CN1282981A - Wet processing device - Google Patents
Wet processing device Download PDFInfo
- Publication number
- CN1282981A CN1282981A CN00120809A CN00120809A CN1282981A CN 1282981 A CN1282981 A CN 1282981A CN 00120809 A CN00120809 A CN 00120809A CN 00120809 A CN00120809 A CN 00120809A CN 1282981 A CN1282981 A CN 1282981A
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- CN
- China
- Prior art keywords
- wafer
- cartridge unit
- wet treater
- liquid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The present invention provides a wet processing apparatus comprising: a chamber 2 for processing wafers; a chuck unit 3 for holding the wafers; a chemical liquid piping 8 and a washing liquid piping 9 arranged in the chuck unit; and a chemical liquid nozzle 6 arranged on the chuck unit and connected to the chemical liquid piping 8 for spraying a chemical liquid 10 onto the wafers 1 or a washing liquid nozzle arranged on the chuck unit and connected to the washing liquid piping 9 for spraying a washing liquid 11 onto the wafers 1.
Description
The present invention relates to wet treater, particularly be used for cleaning and handling the Semiconductor substrate wet treater of (hereinafter being called wafer) with chemical method.
In wet treater, an important factor is to improve wafer to clean and chemically treated effect.For this reason, Chang Gui wet treater (conventional example 1) is a monolithic type.That is, a wafer is placed in the process chamber.Treat liquid (be used for clean or chemical treatment) with jet injection to the wafer that is rotating.In the method, once only handle a wafer.Therefore, output is very low, and manufacturing cost is very high.
In order to address this problem, a kind of multiple-grooved wet treater is arranged, be used for carrying out continuously wafer and clean and chemical treatment.Conventional multiple-grooved wet treater has two types: the ejection-type shown in immersion type shown in Figure 5 and Fig. 6 and 7.(cutaway view) as shown in Figure 5, in the multiple-grooved wet treater (conventional example 2) of immersion type, the carrier 31 that accommodates a plurality of wafers 1 is immersed in treat liquid 32 (being used for cleaning or chemical treatment), treat liquid provides by being arranged on treatment box 33 following inlets 34, and treat liquid 32 is overflowed to flow into and is arranged in the treatment trough 33 open tops discharge ditch 35 on every side simultaneously.In described immersion type multiple-grooved wet treater, the wafer 1 that is contained in the carrier 31 is immersed in the treat liquid 32.Therefore, when clean wafers 1, the dirt that is attached on the carrier 31 can spread in the cleaning fluid, thereby pollutes wafer 1.In addition, owing to the interval between the wafer that is contained in the carrier 31 is not very big, therefore can not obtain high cleaning efficiency.The contamination particle that is attached to wafer 1 can not removed fully.In addition, when carrying out the chemical treatment of wafer 1, the replacing of chemical liquid is too slow, needs the very long processing time.
In view of above problem, recently, often use the ejection-type wet treater.In the conventional multiple-grooved wet treater (conventional example 3) of described ejection-type, (cutaway view) as shown in Figure 6, the carrier 31 that accommodates a plurality of wafers 1 is placed in the process chamber 36, so that the treat liquid 32 that acceptance is ejected by the nozzle 37 that is fixed to process chamber 36 tops (being used for cleaning or chemical treatment).Yet because nozzle 37 is arranged on fixing position, because carrier 31, cleaning fluid or chemical liquid can not reach all parts of wafer.In addition, quite long by nozzle 37 to the distance of wafer 1, can not obtain enough cleaning or chemical treatment effect.
