JPH0929158A - Rotary coater - Google Patents
Rotary coaterInfo
- Publication number
- JPH0929158A JPH0929158A JP18183795A JP18183795A JPH0929158A JP H0929158 A JPH0929158 A JP H0929158A JP 18183795 A JP18183795 A JP 18183795A JP 18183795 A JP18183795 A JP 18183795A JP H0929158 A JPH0929158 A JP H0929158A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- coating
- coating liquid
- solvent vapor
- spray nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は基板を回転させて基
板上に塗布液の被膜を形成する回転式塗布装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary coating apparatus for rotating a substrate to form a coating film of a coating liquid on the substrate.
【０００２】[0002]
【従来の技術】半導体ウエハ等の基板の表面に例えばレ
ジスト等の感光液を塗布するために、スピンコーティン
グ法を用いた回転式塗布装置が用いられている。従来の
スピンコーティング法では、基板の中央部にレジスト等
の塗布液を滴下し、この塗布液を基板の回転に伴う遠心
力によって基板の中心部から周縁部に引き延ばすことに
より、基板の全面に塗布液の被膜（塗布膜）を均一に形
成する。2. Description of the Related Art In order to coat a surface of a substrate such as a semiconductor wafer with a photosensitive liquid such as a resist, a rotary coating apparatus using a spin coating method is used. In the conventional spin coating method, a coating solution such as a resist is dropped onto the central portion of the substrate, and the coating solution is spread from the central portion of the substrate to the peripheral portion by the centrifugal force caused by the rotation of the substrate, thereby coating the entire surface of the substrate. A liquid film (coating film) is uniformly formed.
【０００３】この場合、塗布液は基板の中心部から周縁
部に向かって放射状に拡がる傾向にあり、塗布液の供給
量が少ないと基板上の塗布膜に放射状の条痕が生じる。
したがって、基板の全面に均一な塗布膜を形成するため
には多量の塗布液を供給する必要がある。このとき、余
分な塗布液は基板の周縁部から周囲に飛散し、廃液とな
る。通常、最終的に基板上に塗布膜として残る塗布液の
数十倍の量の塗布液を供給することになる。In this case, the coating liquid tends to spread radially from the central portion of the substrate toward the peripheral portion, and when the supply amount of the coating liquid is small, radial streaks are formed on the coating film on the substrate.
Therefore, it is necessary to supply a large amount of coating liquid in order to form a uniform coating film on the entire surface of the substrate. At this time, the excess coating liquid is scattered from the peripheral portion of the substrate to the periphery to become a waste liquid. Normally, the coating liquid is supplied in an amount of several tens of times the amount of the coating liquid that finally remains as a coating film on the substrate.
【０００４】特に、基板の大口径化に伴ってこのような
無駄な塗布液の量が増大する。また、大口径基板では所
望の遠心力が得られるときの基板の周速が速くなり、基
板周囲の空気の流れが速くなる。それにより、基板上の
塗布液の膜厚分布が乱されたり、パーティクルが増大す
るおそれがある。In particular, such a wasteful amount of coating liquid increases as the diameter of the substrate increases. Further, in a large-diameter substrate, the peripheral speed of the substrate becomes faster when a desired centrifugal force is obtained, and the air flow around the substrate becomes faster. This may disturb the film thickness distribution of the coating liquid on the substrate or increase the number of particles.
【０００５】そこで、基板を回転させながらスプレーノ
ズルで塗布液を基板表面に分散塗布する方法が特開昭４
９−１１１５７９号、特開昭５０−９９４７２号公報等
に提案されている。また、特開昭６０−８５５２４号公
報には、一方のノズルよりレジスト液を霧状に噴射し、
他方のノズルよりレジスト溶剤を霧状に噴射し、混合さ
せながら回転する基板上に落下させてレジスト膜を塗布
することが開示されている。この方法によると、基板上
の塗布膜に放射状の条痕が生じないので、塗布液の使用
量の低減が可能となる。Therefore, there is a method of dispersing and applying a coating liquid on the surface of a substrate with a spray nozzle while rotating the substrate.
No. 9-111579, Japanese Patent Laid-Open No. 50-99472, and the like. Further, in JP-A-60-85524, a resist solution is sprayed from one nozzle in a mist state,
It is disclosed that the resist solvent is sprayed in a mist form from the other nozzle and dropped onto a rotating substrate while mixing to apply a resist film. According to this method, since radial streaks are not generated in the coating film on the substrate, it is possible to reduce the amount of coating liquid used.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記の
スプレーノズルを用いた従来の方法によると、霧状の塗
布液が空間を飛散している時間は短いが、霧自体の表面
積が大きいので、霧状の塗布液の表面の乾燥が進行す
る。それにより、基板上に堆積した塗布液が遠心力によ
り塗り広げられる段階で塗布膜にむらが発生し、膜厚の
均一性が損なわれる。However, according to the conventional method using the above-mentioned spray nozzle, the fog-like coating liquid is scattered in the space for a short period of time, but the surface area of the fog itself is large. Drying of the surface of the coating liquid in the form of stripes proceeds. This causes unevenness in the coating film at the stage where the coating liquid deposited on the substrate is spread by the centrifugal force, impairing the uniformity of the film thickness.
【０００７】また、上記の２つのノズルを用いた方法で
霧状のレジスト液に霧状のレジスト溶剤を混合しても、
霧状のレジスト液の乾燥を十分に阻止することができな
い。そのため、少量の塗布液で十分に均一な塗布膜を形
成することは困難である。Further, even if the atomized resist solution is mixed with the atomized resist solution by the method using the above two nozzles,
It is not possible to sufficiently prevent the atomized resist solution from drying. Therefore, it is difficult to form a sufficiently uniform coating film with a small amount of coating liquid.
【０００８】そこで、本発明の目的は、塗布液の使用量
を節減しながら基板表面に均一な塗布膜を形成すること
ができる回転式塗布装置を提供することである。Therefore, an object of the present invention is to provide a rotary coating apparatus capable of forming a uniform coating film on the surface of a substrate while reducing the amount of coating liquid used.
【０００９】[0009]
【課題を解決するための手段および発明の効果】第１の
発明に係る回転式塗布装置は、塗布室内で基板を回転さ
せて基板上に塗布液の被膜を形成する回転式塗布装置に
おいて、基板上に塗布液を霧状に噴射するスプレーノズ
ルを塗布室内に配設するとともに、スプレーノズルと基
板との間の空間に溶剤蒸気を供給する溶剤蒸気供給手段
を設けたものである。The rotary coating apparatus according to the first invention is a rotary coating apparatus for rotating a substrate in a coating chamber to form a coating film of the coating liquid on the substrate. A spray nozzle for spraying the coating liquid in the form of a mist is provided in the upper part of the coating chamber, and a solvent vapor supply means for supplying a solvent vapor is provided in a space between the spray nozzle and the substrate.
【００１０】第２の発明に係る回転式塗布装置は、第１
の発明に係る回転式塗布装置の構成において、スプレー
ノズルが塗布液および溶剤蒸気の供給を受けて溶剤蒸気
とともに塗布液を霧状に噴射する二流体ノズルからなる
ものである。The rotary type coating apparatus according to the second invention is the first type.
In the configuration of the rotary coating apparatus according to the invention, the spray nozzle is a two-fluid nozzle that receives the supply of the coating liquid and the solvent vapor and sprays the coating liquid together with the solvent vapor in a mist state.
【００１１】第３の発明に係る回転式塗布装置は、第１
または第２の発明に係る回転式塗布装置の構成におい
て、塗布室内を溶剤の飽和蒸気圧に保つ圧力供給手段を
さらに備えたものである。The rotary coating apparatus according to the third invention is the first
Alternatively, in the structure of the rotary coating apparatus according to the second aspect of the present invention, pressure supply means for maintaining the saturated vapor pressure of the solvent in the coating chamber is further provided.
【００１２】第１〜第３の発明に係る回転式塗布装置に
おいては、スプレーノズルにより回転する基板上に塗布
液が霧状に噴射されるとともに、スプレーノズルと基板
との間の空間に溶剤蒸気が供給される。それにより、霧
状の塗布液は、スプレーノズルから噴射されてから基板
上に達するまでの間、溶剤蒸気の雰囲気中に存在するこ
とになり、塗布液の霧が表面から乾燥することが抑制さ
れる。霧状の塗布液が基板に到達すると、回転する基板
の遠心力により塗布液の霧どうしが一体となり、均一に
引き伸ばされながら均一な膜になる。In the rotary coating apparatus according to the first to third aspects of the invention, the coating liquid is sprayed in a mist state onto the substrate rotated by the spray nozzle, and the solvent vapor is formed in the space between the spray nozzle and the substrate. Is supplied. As a result, the atomized coating liquid remains in the atmosphere of the solvent vapor from being sprayed from the spray nozzle until reaching the substrate, and the coating liquid mist is prevented from drying from the surface. It When the atomized coating liquid reaches the substrate, the centrifugal force of the rotating substrate causes the mist of the coating liquid to be integrated, and the film is uniformly stretched to form a uniform film.
