CN112323036B - Power feed-in mechanism, rotating base device and semiconductor processing equipment - Google Patents
Power feed-in mechanism, rotating base device and semiconductor processing equipment Download PDFInfo
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- CN112323036B CN112323036B CN202011209005.7A CN202011209005A CN112323036B CN 112323036 B CN112323036 B CN 112323036B CN 202011209005 A CN202011209005 A CN 202011209005A CN 112323036 B CN112323036 B CN 112323036B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The embodiment of the invention provides a power feed-in mechanism, a rotary base device and semiconductor processing equipment, wherein the power feed-in mechanism comprises a conductive fixing piece, a fixed connecting piece and a rotary connecting piece, wherein the conductive fixing piece is electrically connected with a power source; the rotary connecting piece is annular and is arranged coaxially with the rotation axis of the rotating part, and the rotary connecting piece and the rotating part rotate synchronously and are electrically conducted with each other; the fixed connecting piece is fixedly connected with the conductive fixing piece and is electrically communicated with the conductive fixing piece; the fixed connecting piece is in elastic contact with the rotary connecting piece and is electrically conducted with each other. The technical scheme of the power feed-in mechanism, the rotary base device and the semiconductor processing equipment provided by the embodiment of the invention not only can improve the power transmission efficiency and avoid the ignition risk in the prior art, but also can simplify the structure and reduce the assembly requirement and the installation and maintenance difficulty, thereby improving the expansibility of the rotary base device.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a power feed-in mechanism, a rotary base device and semiconductor processing equipment.
Background
Physical Vapor Deposition (PVD) is one of the most commonly used processes in integrated circuit and device fabrication. The thickness uniformity and stress of the thin film are critical parameters of the PVD process, and therefore, the thickness uniformity of the thin film is usually improved by using a spin pedestal, and for the reduction of the stress of the thin film, ions with higher energy are required to bombard the thin film during the deposition process, and therefore, the spin pedestal needs to be loaded with rf power to obtain a proper bias voltage for the pedestal, so as to improve the ion energy in the plasma. It is very challenging to maintain a good stable rf connection during the rotation of the susceptor.
In the prior art, two mutually nested induction coils are usually disposed around the rotatable base support, and the magnetic field generated by the induction coils can be used to couple rf energy to the base support by means of magnetic field coupling, so as to transmit rf power to the rotating base. However, this inevitably has the following problems in practical use:
firstly, the problem of magnetic flux leakage exists when radio frequency power is transmitted through an inductance coil in an inductance coupling mode, and the power transmission efficiency is low.
Secondly, in order to increase the rf power fed to the base support, the voltage of the inductor coil needs to be increased, which may cause a risk of sparking when the voltage is raised to a certain threshold.
Thirdly, for some processes, the base is required to have the capability of heating or fixing the wafer, and the base is required to be correspondingly provided with a power supply lead, a cooling water and a back-blowing gas introducing pipeline, so that a large space is difficult to be reserved from a base rotating shaft with a small volume for installing the radio frequency feed-in mechanism, and therefore, how to realize the simple structure, low assembly requirement and low installation and maintenance difficulty of the radio frequency feed-in mechanism is also a problem which needs to be solved urgently at present.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a power feed-in mechanism, a rotary base device and semiconductor processing equipment, which not only can improve the power transmission efficiency and avoid the ignition risk in the prior art, but also can simplify the structure, reduce the assembly requirement and the installation and maintenance difficulty, and further can improve the expansibility of the rotary base device.
To achieve the above object, an embodiment of the present invention provides a power feeding mechanism for feeding output power of a power source into a rotating component, which includes a conductive fixing member, a fixed connecting member and a rotating connecting member, wherein,
the conductive fixing piece is electrically connected with the power source;
the rotary connecting piece is annular and is arranged coaxially with the rotation axis of the rotating component, and the rotary connecting piece and the rotating component rotate synchronously and are mutually and electrically communicated;
the fixed connecting piece is fixedly connected with the conductive fixing piece and is electrically communicated with the conductive fixing piece; the fixed connecting piece is in elastic contact with the rotary connecting piece and is mutually and electrically communicated.
