CN1971959A - 半导体致冷设备专用翼管形散热器及其制备方法 - Google Patents

半导体致冷设备专用翼管形散热器及其制备方法 Download PDF

Info

Publication number
CN1971959A
CN1971959A CN200610102206.0A CN200610102206A CN1971959A CN 1971959 A CN1971959 A CN 1971959A CN 200610102206 A CN200610102206 A CN 200610102206A CN 1971959 A CN1971959 A CN 1971959A
Authority
CN
China
Prior art keywords
transverse tube
standpipe
refrigeration unit
semiconductor refrigeration
end cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200610102206.0A
Other languages
English (en)
Other versions
CN100433392C (zh
Inventor
温金宇
王双玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luquan Jiwei Electric Appliance Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNB2006101022060A priority Critical patent/CN100433392C/zh
Publication of CN1971959A publication Critical patent/CN1971959A/zh
Priority to US11/940,836 priority patent/US20080128120A1/en
Application granted granted Critical
Publication of CN100433392C publication Critical patent/CN100433392C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0219—Arrangements for sealing end plates into casing or header box; Header box sub-elements
    • F28F9/0224—Header boxes formed by sealing end plates into covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09—Heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F2009/0285—Other particular headers or end plates
    • F28F2009/0292—Other particular headers or end plates with fins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49359—Cooling apparatus making, e.g., air conditioner, refrigerator

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明属于散热器及制备方法，特别是指一种半导体致冷设备专用翼管形散热器及其制备方法。包括由立管和上下横管焊接、且彼此连通组成散热腔，与散热腔通过管路连通的蒸发器，横管的两端为盲端，横管和立管外表面分布有连接处的切线呈夹角α、且沿轴向延伸的条形翼片，其中0°＜α≤90°，制作时将各主要构件通过挤出、冲压或其他机加工工艺分别成型，焊接后制成散热器。它解决了现有技术存在的焊点数量繁多，工艺复杂，不能实现工业化批量生产等问题。具有加工工艺简单可靠，可大批量的工业化生产，大量的减少了焊接点等优点。

