip | |
| CN201450226U (en) | Novel horizontal-array liquid refrigeration semiconductor laser with low cost | |
| CN105470810B (en) | A kind of macro channel liquid cooling high-power semiconductor laser and device | |
| CN105048287B (en) | A kind of horizontal array high-power semiconductor laser | |
| CN103311798A (en) | Packaging structure and packaging method of large-power linear array laser device | |
| CN111370991A (en) | Semiconductor laser, stacked array and horizontal array of insulating type heat sink | |
| CN201927886U (en) | Horizontal array large-power semiconductor laser with substitutable chip | |
| CN101635432B (en) | Liquid refrigerating chip for semiconductor laser and preparation method thereof | |
| CN102064465A (en) | Bidirectional refrigeration type semiconductor laser and manufacturing method thereof | |
| CN106058636B (en) | Conduction cooling high-power semiconductor laser | |
| CN100364190C (en) | Passive radiating small heat sink semiconductor laser bar | |
| CN109787084B (en) | Semiconductor laser array packaging structure with efficient heat dissipation and manufacturing method | |
| CN1402394A (en) | Manufacture of high-power semiconductor laser stacked array | |
| CN109273981B (en) | Heat dissipation device for semiconductor laser and laser module | |
| CN102684066A (en) | Dual-channel liquid cooling multiquantum-well semiconductor laser and preparation method thereof | |
| CN101150244A (en) | High-power laser diode array structure | |
| KR102198241B1 (en) | Radiant heat panel of LED lighting based on non-oriented refrigerant flow | |
| CN105470809A (en) | Macro-channel liquid refrigerator and refrigerator combination | |
| CN201450227U (en) | Novel laminated-array liquid refrigeration semiconductor laser with low cost | |
| CN201450224U (en) | Low cost single bar liquid refrigeration laser |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Novel low-cost horizontal array liquid refrigeration semiconductor laser and manufacturing method thereof Effective date of registration: 20141119 Granted publication date: 20111228 Pledgee: Bank of Changan Limited by Share Ltd Xi'an Lianhu District Branch Pledgor: Xi'an Focuslight Technology Co., Ltd. Registration number: 2014990000962 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| CP03 | Change of name, title or address |
Address after: 710077 Xi'an hi tech Zone 56, Xi'an, Shaanxi Province, No. 56 Patentee after: FOCUSLIGHT TECHNOLOGIES INC. Address before: 710119, No. 17, information Avenue, new industrial park, hi tech Zone, Shaanxi, Xi'an Patentee before: Xi'an Focuslight Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20190301 Granted publication date: 20111228 Pledgee: Bank of Changan Limited by Share Ltd Xi'an Lianhu District Branch Pledgor: Xi'an Focuslight Technology Co., Ltd. Registration number: 2014990000962 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |