CN101839427B - Large-size direct type LED backlight source and preparation method - Google Patents
Large-size direct type LED backlight source and preparation method Download PDFInfo
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- CN101839427B CN101839427B CN2010101454164A CN201010145416A CN101839427B CN 101839427 B CN101839427 B CN 101839427B CN 2010101454164 A CN2010101454164 A CN 2010101454164A CN 201010145416 A CN201010145416 A CN 201010145416A CN 101839427 B CN101839427 B CN 101839427B
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Abstract
The invention discloses a large-size direct type LED backlight source and a preparation method. The backlight source structure comprises an edge emission type LED, a metal basal plate and a lower wall casing; the edge emission type LED comprises a conical half-reflecting semi-permeable mirror, an LED chip, packaging resin and an LED lamp holder; a plurality of light reflecting bowls are punched on the metal basal plate and are evenly distributed on the metal basal plate, the lower wall casing is in a frame-shaped structure and is arranged at the lower end of the metal basal plate, a hollow cavity is formed between the lower wall casing and the metal basal plate, the lower surface of the metal basal plate and the upper surface of the lower wall casing are provided with fine structures in the hollow cavity, fine structures at the lower ends of the light reflecting bowls are connected with the fine structure at the upper surface of the lower wall casing, and a liquid absorption core is formed; and support columns are arranged between the adjacent light reflecting bowls, have equal heights with the light reflecting bowls and are connected with the fine structure at the upper surface of the lower wall casing, and a liquid absorption core is formed. The invention provides an LED backlight source structure compromising the performance and the energy consumption under the precondition of low cost and realizing the lightness and the thinness of a large-size LED and a manufacturing process.
Description
Technical field
The present invention relates to light emitting diode (LED) back light source structure of a kind of LCD (LCD), particularly relate to big power LED backlight source structure of on large-scale LCD, using and preparation method thereof.The present invention is applicable to the application scenario that all need the LED spot light is converted into area source.
Background technology
Because LCD itself is not luminous, need to seek the supplier of a backlight, so the performance of backlight has just determined the visual impression that LCD is external as film liquid crystal display light source.Backlight is to transfer spot light in the module backlight or line source to equally distributed area source, and collocation film control visual angle, improves optical characteristics, makes LCD reach the perfect purpose that shows.The backlight of LCD is a module that combines many optical thin film materials, and the development technique of backlight itself is across fields such as optics, chemistry, electronics, and its cost accounts for the 20%-30% of LCD all material cost.Optimizing backlight design is one of direction that reduces at present the LCD product cost; With the optical efficiency of present backlight, still have the very large space of improving, but integrally-built precision requirement is also strict relatively; Even the housing of fixation also has very large influence to optics.Along with the fast development of LCD technology with reach its maturity; The lifting of manufacturing technology, under the trend of large scale and low price, backlight module is being considered lightweight, slimming, low cost, high briliancy and the market demand that reduces cost; For remaining on the competitiveness of future market; Exploitation, the novel backlight module of design are the direction and the important topic of effort from now on, and it is representing a kind of developing direction of following electronic technology production equipment.
At present, adopting the LCD TV of traditional CCFL (CCFL) backlight technology is the market mainstream.The LED-backlit source technology is more more advanced than CCFL backlight technology.The CCFL backlight is that excitated fluorescent powder is luminous, and assorted surplus composition is more in its luminescent spectrum, and excitation is low, causes its colour gamut little, has only about 70% of NTSC usually.In the coming years, LCD with the LED-backlit source because have that colour gamut is wide, brightness is high, the life-span is long, advantage such as low in energy consumption and environmental protection, will replace the CCFL backlight without doubt, cut a conspicuous figure in large scale demonstration field.Large scale LED-backlit source also is the focus of studying at present; Under the effort of each scientific research institution; The cost in LED-backlit source is more and more lower; And light efficiency is higher, brighter and it is lighter more to approach, and believes that the LCD product of LED-backlit source lighting will get into average family in the near future, brings brand-new color sensation for more people.