For addressing this problem, developed the ejection-type multiple-grooved wet treater of no carrier now.Fig. 7 is the perspective view of the conventional multiple-grooved wet treater (conventional example 4) of the ejection-type of described no carrier, a pair of suspension bracket (hanger) 38 wherein is set is used to place a plurality of wafers 1, and nozzle 37 is fixed on the suspension bracket 38.In process chamber 36, treat liquid 32 (being used for cleaning or chemical treatment) is ejected into the wafer 1 that is supported by suspension bracket 38 by the nozzle 37 that is arranged on the suspension bracket 38.Adopt this structure, do not have carrier to interfere with the problem of treat liquid 32 jet flows of wafer 1, the distance between nozzle 37 and the wafer 1 also is reduced.Therefore, compare, improved cleaning or chemical treatment effect with the ejection-type multiple-grooved wet treater of conventional example 3.Yet in the ejection-type multiple-grooved wet treater of described no carrier, nozzle 37 is arranged on assigned position, and nozzle 37 still has a segment distance to wafer 1.Therefore, cleaning fluid or chemical liquid can not be ejected on the wafer 1 equably, still can not reach enough cleaning or chemical treatment effects.In addition, when clean wafers 1, only can wash bulky grain, so cleaning performance is insufficient.
Above-mentioned conventional wet treater has variety of issue.Under single panel type wet treater situation, once only handle a wafer, reduce output and increased manufacturing cost.
In addition, in the multiple-grooved wet treater, though once can handle a plurality of wafers, under the situation of immersion type multiple-grooved wet treater, when clean wafers 1, the contamination particle that is attached on the carrier 31 is dispersed in the cleaning fluid, has polluted wafer 1.That is, cleaning efficiency reduces, and can not fully remove attached to the contamination particle on the wafer 1.In addition, when wafer 1 was carried out chemical treatment, the liquid changing speed of wafer 1 was very slow, and processing needs the very long cycle.Under the situation of ejection-type multiple-grooved wet treater, exist cleaning fluid or chemical treatment liquid not to be ejected into equably on the wafer 1, and feasible can not the acquisition of the distance between nozzle 37 and the wafer 1 effectively cleaned or the chemical treatment effect.In addition, when clean wafers 1, only large-sized contamination particle can be removed, sufficient cleaning performance can not be reached.
Therefore, an object of the present invention is to provide a kind of can a plurality of wafers of single treatment and have good cleaning or the wet treater of chemical treatment effect.
Wet treater according to the present invention comprises: the chamber of handling substrate; The cartridge unit of clamp substrate; Be located at the treat liquid pipe in the cartridge unit; And be located on the cartridge unit and the treat liquid nozzle that is connected with the treat liquid pipe, be used for treat liquid is ejected into substrate.
In addition, said apparatus comprises: the plural types of processings liquid line; The plural types of processings fluid injector, it is connected with the plural types of processings liquid line respectively, and is arranged in the cartridge unit.
In addition, but a plurality of substrates of above-mentioned cartridge unit clamping, and the treat liquid nozzle can be arranged on the top by each substrate of cartridge unit clamping.
In addition, above-mentioned treat liquid can be chemical liquid or cleaning fluid.
In addition, above-mentioned cartridge unit comprises the mechanism that is used to rotate whole cartridge unit.
In addition, above-mentioned cartridge unit has the anchor clamps of each substrate neighboring of clamping.
In addition, above-mentioned substrate is a Semiconductor substrate.
According to the present invention, because the distance between treat liquid nozzle and the Semiconductor substrate is very little, and chemical liquid or cleaning fluid can be ejected on the Semiconductor substrate equably and effectively.In addition, once can handle a plurality of Semiconductor substrate.In addition, owing to when chemical liquid or cleaning fluid are ejected on the Semiconductor substrate, rotate Semiconductor substrate by rotating whole cartridge unit, so chemical liquid or cleaning fluid just can more effectively be ejected on the Semiconductor substrate.
Fig. 1 shows the vertical view of wet treater according to an embodiment of the invention.
Fig. 2 shows the cutaway view of Fig. 1 embodiment.
Fig. 3 shows the assessment that is obtained effect by wet treater of the present invention.
Fig. 4 shows the chip architecture that Fig. 3 assesses use.
Fig. 5 shows the cutaway view of routine techniques.
Fig. 6 shows the cutaway view of another routine techniques.
Fig. 7 shows the perspective view of another routine techniques.