Optionally, one of the rotating connector and the fixed connector is a conductive elastic member, and the other of the rotating connector and the fixed connector is a conductive rigid member; the conductive elastic member is held in elastic contact with the conductive rigid member by being elastically deformed.
Optionally, the fixed connecting piece is a conductive elastic piece, and the rotating connecting piece is a conductive rigid piece;
the fixed connecting piece comprises two elastic split bodies, and one ends of the two elastic split bodies are fixedly connected with the conductive fixing piece and are mutually and electrically conducted; the other ends of the two elastic split bodies extend in different directions in the horizontal plane respectively, so that the rotary connecting piece is clamped between the two elastic split bodies, the fixed connecting piece is elastically contacted with the peripheral surface of the rotary connecting piece, and the fixed connecting piece and the rotary connecting piece are mutually and electrically conducted.
Optionally, the fixed connecting piece is a conductive elastic piece, and the rotary connecting piece is a conductive rigid piece;
the fixed connecting piece is positioned between the rotating connecting piece and the conductive fixing piece, and the movable end of the fixed connecting piece is in elastic contact with the lower end face of the rotating connecting piece.
Optionally, the fixing and connecting member includes at least two elastic separated bodies, and one end of each of the at least two elastic separated bodies is fixedly connected to the conductive fixing member and is electrically conducted with the conductive fixing member; the other ends of the at least two elastic split bodies extend upwards in an inclined mode relative to the vertical direction, and included angles are formed between the different elastic split bodies so as to be in elastic contact with different positions of the lower end face of the rotary connecting piece.
Optionally, the conductive elastic element includes a brush, a spring, or a soft conductive element.
Optionally, the conductive rigid element includes a contact surface contacting the conductive elastic element, and the contact surface includes a concave surface or a convex surface.
Optionally, the concave surface or the convex surface is a circular arc surface, a conical surface, a step surface or an irregular surface.
Optionally, the hardness of the conductive elastic member is lower than that of the conductive rigid member.
Optionally, the power feed-in mechanism further includes an insulating guide, the insulating guide is annular and is arranged coaxially with the rotation axis of the rotating component, and the insulating guide and the rotating component rotate synchronously; and the number of the first and second electrodes,
the insulating guide is formed with an annular groove in which the rotary connector is disposed, and a dimension of the rotary connector in a depth direction of the annular groove is smaller than a depth of the annular groove.
As another technical solution, an embodiment of the present invention further provides a rotating base apparatus, including a rotatable base, a bias power source, and a power feeding mechanism, where the power feeding mechanism is configured to feed output power of the bias power source into the base, and the power feeding mechanism adopts the above power feeding mechanism provided in the embodiment of the present invention.
Optionally, the rotating base device further comprises a vertically arranged rotating shaft, and the upper end of the rotating shaft is connected with the base;
the rotating connecting piece is sleeved on the rotating shaft, and the conductive fixing piece is arranged on one side of the rotating connecting piece; the fixed end of the fixed connecting piece is fixedly connected with the conductive fixing piece, and the movable end of the fixed connecting piece is in elastic contact with the outer peripheral surface of the rotating connecting piece.
Optionally, the rotary connector is arranged at the bottom of the base and is arranged coaxially with the rotation axis of the base;
the conductive fixing piece and the fixed connecting piece are both arranged below the rotary connecting piece; the fixed end of the fixed connecting piece is fixedly connected with the conductive fixing piece, and the movable end of the fixed connecting piece is in elastic contact with the lower end face of the rotary connecting piece.
As another technical solution, an embodiment of the present invention further provides a semiconductor processing apparatus, including a reaction chamber and the above rotating susceptor device, wherein the rotatable susceptor is disposed in the reaction chamber.
The embodiment of the invention has the following beneficial effects:
according to the power feed-in mechanism provided by the embodiment of the invention, the annular rotary connecting piece is adopted, so that the installation position can be flexibly selected, the synchronous rotation with the rotary part is realized, and the expansibility of the rotary base device can be improved. Moreover, through utilizing fixed connector and swivel connected coupler elastic contact, and mutual electric conduction to this fixed connector and electrically conductive mounting fixed connection, and mutual electric conduction can make electrically conductive mounting independently set up for rotary part, thereby not only can improve power transmission efficiency, avoid the risk of striking sparks that exists among the prior art, can simplify the structure, and reduce the assembly requirement, the installation and maintain the degree of difficulty.
According to the rotary base device provided by the embodiment of the invention, by adopting the power feed-in mechanism provided by the embodiment of the invention, not only can the power transmission efficiency be improved, the ignition risk in the prior art be avoided, but also the structure can be simplified, the assembly requirement and the installation and maintenance difficulty can be reduced, and therefore, the expansibility of the rotary base device can be improved.
By adopting the rotary base device provided by the embodiment of the invention, the semiconductor processing equipment provided by the embodiment of the invention not only can improve the power transmission efficiency and avoid the ignition risk in the prior art, but also can simplify the structure and reduce the assembly requirement and the installation and maintenance difficulty, thereby improving the expansibility of the rotary base device.
Drawings
Fig. 1 is an axial cross-sectional view of a power feed-in mechanism according to a first embodiment of the present invention;
fig. 2 is a radial cross-sectional view of a power feed-in mechanism according to a first embodiment of the present invention;
FIG. 3 is a longitudinal sectional view of the outer peripheral surface of a rotary joint member employed in the first embodiment of the present invention;
fig. 4 is an axial cross-sectional view of a power feed-in mechanism according to a second embodiment of the present invention;
fig. 5 is a radial cross-sectional view of a power feed-in mechanism provided in a second embodiment of the present invention;
FIG. 6 is a structural view of a fixing connector employed in the second embodiment of the present invention;
FIG. 7 is a longitudinal cross-sectional view of the lower end face of a swivel joint used in a second embodiment of the present invention;
fig. 8 is a sectional view of a semiconductor processing apparatus according to a third embodiment of the present invention;
fig. 9 is a sectional view of a semiconductor processing apparatus according to a fourth embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the power feeding mechanism, the rotating base device and the semiconductor processing equipment provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
First embodiment
Referring to fig. 1, a power feeding mechanism 1 according to a first embodiment of the present invention is used for feeding output power of a power source into a rotating component (not shown), such as a base, a target or a coil, which rotates around a rotation axis 11a thereof. The power source is usually a matcher and a power supply, wherein the matcher is used for enabling load impedance to be matched with output impedance of the power supply by dynamically adjusting a variable capacitor in a matching circuit in a process so as to ensure that the output power of the power supply is applied to plasma inside the chamber to the greatest extent. The power supply comprises a radio frequency power supply, a low frequency power supply, an intermediate frequency power supply or a direct current power supply and the like.
Specifically, power feed-in mechanism 1 includes electrically conductive mounting 15, fixed connector 14 and swivel connected coupler 13, and wherein, electrically conductive mounting 15 is connected with the power supply electricity, and in this embodiment, this electrically conductive mounting 15's structure is unrestricted, and for example electrically conductive mounting 15 is the column, and vertical setting, and this can reduce the occupation space to be favorable to improving the expansibility of rotating base device.
The rotary joint 13 is annular and is disposed coaxially with the rotation axis 11a of the rotary member, and the rotary joint 13 rotates synchronously with the rotary member and is electrically conducted to each other. Taking the case that the rotary connector 13 is sleeved on the rotary shaft of the rotating component as an example, the rotary connector 13 is in a cylindrical shape and is sleeved and fixed on the rotary shaft of the rotating component so as to be capable of rotating synchronously with the rotating component, and meanwhile, the rotary connector 13 is electrically conducted with the rotary shaft, so that the rotary connector is electrically conducted with the rotating component. Through adopting annular swivel connected coupler 13, not only simple structure, assembly require lowerly, but also can select the mounted position in a flexible way to realize with the synchronous revolution of rotary part, thereby can improve the expansibility of rotating base device.