Compare traditional C CFL backlight and compare, adopt the LCD TV in LED-backlit source all to obtain comprehensive lifting at aspects such as picture performance, environmental protection and energy saving, ultra-thin outward appearance, amusement functions.Aspect luminescent lifetime, the specified service life of CCFL light source (half is bright), between 8000--100000 hour, led light source then can reach about the twice of CCFL light source.Aspect environmental protection, though the manufacturer aspect has reduced the mercury content among the CCFL as possible at present, the CCFL that does not have mercury fully can bring some new technical problems, temporarily also hopeless solution.And review LED-backlit, and it is advantageous that poisonous and harmful substances such as not leaded fully and mercury, be real environmental protection light source.
At present, LCD module backlight mainly adopts side-light type and straight-down negative.Under large-size, the uniformity of luminance and the luminosity of side-light type back light all are restricted, and the weight of LGP and cost also have greatly increased with the increase of size.By comparison, direct-light-type backlight technology is simple, does not need LGP, and its key problem in technology is the uniformity of color and brightness, is the main flow of present large scale LED-backlit source research and development.High-quality LED liquid crystal display requires its backlight color reducibility, brightness and basic optical performances such as color and brightness uniformity good, and straight-down negative is even distribution LED in the panel behind, and the light that light source is dispersed can evenly be communicated on the whole image.If adopt the Region control technology, its brightness can be carried out active adjustment along with the brightness of picture, compares and adopts effectively energy-conservation can reaching more than 30% of CCFL LCD TV backlight.When showing black, can directly turn off the light in its corresponding LED zone, thereby show very perfectly black.Therefore, the expert generally believes the straight image that can appear more accurately backlight down, and shows outstanding color and light and shade contrast effect.And the direct LED backlight of circulation is employed in the method that lambert's type led light source front end installs lens additional mostly and enlarges its angle of divergence and change its Illumination Distribution on face to be illuminated in the market.But the lens that installed additional are owing to complex-shaped and optical accuracy require height, so manufacturing cost is often high.It receives the restriction of angle of flare angle simultaneously, and the thickness problem of backlight still has to be solved.
The LCD product is along with size is big more, and the shared cost of module backlight is high more, and down straight aphototropism mode set is the essential key technology of large-scale LCD product; Be applied in the large scale down straight aphototropism mode set with high-capacity LED; The problem that at first faces is a LED point light source light-emitting characteristic, causes the exiting surface can't be even easily, with the light source of high-capacity LED as large scale module backlight; Existing now many discussion and research; But in the entire aphototropism mould design, still have many worth discussions and improved place, for example LED heat radiation and production cost problem.Along with developing rapidly of microelectric technique, the microminiaturization of electronic device has become the main flow trend of modern electronic equipment development.The electronic device features size constantly reduces, and the integrated level of chip, packaging density and operating frequency improve constantly, and these all make the heat flow density of chip raise rapidly.Therefore circuit and chip cooling problem thereof seem especially outstanding.And soaking plate has high thermal conductivity and good uniform temperature, becomes one of up-and-coming technology that solves the electronic radiation problem.Soaking plate belongs to a type of heat pipe, and soaking plate has more outstanding advantage than general heat pipe, and its shape is very beneficial for central heat source is carried out thermal diffusion.
It is thus clear that, the large-size direct type LED backlight source structure be after the backlight module Development Trend, and along with the development of control theory, manufacturing technology and people continuous pursuit to high quality display.Will certainly impel technology such as light, electricity, heat constantly to be connected, to make up, thereby satisfy the demand of future market.
Summary of the invention
In order to overcome the contradiction between existing backlight thickness, performance and the manufacturing cost, it is a kind of in low-cost Gu Xingneng and energy consumption that the present invention provides, and realizes lightening LED-backlit source structure and the manufacturing process of large-scale LCD.
