CN1967385A - Anticorrdant dilution system - Google Patents
Anticorrdant dilution system Download PDFInfo
- Publication number
- CN1967385A CN1967385A CNA200610128932XA CN200610128932A CN1967385A CN 1967385 A CN1967385 A CN 1967385A CN A200610128932X A CNA200610128932X A CN A200610128932XA CN 200610128932 A CN200610128932 A CN 200610128932A CN 1967385 A CN1967385 A CN 1967385A
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- Prior art keywords
- liquid
- anticorrdant
- high viscosity
- pipeline
- dilution system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Materials For Photolithography (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides an anticorrdant dilution system comprising a pipeline used for flow of a liquid, such as a resist with high viscosity, which is easy to dry but difficult to deal with. Said anticorrdant dilution system 1 comprises a pipeline 3 and a modulating groove 2, wherein the pipeline 3 comprises a pipe 3a used for a resist with high viscosity, a pipe 3b used for a diluting solvent and an outflow part 3e. In the modulating groove 2, the resist with high viscosity and the diluting solvent are mixed, wherein the resist with high viscosity flows into the pipe 3a used for a resist with high viscosity and flows out from the outflow part 3e while the diluting solvent flows into the pipe 3a used for a diluting solvent and flows out from the outflow part 3e. Using the anticorrdant dilution system 1, a diluting solvent is capable of swashing and removing resist with high viscosity which is often maintained on the pipe surface.
Description
Technical field
The present invention relates to solve the technology of the dry problem of Anticorrdant dilution system medium-high viscosity resist.
Background technology
To form the last stage that thickness is filmed uniformly, need this liquid against corrosion of modulation as coating liquid against corrosion on bodies to be coated such as semiconductor wafer or crystal liquid substrate.Liquid against corrosion normally will dilute from carrying viewpoints such as cost that the high viscosity resist that provides will be provided in factory that reality is used etc., is modulated into suitable viscosity.
Fig. 3 illustrates existing Anticorrdant dilution system.Anticorrdant dilution system 21 is made of with pipeline 25, valve 24, valve 26 with pipeline 23, diluting solvent preparation vessel 22, high viscosity resist.High viscosity resist 27 is directed into the high viscosity resist with in the pipeline 23, makes it flow to preparation vessel 22.Valve 24 is arranged on the high viscosity resist with on the pipeline 23, can adjust the flow of the high viscosity resist 27 that flows to preparation vessel 22.Diluting solvent 28 is directed into diluting solvent with in the pipeline 25, makes it flow to preparation vessel 22.Valve 26 is arranged on diluting solvent with on the pipeline 25, can adjust the flow of the diluting solvent 28 that flows to preparation vessel 22.
Below the method for using such Anticorrdant dilution system 21 to dilute the high viscosity resist is described.At first, open valve 24, the high viscosity resist 27 of scheduled volume is flowed in the preparation vessel 22, valve-off 24 then.
Then, open valve 26, diluting solvent 28 is flowed in the preparation vessel 22.Make diluting solvent 28 flow into preparation vessel 22 high viscosity resist 27 is diluted to after the proper viscosity valve-off 26 with required amount.
Like this, respectively from separately independently the high viscosity resist import high viscosity resist, diluting solvent with pipeline, diluting solvent with pipeline, dilute, reach suitable viscosity up to this high viscosity resist.
In addition, other method as dilution high viscosity resist, following coating membrane formation device is for example disclosed in patent documentation 1: material liquid and the dilution of preserving high concentration in the coating membrane formation device, leading section semiconductor wafer being supplied with the nozzle of coating fluid mixes this material liquid and this dilution.
And, following photoresist apparatus for coating is disclosed in patent documentation 2: have between photoresist groove and diluent nozzle and be used to mix photic Anticorrdant dilution and be injected into device in this dilution trap with the dilution trap of solvent and photoresist and with this photoresist dilution agent with solvent.
