CN1946869A - Vacuum device where power supply mechanism is mounted and power supply method - Google Patents

Vacuum device where power supply mechanism is mounted and power supply method Download PDF

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Publication number
CN1946869A
CN1946869A CNA2005800126691A CN200580012669A CN1946869A CN 1946869 A CN1946869 A CN 1946869A CN A2005800126691 A CNA2005800126691 A CN A2005800126691A CN 200580012669 A CN200580012669 A CN 200580012669A CN 1946869 A CN1946869 A CN 1946869A
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China
Prior art keywords
electrode
contact
supply unit
power
vacuum chamber
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CNA2005800126691A
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Chinese (zh)
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CN1946869B (en
Inventor
泷本昌行
小室弘之
布施丰
阿部辰弥
青名端一仁
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Showa Shinku Co Ltd
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Showa Shinku Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/221—Ion beam deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/023—Means for mechanically adjusting components not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/24—Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00—Rotary current collectors, distributors or interrupters
    • H01R39/64—Devices for uninterrupted current collection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/024—Moving components not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3132—Evaporating
    • H01J2237/3137—Plasma-assisted co-operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00—Rotary current collectors, distributors or interrupters
    • H01R39/02—Details for dynamo electric machines
    • H01R39/38—Brush holders
    • H01R39/381—Brush holders characterised by the application of pressure to brush

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A contact condition between a rotary electrode placed in a vacuum tank and a power supply mechanism for supplying power by being in contact with the rotary electrode is improved. A vacuum device comprising a vacuum tank, a rotary electrode placed in the vacuum tank in an electrically insulated state, and a power supply mechanism for supplying power by being in contact with the rotary electrode, wherein the rotary electrode has an annular shape, rotates horizontally relative to the central axis of the annular shape, the power supply mechanism has an electrode member, and the electrode member and the rotary electrode are in contact with each other at at least one contact surface.

Description

The vacuum device and the power source method of supply unit are installed
Technical field
The present invention relates to be used for electric power is offered the supply unit of the equipment of the rotator in the vacuum chamber, more particularly, relate to the supply unit that is used for radio frequency power is offered the equipment of the substrate dome that deposition substrate is installed thereon, rotatably arrange the substrate dome.
Background technology
In vacuum deposition method, make the ionization of gas of introducing in the vacuum chamber so that generate positively charged ion, make vapor molecule press to substrate thus, the method that forms the strong and fine and close film of coherency thus is commonly referred to ion assisted deposition (being abbreviated as " IAD " hereinafter).
Fig. 4 represents to use the IAD method, based on the synoptic diagram of the optical thin film vacuum sediment equipment of the direct application system of radio-frequency voltage.Hereinafter the formation of the film of system shown in this Fig is used in general introduction.
In vacuum chamber 30; arrange deposition substrate 23, substrate dome, substrate dome rotating mechanism 24, the substrate heater 33 of deposition substrate 23 are installed; be used for heating deposition substrate 23, deposition material 34, fill deposition material crucible 35, be used for deposition material 34 be heated to vaporization temperature electron beam gun 36, be used for when finishing deposition so as the shutter 37 of closing when protecting deposition material, be used for gas introduce vacuum chamber inlet mouth, be used for applying the supply unit 22 of radio-frequency voltage, and the neutralizer 38 that is used to send electronics at substrate dome 22 two ends of positive rotation.
When carrying out deposition by the equipment among the same figure, deposition substrate 23 at first is connected to substrate dome 22 and crucible 35 is filled deposition material 34.By the exhaust system (not shown), from vacuum chamber 30 exhausted airs, after this, by substrate dome swivel arrangement 24 rotation substrate domes 22 and at substrate heater 33 times, heating deposition substrate 23.When vacuum tightness and substrate temperature reach target value, use electron beam irradiation deposition material 34 from electron beam gun 36 so that make its temperature be elevated to vapour temperature.Simultaneously, by inlet mouth 31, gas is stayed in the vacuum chamber, and sent electronics from neutralizer 38.Use supply unit 32, apply radio-frequency voltage at substrate dome 22 two ends so that the gas that ionization is introduced from inlet mouth 31, thereby in vacuum chamber 30, generate plasma.Open shutter 37 and make deposition material 34 be ejected in the vacuum chamber and under ionic helps, be deposited on the deposition substrate 23, thereby form dense film.When the thickness of film reaches target value, close this shutter 37, then, stop electron beam gun 36, substrate heater 33, supply unit 32, gas introducing and neutralizer 38.After cooling, air is introduced in the vacuum chamber, then, can take out film forming deposition substrate 23 thereon.