The object of the invention is realized through following technical scheme:
A kind of large-size direct type LED backlight source structure; Comprise edge transmitting type LED, metal substrate and lower wall shell; The a plurality of reflectors of punching press on the said metal substrate; Reflector evenly distributes on metal substrate, and being provided with thickness at the metal substrate upper surface is 0.08mm-0.1mm heat insulation dielectric layer, and heat insulation dielectric layer upper surface is covered with the wired circuit that connects led chip;
Said lower wall shell is the shaped as frame structure, is arranged on the lower end of metal substrate, forms cavity between lower wall shell and the metal substrate, is filled with the working medium of 40%-45% cavity volume in the cavity; In cavity, metal substrate lower surface and lower wall shell upper surface are provided with fine structure, and the fine structure of reflector lower end is connected with the fine structure of lower wall shell upper surface, form wick; Be provided with support column between the adjacent reflector, height such as support column and reflector are connected with the fine structure of lower wall shell upper surface, form wick; Distance between the adjacent supports post is 10-20mm; Said fine structure is meant that spacing is that 0.1-0.2mm, height are the microprotrusion of 0.1-0.2mm, or the copper powder particle sinter layer; Said microprotrusion is taper or cylindricality;
Edge transmitting type LED is made up of conical half-reflecting semi-permeable, led chip, potting resin and LED lamp socket; Led chip places on the lamp socket, and half-reflecting half mirror is that wall thickness is the conical glass lens of 0.2mm-0.8mm, is fixed in the led chip top through cloche, and cloche inside is full of potting resin; Lamp socket is fixed in the inside of reflector and is positioned on the reflector axis; Led chip and reflector central point end are at a distance of 1.5mm-3.5mm; All scribble reflectorized material on reflector inwall and the LED lamp socket; Wired circuit is serially connected in a series arm with a plurality of led chips, and a plurality of series arms are connected in parallel.
For further realizing the object of the invention; Said led chip places on the lamp socket; Half-reflecting half mirror is fixed in the led chip top by glass lamp shade, and its inside is full of potting resin and sealing, the cone-apex angle α equal and opposite in direction of the main angle of emergence β of LED emitted light and conical half-reflecting semi-permeable.
Said support column is that punching press forms on metal substrate.
Said support column is to form column structure at the copper powder particle sintering.
Said metal substrate material is preferably aluminium or red copper.
Said working medium is preferably ammoniacal liquor or pure water.
Said heat insulation dielectric layer is preferably Al
2O
3Micro-arc oxidation films, epoxy glass pricker cloth or epoxy resin.
Said lower wall shell lower surface is provided with fin structure.
A kind of preparation method of large-size direct type LED backlight source comprises the steps:
(1) rolls out taper or cylindricality microprotrusion structure at the metal substrate lower surface; Successively metal substrate is carried out surface finish, electrochemical deoiling and washed with de-ionized water is handled, to plate a layer thickness be the micro-arc oxidation films of 0.08mm-0.1mm to the method that adopts differential arc oxidation again or be covered with the insulating medium layer that a layer thickness is 0.08mm-0.1mm above that at the upper surface of metal substrate; Clean up and dry with pure water, be covered with one deck Copper Foil more above that, print or erode away wired circuit; At last stamp out reflector being covered with on the metal substrate of circuit layer;
(2) form fine structure at lower wall shell upper surface, said fine structure is meant that spacing is that 0.1-0.2mm, height are the microprotrusion of 0.1-0.2mm, or the copper powder particle sinter layer; Said microprotrusion is taper or cylindricality; Between metal substrate lower surface and the lower wall shell upper surface, between adjacent reflector, support column is set, height such as support column and reflector, said support column are that punching press forms on metal substrate, or form column structure by the copper powder particle sintering; The lower wall shell is processed frame type structure, be placed under the metal substrate, form cavity, process implementation of port in the arbitrary side of lower wall shell with metal substrate;
(3) with metal substrate and lower wall shell surface and the inner cleaning of copper tube; Put it to then in the solution such as dilute sulfuric acid or alcohol; Use the supersonic wave cleaning machine clean, the utilization soldering processes carry out soldering and sealing with lower wall shell and junction, metal substrate edge, and copper tube is connect implementation of port;
(4) working medium is filled in the cavity, filling amount is the 40%-50% of whole cavity volume; Along implementation of port cavity is vacuumized then, require the interior final vacuum of soaking plate cavity to be less than 1.33 * 10
-3Pa uses argon arc welding to carry out soldering and sealing at last;
(5) edge transmitting type LED is positioned on the axis of reflector, the adjustment lamp socket makes led chip and reflector central point end at a distance of 1.5mm-3.5mm, simultaneously LED is welded on the aluminium base circuit.