[patent documentation 1] TOHKEMY 2001-176776 communique
The real public clear 61-188351 communique of [patent documentation 2] Japan
In the Anticorrdant dilution system 21 of Fig. 3 in the employed pipeline, independently be provided with the high viscosity resist respectively with pipeline and diluting solvent pipeline.Therefore, be attached with residual high viscosity resist with the inner surface of pipeline, this high viscosity resist drying and set at the high viscosity resist.At the high viscosity resist with among the pipeline, especially with escape hole that air contacts the most near, this set is remarkable.Therefore, such Anticorrdant dilution system designs as prerequisite with following situation, that is, by regular maintenance the high viscosity resist is cleaned with pipeline and to use.
And, when the high viscosity resist exists the dry thing of high viscosity resist or viscosity changing matter with the link position of pipeline or high viscosity resist with the set valve place of pipeline, might there be following problems: by the production of foreign matters due to this drying thing or the viscosity changing matter or the characteristic variations of resist etc.
And, when cleaning high viscosity resist is used pipeline, need stop the work of this Anticorrdant dilution system, need its alternative machine (backup device in the cleaning).Therefore, be unsuitable for this Anticorrdant dilution system of working all the time.
And, in the photoresist apparatus for coating of patent documentation 1 and patent documentation 2, be difficult to modulate exactly the concentration of liquid against corrosion, can not be set at suitable concentration.Therefore, the THICKNESS CONTROL during painting erosion resistant agent might become difficult on semiconductor wafer.
Summary of the invention
In view of above-mentioned problem, the invention provides a kind of Anticorrdant dilution system, it has makes easily dry and pipeline that reluctant liquid circulates such as high viscosity resist.
The present invention relates to a kind of Anticorrdant dilution system, this Anticorrdant dilution system is characterised in that it has pipeline and mixing portion, and described pipeline has inflow portion more than 2 and the outflow portion more than 1; Described mixing portion is with first liquid and second liquid mixing, the first inflow portion of this first liquid from described inflow portion flow into, the first outflow portion from described outflow portion flows out, the second inflow portion of this second liquid from described inflow portion flows into, flows out from the described first outflow portion, and the viscosity of this second liquid is lower than described first liquid relatively.
According to such structure, in use, second liquid can wash (washing い stream The) to described first liquid that often remains in pipe surface.
And described Anticorrdant dilution system has following characteristics: described first liquid is anticorrosive additive material, and described second liquid is the thinning agent of the described anticorrosive additive material of dilution.
According to such structure, in use, diluting solvent can wash the high viscosity resist that often remains in pipe surface.
Described Anticorrdant dilution system also has following characteristics: described mixing portion has preparation vessel, and this preparation vessel utilizes described first liquid of described second liquid diluting, to adjust the viscosity of this first liquid.
According to such structure,, the viscosity of first liquid can be modulated into suitable viscosity by diluting with second liquid.
Described Anticorrdant dilution system is characterised in that it further has first supply unit and second supply unit, and described first supply unit can be filled described first liquid, and this first liquid is supplied with to the described first inflow portion; Described second supply unit can be filled described second liquid, and this second liquid is supplied with to the described second inflow portion.
According to such structure, first liquid can be supplied with to the first inflow portion from first supply unit, second liquid is supplied with to the second inflow portion from second supply unit.
Described Anticorrdant dilution system is characterised in that it further has connecting portion, and this connecting portion connects described first supply unit and described second supply unit, makes described second liquid flow into this first supply unit from this second supply unit.
According to such structure, can also first liquid of the inner surface of the inner surface that remains in described first supply unit and the first inflow portion be washed.
The present invention relates to the using method of Anticorrdant dilution system, this Anticorrdant dilution system has pipeline and modulation portion, and described pipeline has inflow portion more than 2 and the outflow portion more than 1, and described modulation portion is used to dilute resist with modulation viscosity; The method is characterized in that, the first inflow portion from described inflow portion flows into first liquid, the first outflow portion of this first liquid from described outflow portion flowed out, be supplied to described modulation portion, supply with after described first liquid, the second inflow portion from described inflow portion flows into second liquid that viscosity is lower than this first liquid relatively, and this second liquid is flowed out from the described first outflow portion, is supplied to described modulation portion.