For example, above-mentioned vacuum sediment equipment is disclosed in patent documentation 1.
Fig. 5 (b) is illustrated in the schematic plan view of the supply unit 32 shown in Fig. 4.Among Fig. 5 (a) presentation graphs 5 (b), the schematic section of Z-Z ' along the line.When from base plate when top board is seen, the supply unit 32 that the explanation of orthographic plan example shown in Fig. 5 (b) is arranged in vacuum chamber.Fig. 6 represents the detailed maps of supply unit 32 and peripheral hardware thereof.Hereinafter, will traditional supply unit 32 be described with reference to figure 5 and 6.
Supply unit 32 is by passing through steel plate 28, radio-frequency power supply (not shown) outside being installed in vacuum chamber 30 provide radio frequency power plate-like base 40, as be used for rotating body be connected to the electrode of power supply contact 41, be used for fixing and arrange contact 41 contact pad 42, be fixed to and be arranged in pedestal, be used for the holding contact pedestal two pins 43, help from pedestal 40, provide the power supply thin plate 44 of contact pad 42 with radio frequency power, and two springs 45 that are arranged in 42 of pedestal 40 and contact pad are formed.Contact 41, contact pad 42, pin 43, spring 45 and power supply thin plate 44 form a contact point unit.A plurality of contact point unit are arranged on the pedestal 40.For example, four contact point unit are installed in its substrate dome diameter on the device of about Φ 700 to 1200.
Rotating body and vacuum chamber 30 electrical isolations be made up of substrate dome 22, dome stopper 51, dome adapter 50 and power panel 52 also rotatably are arranged in the vacuum chamber 30 and whole rotation.Power panel 52 is fixing and be arranged on the dome adapter 50 and supply unit 32 is arranged on the power panel 52.Fig. 8 schematically shows the state of the contact 41 of contact electricity source plate 52.The figure shows when the power panel 52 of the top board from vacuum chamber when base plate is seen.Arrange four contact point unit and only show contact 41.Power panel 52 for plate-like and therein heart place have concentric circle holes.In the mode of radially arranging longitudinal direction, connect each unitary contact 41 from the rotation center of power panel 52.
Supply unit 32 is arranged in by porcelain insulator 27 on the top board of vacuum chamber and from the vacuum chamber electrical isolation.Contact 41 as electrode touches power panel 52 so that apply radio-frequency voltage at the rotating body two ends.Owing to use isolator or the like, in vacuum chamber, arrange rotating body, electric power is only offered the rotating body of contact electricity source apparatus.Therefore, substrate dome 22 two ends that radio-frequency voltage are applied to as rotating body allow to use IAD method deposition.
Two pins 43 are inserted in two through holes 46 that provide in the contact pad 42.Along pin 43 holding contact pedestal 42 and the contact 41 that is fixed to the upper movably.Spring 45 is arranged in around the periphery of pin 43 and the elastic force of spring 45 provides the power that power panel 52 was pushed away contact pad 42 for contact 41.The cross section of contact 41 is an arc, with and arc-shaped curved surface contact electricity source plate 52.Contact 41 is become with copper such as phosphor bronze by material.
When because rotation during worn contact, is fixed to the instability that contacts that pedestal 40 may make 52 of contact 41 and power panel with contact 41, radio frequency power stably can not be offered substrate dome 22, the guiding discharge failure.Finish when deposition at every turn, remove substrate dome 22, so that during each stationary substrate dome 22,, aspect distance, produce little error 40 of power panel 52 and pedestals.For this reason, in traditional supply unit, the plane that pin 43 is vertically offered power panel 52 is so that can be along pin 43 holding contact pedestal 42 movably, thereby allows contact 41 vertically is pushed on the plane of power panel 52.
Patent documentation 1: Japanese Unexamined Patent Publication No No.2001-73136.
Have traditional contact contact rotating body and enter little with the linear area that contact of power panel, the wear problems of acceleration contact.This is because traditional power panel suffers tufftride process its surface of hardening, and increases the slip resistance of power panel.The wearing and tearing of contact from the contacting of power panel, cause the problem that generates arc-over so that wipe the tip of contact portion significantly.Except that above-mentioned, exist the tufftride process to be easy to increase another problem of resistance.High slip resistance is owing to wear and tear, and making the power panel roughen increases the resistance that is used for reducing power-efficient.