With respect to prior art, the present invention has following advantage and beneficial effect:
The present invention utilizes the reflex of reflector, makes spot light can in short distance, be diffused as area source, thereby has solved the little problem of traditional light emitting diode angle of divergence, simultaneously because the minimizing of LED usage quantity makes manufacturing and use cost reduce greatly; The integral application of soaking plate and circuit design has solved the heat dissipation problem (promptly having prolonged the service life of backlight) of LCD with not only being rich in surplus, and has been convenient to modernized large-scale production.Thereby at the product advantage of truly having realized lightening, the low energy consumption of LCD, high life, industrialization.
Description of drawings
Fig. 1 is the embodiment of the invention 1 a backing structure profile.
Fig. 2 is the embodiment of the invention 1 a backing structure vertical view.
Fig. 3 is topping up pipe riding position figure in the embodiment of the invention 1 soaking plate.
Fig. 4 is the outgoing sketch map of light in the embodiment of the invention 1 single backing structure.
Fig. 5 is the embodiment of the invention 1 an adjacent optical structure beam projecting sketch map.
Fig. 6 is the embodiment of the invention 1 an entire aphototropism mould vertical view.
Fig. 7 is the embodiment of the invention 2 single backing structure profiles.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is done further detailed description, but embodiment of the present invention not only is confined to this.
As shown in Figure 1, a kind of large-size direct type LED backlight source comprises metal substrate 6, soaking plate and edge transmitting type LED.The a plurality of reflectors 5 of punching press on the metal substrate 6, reflector 5 evenly distribute on metal substrate 6, and it is bowl-shape free form surface structure; Be provided with the support column 9A that is formed by metal substrate 6 punching presses between the reflector 5, support column 9A is the column structure that caves inward.
As shown in Figure 2, the method that adopts differential arc oxidation is at metal substrate 6 surface plating one deck Al
2O
3Micro-arc oxidation films, as the high heat conductive insulating dielectric layer, Al
2O
3The micro-arc oxidation films surface is covered with the wired circuit 11 that connects led chip 2.
The lower wall shell is the shaped as frame structure, by the punch forming of aluminum rectangular slab, is arranged on the lower end of metal substrate 6, forms cavity between lower wall shell 8 and the metal substrate 6, is filled with the ammonia spirit 10 of 40%-45% cavity volume in the cavity; In cavity, lower wall shell 8 and metal substrate 6 all are provided with the microprotrusion 9B of spacing 0.1-0.2mm, high 0.1-0.2mm; Reflector 5 and height such as support column 9A grade, lower wall shell 8 joins with support column 9A place at reflector 5 with the microprotrusion of metal substrate 6.Generally speaking, soaking plate is a kind of flat-plate heat pipe, is used for central heat source is diffused into large-area sealing two mutually tabular heat transfer systems with being close to isothermal, comprises upper wall shell, lower wall shell and working medium; The upper wall shell becomes cavity with the lower wall hull shape, is provided with working medium in the cavity; The upper wall shell is provided with support column arrangement (under the small size situation also can without support column arrangement); Upper wall shell and lower wall shell inside all are provided with microprotrusion.Support column and microprotrusion are served as the effect of wick jointly in soaking plate; In the present embodiment, metal substrate 6 is as the upper wall shell of soaking plate, in economical with materials, alleviate quality in, also reduced production cost.
Edge transmitting type LED is made up of conical half-reflecting semi-permeable 1, led chip 2, potting resin 3 and LED lamp socket 4; Led chip 2 places on the lamp socket 4, and half-reflecting half mirror 1 is that a kind of wall thickness is the conical glass lens of 0.2mm-0.8mm, can be fixed in led chip 2 tops through cloche, and cloche inside is full of potting resin 3; Lamp socket 4 is fixed in the inside of reflector 5 and is positioned on reflector 5 axis; The least significant end at led chip 2 and reflector center is at a distance of 1-2mm.All scribble reflectorized material (can select the micro-prism type reflective membrane of 3M company for use) on reflector 5 inwalls and the LED lamp socket 4; The cone-apex angle α equal and opposite in direction (as shown in Figure 4) of the main angle of emergence β of LED emitted light and conical half-reflecting semi-permeable 1.Wired circuit 11 is serially connected in a series arm with a plurality of led chips 2, and a plurality of series arms are connected in parallel.