The fixed connecting piece 14 is fixedly connected with the conductive fixing piece 15 and is electrically conducted with each other, that is, the fixed connecting piece 14 and the conductive fixing piece 15 form an assembly body; the fixed link 14 is in elastic contact with the rotary link 13 and is electrically conducted to each other. Since the movable end of the fixed link 14 is in elastic contact with the rotary link 13, that is, the movable end of the fixed link 14 is separable from the rotary link 13, this enables the conductive fixing member 15 to be independently provided with respect to the rotary member, thereby making it possible to simplify the structure and reduce assembly requirements, installation and maintenance difficulties. Meanwhile, when the rotating connecting piece 13 rotates, the movable end of the fixed connecting piece 14 can be ensured to be in elastic contact with the rotating connecting piece 13 and be electrically conducted with each other, compared with a mode of transmitting power in an inductive coupling mode in the prior art, the power transmission efficiency is higher, and the risk of sparking existing in the prior art can be avoided.
The elastic contact between the fixed connecting member 14 and the rotating connecting member 13 can be achieved in various ways, for example, one of the rotating connecting member 13 and the fixed connecting member 14 is an electrically conductive elastic member, and the other of the rotating connecting member 13 and the fixed connecting member 14 is an electrically conductive rigid member. And, the conductive elastic member maintains elastic contact with the conductive rigid member by generating elastic deformation. Specifically, when the conductive elastic member is separated from the conductive rigid member, the conductive elastic member is in an original state, and when the conductive elastic member is in elastic contact with the conductive rigid member, the conductive elastic member is elastically deformed by the pressure of the conductive rigid member, so that the conductive elastic member can be kept in elastic contact with the conductive rigid member.
Optionally, the conductive elastic element includes a brush, a spring, or a soft conductive element. The soft conductive component is, for example, a soft alloy such as an aluminum alloy, a stainless steel alloy, or the like.
In this embodiment, the fixed connector 14 is a conductive elastic member, and the rotating connector 13 is a conductive rigid member. Furthermore, as shown in fig. 2, the conductive fixing member 15 is disposed at one side of the rotary connecting member 13, and the fixed connecting member 14 includes two elastic sub-bodies (14a, 14b), one ends of the two elastic sub-bodies (14a, 14b) are fixedly connected to the conductive fixing member 15 and are electrically conducted to each other; the other ends of the two elastic sub-bodies (14a, 14b) extend in different directions in the horizontal plane, respectively, to achieve elastic contact of the fixed link 14 with the outer circumferential surface of the rotary link 13 and electrical conduction with each other by sandwiching the rotary link 13 therebetween. For example, if the fixed connector 14 is a brush, the two elastic separate bodies (14a, 14b) are divided into two parts by the brush. By providing two elastic separate bodies (14a, 14b), the contact area with the outer peripheral surface of the rotary joint 13 can be increased, and power transmission efficiency can be improved.
In some embodiments, the conductive rigid member includes a contact surface contacting the conductive elastic member, and fig. 3 is a longitudinal sectional view of an outer circumferential surface of the rotating connecting member according to the first embodiment of the present invention. As shown in fig. 3, the rotating connector 13 is taken as an example of a conductive rigid member, and the longitudinal section is an axial section of the rotating connector 13. The contact surface 13a of the rotation link 13 is an outer circumferential surface of the rotation link 13, and the contact surface 13a includes a concave surface or a convex surface. For example, the contact surface 13a is shaped to increase the contact area between the rotary connector 13 and the fixed connector 14, so that power transmission efficiency can be improved, as shown in fig. 3 (1) showing a circular arc concave surface, fig. 3 (2) showing a circular arc convex surface, fig. 3 (3) showing a tapered convex surface, and fig. 3 (4) showing a tapered concave surface. Of course, in practical applications, the contact surface 13a may also be a flat surface as illustrated in fig. 3 (5), or may be any other shape such as a stepped surface or an irregular surface.
In some embodiments, the conductive elastic member has a hardness lower than that of the conductive rigid member. This makes the softer conductive elastic member more easily worn by the conductive rigid member, thereby reducing the loss of the conductive rigid member and improving the life of the conductive rigid member. For example, the fixed link 14 is a conductive elastic member, the rotary link 13 is a conductive rigid member, and the hardness of the fixed link 14 is lower than that of the rotary link 13, which can reduce the loss of the rotary link 13, thereby improving the life of the rotary link 13.