Description

半导体致冷设备专用翼管形散热器及其制备方法
技术领域
本发明属于散热器及制备方法，特别是指一种半导体致冷设备专用翼管形散热器及其制备方法。
背景技术
目前公开的资料显示立管散热器的整体结构为上下横管与立管之间打联接孔和加散热丝等方式人工组焊来完成的。其横管一般采用光管和立管的焊接，原有横管、立管的散热面积，由于采用光管加焊接散热丝及散热片来解决，故造成光管与散热丝及散热片之间为点焊接触，不仅散热面积受到焊接点的限制，而且传热效率仅是整体结构传热效率的20％～30％。该种类散热器存在着散热管表面的焊点数量繁多，焊接工艺复杂，只能限于手工焊接制作，不能实现工业化批量生产，零部件不易实现标准化生产，且焊接质量没有保证的问题。
发明内容
本发明的目的之一在于提供一种结构简化，易于实现标准化生产，且散热效果好的半导体致冷设备专用翼管形散热器。
本发明的另一目的在于提供一种易于实现工业化生产的半导体致冷设备专用翼管形散热器的制备方法。
本发明的整体技术解决方案是：
a、将立管(1)、横管或条形端盖(2)分别通过挤出成型工艺分别挤出成型，将表面涂覆焊接敷料的板材通过冲压成型工艺制成周边呈凹槽的端盖(7)以及表面开设翻边通孔、两侧呈凹槽的连接板(9)；或直接在横管表面采用机加工方式加工出通孔；
b、将条形端盖(2)、立管(1)剪切成相应的长度；
c、将步骤a、b中制备完毕的条形端盖(2)、连接板(9)、端盖(7)组装成横管，然后将横管与步骤b中制备好的立管(1)按照装配要求插装连接完毕，并用专用卡具固定后，送入炉焊设备，加温使各构件表面的焊接敷料熔融，熔融敷料在各构件的连接缝隙处通过毛细作用进行自蔓延，实现各构件之间的固定连接；该步骤中还可将步骤a中制备的带有通孔的横管直接与步骤b中的立管(1)进行焊接组配。
本发明中的具体技术解决措施还有：
横管由为型材组成、且断面呈拱型的条形端盖2，封堵于条形端盖2条形开口处的连接板9组成管形结构，横管的两端封装有端盖7。可以显而易见地是，条形端盖2既可以采用断面为“U”形的一体化型材，也可以选用选用板材或异形板材搭接组焊形成，其中优选的技术方案是采用条形端盖2选用断面为“U”形的一体化型材。该种结构适宜于大规模批量生产。
横管或者还可以直接通过型材挤出成型，并在其表面通过机加工的方式加工出与立管连接的通孔，该种结构适宜于小规模生产，虽然焊点数量较多，生产效率低，但不脱离本发明的实质。
条形翼片6在横管及立管1的管壁外表面呈径向分布、沿轴向延伸。其中优选的技术方案是条形翼片6在横管及立管1的管壁外表面呈径向等角度分布、沿轴向延伸。
条形翼片6与横管或立管1采用一体化成型。其中优选的技术方案是选用铝型材为制作材质、采用挤出成型工艺一体化成型。
横管、立管1与相邻的管件或构件之间选用焊接配合。
横管或立管1上设有泄压阀3。
横管端部设有与其内腔连通观察孔5。
制备方法中还包一步骤d，即将步骤c中制备好的散热器相应的构件表面装配泄压阀3和观察孔5。
本发明所取得的实质性特点和显著的技术进步在于：
第一；采用横管、立管一次性挤出成型，连接板与通孔一次冲压落料，并且组装后进炉一次焊接成型来完成。将散热器主体定型为立管类散热器，克服了盘管式散热器循环管路单一，而且散热水在循环过程中遇到的弯路很多，使循环受阻的问题，同时也克服了板式散热器的承压能力低，容易造成散热器的扭曲、变形、焊点开裂等问题。
第二；主要部件为挤出型材，生产加工工艺简单可靠，而且成本低廉，成品率高。立管、横管或横管的条形端盖与条形翼片整体一次挤出成型，这样不仅散热面积比现有产品增加了8～10倍，而且传热效率提高了60％～80％。
第三；使用高端设备焊接，克服了手工焊接的质量差，效率低的问题，且可以大批量的工业化生产。
第四；采用在立管和横管表面设有条形翼片，增加了立管和横管的有效散热面积，而且大量的减少了焊接点。
附图说明
本发明的附图有：
图1是本发明的整体结构示意图。
图2是图1的左视图。
图3是图2中的I部放大结构示意图。
具体实施方式
以下结合附图对本发明的实施例做进一步描述，但不作为对本发明的限定。
半导体致冷设备专用翼管形散热器，包括由立管1和上下横管焊接、且彼此连通组成散热腔，与散热腔通过管路连通的蒸发器4，横管的两端为盲端，所述的横管和立管1外表面分布有条形翼片6，条形翼片6在横管及立管1的管壁外表面呈径向等角度分布、沿轴向延伸。横管为由断面呈拱型的条形端盖2，封堵于条形端盖2条形开口处的连接板9组成管形结构，横管的两端封装有端盖7。
条形翼片6与横管或立管1是选用铝型材为制作材质、采用挤出成型工艺一体化成型。
横管、立管1与相邻的管件或构件之间选用焊接配合。
横管或立管1上设有泄压阀3。
横管端部设有与其内腔连通观察孔5。
半导体致冷设备专用翼管形散热器的制备方法，包括如下步骤：
a、将条形端盖2、立管1通过挤出成型工艺分别一次性挤出成型，将表面涂覆焊接敷料的板材通过冲压成型工艺制成周边呈凹槽的端盖7以及表面开设翻边通孔、两侧呈凹槽的连接板9；
b、将条形端盖2、立管1剪切成相应的长度；
c、将步骤a、b中制备完毕的条形端盖2、连接板9、端盖7组装成横管，然后将横管与步骤b中制备好的立管1按照装配要求插装连接完毕，并用专用卡具固定后，送入炉焊设备，加温至230℃左右，使各构件表面的焊接敷料熔融，熔融敷料在各构件的连接缝隙处通过毛细作用进行自蔓延，实现各构件之间的固定连接。
制备方法中还包一步骤d，即将步骤c中制备好的散热器相应的构件表面装配泄压阀3和观察孔5。