A kind of preparation technology of large-size direct type LED backlight source comprises the steps:
(1) (specification is that 683mm * 1215mm) lower surface rolls out the microprotrusion 9B of spacing 0.1mm, high 0.2mm for the aluminium base 6 of 0.7mm thick; Successively aluminium base 6 is carried out surface finish, electrochemical deoiling and washed with de-ionized water and handle, adopt the method for differential arc oxidation to plate the Al that a layer thickness is 0.08mm-0.1mm on the surface of aluminium base 6 again
2O
3Micro-arc oxidation films; Clean up and dry with pure water afterwards, be covered with the Copper Foil that a layer thickness is 0.05mm more above that, print 63 series arms, wherein every branch road can connect 6 LED lamps; The last reflector 5 and support column arrangement 9A that on aluminium base 6, stamps out high for 4mm, spacing is 40-50mm between the wherein adjacent reflector 5, the distance between the adjacent supports post 9A is 7-15mm;
(2) roll out spacing 0.1mm on lower wall shell 8 tops, the microprotrusion 9B of high 0.2mm strikes out the groove that the degree of depth is 4mm along its edge with it again; Process the implementation of port that diameter is 3.1mm in the center of the lower wall shell 8 either side walls of moulding then, implementation of port is connected with red copper tubule 14, is used to pour into working medium and vacuumizes.Red copper tubule 14 length can be 50mm, and diameter can be 3mm (as shown in Figure 3);
(3) use instrument such as hairbrush that the surface and copper tube 14 inside of metal substrate 6 and lower wall shell 8 are cleaned up; Remove burr; Put it to then in the dilution heat of sulfuric acid that weight percent concentration is 8-10%; Use supersonic wave cleaning machine cleaning 8-15min, the utilization soldering processes carry out soldering and sealing with soaking plate in metal substrate 6 and junction, lower wall shell edge, simultaneously the red copper tubule are welded to the implementation of port of reservation;
In the formed cavity, filling amount is the 40%-50% of whole cavity volume when (4) ammoniacal liquor being filled into metal substrate 6 and being connected with the lower wall shell; Along implementation of port cavity is vacuumized then, require the interior final vacuum of soaking plate cavity to be less than 1.33 * 10-3Pa, use argon arc welding to carry out soldering and sealing at last;
(5) edge transmitting type LED is positioned on the axis of reflector 5; And through the adjustment led chip 2 of lamp socket and the height of reflector 5 bottom centre; Led chip and reflector bottom centre's point highly are 1.5mm-3.5mm, simultaneously LED are welded on the aluminium base circuit.
As shown in Figure 4; The light that led chip 2 is launched, after potting resin 3 was injected into half-reflecting half mirror 1, wherein most light were reflected by conical half-reflecting semi-permeable 1 earlier through light path 15; Refracted to reflector 5 again; Reflexed to target object plane (plane, diffusion barrier place) by the reflective coating of reflector 5 inner surfaces at last, remaining fraction light is through light path 16 direct outgoing to target object planes (because the wall thickness of conical half-reflecting semi-permeable 1 is very thin, so it can be ignored to interception of rays).
As shown in Figure 5, the single optical texture 12 that includes reflector can form the length of side on diffuser plate be that the square uniform illumination of 45mm distributes, and its arrangement mode on metal substrate 6 is square arrange (as shown in Figure 6).Because adjacent optical structure crosstalking of the Illumination Distribution that forms on diffuser plate can ignore, so the uniform illumination distribution that all single led light sources form on diffuser plate can infinitely splice, thereby realized the conversion of LED spot light to uniform area light source.