In some embodiments, as shown in fig. 1, the power feed-in mechanism 1 further includes an insulating guide 12, the insulating guide 12 is annular and is disposed coaxially with the rotation axis 11a of the rotating member, and the insulating guide 12 rotates synchronously with the rotating member. The insulating guide 12 is made of, for example, ceramic, insulating resin, or the like. The insulating guide 12 is formed with an annular groove 12a, specifically, the annular groove 12a is circumferentially provided on the outer peripheral surface of the insulating guide 12, the rotary joint 13 is provided in the annular groove 12a, and the dimension of the rotary joint 13 in the depth direction of the annular groove 12a (i.e., the radial thickness of the rotary joint 13 in fig. 1) is smaller than the depth of the annular groove 12 a. With the insulating guide 12, the annular groove 12a thereof can restrict the position of the rotational connector 13 and improve the insulating effect to the rotational connector 13, thereby improving the connection stability and achieving the purpose of preventing sparking. In practical applications, the position of the annular groove 12a is adaptively set according to the specific connection position of the rotary connector 13 and the rotating component.
The insulating guide 12 may have various structures, for example, as shown in fig. 1, the insulating guide 12 may have a unitary structure, and the rotary connector 13 may be fixed in the annular groove 12a by welding or riveting (e.g., using a countersunk head nail). Also, the electrical conduction of the rotary connector 13 to the rotary member may be achieved by passing a conductive screw through the insulating guide 12. Of course, in practical applications, the above-mentioned insulated guiding element 12 may also adopt a split structure, specifically, the rotary connecting element 13 is directly sleeved on the rotating component and is electrically connected with each other, and the above-mentioned insulated guiding element 12 is composed of two annular split bodies, the two annular split bodies are sleeved on the rotating component at intervals, the above-mentioned annular groove 12a is formed by the interval between the two annular split bodies, that is, the rotary connecting element 13 is clamped between the two annular split bodies.
It should be noted that the dimension of the rotary joint 13 in the depth direction of the annular groove 12a (i.e., the radial thickness of the rotary joint 13 in fig. 1) should be smaller than the depth of the annular groove 12a for the purpose of preventing sparking.
It should also be noted that, in practical applications, the number of the rotary connectors 13 may be multiple, and the number of the annular grooves 12a corresponds to the number of the rotary connectors 13.
Second embodiment
As shown in fig. 4, a power feeding mechanism 1 'according to a second embodiment of the present invention, compared to the first embodiment, also includes a conductive fixing member 15', a fixing connecting member 14', and a rotating connecting member 13', wherein the conductive fixing member 15 'is electrically connected to a power source, and the conductive fixing member 15' may have various structures, such as a column shape, and is vertically disposed, which may reduce the occupied space, thereby facilitating the increase of the expansibility of the rotating base apparatus.
The rotary connector 13 'is annular and is arranged coaxially with the rotation axis 11a of a rotary member (not shown), such as a rotary base, at the bottom of which the rotary connector 13' may be arranged. And, the rotary connector 13' rotates in synchronization with the rotation member and is electrically conducted to each other. As shown in fig. 4, the rotary connector 13' may have a disk shape, for example. Through adopting annular swivel connected coupler 13', not only simple structure, assembly require lowerly, but also can select the mounted position in a flexible way to realize with the synchronous revolution of rotary part, thereby can improve the expansibility of rotating base device.
The fixed connecting piece 14 'is fixedly connected with the conductive fixing piece 15' and is electrically conducted with each other, that is, the fixed connecting piece 14 'and the conductive fixing piece 15' form an assembly body; the fixed link 14 'is in elastic contact with the rotary link 13' and is electrically conducted with each other. Since the movable end of the fixed link 14' is in elastic contact with the rotary link 13', that is, the movable end of the fixed link 14' is separable from the rotary link 13', it is possible to make the conductive fixing member 15' independently provided with respect to the rotary member, thereby simplifying the structure and reducing the assembly requirement, the installation and the maintenance difficulty. Meanwhile, when the rotating connecting piece 13' rotates, the movable end of the fixed connecting piece 14' can be ensured to be in elastic contact with the rotating connecting piece 13' and be electrically conducted with each other, compared with a mode of transmitting power in an inductive coupling mode in the prior art, the power transmission efficiency is higher, and the risk of sparking existing in the prior art can be avoided.
