CN1979903A - 发光二极管模组 - Google Patents

发光二极管模组 Download PDF

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CN1979903A
CN1979903A CNA2005101023124A CN200510102312A CN1979903A CN 1979903 A CN1979903 A CN 1979903A CN A2005101023124 A CNA2005101023124 A CN A2005101023124A CN 200510102312 A CN200510102312 A CN 200510102312A CN 1979903 A CN1979903 A CN 1979903A
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emitting diode
light
heat abstractor
light emitting
conductive connecting
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CN100454595C (zh
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胡祯祥
林雨利
谭理光
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/93—Thermoelectric, e.g. peltier effect cooling

Abstract

本发明公开一种具有高散热效率的发光二极管模组，其包括一封装完成的发光二极管以及一散热装置，该发光二极管具有正负极性的导电接脚，该等导电接脚从该发光二极管的底部延伸，该发光二极管其中一极性的导电接脚结合在该散热装置上，该散热装置接设在一电源的一个极性上。从而，该散热装置兼具导电与散热功能，有效解决发光二极管的导电接脚与所需安装的散热装置之间的干涉问题。

Description

发光二极管模组
【技术领域】
本发明涉及发光源模组，特别是关于一种具有散热装置以同时对发光源进行散热的发光二极管模组。
【背景技术】
发光二极管(LED，Light-emitting Diode)作为发光源由于具有高效益的特性，而在汽车、交通信号灯指示、屏幕显示，甚至照明等领域得到广泛应用。作为固体光源本身的一个特点，LED发光源在工作时也将发出热量，而它所散发出的热量能否及时导出或散发出去，将成为影响LED发光品质与寿命的关键因素，这是因为，随着温度的升高，LED的发光效益将显著下降，严重影响其发光亮度及缩短其使用寿命。
目前，业界已开始采用散热装置对LED进行辅助散热，其中一种方式是在LED的封装过程中，即将散热板或散热块等散热装置一并封装在内，但此种方式所能结合的散热装置往往体积较小，导致散热能力有限；且此种方式由于LED与散热装置固定结合在一起，导致可互换性及通用性较差，不利于节省资源，不便根据LED所需散热需求而选择合适的散热装置。
为此，业界亦有采用将预先封装好的LED再贴设于散热装置上的方法对LED进行散热，如图1所示，预先封装好的LED 10穿设通过电路板12上预设的穿孔121而直接贴设在金属散热板13上，从而将该等LED 10所产生的热量即可通过该金属散热板13而散发出去。然而，此种散热方式较适合LED10的导电接脚14设于两侧的情形，而针对LED的另一种封装模式即导电接脚设置在LED底部的情形，如图2所示的直立式LED而言，则会出现输入电源的导电接脚与所需安装的散热装置产生干涉的问题，而为将导电接脚与散热装置的干涉处避开，通常需要牺牲大量的散热面积，导致无法兼顾考虑输入电源及散热效果。
【发明内容】
有鉴于此，在此实有必要提供一种具高散热效率的发光二极管模组，同时避免出现安装干涉问题。
该发光二极管模组包括一封装完成的发光二极管以及一散热装置，该发光二极管具有正负极性的导电接脚，该等导电接脚从该发光二极管的底部延伸，该发光二极管其中一极性的导电接脚结合在该散热装置上，该散热装置接设在一电源的其中一个极性上。
上述发光二极管模组是利用散热装置来做为电源输入的极性，即不影响电源输入，又可使散热装置完全贴于所需散热的发光二极管上，且散热装置互换性强，其可视情形而增大散热面积，增加散热效果，不须为将发光二极管的导电接脚与散热装置的干涉处避开而牺牲大量散热面积，更可将散热片与发光二极管之间模块化，成为随插即用的装置，同时兼具考虑散热效果以及输入电源的便利性。
【附图说明】
下面参考附图，结合实施例对本发明作进一步描述。
图1是发光二极管的其中一现有散热结构示意图。
图2是直立式发光二极管的其中一现有封装结构示意图。
图3是本发明发光二极管模组第一实施例的立体分解示意图。
图4是图3所示发光二极管模组的另一视角的分解示意图。
图5是图3的立体组装图。
图6是本发明发光二极管模组第二实施例的立体分解示意图。
图7是图6的立体组装图。
图8是本发明发光二极管模组第三实施例的立体分解示意图。
图9是图8的另一视图。
图10是图8的立体组装图。
【具体实施方式】
图2为直立式发光二极管的其中一现有封装结构，基本构成为一发光二极管芯片(die)20、一封装层22及两支架24、25，该芯片20放置在其中一支架25所形成的碗部空间内，其工作时产生的热量将通过该等支架24、25而传导出去。
图3至图5揭示为本发明发光二极管模组的第一实施例，包括一封装完成的发光二极管30、一聚光片40、一散热装置50、一外壳60及一电源线70。其中，该发光二极管30为直立式结构，沿其底部延伸具有若干导电接脚32，图中揭示为具有八个导电接脚32，相应地该发光二极管30内封装有七个发光二极管芯片(die)，以增加整体发光亮度，其中一导电接脚34当作公共电极并可通过该电源线70以拉出的方式而接设在一外部电源(图未示)的一个极性上。该散热装置50与发光二极管30的导电接脚32结合，包括若干圆盘状平行堆叠排列的散热鳍片52，其预部设有可与发光二极管30的导电接脚32相互结合的一结合机构，此结合机构于本实施例中为一凸伸部54，该凸伸部54上设置有若干孔洞542(请参图4)，从而该发光二极管30的导电接脚32则可直接插入至该等孔洞542中并使发光二极管30的底部表面与该凸伸部54的顶部表面接触，而达成将该发光二极管30结合至该散热装置50上，该等导电接脚32与孔洞542的大小可通过精确设计而达成紧密结合，据此，发光二极管30在工作时产生的热量可通过发光二极管30的底部以及由该底部延伸的导电接脚32而直接传递至该散热装置50上快速且充分地散发出去，同时该散热装置50亦作为该发光二极管30的另一极性输入而接设在该外部电源的另一极性上。
该外壳60设置在该散热装置50外围，可将散热装置50与发光二极管30起固定与保护的功用，此外壳60并可做为组装电源极性及分离电源极性之使用，且促成整体实现模块化结构设计。在实务上，该散热装置50的底部可设置一凹孔56，而该外壳60上对应该凹孔56位置延伸设置一导电杆62，其可伸入至该凹孔56内并与该散热装置50电性接触，从而，该外部电源的正负极性则可分别与该电源线70及该导电杆62接设，而实现对该发光二极管30供电。
图6及图7揭示为本发明发光二极管模组的第二实施例，其与上述第一实施例的区别在于所设的散热装置50a的底部装设有一导电结构80，此导电结构80的底缘亦延伸设置一导电杆82，该导电杆82穿过外壳60a后即可与上述外部电源的其中一极性接设，从而，本实施例所设置的此导电结构80可供模块化时的极性使用。
图8至图10揭示为本发明发光二极管模组的第三实施例，在该实施例中，该发光二极管30b的底部延伸有导电接脚32、34；该实施例所设的散热装置50b对发光二极管30b进行散热并同时亦作为一极性输入，包括若干辐射排列的散热鳍片52b，且沿顶部至底部贯穿开设有一沟槽58，以供电源线70b穿设并与发光二极管30b的其中一导电接脚34接设，该散热装置50b的顶部设置一具有凹陷部54b的结合机构，且于该凹陷部54b所在的位置上设置一孔洞542b，当该发光二极管30b结合至该散热装置50b上时，其另一导电接脚32则可伸入至该孔洞542b中而与该散热装置50b电性接通；该实施例所设外壳60b的底部亦设置有一导电杆62b，其可伸入对应设于该散热装置50b底部的凹孔56中。从而，外部电源的正负极性则可分别与该电源线70b及该外壳60b的导电杆62b接设，而实现对该发光二极管30b供电，且同时该散热装置50b对发光二极管30b在工作时产生的热量进行散发。
本发明的上述实施例中，散热装置50、50a、50b与发光二极管30、30b的结合方式灵活，可互换性大大增强，可根据不同使用场合方便地为发光二极管30、30b配备不同型式的散热装置；且散热装置50、50a、50b在散发发光二极管30、30b热量的同时，亦作为外部输入电源的其中一极性而对发光二极管30、30b供电，有效解决发光二极管30、30b用于输入电源的导电接脚32、34与所需安装的散热装置产生干涉的问题，达到兼顾考虑输入电源及散热效果。