Traditional contact enters according to shape, enter with the linearity of rotating body to contact, so that the contact area diminishes inevitably and increases impedance.In addition, exist the wearing and tearing of contact portion to change contact area, another problem that causes the impedance between new and worn contact to change.
In addition, traditional contact point unit is along with respect to two pin to-and-fro movements as the power panel arranged vertical of rotating body, and this causes operating troubles.The external force that is applied to the contact in the conventional apparatus is described with reference to figure 7.Make contact 41 stand its oneself weight and equal elastic force, the 41 power f4 that are applied to the power of power panel 52 from the contact by spring.In addition, make contact 41 stand rotation, from the power f5 in the sense of rotation of power panel 52 direction of the arrow among the figure " C " expression (promptly by) by substrate dome 22.Make contact 41 stand the f6 that makes a concerted effort that is made up of the summation of power f4 and f5, yet in conventional apparatus, the f6 that makes a concerted effort that is applied to contact 41 is inconsistent in the direction of motion (i.e. the direction of the arrow shown in the figure " d ") of contact 41, this causes operating troubles.In traditional device, with respect to its mode longitudinally of rotation center radial array, arrange contact 41, so that according to the position of contact 41 contact electricity source plates 52, the power f5 difference in the sense of rotation.Fig. 8 schematically shows the direction and the size of the power of the every bit that is applied to conventional contact 41.Power f5 and speed because sense of rotation in (being the direction of arrow " e " shown in this Fig) are proportional.The periphery of the size of power (f5 ') speed that changes to higher (f5 ") from the lower center of speed, this produces contact and reverses (by the arrow among the figure " f " expression).
In addition, little spring is to heat-sensing so that be easy to lose elasticity, hinders level and smooth vertical movement.
Summary of the invention
According to a first aspect of the invention, a kind of vacuum apparatus is provided, be characterised in that and comprise: vacuum chamber, be arranged in the vacuum chamber and with the rotating electrode of vacuum chamber electrical isolation, and supply unit, the contact rotating electrode is so that provide electric power to it, wherein, rotating electrode has annular shape and horizontally rotates with respect to the central shaft of annular shape, and supply unit is made up of electrode member, and electrode member and rotating electrode contact with each other at least one contact surface.In addition, electrode member have with the equidistant plane of contact surface in shared cross-sectional area constant shape.
According to a second aspect of the invention, provide a kind of vacuum apparatus, be characterised in that to comprise vacuum chamber, be arranged in the vacuum chamber and with the rotating electrode of vacuum chamber electrical isolation, and supply unit, the contact portion by on the rotating electrode provides electric power; Wherein, rotating electrode has annular shape, and flatly rotates with respect to the central shaft of annular shape, and supply unit is made up of electrode member, and electrode member is movable to the direction that overlaps basically with the direction of the power that is applied by rotating electrode.
According to a third aspect of the invention we, provide a kind of vacuum apparatus, be characterised in that to comprise vacuum chamber, be arranged in the vacuum chamber and with the rotating electrode of vacuum chamber electrical isolation, and supply unit, the contact rotating electrode is so that provide electric power to it; Wherein, rotating electrode has cylindrical shape and horizontally rotates with respect to the central shaft of cylindrical shape, and supply unit is made up of electrode member, and electrode member and rotating electrode contact with each other at least one contact portion, and contact portion is positioned on the side of rotating electrode at least.In addition, electrode member is movable to the direction of insertion between the both direction, and a direction is the direction of placing electrode member, this direction is perpendicular to contact portion, other direction is the direction of rotating electrode rotation, this direction and contact portion tangent, and be movable to and the symmetric direction of direction of insertion.
Of the present invention second and the third aspect in, electrode member is supported by a fulcrum, in fact this fulcrum is positioned at perpendicular on any point on the straight line of the power or the direction of making a concerted effort and by a point on the electrode member, and electrode member can move around fulcrum.
Of the present invention first to the third aspect, supply unit further has the electrode base of fixed electorde member, the unit pedestal of support electrode pedestal, and the electrode member pedestal is fastened to the pin of unit pedestal, and electrode member pedestal and electrode can use pin to move as fulcrum.In addition, contact portion or contact surface are arranged in the inboard of rotating electrode.In addition, this vacuum apparatus has at least one spring, makes electrode member press to rotating electrode.Rotating electrode is made up of rotating cylindrical and contact portion or contact surface, and described rotating cylindrical has the substrate dome that deposition substrate is installed thereon.In addition, supply unit further has makes spring be fixed to the spring pedestal of base unit, electric power is offered the power supply thin plate of electrode from the unit pedestal, by being clipped in power supply thin plate therebetween, make electrode be fastened to the sunk screw of electrode base and the power supply thin plate retainer that the power supply thin plate is fixed to the spring pedestal.