The elastic contact between the movable end of the fixed connection member 14 'and the rotating connection member 13' can be achieved in various ways, for example, one of the rotating connection member 13 'and the fixed connection member 14' is an electrically conductive elastic member, and the other of the rotating connection member 13 'and the fixed connection member 14' is an electrically conductive rigid member. And, the conductive elastic member maintains elastic contact with the conductive rigid member by generating elastic deformation. Specifically, when the conductive elastic member is separated from the conductive rigid member, the conductive elastic member is in an original state, and when the conductive elastic member is in elastic contact with the conductive rigid member, the conductive elastic member is elastically deformed by the pressure of the conductive rigid member, so that the conductive elastic member can be kept in elastic contact with the conductive rigid member.
In this embodiment, the fixed connector 14 'is a conductive elastic member, and the rotating connector 13' is a conductive rigid member; and, the fixed link 14 'is located below the rotary link 13', and the fixed link 14 'is in elastic contact with the lower end surface of the rotary link 13'. In some embodiments, as shown in fig. 6, the fixing connector 14 'includes two elastic sub-bodies (14 a',14b '), one end of each of the two elastic sub-bodies (14 a',14b ') is fixedly connected to the conductive fixing member 15', and the two elastic sub-bodies are electrically connected to each other; the other ends of the two elastic sub-bodies (14 a ',14b ') extend obliquely upward with respect to the vertical direction, and different elastic sub-bodies are angled to elastically contact different positions of the lower end surface of the rotary joint 13 '. For example, if the fixed connection member 14' is a brush, the two elastic split bodies (14 a ',14b ') are divided into two parts by the brush. By providing the two elastic split bodies (14 a ',14b '), the contact area with the lower end surface of the rotary joint 13' can be increased, and the power transmission efficiency can be improved.
In this embodiment, the conductive fixing element 15' is in a column shape and is vertically disposed, and the two elastic split bodies (14 a ',14b ') extend obliquely and upwardly from the conductive fixing element 15' toward different directions, respectively, it should be noted that the two elastic split bodies (14 a ',14b ') may extend arbitrarily toward the three-dimensional space direction as long as they can elastically contact different positions of the lower end surface of the rotating connection element 13 '. Of course, in practical application, the number of the elastic split bodies can be three, four or more than five according to specific requirements.
In some embodiments, the conductive rigid element includes a contact surface contacting the conductive elastic element, and fig. 7 is a longitudinal sectional view of a lower end surface of a rotating connecting element according to a second embodiment of the present invention. As shown in fig. 7, the rotating connector 13 'is taken as an example of a conductive rigid member, and the longitudinal section is an axial section of the rotating connector 13'. The contact surface 13a 'of the rotary joint 13' is the lower end surface of the rotary joint 13', and the contact surface 13a' includes a concave surface or a convex surface. For example, the circular arc concave surface is illustrated in (1) of fig. 7, (2) of fig. 7 illustrates the circular arc convex surface, (3) of fig. 7 illustrates the tapered convex surface and (4) of fig. 7 illustrates the tapered concave surface, and the shape of the contact surface 13a ' may increase the contact area of the rotary connector 13' and the fixed connector 14', so that power transmission efficiency may be improved. Of course, in practical applications, the contact surface 13a' may also be a flat surface as illustrated in (5) of fig. 7, or may be any other shape such as a stepped surface or an irregular surface.
The other structures of the power feeding mechanism 1' provided in the second embodiment of the present invention are the same as those of the first embodiment, and are not described herein again.
