CN1987904A - Rfid标签 - Google Patents

Rfid标签 Download PDF

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CN1987904A
CN1987904A CNA2006100745236A CN200610074523A CN1987904A CN 1987904 A CN1987904 A CN 1987904A CN A2006100745236 A CNA2006100745236 A CN A2006100745236A CN 200610074523 A CN200610074523 A CN 200610074523A CN 1987904 A CN1987904 A CN 1987904A
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circuit chip
rfid label
substrate
base portion
antenna
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CN100524352C (zh
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石川直树
马场俊二
吉良秀彦
小林弘
松村贵由
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Fujitsu Ltd
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Fujitsu Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07728Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1744Means bringing discrete articles into assembled relationship
    • Y10T156/1751At least three articles
    • Y10T156/1754At least two applied side by side to common base

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

RFID标签。本发明涉及一种无需接触而与外部设备进行信息交换的RFID标签,并且本发明用于在不增加RFID标签的厚度的同时提高抗弯曲性。利用热固化粘合剂将电路芯片粘结到基片的基部。折叠基片,并将紫外固化粘合剂涂覆在电路芯片上。基片的折返部折回到电路芯片上,令紫外光照射到所述折返部,结果利用粘合剂将电路芯片的两个表面都粘结到基片。

Description

RFID标签
技术领域
本发明涉及一种无需接触而与外部设备进行信息交换的RFID(射频标识)标签。需要注意的是,在本领域技术人员当中也可将这里采用的术语“RFID标签”作为“RFID标签”的内部组件(插件)称作“RFID标签插件”。另选地,“RFID标签”可被称作“无线电IC标签”。另外,“RFID标签”还包括非接触型IC卡。
背景技术
近年来,已经提出了各种类型的通过利用无线电波以非接触方式与以读写器为代表的外部设备交换信息的RFID标签。提出了一种通过将用于进行无线电通信的天线图案和电路芯片(IC芯片)安装在由塑料、纸等构成的基片上而构造的RFID标签(例如参见特开2000-311226号公报、特开2000-200332号公报、特开2001-351082号公报)。对于这种类型的RFID标签,考虑了如下使用形式,其中附于物品等上的RFID标签与外部设备交换关于该物品的信息,由此使得可以对物品等进行识别。
图1是示出RFID标签的示例的顶视图。
图1中示出的RFID标签1由如下部件构成:天线12,置于由片状PET薄膜等构成的基片13上;和电路芯片11,通过焊接等与天线12电连接,并且利用粘合剂固定到基片13。
构成RFID标签1的电路芯片11能够经由天线12与外部设备进行无线电通信和信息交换。
这里,图1示出具有从位于RFID标签的中央的电路芯片11延伸到该电路芯片两侧的形状的天线作为RFID标签1的天线12。然而,天线12并不限于这种类型,可采用环形天线以及具有其他各种形状的天线作为天线12。
图2是说明在常规RFID标签中出现问题时的状态的图。图3示出了表示在图2的部分(B)中示出的圈R内的部分的放大图,并说明在图2的部分(B)中示出的状态下出现的问题。
需要注意的是,在图2、图3以及以下说明的各个图中都未示出天线。
根据RFID标签1的应用,除了如图2的部分(A)中所示在平面状态下原样地附接RFID标签1的使用形式以外,还可将RFID标签1粘贴到曲面,以使得向RFID标签施加弯曲力,如图2的部分(B)中所示。
当如图2的部分(B)中所示将弯曲力施加给RFID标签1时,可能出现如下问题,即粘合剂14从基片13剥落,结果无法保持电路芯片11与天线(未示出,参见图1)之间的电连接,并由此阻碍了通信功能。
图4是示出针对图3所示的剥落的预防措施的示例的图。
在图4中,以模具树脂15密封基片13上的电路芯片11。当采用通过模具树脂进行的这种密封处理时,可以提高弯曲强度,但是增加了整体厚度,这将导致背离减小厚度和尺寸的需要的结果。
鉴于上述情况,本发明提供了一种厚度略微增加而大幅度提高了对弯曲力的抗性的RFID标签。
发明内容