Claims (9)

1、半导体致冷设备专用翼管形散热器，包括由立管(1)和上下横管焊接、且彼此连通组成散热腔，与散热腔通过管路连通的蒸发器(4)，横管的两端为盲端，其特征在于所述的横管和立管(1)外表面分布有连接处的切线呈夹角α、且沿轴向延伸的条形翼片(6)，其中0°＜α≤90°。
2、根据权利要求1所述的半导体致冷设备专用翼管形散热器，其特征在于所述的横管由为型材组成、且断面呈拱型的条形端盖(2)，封堵于条形端盖(2)条形开口处的连接板(9)组成管形结构，横管的两端封装有端盖(7)。
3、根据权利要求1所述的半导体致冷设备专用翼管形散热器，其特征在于所述的条形翼片(6)在横管及立管(1)的管壁外表面呈径向分布、沿轴向延伸。
4、根据权利要求1所述的半导体致冷设备专用翼管形散热器，其特征在于所述的条形翼片(6)与横管或立管(1)采用一体化成型。
5、根据权利要求1所述的半导体致冷设备专用翼管形散热器，其特征在于所述的横管、立管(1)与相邻的管件或构件之间选用焊接配合。
6、根据权利要求1所述的半导体致冷设备专用翼管形散热器，其特征在于所述的横管或立管(1)上设有泄压阀(3)。
7、根据权利要求1所述的半导体致冷设备专用翼管形散热器，其特征在于所述的横管端部设有与其内腔连通观察孔(5)。
8、根据权利要求1-5所述的半导体致冷设备专用翼管形散热器的制备方法，其特征在于包括如下步骤：
a、将立管(1)、横管或条形端盖(2)分别通过挤出成型工艺分别挤出成型，将表面涂覆焊接敷料的板材通过冲压成型工艺制成周边呈凹槽的端盖(7)以及表面开设翻边通孔、两侧呈凹槽的连接板(9)；或直接在横管表面采用机加工方式加工出通孔；
b、将条形端盖(2)、立管(1)剪切成相应的长度；
c、将步骤a、b中制备完毕的条形端盖(2)、连接板(9)、端盖(7)组装成横管，然后将横管与步骤b中制备好的立管(1)按照装配要求插装连接完毕，并用专用卡具固定后，送入炉焊设备，加温使各构件表面的焊接敷料熔融，熔融敷料在各构件的连接缝隙处通过毛细作用进行自蔓延，实现各构件之间的固定连接；该步骤中还可将步骤a中制备的带有通孔的横管直接与步骤b中的立管(1)进行焊接组配。
9、根据权利要求8所述的半导体致冷设备专用翼管形散热器的制备方法，其特征在于还包一步骤d，即将步骤c中制备好的散热器相应的构件表面装配泄压阀(3)和观察孔(5)。
CNB2006101022060A 2006-12-01 2006-12-01 半导体致冷设备专用翼管形散热器及其制备方法 Expired - Fee Related CN100433392C (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB2006101022060A CN100433392C (zh) 2006-12-01 2006-12-01 半导体致冷设备专用翼管形散热器及其制备方法
US11/940,836 US20080128120A1 (en) 2006-12-01 2007-11-15 Fin-pipe shaped radiator specially adapted to a semiconductor chilling unit and the method of making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2006101022060A CN100433392C (zh) 2006-12-01 2006-12-01 半导体致冷设备专用翼管形散热器及其制备方法