【００１３】この場合、塗布液の霧の表面の乾燥が抑制
されているので、膜厚分布の乱れが少なく、かつ霧状の
塗布液が基板上に分散塗布されるので、基板の回転数を
低く抑えても基板全面に塗布液を均一に塗り広げること
ができる。したがって、大口径の基板上でも少量の塗布
液の供給により均一な塗布液の被膜を形成することがで
き、塗布液のコストを節減することができる。In this case, since the surface of the mist of the coating liquid is suppressed from being dried, the film thickness distribution is less disturbed, and the atomized coating liquid is dispersed and coated on the substrate. Even if it is kept low, the coating liquid can be spread evenly over the entire surface of the substrate. Therefore, it is possible to form a uniform coating film of the coating liquid by supplying a small amount of the coating liquid even on a large-diameter substrate, and it is possible to reduce the cost of the coating liquid.
【００１４】特に、第２の発明に係る回転式塗布装置に
おいては、二流体ノズルから溶剤蒸気とともに塗布液が
霧状に噴射されるので、塗布液の噴射の瞬間から霧状の
塗布液が溶剤蒸気に包まれ、噴射後は、さらに二流体ノ
ズルと基板との間の空間に供給される溶剤蒸気にも包ま
れることになる。それにより、霧状の塗布液が噴射の瞬
間から基板上に堆積されるまで常に溶剤蒸気の雰囲気中
に存在することになり、塗布液の霧の表面の乾燥が十分
に抑制される。In particular, in the rotary coating apparatus according to the second aspect of the present invention, the coating fluid is sprayed from the two-fluid nozzle together with the solvent vapor in a mist state. After being sprayed, it will be wrapped in solvent vapor that is supplied to the space between the two-fluid nozzle and the substrate after spraying. As a result, the mist-like coating liquid is always present in the atmosphere of the solvent vapor from the moment of jetting until it is deposited on the substrate, and the surface of the mist of the coating liquid is sufficiently suppressed.
【００１５】さらに、第３の発明に係る回転式塗布装置
においては、塗布室内が溶剤の飽和蒸気圧に保たれるの
で、溶剤が溶剤蒸気に気化し、塗布室内が溶剤蒸気の雰
囲気に安定に保たれる。Furthermore, in the rotary coating apparatus according to the third aspect of the present invention, since the coating chamber is maintained at the saturated vapor pressure of the solvent, the solvent vaporizes into the solvent vapor and the coating chamber is stabilized in the atmosphere of the solvent vapor. To be kept.
【００１６】[0016]
【発明の実施の形態】図１は本発明の一実施例における
回転式塗布装置の概略構成図である。図１において、半
導体ウエハ等の基板１は基板載置台２上に吸引して保持
される。基板載置台２はモータ（図示せず）の回転軸３
により回転駆動される。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic configuration diagram of a rotary coating apparatus according to an embodiment of the present invention. In FIG. 1, a substrate 1 such as a semiconductor wafer is sucked and held on a substrate mounting table 2. The substrate mounting table 2 is a rotary shaft 3 of a motor (not shown).
Is driven to rotate.
【００１７】基板載置台２の中心部の上方にはスプレー
ノズル４が配設されている。このスプレーノズル４は二
流体ノズルからなり、２つの注入口４ａ，４ｂおよび１
つの噴射口４ｃを有する。基板１の寸法が例えば８イン
チである場合には、基板１の表面からスプレーノズル４
の噴射口４ｃまでの距離は１５０ｍｍ程度に設定され
る。A spray nozzle 4 is arranged above the center of the substrate mounting table 2. This spray nozzle 4 comprises a two-fluid nozzle and has two inlets 4a, 4b and 1
It has one injection port 4c. When the size of the substrate 1 is, for example, 8 inches, the spray nozzle 4 is
The distance to the injection port 4c is set to about 150 mm.