According to a forth aspect of the invention, a kind of method that electric power is provided in supply unit is provided, supply unit is arranged in the vacuum chamber and forms with the electrode member of the annular shape rotating electrode of vacuum chamber electrical isolation by electric power is offered, the method is characterized in that and comprise:, flatly rotate rotating electrode with respect to the central shaft of annular shape; Make electrode member and rotating electrode at least one contact surface each other face contact; And the area that makes contact surface keeps constant.
According to a fifth aspect of the invention, a kind of method that electric power is provided in supply unit is provided, supply unit is arranged in the vacuum chamber and forms with the electrode member of the annular shape rotating electrode of vacuum chamber electrical isolation by electric power is offered, the method is characterized in that and comprise:, flatly rotate rotating electrode with respect to the central shaft of annular shape; Make electrode member and rotating electrode at least one contact surface each other face contact; And make electrode member be movable to the direction that overlaps basically with the direction of the power that applies by rotating electrode.
In aspect the above-mentioned the 4th or the 5th, rotating electrode is formed by being electrically connected to the substrate dome that deposition substrate is installed and the power supply body of supply unit thereon.
The present invention allows stable electric power is offered rotating body and provides good maintainability for supply unit.
Description of drawings
Fig. 1 represents the synoptic diagram according to supply unit of the present invention;
Fig. 2 represents the synoptic diagram according to supply unit of the present invention and peripheral unit;
Fig. 3 describes according to the present invention, is applied to the figure of the external force of supply unit;
Fig. 4 represents the synoptic diagram of vacuum apparatus;
Fig. 5 represents the synoptic diagram of traditional supply unit;
Fig. 6 represents the traditional supply unit and the synoptic diagram of peripheral unit thereof:
Fig. 7 represents the synoptic diagram of traditional supply unit; And
Fig. 8 represents the schematic plan view of traditional supply unit.
Denotational description
1 supply unit
2 contacts
3 contact pad
4 spring pedestals
5 springs
6 power supply thin plates
7 pins
8 sunk screws
9 unit pedestals
10 power supply thin plate retainers
11 detent
12 fixed orificess
13 through holes
20 power rings
21 dome adapters
22 substrate domes
23 deposition substrate
24 swivel arrangements
25 porcelain insulators
26 pedestals
27 porcelain insulators
28 steel plates
30 vacuum chambers
31 inlet mouths
32 supply units
33 substrate heaters
34 deposition material
35 crucibles
36 electron beam gun
37 shutters
38 neutralizers
40 pedestals
41 contacts
42 contact pad
43 pins
44 power supply thin plates
45 springs
46 through holes
50 dome adapters
51 dome stoppers
52 power panel
Embodiment
With reference to Fig. 1 and 2, the embodiment of the supply unit relevant with the present invention is described.The parts identical with conventional art are given identical reference character and are repeated in this description so that omit it.Fig. 1 represents the synoptic diagram of supply unit, and Fig. 2 represents the synoptic diagram of supply unit and peripheral unit thereof.Device shown in Fig. 1 and 2 can be installed on the vacuum apparatus for example shown in Figure 4.
Supply unit 1 shown in Figure 1 is by unit pedestal 9, for contacting rotating body so that provide the contact 2 of the electrode of electric power to it, be fixed to and be arranged on the unit pedestal 9 and have the spring pedestal 4 of recess, be used for contact pad 3 is fixed to the pin 7 of unit pedestal 9, be fixed to the spring 5 in the recess of spring pedestal 4 and contact pad 3, be used for electric power is provided to from unit pedestal 9 the power supply thin plate 6 of contact 2, be used for by being clipped in an end of power supply thin plate 6 between the two, contact 1 is fixed to the sunk screw 8 of contact pad 3, and, power supply thin plate 6 is fixed to the power supply thin plate retainer 10 of spring pedestal 4 by being clipped in the other end of the power supply thin plate 6 between retainer and spring pedestal.Fig. 1 (a) represents diagrammatic side view.Fig. 1 (b) expression when from base plate when top board is seen, install and be arranged in the schematic plan view of the interior supply unit 1 of vacuum chamber.Unit of supply unit 1 expression shown in Figure 1.The device that it is Φ 700 to 1200 that two contact point unit can be connected to its substrate dome diameter for example.