In summary, the power feeding mechanism provided in the above embodiments of the present invention can flexibly select the installation position by using the annular rotary connector, so as to achieve synchronous rotation with the rotary component, thereby improving the expansibility of the rotary base device. Moreover, the movable end of the fixed connecting piece is in elastic contact with the rotary connecting piece, the fixed end of the fixed connecting piece is in electric conduction with the rotary connecting piece, the fixed end of the fixed connecting piece is fixedly connected with the conductive fixing piece, the conductive fixing piece is in electric conduction with the rotary connecting piece, and the conductive fixing piece can be arranged independently relative to the rotary component, so that the power transmission efficiency can be improved, the ignition risk existing in the prior art can be avoided, the structure can be simplified, and the assembling requirement, the installation difficulty and the maintenance difficulty can be reduced.
Third embodiment
As another technical solution, as shown in fig. 8, a semiconductor processing apparatus 2 according to a third embodiment of the present invention includes a reaction chamber 21, a rotating base device and a target 22 disposed above the rotating base device are disposed in the reaction chamber 21, wherein the target 22 is electrically connected to an upper rf power source 23. The rotating susceptor apparatus includes a rotatable susceptor 24, a bias power source, and a power feed-in mechanism 1, wherein the susceptor 24 is disposed in a reaction chamber 21. The bias power source comprises a matcher 28 and a power supply 29, wherein the matcher 28 is configured to match the load impedance with the output impedance of the power supply 29 by dynamically adjusting a variable capacitor in the matching circuit during the process, so as to ensure that the output power of the power supply 29 is maximally applied to the plasma inside the chamber. The power supply 29 includes a radio frequency power supply, a low frequency power supply, an intermediate frequency power supply, or a direct current power supply, etc.
In this embodiment, the rotating base device further includes a rotating shaft 25 and a rotating driving mechanism 26, wherein the rotating shaft 25 is a rotating component in the first embodiment, the rotating shaft 25 is vertically disposed, an upper end of the rotating shaft 25 is connected to the base 24, a lower end of the rotating shaft 25 is connected to the power feeding mechanism 1, specifically, a radio frequency transmission line 27, such as a copper column, is disposed in the rotating shaft 25, and the radio frequency transmission line 27 is electrically connected to the power feeding mechanism 1 to realize power transmission. The rotation driving mechanism 26 is connected to an intermediate position between the upper end and the lower end of the rotation shaft 27 for driving the rotation shaft 27 to rotate.
The rotation driving mechanism 26 may include a motor and a transmission mechanism, and the motor is connected to the rotation shaft 25 through the transmission mechanism. The transmission mechanism is, for example, a belt transmission mechanism, a gear transmission mechanism, or the like. The rotation driving mechanism 26 receives the weight of the rotation shaft 25 and the base 24 thereon.
The power feeding mechanism 1 is used for feeding the output power of the bias power source into the base 24 through the rf transmission line 27, and the power feeding mechanism 1 adopts the power feeding mechanism 1 provided in the above-mentioned first embodiment of the present invention. Specifically, as shown in fig. 1, the rotary connector 13 is fitted over the rotary shaft 25 (i.e., the rotary member in fig. 1); the fixed connector 14 is fixedly connected with the conductive fixing member 15 and elastically contacts with the rotary connector 13. Because swivel connected coupler 13 is cyclic annular, its mounted position can set up in a flexible way to not being restricted to the cover and establishing in the bottom position department of rotation axis 25, other mounted positions can also be selected in a flexible way to realize with the synchronous revolution of base 24, thereby can improve the expansibility of rotating base device. Moreover, the structure of the conductive fixing member 15 is not limited, for example, the conductive fixing member 15 is in a column shape, and is vertically disposed, and this can reduce the occupied space, thereby being favorable for improving the expansibility of the spin base device.
In addition, the structure of the power feed-in mechanism 1 is simple, and only corresponding power feed-in components are added on the part of the rotating shaft 25, which is positioned outside the reaction chamber 21, so that the original structure of the semiconductor processing equipment 2 is not changed, and the improvement cost is low.
Fourth embodiment
A semiconductor processing apparatus 2 according to a fourth embodiment of the present invention is different from the third embodiment only in the structure of the power feeding mechanism. As shown in fig. 9, the power feed-in mechanism 1' has the same structure as the second embodiment described above.