鉴于上述情况做出本发明,本发明提供了一种RFID标签,包括:基片;置于所述基片上的通信天线;以及电路芯片,连接到所述天线,并经由所述天线进行无线电通信,其中所述基片被折叠以夹住所述电路芯片,并且其中所述电路芯片附于所述折叠基片的两个表面上,所述表面面向所述电路芯片。
根据本发明的RFID标签具有其中由基片夹住电路芯片的结构。基片可由薄片材料制成,使得可几乎不增加厚度,并同时大幅度提高对弯曲力的抗性。
这里,在根据本发明的RFID标签中,基片可包括:基部,电路芯片置于其上;第一折返部,从所述基部延伸出并被折回以覆盖电路芯片的半个部分;以及第二折返部,沿与所述第一折返部相反的方向从所述基部延伸出并被折回以覆盖电路芯片的除所述第一折返部覆盖的半个部分以外的剩余半个部分。另选地,基片可包括:基部,电路芯片置于其上;和折返部,从所述基部延伸出并被折回以覆盖电路芯片的整个表面。
根据本发明,如上所述,实现了既薄且强耐折的RFID标签。
附图说明
图1是示出RFID标签的示例的顶视图;
图2是说明在常规RFID标签中出现问题时的状态的图;
图3是示出在图2的部分(B)中示出的圈R内的部分的放大图,并说明了在图2中示出的状态下出现的问题;
图4是示出针对图3所示的剥落的预防措施的示例的图;
图5是作为根据本发明的实施例的RFID标签的侧视图;
图6是图5中示出的RFID标签的顶视图;
图7是示出图5和图6中示出的RFID标签的制造过程的图;
图8是作为根据本发明的另一实施例的RFID标签的侧视图;
图9是图8中示出的RFID标签的顶视图;以及
图10是说明图8和图9中示出的RFID标签的制造过程的图。
具体实施方式
下面,将描述根据本发明的实施例。
图5是作为根据本发明的实施例的RFID标签的侧视图,而图6是图5中示出的RFID标签的顶视图。
图5和图6中示出的RFID标签10具有其中基片13折返以夹住电路芯片11的结构。
基片13具有:基部131,该基部131与电路芯片11的下表面111相接触;第一折返部132,从基部131延伸出并折回以接触并覆盖电路芯片11的上表面112的半个部分;以及第二折返部133,沿与第一折返部132相反的方向从基部131延伸出,并折回以接触并覆盖电路芯片11的上表面112除第一折返部132覆盖的半个部分以外的剩余半个部分。
另外,利用粘合剂141将电路芯片11的下表面111侧粘结到基部131的表面,该表面面向电路芯片侧,并利用粘合剂142将电路芯片11的上表面112侧粘结到第一折返部132和第二折返部133的表面,这些表面面向电路芯片侧。
在图5和图6中所示的根据本实施例的RFID标签1中,与图1到图3中示出的现有技术形式相比,仅需要将厚度增加一片薄基片厚,使得通过几乎不增加RFID标签的厚度而显著提高对弯曲力的抗性。
图7是示出图5和图6中所示的RFID标签的制造过程的图。
首先,在基片13上形成天线(未示出,参见图1)(图7的部分(a)),在其上由喷嘴51涂覆热固性粘合剂141(图7的部分(b)),并将电路芯片11放置在粘合剂141上。由加热/加压头52对电路芯片11和天线进行加热和加压以使它们彼此焊接连接(图7的部分(c)),并通过对粘合剂141进行热固化将电路芯片11固定在基片13的基部131上。
接着,将基片13的基部131压入形成于板55中的凹部521(图7的部分(d)),并由喷嘴51将通过接收紫外光照射而固化的粘合剂142涂覆在电路芯片11上(图7的部分(e))。然后,由辊53来折叠基片13(图7的部分(f)),并通过接收来自紫外灯54的紫外光线541的照射来固化粘合剂142(图7的部分(g))。由此,将电路芯片11固定到基片13的第一折返部132和第二折返部133(图7的部分(h))。通过这些过程来形成图5和图6中示出的RFID标签。
图8是作为根据本发明的另一实施例的RFID标签的侧视图,而图9是图8中所示的RFID标签的顶视图。
类似于图5和图6中所示的RFID标签10,图8和图9中所示的RFID标签20具有基片13折回以夹住电路芯片11的结构。
然而,基片13具有:基部131,电路芯片11置于其上并且该基部131与电路芯片11的下表面111相接触;和折返部134,从基部131延伸并折回以与电路芯片11的上表面112的整个表面接触,由此覆盖电路芯片11的整个表面。
利用粘合剂141将电路芯片11的下表面111侧粘结到基片13的基部131在电路芯片11侧的表面,并利用粘合剂142将电路芯片11的上表面112侧粘结到基片13的折返部134在电路芯片11侧的表面。
另外在图8和图9中示出的RFID标签20的情况下,与图1到图3所示的现有技术形式相比,仅需将厚度增加一片薄基片厚,使得可以通过几乎不增加RFID标签厚度而显著提高对弯曲力的抗性。
图10是说明图8和图9中所示的RFID标签的制造过程的图。
这里,类似于图7的部分(a)到图7的部分(c)中示出的过程,在基片13上形成天线(未示出)。将热固性粘合剂141涂覆在基片13的一端,并将电路芯片11置于粘合剂141上。对电路芯片11和天线进行加热和加压以彼此连接,并通过粘合剂141将电路芯片11固定到基片13。
接着,类似于图7的部分(d)中所示的过程,将基片13的基部131压入板55的凹部521,以使得折返部134被折回。然后,类似于图7的部分(e)到图7的部分(g)中示出的过程,将紫外固化粘合剂涂覆在电路芯片11的上表面112上,然后再折回折返部134,并通过接收紫外光照射来固化粘合剂。结果,形成具有图8和图9所示形状的RFID标签20。
如在上述两个实施例中所示,根据本发明的RFID标签具有如下结构,其中电路芯片11由基片13夹住,并且电路芯片11的下表面111和上表面112都粘结到基片13。结果,在根据本发明的RFID标签中,与图1到图3中所示的现有技术形式相比,可以通过几乎不增加RFID标签的厚度而显著提高对弯曲力的抗性。

