CN200990756Y - 电子器件制造室 - Google Patents
电子器件制造室 Download PDFInfo
- Publication number
- CN200990756Y CN200990756Y CN 200620018860 CN200620018860U CN200990756Y CN 200990756 Y CN200990756 Y CN 200990756Y CN 200620018860 CN200620018860 CN 200620018860 CN 200620018860 U CN200620018860 U CN 200620018860U CN 200990756 Y CN200990756 Y CN 200990756Y
- Authority
- CN
- China
- Prior art keywords
- chamber
- electronic device
- chamber component
- straight line
- line portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 27
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 28
- 230000032258 transport Effects 0.000 description 24
- 238000012546 transfer Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 238000010276 construction Methods 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000012636 effector Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/145,003 US20060051507A1 (en) | 2004-06-02 | 2005-06-02 | Electronic device manufacturing chamber and methods of forming the same |
| US11/145,003 | 2005-06-02 | ||
| US11/214,475 | 2005-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200990756Y true CN200990756Y (zh) | 2007-12-12 |
Family
ID=38941782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620018860 Expired - Lifetime CN200990756Y (zh) | 2005-06-02 | 2006-03-09 | 电子器件制造室 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3127265U (ja) |
| CN (1) | CN200990756Y (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010028099A (ja) * | 2008-06-20 | 2010-02-04 | Ngk Insulators Ltd | 基板熱処理用セッター及びこれを用いたｔｆｔ基板の熱処理方法 |
| JP5526988B2 (ja) * | 2010-04-28 | 2014-06-18 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理システム |
| JP5575558B2 (ja) * | 2010-06-30 | 2014-08-20 | 東京エレクトロン株式会社 | 処理装置 |
-
2006
- 2006-03-09 CN CN 200620018860 patent/CN200990756Y/zh not_active Expired - Lifetime
- 2006-06-02 JP JP2006004287U patent/JP3127265U/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3127265U (ja) | 2006-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20071212 |
|
| EXPY | Termination of patent right or utility model |