Power ring 20 shown in Figure 2, dome adapter 21 and substrate dome 22 comprise rotating body and be arranged in the vacuum chamber and with its electrical isolation.Particularly, power ring 20 is fixed to swivel arrangement 24 through porcelain insulator 25, and dome adapter 21 is connected respectively with substrate dome 22 and is fixed to power ring 20 and dome adapter 21.In the present embodiment, can be by the fastening above-mentioned element of screw so that whole these elements of rotation because consider maintainability, constitute rotating body individually.Electric power is offered rotating body with the peripheral unit electrical isolation from supply unit 1.Deposition substrate 23 is installed on the substrate dome 22, and radio frequency power is offered substrate dome 22 so that use IAD method, deposition compact film from supply unit 1.This is identical with traditional method.
Supply unit 1 is connected to pedestal 26, and pedestal 26 is fixing and be arranged in the vacuum chamber, and electrical isolation with it.In the present embodiment name, unit pedestal 9 is fixed to the lower part of pedestal 26 by fixed orifices 12, and this pedestal 26 is fixing and be arranged on the top board of vacuum chamber through porcelain insulator 27, allows thus to remove each unit when safeguarding.By unit pedestal 9, spring pedestal 4, power supply thin plate 6 and contact 2, will be by being connected to the steel plate 28 that is installed in the outer radio-frequency power supply (not shown) of vacuum chamber, the radio frequency power that is applied to pedestal 26 offers power ring 20, then, through dome adapter 21, be applied to substrate dome 22.In Fig. 2, make the parts that in vacuum chamber, apply radio frequency (RF) painted and block porcelain insulator.The element of forming the route that applies above-mentioned RF power preferably uses high conductive material, such as copper.
The contact 2 of supply unit 1 is contacted with rotary power source ring 20 electric power is offered rotating body from supply unit 1.Power ring 20 is cylinders, and the inner wall surface of contact 2 contact cylinders.In the present embodiment, power ring 20 is used as supply unit with traditional dome stopper, thereby reduces the quantity of parts.Contact 2 is characterised in that it is configured as and power ring 20 surperficial contacts, thereby increases the contact area of regulated supply.In the present embodiment name, a face of rectangular parallelepiped protrusion part is equaled the curved surface of the curved surface of power ring 20 as curvature, and make curved surface contact power ring 20, and allowing when bringing into use new contact, contact area is 13 times wide of contact area of conventional apparatus shown in Figure 5.This solution enters the problem of the too little so that increase impedance of the contact area of the contact that the conventional contact of line contact and the spheroid that contact by inlet point form, or the terminal volume of contact is too little so that the problem of quick worn contact, make thus to stablize electric power is provided, improve the stability of discharge, and the burden that reduces power supply.
When it is surperficial even the above-mentioned shape of contact 2 is worn and torn, also do not change contact area, and use will not change impedance so that allow stably to provide electric power.The shape of contact 2 is not limited to the foregoing description, but can be make be in the contact surface normal direction of rotating body and with the equidistant face of the contact surface shape that equates of area always.
Make the wall of contact 2 contact cylinder power rings 20 will not produce reversing of contact 2, different with conventional art, allow to reduce operating troubles.This is because by power ring 20, and the power that is applied to the sense of rotation of contact 2 equates in the contact surface of power ring 20 contact contacts 2.Provide the contact surface of 2 of the rotating body of power and contacts to be not limited to the foregoing description, but can be arranged in the concentric circle of the central shaft of rotating body on.
Allowing contact 2 to become high heat resistance and enter with 20 of power rings with the material that acts on contact 2 phosphor bronze contacts, even because when bringing into use new contact, the shape of contact 2 is not finished with the shape of power ring 20 and is overlapped, and can wipe its projection in the short period of time yet.In addition, use to allow to make electric conductivity to be maintained to high level, and reduce patience by the material that stands by Teflon (registered trademark) electroless nickel or electroless nickel surface-treated stainless steel are made.Vacuum nitriding is handled and can be used for increasing surface hardness.To also be used for reducing resistance and slip resistance and improve thermotolerance and heat-resisting mill by standing to be used for power ring 20 by the material that the surface-treated stainless steel of Teflon (registered trademark) electroless nickel or electroless nickel is made.In the present embodiment, the stainless steel that stands the vacuum oxide treatment is used for than contact 2 bigger and expensive power rings 20 so that increase wear resistance, and phosphor bronze is used for contact 2 so that make it become running stores.