According to such method, in use, second liquid can wash described first liquid that remains in pipe surface.
The using method of described Anticorrdant dilution system also has following characteristics: supply with this first liquid from first supply unit that is filled with described first liquid that is supplied to the described first inflow portion, after described first supply unit is supplied with this first liquid, in this first supply unit, add described second liquid, this second liquid is supplied to the described first inflow portion from this first supply unit, flows out from the described first outflow portion.
According to such structure, can first liquid of the inner surface of the inner surface that remains in described first supply unit and the first inflow portion be washed.
The using method of described Anticorrdant dilution system is characterised in that described first liquid is anticorrosive additive material, and described second liquid is the thinning agent of the described anticorrosive additive material of dilution.
According to such structure, can the high viscosity resist of the inner surface of the inner surface that remains in described first supply unit and the first inflow portion be washed.
By diluting solvent is connected with pipeline with the high viscosity resist with pipeline, in use, diluting solvent washes the high viscosity resist that often remains in pipe surface, therefore, can reduce production of foreign matters and reduce the danger of sneaking into viscosity variation product.And, can reduce the frequency of maintenance of Anticorrdant dilution system, can make contributions to the raising of work efficiency.
Description of drawings
Fig. 1 illustrates the Anticorrdant dilution system of first embodiment.
Fig. 2 illustrates the Anticorrdant dilution system of second embodiment.
Fig. 3 illustrates existing Anticorrdant dilution system.
Embodiment
[first embodiment]
Fig. 1 illustrates the Anticorrdant dilution system of present embodiment.Anticorrdant dilution system 1 mainly is made of preparation vessel 2, pipeline 3.Pipeline 3 has 2 inflow portions and 1 outflow portion.Side among 2 inflow portions imports high viscosity resist 5.Below, the pipeline that imports high viscosity resist 5 is called high viscosity resist pipeline 3a.
And the opposing party among 2 inflow portions of this pipeline 3 imports diluting solvent 6 (low viscosity solvent).Below, the pipeline that imports diluting solvent 6 is called diluting solvent pipeline 3b.
Pipeline has following structure: the high viscosity resist is connected with pipeline 3b with diluting solvent with pipeline 3a, and pipeline further extends to the 3e of outflow portion from this connecting portion 3c.Below, the pipe section from connecting portion 3c to the 3e of outflow portion is called common conduit 3d.
Be respectively arranged with valve 4a, 4b with pipeline 3a and diluting solvent on pipeline 3b at the high viscosity resist.Valve 4a is used to adjust the flow that flows to the high viscosity resist 5 of the 3e of outflow portion from the high viscosity resist with pipeline 3a.Valve 4b is used to adjust the flow that flows to the diluting solvent 6 of the 3e of outflow portion from diluting solvent with pipeline 3b.
In preparation vessel 2, will mix from high viscosity resist 5 and the diluting solvent 6 that the 3e of outflow portion flows out, utilize diluting solvent 6 with 5 dilutions of high viscosity resist, thereby high viscosity resist 5 can be modulated into the viscosity that reaches predetermined.
Below the method for using 1 pair of high viscosity resist 5 of such Anticorrdant dilution system to dilute is described.In addition, the original state of Anticorrdant dilution system 1 is that preparation vessel 2 is a closing state for empty, valve 4a, 4b.
At first, open valve 4a, make high viscosity resist 5 flow into preparation vessel 2.Flow into after the scheduled volume high viscosity resist 5 valve-off 4a.At this moment, be attached with residual high viscosity resist 5 at the periphery of the valve 4a of insides of pipes, inner surface and the 3e of outflow portion of common conduit 3d.