During the work of LED lamp; Heat is delivered to the metal substrate 6 as evaporating surface through lamp socket 4; Be delivered in the ammonia spirit 10 by the microprotrusion 9B that rolls out on the metal substrate 6, impel ammonia spirit 10 to seethe with excitement, gasify because of temperature rise, in a single day the ammoniacal liquor 10 that is converted into gaseous state touch the lower wall shell 8 as cryosurface; Be re-condensed into liquid at once, discharge heat simultaneously rapidly.Liquid ammoniacal liquor 10 relies on support column 9A and the common capillary forces of microprotrusion 9B, is back to boiling place of metal substrate 6 bottoms again along soaking plate inner surface or support column arrangement 9A.So far, soaking plate has been accomplished an operation cycle.So repeatedly, thus realized the heat that LED produces is diffused into rapidly on the whole soaking plate by one by one little concentrated area.Along with becoming more meticulous of the slimming of LED-backlit module thickness, requirement backlight; Cause LED-backlit module heat flow density to improve rapidly; Especially the regional heat flow density under the great power LED wick is often high; And it is very big influenced by its operating temperature, so the design of the cooling system important that seems in the backlight source module.Because LED belongs to spot light, the heat of its generation is concentrated relatively, and soaking plate has high thermal conductivity and good uniform temperature, therefore becomes LED-backlit source heat-dissipating problem one of the means extremely effectively that solve.
As shown in Figure 7, a kind of large-size direct type LED backlight source comprises metal substrate 6, soaking plate and edge transmitting type LED.The a plurality of reflectors 5 of punching press on the metal substrate 6, reflector 5 evenly distribute on metal substrate 6, and it is bowl-shape free form surface structure.
Edge transmitting type LED is with embodiment 1.
The preparation method in a kind of LED-backlit source comprises the steps:
(1) (specification is that 683mm * 1215mm) bottom rolls out the microprotrusion 9B of spacing 0.1mm, high 0.2mm for the metal substrate 6 of 0.7mm thick; On the upper surface of metal substrate 6, be covered with the insulating medium layer that a layer thickness is 0.08mm-0.1mm; Being covered with a layer thickness more above that is the wired circuit 11 (Copper Foil) of 0.05mm; Print 63 series arms; Wherein every branch road can connect 6 LED lamps, on metal substrate 6, stamps out height and is the reflector 5 of 4mm, and spacing is 40mm-50mm between the wherein adjacent reflector 5;
(2) rolling out spacing in lower wall shell 8 bottoms is 1mm, and the fin structure 13 of high 2mm strikes out the shaped as frame structure that the degree of depth is 4mm with lower wall shell 8; Lower wall shell 8 tops go out to have the liquid sucting core structure 9C of support column 9A with the copper powder particle sintering, and (900 ℃ furnace temperature kept N 20 minutes
2Protection).Implementation of port, the preparation of red copper tubule 14 is with embodiment 1;
(3) use instrument such as hairbrush that upper and lower wall shell surface and copper tube 14 inside are cleaned up; Remove burr; Put it to then in the dilution heat of sulfuric acid that concentration is 8-10%; Use supersonic wave cleaning machine cleaning 8-15min, the utilization soldering processes carry out soldering and sealing with soaking plate in junction, upper and lower wall shell edge, simultaneously the red copper tubule are welded to the implementation of port of reservation;
In the formed cavity, filling amount is the 40%-50% of whole cavity volume, along implementation of port cavity is vacuumized then when (4) distilled water being filled into upper and lower wall shell and connecting, and requires that final vacuum is less than 1.33 * 10 in the soaking plate cavity
-3Pa uses argon arc welding to carry out soldering and sealing at last;
(5) edge transmitting type LED is positioned on the axis of reflector 5, and obtains the optimum position through the adjustment of lamp socket, led chip and reflector central point end are welded to LED on the aluminium base circuit at a distance of 1.5mm-3.5mm simultaneously.
The operation principle of present embodiment is identical with embodiment 1.