Publications (2)

Publication Number Publication Date
CN1971959A true CN1971959A (zh) 2007-05-30
CN100433392C CN100433392C (zh) 2008-11-12

Family

ID=38112649

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006101022060A Expired - Fee Related CN100433392C (zh) 2006-12-01 2006-12-01 半导体致冷设备专用翼管形散热器及其制备方法

Country Status (2)

Country Link
US (1) US20080128120A1 (zh)
CN (1) CN100433392C (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102478317A (zh) * 2010-11-29 2012-05-30 陶礼德 扁盒立式热管换热水箱
CN102528409A (zh) * 2012-01-05 2012-07-04 华为技术有限公司 重力环路热管散热器、冷凝器及制备方法
CN104864636A (zh) * 2014-02-20 2015-08-26 摩丁制造公司 钎焊的热交换器

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201393359Y (zh) * 2009-02-26 2010-01-27 富准精密工业(深圳)有限公司 散热装置及其基座
GB2498373B (en) * 2012-01-12 2016-08-31 ECONOTHERM UK Ltd Heat exchanger
DE102015010288A1 (de) 2014-08-22 2016-02-25 Modine Manufacturing Company Wärmetauscher, Behälter für Wärmetauscher und Verfahren zur Herstellung desselben

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2965360A (en) * 1954-08-19 1960-12-20 Brown Fintube Co Heat exchangers
US2924437A (en) * 1955-03-21 1960-02-09 Olin Mathieson Heat exchanger
GB2196730B (en) * 1986-10-21 1991-06-26 Austin Rover Group A heat exchanger
EP0515736A1 (en) * 1991-05-28 1992-12-02 New Holland Ford Limited Radiator for vehicle cooling system
US5186248A (en) * 1992-03-23 1993-02-16 General Motors Corporation Extruded tank condenser with integral manifold
JPH07305986A (ja) * 1994-05-16 1995-11-21 Sanden Corp 多管式熱交換器
JPH08327276A (ja) * 1995-05-30 1996-12-13 Sanden Corp 多管式熱交換器
US5823250A (en) * 1997-09-05 1998-10-20 General Motors Corporation Integrally extruded radiator tank and oil cooler
US7128136B2 (en) * 1998-08-10 2006-10-31 Gregory Christian T Radial flow heat exchanger
JP2001257383A (ja) * 2000-01-07 2001-09-21 Citizen Watch Co Ltd 熱電素子およびその製造方法
CN2536973Y (zh) * 2002-03-06 2003-02-19 山东小鸭集团冰柜有限公司 高效半导体制冷器
CN1234167C (zh) * 2002-05-20 2005-12-28 深圳市益酷科技有限公司 散热翅片、热管、母板金属一体化散热器
US7496285B2 (en) * 2003-07-18 2009-02-24 Liebert Corporation Multi-pass parallel-tube heat exchanger
TWI262285B (en) * 2005-06-03 2006-09-21 Foxconn Tech Co Ltd Loop-type heat exchange apparatus
CN100573416C (zh) * 2005-07-15 2009-12-23 富准精密工业(深圳)有限公司 电脑系统及其散热模组
US20070175610A1 (en) * 2006-01-30 2007-08-02 Yun-Yu Yeh Heat dissipating device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102478317A (zh) * 2010-11-29 2012-05-30 陶礼德 扁盒立式热管换热水箱
CN102478317B (zh) * 2010-11-29 2014-08-13 陶礼德 扁盒立式热管换热水箱
CN102528409A (zh) * 2012-01-05 2012-07-04 华为技术有限公司 重力环路热管散热器、冷凝器及制备方法
CN102528409B (zh) * 2012-01-05 2014-07-16 华为技术有限公司 重力环路热管散热器、冷凝器及制备方法
CN104864636A (zh) * 2014-02-20 2015-08-26 摩丁制造公司 钎焊的热交换器
CN104864636B (zh) * 2014-02-20 2019-09-13 摩丁制造公司 钎焊的热交换器