The recess part of spring pedestal 4 and contact pad 3 can be to have the pond of this shape so that allow spring 5 to be installed in wherein, but best shape equals spring 5.Spring pedestal 4 and contact pad 3 are placed in contact 2 and contact the position that power ring 20 and recess face with each other.Fig. 1 (e) expression is along the schematic section of the line Y-Y ' shown in Fig. 1 (b).Spring pedestal 4 is by screw or other are fixed to unit pedestal 9 and contact pad 3 is connected to unit pedestal 9 by certain degree of freedom.Particularly, in contact pad 3, form through hole 13 and pin 7 inserted wherein so that contact pad 3 is connected to unit pedestal 9, thereby allow contact pad 3 with pin 7 as the fulcrum rotation.Fig. 1 (d) is illustrated in the schematic section of the line X-X ' shown in Fig. 1 (b).Molybdenumdisulphide is toasted on pin 7 or makes it stand other surface treatments so that reduce friction is desirable.By shrinking and elasticized spring, spring 5 is placed in the recess, so that make contact 2 press to power ring 20.
With reference to figure 3 external force that is applied to contact 2 is described.
Owing to by spring 5, power ring 20 is pressed in contact 2,,, makes contact 2 through stressed f1 by power ring 20 by in the direction that pushes back contact 2.On the other hand, when substrate dome 2 begins to rotate, by power ring 20, make contact 2 in sense of rotation or in by the direction shown in the arrow among this figure " a " through stressed f2.The f3 that makes a concerted effort that sets up jointly by power f1 and f2 is stood in this expression contact 2.At this moment, in the present embodiment, the movable direction of contact 2 or is overlapped with the direction of the f3 that makes a concerted effort basically by the direction shown in the arrow among this figure " b " guarantees that always stable rotation is operated.Change with the speed of rotation and the elastic force of spring 5 owing to be applied to the f3 that makes a concerted effort of contact 2, according to required speed of rotation and other, pre-determine be applied to contact 2 the f3 that makes a concerted effort so that make the contact 2 can be mobile in equaling the direction of f3 with joint efforts.In the present embodiment, contact 2 is constituted uses pins 7 as fulcrum, to-and-fro movement on arc so that can make pin 7 be positioned at by contact power ring 20 and with the line on the vertical surface of direction of the f3 that makes a concerted effort on.
Pin 7 as fulcrum, moves contact pad 3 spring 5 is inserted in the recess so that go out, unless suitably constrained motion scope on arc.In the present embodiment, contact pad 3 by L shaped constitute and be configured in the specified angle of a L shaped end and spring pedestal 4 collisions, move.The contact pad 3 that can suitably be shaped and spring pedestal 4 are so that move in required angle.For example, pin can be provided as stop component individually, be used for the motion of contact pad 3 is restricted to range of movement.In the present embodiment, form stop part 11 with contact pad 3 and spring pedestal 4 and be used for reducing number of components.Fig. 1 (c) expression stops the state of contact by the stop part.
In the present embodiment, move to be different from traditional mode contact 2, allows diameter and the bigger material of diameter of wire are used for spring 5.This allow to suppress because heat, and spring shrinks reducing of the snap-in force that causes.Although increase snap-in force by spring 5,, alleviate wearing and tearing because contact 2 and power ring 20 stand to be used to reduce the surface treatment of slip resistance.This allows to provide electric power, simultaneously with high speed rotating substrate dome 22.
Compare with traditional device, can prolong keeping the cycle of contact point unit significantly, enough thick because each parts is made, spring 5 diameters are bigger, can select best materials and surface treatment, and the available volume of contact 2 is bigger.
In addition, as shown in the drawing, reduce the quantity of consumable component basically, demonstrate the huge advantage of price.
In addition, as for the power source performance of being concerned about, the strong snap-in force of contact face contact and spring allows impedance is maintained more low value.The wearing and tearing of contact 2 will not change contact area, so that when using this contact, also not change impedance.
Although in the above-described embodiments, supply unit is used for RF power is provided to vacuum apparatus, this device can be used to provide dc power.Other materials and surface treatment can be used for except above-mentioned points contact and power ring, as long as their characteristics are identical.