Claims (9)
1. large-size direct type LED backlight source structure; Comprise edge transmitting type LED, metal substrate and lower wall shell; It is characterized in that: a plurality of reflectors of punching press on the said metal substrate; Reflector evenly distributes on metal substrate, and being provided with thickness at the metal substrate upper surface is the 0.08mm-0.1mm insulating medium layer, and the insulating medium layer upper surface is covered with the wired circuit that connects led chip;
Said lower wall shell is the shaped as frame structure, is arranged on the lower end of metal substrate, forms cavity between lower wall shell and the metal substrate, is filled with the working medium of 40%-45% cavity volume in the cavity; In cavity, metal substrate lower surface and lower wall shell upper surface are provided with fine structure, and the fine structure of reflector lower end is connected with the fine structure of lower wall shell upper surface, form wick; Be provided with support column between the adjacent reflector, height such as support column and reflector are connected with the fine structure of lower wall shell upper surface, form wick; Distance between the adjacent supports post is 10-20mm; Said fine structure is meant the copper powder particle sinter layer, or spacing is that 0.1-0.2mm, height are the microprotrusion of 0.1-0.2mm; Said microprotrusion is taper or cylindricality; Wherein, the fine structure of reflector lower end and lower wall shell upper surface is microprotrusion, or the micro-structural of reflector lower end is microprotrusion, and the fine structure of lower wall shell upper surface is the copper powder particle sinter layer;
Edge transmitting type LED is made up of conical half-reflecting semi-permeable, led chip, potting resin and LED lamp socket; Led chip places on the lamp socket, and half-reflecting half mirror is that wall thickness is the conical glass lens of 0.2mm-0.8mm, is fixed in the led chip top through cloche, and cloche inside is full of potting resin; Lamp socket is fixed in the inside of reflector and is positioned on the reflector axis; The central point end at led chip and reflector center is at a distance of 1.5mm-3.5mm; All scribble reflectorized material on reflector inwall and the LED lamp socket; Wired circuit is serially connected in a series arm with a plurality of led chips, and a plurality of series arms are connected in parallel.
2. a kind of large-size direct type LED backlight source structure according to claim 1; It is characterized in that; Said led chip places on the lamp socket; Half-reflecting half mirror is fixed in the led chip top by glass lamp shade, and glass lamp shade inside is full of potting resin and sealing, the cone-apex angle α equal and opposite in direction of the main angle of emergence β of LED emitted light and conical half-reflecting semi-permeable.
3. a kind of large-size direct type LED backlight source structure according to claim 1 is characterized in that, said support column is that punching press forms on metal substrate.
4. a kind of large-size direct type LED backlight source structure according to claim 1 is characterized in that said support column is to form column structure by the copper powder particle sintering.
5. a kind of large-size direct type LED backlight source structure according to claim 1 is characterized in that said metal substrate material is aluminium or red copper.
6. a kind of large-size direct type LED backlight source structure according to claim 1 is characterized in that said working medium is ammoniacal liquor or pure water.
7. a kind of large-size direct type LED backlight source structure according to claim 1 is characterized in that said insulating medium layer is Al
2O
3Micro-arc oxidation films or epoxy resin.
8. a kind of large-size direct type LED backlight source structure according to claim 1 is characterized in that, said lower wall shell lower surface is provided with fin structure.