【００１８】基板載置台２とスプレーノズル４との間の
空間は、塗布室となるカップ５によって密閉状態とされ
る。カップ５の下部の排気口６は排気経路（図示せず）
に接続されている。また、カップ５の下部には廃液を排
出するためのドレイン口７が設けられている。The space between the substrate mounting table 2 and the spray nozzle 4 is hermetically sealed by a cup 5 serving as a coating chamber. The exhaust port 6 at the bottom of the cup 5 has an exhaust path (not shown).
It is connected to the. Further, a drain port 7 for discharging the waste liquid is provided at the bottom of the cup 5.
【００１９】一方、溶剤蒸気供給源８および塗布液供給
源９が設けられている。溶剤蒸気供給源８においては、
容器１０内に、ＥＣＡ（エチル・セロソルブ・アセテー
ト）、ＭＡＫ（メチル・アミル・ケトン）、ＥＬ（エチ
ル・ラクテート）、ＥＥＰ（エチル・エトキシ・プロピ
オネート）等の溶剤が収容されている。容器１０内はＮ
2 加圧系により例えば圧力０．５ｋｇ／ｃｍ2 で加圧さ
れ、溶剤の飽和蒸気圧に保たれている。それにより、容
器１０内で溶剤蒸気が発生している。塗布液供給源９に
おいては、容器１１内にレジスト等の塗布液が収容され
ている。容器１０内はＮ2 加圧系によって例えば圧力
０．１ｋｇ／ｃｍ2 で加圧されている。On the other hand, a solvent vapor supply source 8 and a coating liquid supply source 9 are provided. In the solvent vapor supply source 8,
A solvent such as ECA (ethyl cellosolve acetate), MAK (methyl amyl ketone), EL (ethyl lactate), EEP (ethyl ethoxy propionate) is contained in the container 10. N in container 10
The pressure is maintained at the saturated vapor pressure of the solvent by applying a pressure of, for example, 0.5 kg / cm 2 by the 2 pressure system. As a result, solvent vapor is generated in the container 10. In the coating liquid supply source 9, a coating liquid such as a resist is contained in a container 11. The inside of the container 10 is pressurized by the N 2 pressure system at a pressure of 0.1 kg / cm 2 , for example.
【００２０】溶剤蒸気供給源８において発生した溶剤蒸
気は、レギュレータ１２、流量計１３およびエアオペレ
ーションバルブ１４を経由してカップ５内に注入され、
かつレギュレータ１５、流量計１６およびエアオペレー
ションバルブ１７を経由してスプレーノズル４の注入口
４ａに注入される。The solvent vapor generated in the solvent vapor supply source 8 is injected into the cup 5 via the regulator 12, the flow meter 13 and the air operation valve 14,
And it is injected into the injection port 4a of the spray nozzle 4 via the regulator 15, the flow meter 16 and the air operation valve 17.
【００２１】一方、塗布液供給源９の容器１１内の塗布
液は、エアオペレーションバルブ１８を経由してスプレ
ーノズル４の注入口４ｂに注入される。また、カップ５
内は、エアオペレーションバルブ１９を介して供給され
る空気により溶剤の飽和蒸気圧に保たれている。カップ
５内の溶剤蒸気は排気口６から排気され、常に溶剤蒸気
供給源８から供給される新鮮な溶剤蒸気で置換されてい
る。On the other hand, the coating liquid in the container 11 of the coating liquid supply source 9 is injected into the injection port 4b of the spray nozzle 4 via the air operation valve 18. Also, cup 5
The inside is kept at the saturated vapor pressure of the solvent by the air supplied through the air operation valve 19. The solvent vapor in the cup 5 is exhausted from the exhaust port 6 and is constantly replaced with fresh solvent vapor supplied from the solvent vapor supply source 8.