Claims (10)

1.一种发光二极管模组，包括一封装完成的发光二极管以及一散热装置，该发光二极管具有正负极性的导电接脚，其特征在于：该等导电接脚由该发光二极管的底部延伸，该发光二极管其中一极性的导电接脚结合在该散热装置上，该散热装置则接设在一电源的一个极性上。
2.如权利要求1所述的发光二极管模组，其特征在于：该散热装置包括若干散热鳍片，且该散热装置与发光二极管导电接脚的结合处设有可与导电接脚相互紧密结合的一结合机构。
3.如权利要求2所述的发光二极管模组，其特征在于：该结合机构为由该散热装置延伸形成的一凸伸部。
4.如权利要求2所述的发光二极管模组，其特征在于：该结合机构为由该散热装置内设置的一凹陷部。
5.如权利要求1所述的发光二极管模组，其特征在于：该发光二极管另一极性的导电接脚是通过一电源线而接设在该电源的另一极性上。
6.如权利要求5所述的发光二极管模组，其特征在于：该散热装置上设置有一沟槽，该电源线收容在该沟槽内。
7.如权利要求1所述的发光二极管模组，其特征在于：该散热装置上装设有一导电结构，此导电结构与该电源连接。
8.如权利要求1所述的发光二极管模组，其特征在于：还包括一外壳，该外壳设置在该散热装置上。
9.如权利要求8所述的发光二极管模组，其特征在于：该外壳上设置有一导电杆，该导电杆与该散热装置及该电源电性连接。
10.如权利要求1所述的发光二极管模组，其特征在于：该发光二极管内封装有若干个发光芯片，该等发光芯片具有一公共极性的导电接脚，该公共极性的导电接脚是通过一电源线而接设在该电源的另一极性上，而该等发光芯片的其它导电接脚结合在该散热装置上。
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