9. the preparation method of the described large-size direct type LED backlight source of claim 1 is characterized in that comprising the steps:
(1) rolls out taper or cylindricality microprotrusion structure at the metal substrate lower surface; Successively metal substrate is carried out surface finish, electrochemical deoiling and washed with de-ionized water and handle, adopt the method for differential arc oxidation to plate the micro-arc oxidation films that a layer thickness is 0.08mm-0.1mm again at the upper surface of metal substrate; Clean up and dry with pure water, be covered with one deck Copper Foil more above that, print or erode away wired circuit; At last stamp out reflector being covered with on the metal substrate of circuit layer;
(2) form fine structure at lower wall shell upper surface, said fine structure is meant the copper powder particle sinter layer, or spacing is that 0.1-0.2mm, height are the microprotrusion of 0.1-0.2mm; Said microprotrusion is taper or cylindricality; Between metal substrate lower surface and the lower wall shell upper surface, between adjacent reflector, support column is set, height such as support column and reflector, said support column are that punching press forms on metal substrate, or form column structure by the copper powder particle sintering; The lower wall shell is processed frame type structure, be placed under the metal substrate, form cavity, process implementation of port in the arbitrary side of lower wall shell with metal substrate;
(3) with metal substrate and lower wall shell surface and the inner cleaning of copper tube; Put it to then in dilute sulfuric acid or the alcoholic solution; Use the supersonic wave cleaning machine clean, the utilization soldering processes carry out soldering and sealing with lower wall shell and junction, metal substrate edge, and copper tube is connect implementation of port;
(4) working medium is filled in the cavity, filling amount is the 40%-50% of whole cavity volume; Along implementation of port cavity is vacuumized then, require to form between lower wall shell and the metal substrate the interior final vacuum of cavity and be less than 1.33 * 10
-3Pa uses argon arc welding to carry out soldering and sealing at last;
(5) edge transmitting type LED is positioned on the axis of reflector, the adjustment lamp socket makes led chip and reflector central point end at a distance of 1.5mm-3.5mm, simultaneously LED is welded to the circuit layer on the metal substrate.
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| US8721115B2 (en) * | 2010-05-28 | 2014-05-13 | Luxingtek, Ltd. | Light reflective structure and light panel |
| KR101775671B1 (en) * | 2010-09-29 | 2017-09-20 | 삼성디스플레이 주식회사 | Backlight assembly having light emitting diode package and display apparatus having the same |
| CN102537784A (en) * | 2011-12-14 | 2012-07-04 | 中国电子科技集团公司第五十五研究所 | Low-power extremely-high-brightness LED (light emitting diode) backlight source used for liquid crystal projection display system |
| CN102494285A (en) * | 2011-12-21 | 2012-06-13 | 南京中电熊猫液晶显示科技有限公司 | Straight-down regional light control light-emitting diode (LED) backlight module |
| CN102620217A (en) * | 2012-04-12 | 2012-08-01 | 深圳市华星光电技术有限公司 | Backlight module and corresponding liquid crystal display device |
| CN103050617A (en) * | 2012-12-17 | 2013-04-17 | 秦大春 | LED (Light Emitting Diode) plate tube type aluminum circuit board |
| CN103542325A (en) * | 2013-06-14 | 2014-01-29 | 秦彪 | Plate-shaped solid state lighting lamp |
| CN109974495A (en) * | 2013-07-08 | 2019-07-05 | 奇鋐科技股份有限公司 | Equalizing plate structure manufacturing method |
| CN103398313A (en) * | 2013-08-16 | 2013-11-20 | 苏州茂立光电科技有限公司 | Direct type backlight module |
| CN106287578A (en) * | 2015-05-21 | 2017-01-04 | 瑞仪光电(苏州)有限公司 | Reflection subassembly, backlight module |
| CN106558642B (en) * | 2015-09-30 | 2017-12-22 | 江苏诚睿达光电有限公司 | The process of refined light conversion body fitting encapsulation LED a kind of and refined change system |
| CN105319773A (en) * | 2015-11-03 | 2016-02-10 | 青岛海信电器股份有限公司 | Backlight module and liquid crystal display device |
| CN107869672A (en) * | 2017-10-18 | 2018-04-03 | 安徽芯瑞达科技股份有限公司 | Down straight aphototropism mode set based on compound reflecting bowl |
| CN113031341B (en) * | 2021-03-12 | 2023-01-20 | 业成科技（成都）有限公司 | Light emitting diode light source assembly and reflection structure and display structure thereof |
| CN116203756A (en) * | 2021-11-30 | 2023-06-02 | 苏州佳世达电通有限公司 | Light source module for display and display |
| CN116449608B (en) * | 2023-04-28 | 2024-08-30 | 惠科股份有限公司 | Backlight module and display device |
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| CN201032096Y (en) * | 2007-04-11 | 2008-03-05 | 王涛 | Mine lamp LED light source circuit heat radiation integrated device |
| CN201434283Y (en) * | 2009-07-07 | 2010-03-31 | 李妙文 | Energy-saving street lamp |
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