In addition, although in the present embodiment, the inboard of contact 2 contact power rings 20 can be configured to contact 2 to contact its outside.In addition, although in the present embodiment, contact 2 is entered with 20 of power rings contact, even linear or some contact can prevent that also spring 5 from damaging, as long as make the side of contact contact power ring 20, is not applied to reversing of contact thereby do not produce, and as mentioned above, determine the movable direction of contact.
Hereinbefore, the substrate dome that is used for electric power is offered rotatable arrangement in vacuum apparatus has been described.Yet supply unit according to the present invention is suitable for electric power is offered rotating electrode and the foregoing description of arranging in vacuum chamber.When in the deposition method that use to spray, when applying voltage at rotating and depositing material two ends, for example, can by according to the present invention, have the supply unit of container of being mounted with as the deposition material of rotating electrode or the like, apply electric power.

Claims (15)

1. vacuum apparatus is characterised in that to comprise:
Vacuum chamber;
Rotating electrode, be arranged in the described vacuum chamber and with described vacuum chamber electrical isolation; And
Supply unit contacts described rotating electrode so that provide electric power to it;
Wherein, described rotating electrode has annular shape and horizontally rotates with respect to the central shaft of annular shape, and
Described supply unit is made up of electrode member, and described electrode member and described rotating electrode contact with each other at least one contact surface.
2. vacuum apparatus as claimed in claim 1, wherein,
Described electrode member have with the equidistant plane of contact surface in the cross-sectional area constant shape that obtains.
3. vacuum apparatus is characterised in that to comprise:
Vacuum chamber;
Rotating electrode, be arranged in the described vacuum chamber and with described vacuum chamber electrical isolation; And
Supply unit, the contact portion by on the rotating electrode provides electric power; Wherein,
Rotating electrode has annular shape, and flatly rotates with respect to the central shaft of annular shape, and
Described supply unit is made up of electrode member, and described electrode member is movable to the direction that overlaps basically with the direction of the power that is applied by described rotating electrode.
4. vacuum apparatus is characterised in that to comprise:
Vacuum chamber;
Rotating electrode, be arranged in the described vacuum chamber and with described vacuum chamber electrical isolation; And
Supply unit contacts described rotating electrode so that provide electric power to it;
Wherein, described rotating electrode has cylindrical shape and horizontally rotates with respect to the central shaft of cylindrical shape, and
Described supply unit is made up of electrode member, and described electrode member and described rotating electrode contact with each other at least one contact portion, and described contact portion is positioned on the side of described rotating electrode at least.
5. vacuum apparatus as claimed in claim 4, wherein,
Described electrode member is movable to the direction of insertion between the both direction, one of them direction is the direction of placing said electrodes member, this direction is perpendicular to described contact portion, another direction is described rotating electrode sense of rotation, this direction and described contact portion tangent, and be movable to and the symmetric direction of direction of insertion.
6. vacuum apparatus as claimed in claim 5, wherein,
Described electrode member is movable to the direction of being made up of and power tangent vertical with described contact portion of making a concerted effort, and applies the direction of power by described rotating electrode, and the symmetric direction of direction that is movable to and makes a concerted effort.
7. as claim 3,5 or 6 described vacuum apparatuss, wherein,
Described electrode member is supported by a fulcrum,
In fact this fulcrum is positioned at perpendicular on any point on the straight line of the power or the direction of making a concerted effort and by a point on the described electrode member, and
Described electrode member can move around described fulcrum.
8. as any one described vacuum apparatus of claim 1 to 7, wherein,
Described supply unit further have fixing described electrode member electrode base, support the unit pedestal of described electrode base, and described electrode member pedestal is fastened to the pin of described unit pedestal, and
Described electrode member pedestal and described electrode can use pin to move as fulcrum.
9. as any one described vacuum apparatus of claim 1 to 8, wherein,
Described contact portion or contact surface are arranged in the inboard of described rotating electrode.
10. as any one described vacuum apparatus of claim 1 to 9, it is characterized in that further comprising at least one spring, this spring is pressed to described rotating electrode with described electrode member.
11. as any one described vacuum apparatus of claim 1 to 10, wherein, described rotating electrode is made up of rotating cylindrical and contact portion or contact surface, described rotating cylindrical has the substrate dome, on described substrate dome deposition substrate is installed.
12. as claim 10 or 11 described vacuum apparatuss, wherein,
Described supply unit further has:
The spring pedestal makes described spring be fixed to described base unit;
The power supply thin plate offers described electrode with electric power from described unit pedestal;
Sunk screw by being clipped in described power supply thin plate therebetween, makes described electrode be fastened to described electrode base; And
Power supply thin plate retainer is fixed to described spring pedestal with described power supply thin plate.