Then, open valve 4b, make diluting solvent 6 flow into preparation vessel 2 with ormal weight.At this moment, wash by this diluting solvent 6 at the periphery of the valve 4a of insides of pipes, inner surface and the residual high viscosity resist 5 of the 3e of outflow portion of common conduit 3d.Flow into after the scheduled volume diluting solvent 6 valve-off 4b.
Afterwards, in preparation vessel 2, utilize diluting solvent 6 dilution high viscosity resists 5.That is, mix with diluting solvent 6, obtain having the resist of proper viscosity by the high viscosity resist 5 that will put aside in preparation vessel 2.
Like this, can periphery, the inner surface of common conduit 3d and the high viscosity resist 5 of the 3e of outflow portion of the valve 4a that remain in insides of pipes be washed when discharging diluting solvent 6 each.Therefore, can prevent high viscosity resist 5 dry sets attached to the common conduit surface.
And, be used for semiconductor wafer after the proper viscosity owing to high viscosity resist 5 can be modulated in preparation vessel 2, thereby compare with the situation that resist that will dilution directly is applied to semiconductor wafer, can control viscosity easily.
[second embodiment]
In the first embodiment, when valve 4a closes, if the high viscosity resist is with being filled by high viscosity resist 5 all the time in the pipeline 3a, this moment, the high viscosity resist contacted with air hardly with the inner surface of pipeline 3a, and high viscosity resist 5 can not drying take place and anchor at the situation of high viscosity resist with the inner surface of pipeline 3a.
But, stop when the high viscosity resist is supplied with the high viscosity resist with pipeline 3a, because the high viscosity resist contacts with air with the inner surface of pipeline 3a, the situation of set so may remain in high viscosity resist 5 dryings of inner surface of high viscosity resist usefulness pipeline 3a.
Therefore, in the present embodiment, further specify and to be supplied to the Anticorrdant dilution system that the high viscosity resist cleans with the supply groove of pipeline 3a to the high viscosity resist with pipeline 3a and with high viscosity resist 5.
Fig. 2 illustrates the Anticorrdant dilution system of present embodiment.The Anticorrdant dilution system 1 of present embodiment has appended diluting solvent and has supplied with groove 10, high viscosity resist supply groove 11, connecting pipe 12 in the Anticorrdant dilution system of Fig. 1.
Be filled with diluting solvent 6 in diluting solvent supply groove 10, diluting solvent 6 is supplied to diluting solvent pipeline 3b.Be filled with high viscosity resist 5 in high viscosity resist supply groove 11, this high viscosity resist 5 is supplied to high viscosity resist pipeline 3a.
Connecting pipe 12 is used to connect diluting solvent and supplies with groove 10 and high viscosity resist supply groove 11.By this connecting pipe 12, diluting solvent 6 is supplied with groove 10 from diluting solvent and is flowed to high viscosity resist supply groove 11.
Below, the method for using such Anticorrdant dilution system 1 to dilute the high viscosity resist is described.
If high viscosity resist 5 is supplied to high viscosity resist pipeline 3a continuously, then the high viscosity resists 5 in the high viscosity resist supply groove 11 are consumed, and almost become empty.Like this, the high viscosity resist inner surface of supplying with groove 11 with periphery and the high viscosity resist of the valve 4a of the inner surface of pipeline 3a, insides of pipes is exposed to airborne part and increases.
Then, supply with groove 10 by connecting pipe 12 from diluting solvent and supply with groove 11 to the high viscosity resist and supply with diluting solvents 6, supply with the high viscosity resist 5 of the inner surface of groove 11 and wash remaining in the high viscosity resist.And the diluting solvent 6 after this cleaning is supplied to high viscosity resist pipeline 3a, directly is discharged to preparation vessel 2 through the outflow 3e of portion.
Like this, during at every turn from diluting solvent supply groove 10 process connecting pipes 12 and high viscosity resist supply groove 11 outflow diluting solvents 6, can inner surface, the high viscosity resist that remain in high viscosity resist supply groove 11 be washed with the periphery of the valve 4a of pipeline 3a, insides of pipes, the inner surface of common conduit 3d and the high viscosity resist 5 of the 3e of outflow portion.Its result can prevent the set attached to these surperficial high viscosity resist 5 dryings.