Claims (3)

1、一种射频标识标签,包括:
基片;
置于所述基片上的通信天线;以及
电路芯片,连接到所述天线,并经由所述天线进行无线电通信,
其中所述基片被折叠以夹住所述电路芯片,并且
其中所述电路芯片附于所述折叠基片的两个表面上,所述表面面向所述电路芯片。
2、根据权利要求1所述的射频标识标签,其中所述基片包括:
基部,电路芯片置于其上;
第一折返部,从所述基部延伸出并被折回以覆盖电路芯片的半个部分;以及
第二折返部,沿与所述第一折返部相反的方向从所述基部延伸出并被折回以覆盖电路芯片的除所述第一折返部覆盖的半个部分以外的剩余半个部分。
3、根据权利要求1所述的射频标识标签,其中所述基片包括:
基部,电路芯片置于其上;和
折返部,从所述基部延伸出并被折回以覆盖电路芯片的整个表面。
CNB2006100745236A 2005-12-20 2006-04-21 Rfid标签 Expired - Fee Related CN100524352C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005366980A JP4754344B2 (ja) 2005-12-20 2005-12-20 Rfidタグ
JP2005366980 2005-12-20

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CN1987904A true CN1987904A (zh) 2007-06-27
CN100524352C CN100524352C (zh) 2009-08-05

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EP (1) EP1804203B1 (zh)
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KR (1) KR100774902B1 (zh)
CN (1) CN100524352C (zh)
DE (1) DE602006015029D1 (zh)
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US20070139203A1 (en) 2007-06-21
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TW200725425A (en) 2007-07-01
EP1804203A2 (en) 2007-07-04
CN100524352C (zh) 2009-08-05
JP4754344B2 (ja) 2011-08-24
KR100774902B1 (ko) 2007-11-09
TWI318754B (en) 2009-12-21
DE602006015029D1 (de) 2010-08-05
EP1804203B1 (en) 2010-06-23
EP1804203A3 (en) 2008-04-23

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