13. the method that electric power is provided in supply unit, described supply unit is arranged in the vacuum chamber and forms with the electrode member of the annular shape rotating electrode of described vacuum chamber electrical isolation by electric power is offered, and described method is characterised in that and comprises:
With respect to the central shaft of described annular shape, flatly rotate described rotating electrode;
Make described electrode member and described rotating electrode at least one contact surface each other face contact; And
Make the area of described contact surface keep constant.
14. the method that electric power is provided in supply unit, described supply unit is arranged in the vacuum chamber and forms with the electrode member of the annular shape rotating electrode of described vacuum chamber electrical isolation by electric power is offered, and described method is characterised in that and comprises:
With respect to the central shaft of annular shape, flatly rotate described rotating electrode;
Make described electrode member and described rotating electrode at least one contact surface each other face contact; And
Make described electrode member be movable to the direction that overlaps basically with the direction of the power that applies by described rotating electrode.
15. as claim 13 or the 14 described methods that electric power is provided, wherein,
Described rotating electrode is formed by being electrically connected to the substrate dome that deposition substrate is installed and the power supply body of described supply unit thereon.
CN2005800126691A 2004-07-12 2005-01-24 Vacuum device where power supply mechanism is mounted and power supply method Expired - Fee Related CN1946869B (en)

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JP204457/2004 2004-07-12
JP2004204457A JP4022627B2 (en) 2004-07-12 2004-07-12 Vacuum device equipped with power supply mechanism and power supply method
PCT/JP2005/000852 WO2006006263A1 (en) 2004-07-12 2005-01-24 Vacuum device where power supply mechanism is mounted and power supply method

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Cited By (2)

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CN104412355A (en) * 2013-03-14 2015-03-11 迪姆肯公司 Rotating vacuum chamber coupling assembly
CN106050005A (en) * 2016-08-04 2016-10-26 傅华贵 Probe contact type RFID intelligent electronic lock

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4822339B2 (en) * 2006-09-08 2011-11-24 株式会社昭和真空 Vacuum device equipped with power supply mechanism and power supply method
US20140188097A1 (en) * 2012-12-31 2014-07-03 Cold Plasma Medical Technologies, Inc. Method and Apparatus for Dielectric Barrier Discharge Wand Cold Plasma Device
JP6662840B2 (en) * 2017-12-11 2020-03-11 株式会社アルバック Vapor deposition equipment
JP6662841B2 (en) * 2017-12-21 2020-03-11 株式会社アルバック Vapor deposition equipment
CN112323036B (en) * 2020-11-03 2022-10-21 北京北方华创微电子装备有限公司 Power feed-in mechanism, rotating base device and semiconductor processing equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849095B2 (en) 1978-06-06 1983-11-01 日本真空技術株式会社 Equipment for supplying high frequency high power to rotating electrodes operating in a vacuum atmosphere
JPS59206174A (en) 1983-05-09 1984-11-21 Toyo Seikan Kaisha Ltd Power feeder to turning electrode
JP4482972B2 (en) 1999-09-08 2010-06-16 株式会社昭和真空 Optical thin film manufacturing equipment
US7033462B2 (en) * 2001-11-30 2006-04-25 Nissin Electric Co., Ltd. Vacuum arc vapor deposition process and apparatus
JP4483159B2 (en) 2002-07-16 2010-06-16 株式会社昭和真空 Method and apparatus for controlling film thickness distribution in optical thin film manufacturing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
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CN104412355A (en) * 2013-03-14 2015-03-11 迪姆肯公司 Rotating vacuum chamber coupling assembly
CN104412355B (en) * 2013-03-14 2016-11-16 迪姆肯公司 Rotatory vacuum chamber connects assembly
CN106050005A (en) * 2016-08-04 2016-10-26 傅华贵 Probe contact type RFID intelligent electronic lock
CN106050005B (en) * 2016-08-04 2023-10-27 上海硕电电子科技有限公司 Probe contact type RFID intelligent electronic lock

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CN1946869B (en) 2011-09-14
KR100855173B1 (en) 2008-08-29
KR20070030186A (en) 2007-03-15
JP2006031952A (en) 2006-02-02
WO2006006263A1 (en) 2006-01-19
JP4022627B2 (en) 2007-12-19
US20070215047A1 (en) 2007-09-20

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