Also Published As

Publication number Publication date
US20080128120A1 (en) 2008-06-05
CN100433392C (zh) 2008-11-12

Similar Documents

Publication Publication Date Title
US11852421B2 (en) Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system
CN100433392C (zh) 半导体致冷设备专用翼管形散热器及其制备方法
TWI427258B (zh) 熱交換器
CN104713387B (zh) 折弯换热器及换热器的折弯方法
JP2010169289A (ja) 屈曲状熱交換器及びその製造方法
JP2015090266A (ja) 熱交換器及びその製造方法
JP2006308240A (ja) ヒートパイプ式熱交換器及びその製造方法
WO2011156700A2 (en) A micro-channel heat exchanger suitable for heat pump water heater and the manufacturing method
CN104708293B (zh) 换热器的制造方法
CN104154778A (zh) 换热器以及换热器的制造方法
CN101776403B (zh) 一种热交换器
CN103940284A (zh) 换热器及其连接方法
KR101970966B1 (ko) 열교환기의 입출구배관 연결용 입출구 부재
US7207179B2 (en) Method of connecting heat transfer pipe and capillary tube
CN101776413B (zh) 热交换器及其制造方法
KR200432601Y1 (ko) 열교환기용 헤더파이프
KR101422074B1 (ko) 열교환용 인아웃렛 파이프의 고정구조
KR101538346B1 (ko) 열교환기의 제작 방법
WO2009142368A1 (en) Heat exchanger
KR20100131260A (ko) 열교환기용 핀튜브
KR101100118B1 (ko) 열교환기용 매니폴드 및 그 제조방법
CN205617126U (zh) 干洗机用冷凝器
CN2720383Y (zh) 集束型热管散热器
KR102707606B1 (ko) 보일러용 열교환기 제조방법
KR20030058079A (ko) 열교환기의 조립방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: LUQUAN JIWEI ELECTRICAL CO., LTD.

Free format text: FORMER OWNER: WANG SHUANGLING

Effective date: 20090605

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20090605

Address after: No. 1, Xiangyang South Avenue, Hebei, Luquan

Patentee after: Luquan Jiwei Electric Appliance Co., Ltd.

Address before: 1, unit 5, building 18, No. 501 van West Road, Hebei, Shijiazhuang

Patentee before: Wang Shuangling

PE01 Entry into force of the registration of the contract for pledge of patent right

Effective date of registration: 20091127

Pledge (preservation): Pledge

PP01 Preservation of patent right

Effective date of registration: 20100906

Granted publication date: 20081112

PD01 Discharge of preservation of patent

Date of cancellation: 20110306

Granted publication date: 20081112

PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20111230

Granted publication date: 20081112

Pledgee: Hebei Information Industry Investment Co., Ltd.

Pledgor: Luquan Jiwei Electric Appliance Co., Ltd.

Registration number: 2009130000657

DD01 Delivery of document by public notice

Addressee: Liu Wuai

Document name: Notification to Pay the Fees

PP01 Preservation of patent right

Effective date of registration: 20120329

Granted publication date: 20081112

DD01 Delivery of document by public notice

Addressee: Liu Wuai

Document name: Notice of preservation procedure

PD01 Discharge of preservation of patent

Date of cancellation: 20121008

Granted publication date: 20081112

RINS Preservation of patent right or utility model and its discharge
DD01 Delivery of document by public notice

Addressee: Luquan Jiwei Electric Appliance Co., Ltd.

Document name: Notification to Pay the Fees

DD01 Delivery of document by public notice

Addressee: Liu Wuai

Document name: Notification of Termination of Patent Right

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20081112

Termination date: 20121201