【００２２】本実施例では、溶剤蒸気供給源８が溶剤蒸
気供給手段を構成し、エアオペレーションバルブ１９が
圧力供給手段を構成する。本実施例の回転式塗布装置に
おいては、エアオペレーションバルブ１４を開くと、カ
ップ５内に例えば５００ｍ3 ／分の流量で溶剤蒸気供給
源８から溶剤蒸気が供給され、カップ５内が溶剤蒸気の
雰囲気に保たれる。In this embodiment, the solvent vapor supply source 8 constitutes solvent vapor supply means, and the air operation valve 19 constitutes pressure supply means. In the rotary coating apparatus of this embodiment, when the air operation valve 14 is opened, the solvent vapor is supplied from the solvent vapor supply source 8 into the cup 5 at a flow rate of, for example, 500 m 3 / min, and the inside of the cup 5 is filled with the solvent vapor. To be kept in an atmosphere.
【００２３】この状態で、エアオペレーションバルブ１
７，１８を開くと、スプレーノズル４の注入口４ａに溶
剤蒸気供給源８から溶剤蒸気が例えば４０ｍ3 ／分の流
量で注入されるとともに、注入口４ｂに塗布液供給源９
から塗布液が例えば１ｃｃ／秒の流量で注入される。そ
れにより、噴射口４ｃから溶剤蒸気とともに塗布液が霧
状に噴射され、アスピレート効果（霧吹き効果）によ
り、回転している基板１上に霧状に散布される。In this state, the air operation valve 1
When 7, 7 are opened, solvent vapor is injected from the solvent vapor supply source 8 into the injection port 4a of the spray nozzle 4 at a flow rate of, for example, 40 m 3 / min, and the coating liquid supply source 9 is introduced into the injection port 4b.
The coating liquid is injected at a flow rate of, for example, 1 cc / sec. As a result, the coating liquid is sprayed in a mist state together with the solvent vapor from the ejection port 4c, and is sprayed in a mist state on the rotating substrate 1 by the aspirating effect (mist blowing effect).
【００２４】この場合、塗布液の噴射の瞬間から霧状の
塗布液が溶剤蒸気に包まれ、噴射後は、同時に噴射され
た溶剤蒸気およびカップ５内の溶剤蒸気に包まれること
になる。それにより、霧状の塗布液が空間を飛散してい
る間に表面から乾燥することが抑制される。霧状の塗布
液が基板１上に堆積すると、基板１の回転に伴う遠心力
によって塗布液の霧どうしが一体となり、均一に引き延
ばされながら均一な膜が形成される。In this case, the mist-like coating liquid is wrapped in the solvent vapor from the moment of spraying the coating liquid, and after jetting, it is wrapped in the solvent vapor and the solvent vapor in the cup 5 which are sprayed at the same time. As a result, it is possible to prevent the atomized coating liquid from drying from the surface while scattering in the space. When the mist-like coating liquid is deposited on the substrate 1, the mist of the coating liquid is integrated due to the centrifugal force caused by the rotation of the substrate 1, and a uniform film is formed while being uniformly stretched.
【００２５】このように、塗布液の霧の表面の乾燥が十
分に抑制されるので、膜厚分布の乱れが少なく、かつ霧
状の塗布液が基板上に分散塗布されるので、基板１の回
転数を低く抑えても基板１の全面に塗布液を均一に塗り
広げることができる。したがって、大口径の基板上でも
少量の塗布液の供給により均一な塗布膜を形成すること
ができる。As described above, since the surface of the mist of the coating liquid is sufficiently suppressed, the film thickness distribution is less disturbed and the mist-like coating liquid is dispersed and coated on the substrate. Even if the rotation speed is kept low, the coating liquid can be spread evenly over the entire surface of the substrate 1. Therefore, a uniform coating film can be formed on a large-diameter substrate by supplying a small amount of coating liquid.
【図１】本発明の一実施例における回転式塗布装置の概
略構成図である。FIG. 1 is a schematic configuration diagram of a rotary coating apparatus according to an embodiment of the present invention.
１ 基板 ２ 基板載置台 ３ 回転軸 ４ スプレーノズル ４ａ，４ｂ 注入口 ４ｃ 噴射口 ５ カップ ８ 溶剤蒸気供給源 ９ 塗布液供給源 １０，１１ 容器 １４，１７，１８，１９ エアオペレーションバルブ 1 Substrate 2 Substrate Placement Table 3 Rotation Shaft 4 Spray Nozzle 4a, 4b Injection Port 4c Injection Port 5 Cup 8 Solvent Vapor Supply Source 9 Coating Liquid Supply Source 10, 11 Container 14, 17, 18, 19 Air Operation Valve
Claims (3)
に塗布液の被膜を形成する回転式塗布装置において、前
記基板上に前記塗布液を霧状に噴射するスプレーノズル
を前記塗布室内に配設するとともに、前記スプレーノズ
ルと前記基板との間の空間に溶剤蒸気を供給する溶剤蒸
気供給手段を設けたことを特徴とする回転式塗布装置。1. A rotary coating apparatus for rotating a substrate in a coating chamber to form a coating film of the coating liquid on the substrate, wherein a spray nozzle for spraying the coating liquid on the substrate in a mist state is provided in the coating chamber. A rotary coating apparatus, which is provided with solvent vapor supply means for supplying solvent vapor to a space between the spray nozzle and the substrate.