In addition, in first and second embodiments, be not limited to use pipeline with 2 inflow portions and 1 outflow portion.For example, owing to also have the situation of the resist of different viscosities being mixed or uses various diluting solvents, therefore, can use the pipeline of the inflow portion that has more than 3.Certainly, can be provided with valve this moment in each inflow portion, and possess the resist supply groove corresponding with each inflow portion.
And, using like this when having the pipeline of the inflow portion more than 2, might there be the situation of the resist solution of wanting to obtain a plurality of different viscosities, thereby, can use the pipeline of the outflow portion that has more than 2, also can distribute to a plurality of preparation vessels.Certainly, use like this when having the pipeline of the outflow portion more than 2, can be provided for the outflow that liquid is directed to as the outflow portion of purpose is flowed into the road switching mechanism.
In addition, Anticorrdant dilution system involved in the present invention is not limited to above-described embodiment, also can adopt various structures or shape without departing from the spirit and scope of the present invention.
According to more than, the application of the invention, in use, diluting solvent washes the high viscosity resist that remains in pipe surface usually, thereby can reduce production of foreign matters and reduce and to sneak into the danger that viscosity changes product.And, can reduce the frequency of maintenance of Anticorrdant dilution system, can make contributions to the raising of work efficiency.
Claims (8)
1. an Anticorrdant dilution system is characterized in that, this Anticorrdant dilution system has:
Pipeline, this pipeline have inflow portion more than 2 and the outflow portion more than 1; And
Mixing portion, this mixing portion is with first liquid and second liquid mixing, the first inflow portion of this first liquid from described inflow portion flow into, the first outflow portion from described outflow portion flows out, the second inflow portion of this second liquid from described inflow portion flows into, flows out from the described first outflow portion, and the viscosity of this second liquid is lower than described first liquid relatively.
2. Anticorrdant dilution system according to claim 1 is characterized in that, described first liquid is anticorrosive additive material, and described second liquid is the thinning agent of the described anticorrosive additive material of dilution.
3. Anticorrdant dilution system according to claim 1 is characterized in that, described mixing portion has preparation vessel, and this preparation vessel utilizes described first liquid of described second liquid diluting, to adjust the viscosity of this first liquid.
4. Anticorrdant dilution system according to claim 1 is characterized in that, this Anticorrdant dilution system also has:
First supply unit, this first supply unit can be filled described first liquid, and this first liquid is supplied to the described first inflow portion; And
Second supply unit, this second supply unit can be filled described second liquid, and this second liquid is supplied to the described second inflow portion.
5. Anticorrdant dilution system according to claim 4, it is characterized in that, this Anticorrdant dilution system also has connecting portion, and this connecting portion connects described first supply unit and described second supply unit, makes described second liquid flow into this first supply unit from this second supply unit.
6. the using method of an Anticorrdant dilution system, this Anticorrdant dilution system has pipeline and modulation portion, and described pipeline has inflow portion more than 2 and the outflow portion more than 1, and described modulation portion is used to dilute resist with modulation viscosity; The method is characterized in that,
The first inflow portion from described inflow portion flows into first liquid, and the first outflow portion of this first liquid from described outflow portion flowed out, and is supplied to described modulation portion;
Supply with after described first liquid, the second inflow portion from described inflow portion flows into second liquid that viscosity is lower than this first liquid relatively, and this second liquid is flowed out from the described first outflow portion, is supplied to described modulation portion.
7. the using method of Anticorrdant dilution system according to claim 6 is characterized in that,
Supply with this first liquid from first supply unit that is filled with described first liquid that is supplied to the described first inflow portion;
After described first supply unit is supplied with this first liquid, in this first supply unit, add described second liquid;
This second liquid is supplied to the described first inflow portion from this first supply unit, flows out from the described first outflow portion.
8. according to the using method of claim 6 or 7 described Anticorrdant dilution systems, it is characterized in that described first liquid is anticorrosive additive material, described second liquid is the thinning agent of the described anticorrosive additive material of dilution.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005333617A JP4901191B2 (en) | 2005-11-18 | 2005-11-18 | Resist dilution system |
| JP2005333617 | 2005-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1967385A true CN1967385A (en) | 2007-05-23 |
| CN100552547C CN100552547C (en) | 2009-10-21 |
Family
ID=38076213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610128932XA Expired - Fee Related CN100552547C (en) | 2005-11-18 | 2006-09-04 | Anticorrdant dilution system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4901191B2 (en) |
| KR (1) | KR100816319B1 (en) |
| CN (1) | CN100552547C (en) |
| TW (1) | TW200719980A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102989629A (en) * | 2012-10-30 | 2013-03-27 | 茅惠杰 | Improved device for spraying adhesive onto neutral electrode |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4923882B2 (en) * | 2006-09-07 | 2012-04-25 | 三菱化学エンジニアリング株式会社 | Photoresist supply apparatus and photoresist supply method |
| WO2009082639A1 (en) * | 2007-12-20 | 2009-07-02 | Eco-Snow Systems Llc | Fluid injection assembly for nozzles |
| WO2009133621A1 (en) * | 2008-05-01 | 2009-11-05 | 長瀬産業株式会社 | Resist liquid diluting apparatus and method of diluting resist liquid |
| JP6237511B2 (en) * | 2014-07-11 | 2017-11-29 | 東京エレクトロン株式会社 | Chemical discharge mechanism, liquid processing apparatus, chemical discharge method, storage medium |
| CN106179867B (en) * | 2016-09-07 | 2019-05-21 | 武汉华星光电技术有限公司 | Anti-static liquid application system |
| JP6291676B2 (en) * | 2017-05-16 | 2018-03-14 | 東京エレクトロン株式会社 | Chemical discharge mechanism, liquid processing apparatus, chemical discharge method, storage medium |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4605146A (en) * | 1985-02-15 | 1986-08-12 | E. I. Du Pont De Nemours And Company | Hydrostatic film support |
| JPH0443630A (en) * | 1990-06-11 | 1992-02-13 | Nec Corp | Semiconductor manufacturing equipment |
| JPH0929158A (en) * | 1995-07-18 | 1997-02-04 | Dainippon Screen Mfg Co Ltd | Rotary coater |
| JP3333121B2 (en) * | 1996-12-25 | 2002-10-07 | 東京エレクトロン株式会社 | Coating device |
| JP3410342B2 (en) * | 1997-01-31 | 2003-05-26 | 東京エレクトロン株式会社 | Coating device |
| JP2001176776A (en) * | 1999-12-16 | 2001-06-29 | Toshiba Corp | Device for forming coating film |
| JP4335470B2 (en) * | 2000-03-31 | 2009-09-30 | 東京エレクトロン株式会社 | Coating device and mixing device |
| JP3813118B2 (en) * | 2002-10-15 | 2006-08-23 | 沖電気工業株式会社 | Resist processing method |
-
2005
- 2005-11-18 JP JP2005333617A patent/JP4901191B2/en not_active Expired - Fee Related
-
2006
- 2006-09-04 CN CNB200610128932XA patent/CN100552547C/en not_active Expired - Fee Related
- 2006-10-11 KR KR1020060098803A patent/KR100816319B1/en not_active IP Right Cessation
- 2006-11-03 TW TW095140798A patent/TW200719980A/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102989629A (en) * | 2012-10-30 | 2013-03-27 | 茅惠杰 | Improved device for spraying adhesive onto neutral electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4901191B2 (en) | 2012-03-21 |
| KR100816319B1 (en) | 2008-03-24 |
| JP2007142133A (en) | 2007-06-07 |
| KR20070053100A (en) | 2007-05-23 |
| CN100552547C (en) | 2009-10-21 |
| TWI311078B (en) | 2009-06-21 |
| TW200719980A (en) | 2007-06-01 |
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