Introduce one embodiment of the present of invention below with reference to accompanying drawing.Fig. 1 is the vertical view of one embodiment of the invention, and Fig. 2 is the cutaway view along the line A-A of embodiment among Fig. 1.
As illustrated in fig. 1 and 2, comprise with cleaning fluid or chemical treatment liquid according to the wet treater of present embodiment and handle the chamber 2 of wafer 1 and be arranged on cartridge unit 3 in the chamber 2.Cartridge unit 3 has a plurality of chucks 4 and the fixing chuck base 12 of chuck 4 of the neighboring of supporting wafers 1.
Each chuck 4 has the chuck clamps 5 of the neighboring of each wafer 1 of clamping.Chuck clamps 5 is made by the elastic resin (for example polytetrafluoroethylene) of chemically-resistant liquid 10 and cleaning fluid (pure water) 11 corrosion, and is formed with the groove that is used for holding chip 1 neighboring.
Above each chuck clamps 5 in being arranged at chuck 4 (being the top of the neighboring of each wafer 1), be provided with chemical liquid nozzle 6 or cleaning fluid (pure water) nozzle 7.Chemical liquid nozzle 6 and remover liquid nozzle 7 are sprayed onto chemical liquid 10 and cleaning fluid (pure water) 11 on the wafer 1 equably, and nozzle 6 and 7 is made by the metal (for example stainless steel) or the elastic resin (for example polytetrafluoroethylene) of chemically-resistant liquid 10 and cleaning fluid (pure water) 11 corrosion.Two chemical liquid nozzles 6 are set, make center that they pass through wafer 1 toward each other, similarly, two remover liquid nozzles 7 are set, make center that they pass through wafer 1 toward each other.The line that connects two chemical liquid nozzles 6 is perpendicular to the line that connects two remover liquid nozzles 7.
In addition, the chuck base 12 of cartridge unit 3 has discharge gate 13a, is used to discharge chemical liquid 10 and cleaning fluid (pure water) 11, and chamber 2 has discharge gate 13b.
Here, the work of wet treater as shown in Figure 2.At first, by using not shown mechanism, the wafer carrier that is provided with in vertical direction from the spacing (that is, by the wafer pitch of chuck 4 clampings) according to chuck clamps 5 takes out wafer 1, and sends in the chamber 2.
The chuck vis-a-vis 4 of cartridge unit 3 is decontroled by unshowned structure on chuck table 12 in the chamber 2, decontrols and makes the diameter of opening greater than wafer 1.Then wafer 1 is inserted between two chucks 4 vis-a-vis of cartridge unit 3, cooperates with chuck clamps 5 simultaneously.By the mechanism that does not illustrate among the figure, vis-a-vis chuck 4 is closed respectively on the chuck pedestal 12, comes holding chip 1 by the chuck clamps 5 of two chucks 4 thus.
Under this state, rotate by the rotation of whole cartridge unit 3 by the wafer 1 of chuck clamps 5 clampings.Meanwhile, chemical liquid 10 is ejected into wafer 1 by the chemically treated chemical liquid nozzle 6 that is used for wafer 1.Similarly, cleaning fluid (pure water) 11 is ejected on the wafer 1 by the remover liquid nozzle 7 that is arranged on the chuck 4.Here, cartridge unit 3 is rotated by using not shown motor rotating basis 12.
After chemical treatment or cleaning are finished, by unshowned mechanisms grip wafer 1.Make the chuck 4 on the pedestal 12 decontrol the diameter of its opening greater than wafer 1.From chamber 2, take out wafer 1 and be placed in the wafer carrier.
In addition, in the present embodiment, chemical liquid nozzle 6 and remover liquid nozzle 7 are set on the chuck 4, they and rotate integratedly by the wafer of chuck clamps 5 clampings of chuck 4, simultaneously chemical liquid 10 and cleaning fluid (pure water) 11 are ejected into by on the wafer 1 of chemical treatment and cleaning.Yet, the invention is not restricted to said structure, chemical liquid nozzle 6 and remover liquid nozzle 7 can be the structures of fixing.When chemical liquid 10 and cleaning fluid (pure water) 11 being ejected into the chemical treatment of carrying out wafer 1 on the wafer 1 and cleaning, only rotate by the fixing wafer of chuck pedestal 5.