蒸気の供給を受けて前記溶剤蒸気とともに前記塗布液を
霧状に噴射する二流体ノズルからなることを特徴とする
請求項１記載の回転式塗布装置。2. The rotary coating according to claim 1, wherein the spray nozzle comprises a two-fluid nozzle that receives supply of a coating liquid and solvent vapor and sprays the coating liquid together with the solvent vapor in a mist state. apparatus.
保つ圧力供給手段をさらに備えたことを特徴とする請求
項１または２記載の回転式塗布装置。3. The rotary coating apparatus according to claim 1, further comprising a pressure supply unit that maintains the saturated vapor pressure of the solvent in the coating chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18183795A JPH0929158A (en) | 1995-07-18 | 1995-07-18 | Rotary coater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18183795A JPH0929158A (en) | 1995-07-18 | 1995-07-18 | Rotary coater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0929158A true JPH0929158A (en) | 1997-02-04 |
Family
ID=16107686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18183795A Pending JPH0929158A (en) | 1995-07-18 | 1995-07-18 | Rotary coater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0929158A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT409348B (en) * | 1999-04-22 | 2002-07-25 | Thallner Erich | DEVICE FOR APPLYING MATERIALS TO SUBSTRATES, ESPECIALLY FOR PAINTING SI WAFERS |
| JP2005019560A (en) * | 2003-06-24 | 2005-01-20 | D S Giken:Kk | Coating device |
| JP2005334810A (en) * | 2004-05-28 | 2005-12-08 | Alps Electric Co Ltd | Spray coat apparatus and spray-coating method |
| JP2006278856A (en) * | 2005-03-30 | 2006-10-12 | Tech In Tech Co Ltd | Equipment, system and metho for dsubstrate processing |
| US7172991B2 (en) | 2001-10-11 | 2007-02-06 | Hewlett-Packard Development Company, L.P. | Integrated CD/DVD recording and labeling |
| JP2007142133A (en) * | 2005-11-18 | 2007-06-07 | Tokyo Ohka Kogyo Co Ltd | Resist dilution system |
| JP2010186929A (en) * | 2009-02-13 | 2010-08-26 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| JP2016219791A (en) * | 2015-04-08 | 2016-12-22 | ズス・マイクロテック・リソグラフィ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＳｕｓｓ ＭｉｃｒｏＴｅｃ Ｌｉｔｈｏｇｒａｐｈｙ ＧｍｂＨ | Device and method for coating base material |
| JP2017183751A (en) * | 2017-06-12 | 2017-10-05 | 東京エレクトロン株式会社 | Coating film forming device, coating film forming method, and storage medium |
| KR20180114807A (en) * | 2017-04-11 | 2018-10-19 | 비스에라 테크놀러지스 컴퍼니 리미티드 | Apparatus and method for removing photoresist layer from alignment mark |
| WO2020101425A1 (en) * | 2018-11-16 | 2020-05-22 | 주식회사 베프스 | Centrifugal pattern filling apparatus, ultrasonic piezoelectric sensor manufacturing method using same, and ultrasonic piezoelectric sensor or ultrasonic recognition sensor manufactured using method |
-
1995
- 1995-07-18 JP JP18183795A patent/JPH0929158A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6485568B1 (en) | 1999-04-22 | 2002-11-26 | Erich Thallner | Apparatus for coating substrates with materials, particularly for lacquering si-wafers |
| AT409348B (en) * | 1999-04-22 | 2002-07-25 | Thallner Erich | DEVICE FOR APPLYING MATERIALS TO SUBSTRATES, ESPECIALLY FOR PAINTING SI WAFERS |
| US7172991B2 (en) | 2001-10-11 | 2007-02-06 | Hewlett-Packard Development Company, L.P. | Integrated CD/DVD recording and labeling |
| US7501172B2 (en) | 2001-10-11 | 2009-03-10 | Hewlett-Packard Development Company, L.P. | Integrated recording and labeling with optical recording device |
| JP2005019560A (en) * | 2003-06-24 | 2005-01-20 | D S Giken:Kk | Coating device |
| JP4602699B2 (en) * | 2004-05-28 | 2010-12-22 | アルプス電気株式会社 | Spray coating apparatus and spray coating method |
| JP2005334810A (en) * | 2004-05-28 | 2005-12-08 | Alps Electric Co Ltd | Spray coat apparatus and spray-coating method |
| JP2006278856A (en) * | 2005-03-30 | 2006-10-12 | Tech In Tech Co Ltd | Equipment, system and metho for dsubstrate processing |
| JP2007142133A (en) * | 2005-11-18 | 2007-06-07 | Tokyo Ohka Kogyo Co Ltd | Resist dilution system |
| JP2010186929A (en) * | 2009-02-13 | 2010-08-26 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| JP4748742B2 (en) * | 2009-02-13 | 2011-08-17 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP2016219791A (en) * | 2015-04-08 | 2016-12-22 | ズス・マイクロテック・リソグラフィ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＳｕｓｓ ＭｉｃｒｏＴｅｃ Ｌｉｔｈｏｇｒａｐｈｙ ＧｍｂＨ | Device and method for coating base material |
| KR20180114807A (en) * | 2017-04-11 | 2018-10-19 | 비스에라 테크놀러지스 컴퍼니 리미티드 | Apparatus and method for removing photoresist layer from alignment mark |
| JP2018182277A (en) * | 2017-04-11 | 2018-11-15 | 采▲ぎょく▼科技股▲ふん▼有限公司ＶｉｓＥｒａ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏｍｐａｎｙ Ｌｉｍｉｔｅｄ | Apparatus and method of removing photoresist layer from alignment mark |
| US11747742B2 (en) | 2017-04-11 | 2023-09-05 | Visera Technologies Company Limited | Apparatus and method for removing photoresist layer from alignment mark |
| JP2017183751A (en) * | 2017-06-12 | 2017-10-05 | 東京エレクトロン株式会社 | Coating film forming device, coating film forming method, and storage medium |
| WO2020101425A1 (en) * | 2018-11-16 | 2020-05-22 | 주식회사 베프스 | Centrifugal pattern filling apparatus, ultrasonic piezoelectric sensor manufacturing method using same, and ultrasonic piezoelectric sensor or ultrasonic recognition sensor manufactured using method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5449405A (en) | Material-saving resist spinner and process | |
| US5902399A (en) | Method and apparatus for improved coating of a semiconductor wafer | |
| US5571560A (en) | Proximity-dispensing high-throughput low-consumption resist coating device | |
| US5378511A (en) | Material-saving resist spinner and process | |
| US7803720B2 (en) | Coating process and equipment for reduced resist consumption | |
| JPH0929158A (en) | Rotary coater | |
| US5773083A (en) | Method for coating a substrate with a coating solution | |
| US6761930B2 (en) | Method of coating solution on substrate surface using a slit nozzle | |
| JPH05243140A (en) | Spin-coating device and method thereof | |
| JPH10151406A (en) | Method for applying application liquid | |
| JP2007517399A (en) | Method and apparatus for applying a polymer solution to a substrate in a chamber saturated with a solvent | |
| JPH0899057A (en) | Method and device for coating base plate with resist liquid | |
| JP2764069B2 (en) | Application method | |
| JPH08299878A (en) | Rotary coating apparatus and rotary coating method | |
| JPS6085524A (en) | Resist applying method | |
| JPS62121669A (en) | Coating apparatus | |
| JPH044850Y2 (en) | ||
| JPH0132357Y2 (en) | ||
| JP2001068402A (en) | Board treatment equipment | |
| JPH09122560A (en) | Spin coater | |
| JPH04156974A (en) | Spinner device | |
| JPH04171072A (en) | Substrate coater | |
| JPS63169727A (en) | Applicator | |
| JPH02194873A (en) | Coating apparatus | |
| JPH0817700A (en) | Application of resist and resist applying device |