Specifically, as shown in fig. 4, the rotary joint 13' is provided at the bottom of the base 24, and is provided coaxially with the rotation axis of the base 24; the fixed connector 14 'is fixedly connected with the conductive fixing member 15', and the fixed connector 14 'is elastically contacted with the lower end surface of the rotary connector 13'.
Of course, in practical application, because swivel joint spare 13 'is cyclic annular, its mounted position can set up in a flexible way, and is not restricted to the bottom that sets up at base 24, can also select other mounted positions in a flexible way to realize with base 24's synchronous revolution, thereby can improve the expansibility of rotating base device.
The technical scheme of the rotary base device and the semiconductor processing equipment provided by the embodiment of the invention not only can improve the power transmission efficiency and avoid the ignition risk in the prior art, but also can simplify the structure and reduce the assembly requirement and the installation and maintenance difficulty, thereby improving the expansibility of the rotary base device.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (8)
1. A power feed-in mechanism is used for feeding output power of a power source into a rotating component and is characterized by comprising a conductive fixing piece, a fixed connecting piece and a rotating connecting piece, wherein the conductive fixing piece is electrically connected with the power source; the fixed connecting piece is a conductive elastic piece, the conductive elastic piece comprises two elastic split bodies, and one ends of the two elastic split bodies are fixedly connected with the conductive fixing piece and are mutually and electrically communicated; the rotary connecting piece is a conductive rigid piece;
the rotary connecting piece is annular and is sleeved on the rotating shaft when the rotating part is the rotating shaft connected with the base; the other ends of the two elastic split bodies extend in different directions in a horizontal plane respectively, so that the two elastic split bodies are elastically contacted with the outer peripheral surface of the rotary connecting piece and are electrically conducted with each other by clamping the rotary connecting piece between the two elastic split bodies; alternatively, the first and second electrodes may be,
when the rotating part is the base, the rotating connector is arranged at the bottom of the base and is coaxial with the rotating axis of the rotating part, and the rotating connector and the rotating part rotate synchronously and are electrically communicated with each other; the elastic split bodies are positioned between the rotating connecting piece and the conductive fixing piece, the other ends of the elastic split bodies extend upwards in an inclined mode relative to the vertical direction, and different elastic split bodies form included angles to be in elastic contact with different positions of the lower end face of the rotating connecting piece.
2. The power feedthrough mechanism of claim 1, wherein the conductive spring comprises a brush, a leaf spring, a spring, or a soft conductive component.
3. The power feed-in mechanism of claim 1, wherein the conductive rigid element comprises a contact surface in contact with the conductive elastic element, and the contact surface comprises a concave surface or a convex surface.
4. The power feed-in mechanism of claim 3, wherein the concave or convex surface is a circular arc surface, a conical surface, a step surface or an irregular surface.
5. The power feedthrough mechanism of claim 1, wherein the conductive elastic member has a lower hardness than the conductive rigid member.
6. The power feed-in mechanism of any one of claims 1 to 5, further comprising an insulating guide member, wherein the insulating guide member is annular and is disposed coaxially with the rotation axis of the rotating member, and wherein the insulating guide member rotates synchronously with the rotating member; and the number of the first and second electrodes,
the insulating guide is formed with an annular groove in which the rotary connector is disposed, and a dimension of the rotary connector in a depth direction of the annular groove is smaller than a depth of the annular groove.
7. A rotary pedestal device comprising a rotatable pedestal, a bias power source, and a power feed-in mechanism for feeding the output power of the bias power source into the pedestal, wherein the power feed-in mechanism employs the power feed-in mechanism of any one of claims 1-6;
the rotary base device further comprises a vertically arranged rotating shaft, and the upper end of the rotating shaft is connected with the base.
8. A semiconductor processing apparatus comprising a reaction chamber and the rotating pedestal device of claim 7, wherein the rotatable pedestal is disposed in the reaction chamber.
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| CN202011209005.7A CN112323036B (en) | 2020-11-03 | 2020-11-03 | Power feed-in mechanism, rotating base device and semiconductor processing equipment |
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