Be noted that the cleaning and the chemically treated wet treater that the invention is not restricted to be used for Semiconductor substrate (wafer), also be applicable to the surface-treated wet treater that is used for liquid crystal, photomask etc.
As mentioned above, according to the present invention, cartridge unit is arranged on the chamber that is used for chemical treatment or clean wafers, and above the chuck clamps of the chuck of cartridge unit (promptly, the top of each wafer), be provided with the chemical liquid pipe that has in the cartridge unit of being located at and the chemical liquid nozzle or cleaning fluid (pure water) nozzle of cleaning fluid (pure water) pipe.Therefore the distance between nozzle and each wafer is very little, and chemical liquid or cleaning fluid effectively and equably are ejected on the wafer, can obtain chemical treatment efficiently or cleaning.In addition, when clean wafers,, strengthened cleaning performance even undersized particle also can be removed from wafer.In addition, once can handle a plurality of wafers, increase treatment effeciency.In addition, therefore the rotation wafer can effectively and equably be ejected into chemical liquid or cleaning fluid on the wafer in the time of owing to injection chemical liquid or cleaning fluid, has improved the efficient of chemical treatment or cleaning thus.
Use the assessment example of Fig. 3 further to be introduced.When to wafer with through hole behind the organic basic developing liquid developing, clean wafers is to remove the organic basic developer solution.If it is residual that the organic basic developer solution has, will corrode the aluminium wiring below the through hole.Fig. 3 shows the via count of the aluminium wiring that is corroded.Fig. 4 shows the structure of the aluminium wiring under the through hole that has been corroded.
Here, wet treater more of the present invention and conventional multiple-grooved (immersion type) wet treater.The number of openings that Fig. 3 shows the aluminium that the is corroded wiring that wet treater of the present invention produces is less than the number of openings of conventional multiple-grooved wet treater.Reason is that wet treater of the present invention can clean (pure water rinsing) wafer effectively after using the organic basic developer solution.In other words, almost do not have the organic basic developer residual in through hole 14, thereby aluminium wiring 15 is corroded not.
The present invention can implement by other concrete form, and does not break away from spirit of the present invention or fundamental characteristics.Therefore present embodiment can be thought exemplaryly rather than determinate, and scope of the present invention is represented by the explanation of appending claims rather than front, all comprises wherein in the meaning of claim equivalence and all changes in the scope.
The whole open text of Japanese patent application No.11-214212 (application on July 28th, 1999) comprises specification, claims, accompanying drawing and summary, here introduces as reference.
Claims (9)
1. wet treater comprises:
Handle the chamber of substrate;
The cartridge unit of clamp substrate;
Be located at the treat liquid pipe in the cartridge unit; And
The treat liquid nozzle is arranged on the cartridge unit and is connected to the treat liquid pipe, is used for treat liquid is ejected into substrate.
2. according to the wet treater of claim 1, described device comprises:
The plural types of processings liquid line; And
The plural types of processings fluid injector is connected to the plural types of processings liquid line, and is arranged in the cartridge unit.
3. according to the wet treater of claim 1, wherein said cartridge unit clamping has a plurality of substrates, and the treat liquid nozzle is arranged on the top by each substrate of cartridge unit clamping.
4. according to the wet treater of claim 2, wherein said cartridge unit clamping has a plurality of substrates, and a plurality of treat liquid nozzles are arranged on the top by each substrate of cartridge unit clamping.
5. according to the wet treater of claim 1, wherein said treat liquid is chemical liquid or cleaning fluid.
6. according to the wet treater of claim 1, wherein said cartridge unit comprises the mechanism that is used to rotate whole cartridge unit.
7. according to the wet treater of claim 1, wherein said cartridge unit has the anchor clamps that are used for each substrate neighboring of clamping.
8. according to the wet treater of claim 5, wherein said cartridge unit has the anchor clamps that are used for each substrate neighboring of clamping.
9. according to the wet treater of claim 1, wherein said substrate is a Semiconductor substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP214212/1999 | 1999-07-28 | ||
| JP21421299A JP3341727B2 (en) | 1999-07-28 | 1999-07-28 | Wet equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1282981A true CN1282981A (en) | 2001-02-07 |
Family
ID=16652091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN00120809A Pending CN1282981A (en) | 1999-07-28 | 2000-07-27 | Wet processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3341727B2 (en) |
| KR (1) | KR20010049878A (en) |
| CN (1) | CN1282981A (en) |
| TW (1) | TW449816B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100377799C (en) * | 2005-06-22 | 2008-04-02 | 中国科学院上海光学精密机械研究所 | Supersonic cleaning fixture |
| CN100437218C (en) * | 2003-06-19 | 2008-11-26 | 三星电子株式会社 | Substrate treatment apparatus |
| CN101610641B (en) * | 2008-06-19 | 2011-06-29 | 富葵精密组件(深圳)有限公司 | Wet process system and wet processing method |
| CN101001704B (en) * | 2004-06-14 | 2016-01-20 | Fsi国际公司 | One or more wafer is taken out of the system and method for fluid and dry process subsequently |
| CN110813805A (en) * | 2019-11-15 | 2020-02-21 | 陈嘉斌 | Steel sheet surface greasy dirt cleaning equipment |
| CN113290466A (en) * | 2021-04-26 | 2021-08-24 | 高兵 | Semiconductor wafer polishing and cleaning device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100710805B1 (en) | 2006-02-06 | 2007-04-23 | 삼성전자주식회사 | Apparatus and method for cleaning substrates used in manufacturing semiconductor devices |
| WO2009079874A1 (en) * | 2007-12-10 | 2009-07-02 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
| US20120189421A1 (en) * | 2011-01-21 | 2012-07-26 | Samsung Austin Semiconductor, L.P. | Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber |
| KR101394456B1 (en) * | 2011-09-30 | 2014-05-15 | 세메스 주식회사 | Apparatus and method for treating substrate |
| JP6265631B2 (en) | 2013-06-14 | 2018-01-24 | キヤノン株式会社 | Information processing apparatus, information processing apparatus control method, and program |
| JP2022138907A (en) * | 2021-03-11 | 2022-09-26 | キオクシア株式会社 | Substrate cleaning device and substrate cleaning method |
-
1999
- 1999-07-28 JP JP21421299A patent/JP3341727B2/en not_active Expired - Fee Related
-
2000
- 2000-07-25 KR KR1020000042838A patent/KR20010049878A/en active IP Right Grant
- 2000-07-27 CN CN00120809A patent/CN1282981A/en active Pending
- 2000-07-28 TW TW089115208A patent/TW449816B/en not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100437218C (en) * | 2003-06-19 | 2008-11-26 | 三星电子株式会社 | Substrate treatment apparatus |
| CN101001704B (en) * | 2004-06-14 | 2016-01-20 | Fsi国际公司 | One or more wafer is taken out of the system and method for fluid and dry process subsequently |
| CN100377799C (en) * | 2005-06-22 | 2008-04-02 | 中国科学院上海光学精密机械研究所 | Supersonic cleaning fixture |
| CN101610641B (en) * | 2008-06-19 | 2011-06-29 | 富葵精密组件(深圳)有限公司 | Wet process system and wet processing method |
| CN110813805A (en) * | 2019-11-15 | 2020-02-21 | 陈嘉斌 | Steel sheet surface greasy dirt cleaning equipment |
| CN113290466A (en) * | 2021-04-26 | 2021-08-24 | 高兵 | Semiconductor wafer polishing and cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3341727B2 (en) | 2002-11-05 |
| KR20010049878A (en) | 2001-06-15 |
| JP2001044106A (en) | 2001-02-16 |
| TW449816B (en) | 2001-08-11 |
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| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |