JP4822339B2 - Vacuum device equipped with power supply mechanism and power supply method - Google Patents

Description

  The present invention relates to a power supply mechanism for a device that supplies power to a rotating body in a vacuum chamber, and more particularly to a power supply mechanism for a device that mounts a film formation substrate and supplies high-frequency power to a substrate dome that is rotatably arranged in both directions.

  Ion Assisted Deposition (hereinafter referred to as “Ion Assisted Deposition”) is a method for forming a dense thin film with strong adhesion by ionizing the gas introduced into the vacuum chamber and pressing the deposited molecules against the substrate by the generated cations. Called "IAD").

FIG. 4 is a schematic diagram of a vacuum deposition apparatus for optical thin films of the high frequency voltage direct application method using the IAD method, and the outline of thin film formation in the apparatus shown in FIG.
The vacuum chamber 1 has a substrate dome 2 on which a film formation substrate 5 is mounted, a power feeding mechanism 300 for applying a high-frequency voltage to the substrate dome 2, a substrate dome rotation mechanism 4, a vapor deposition material 6 filled in a crucible, and a vapor deposition material 6 at an evaporation temperature. An electron gun 8 that heats the film, a shutter 7 that closes when the vapor deposition is completed and shields the vapor deposition material, and a heater 9 for heating the substrate are arranged.

When vapor deposition is performed using the apparatus shown in the figure, the film formation substrate 5 is first installed on the substrate dome 2, the substrate dome 2 is rotated by the substrate dome rotation mechanism 4, and the film formation substrate 5 is removed using the substrate heating heater 9. Heat. When the degree of vacuum and the substrate temperature reach the target values, the electron gun 8 irradiates the deposition material 6 with an electron beam, and raises the deposition material 6 to the evaporation temperature. By applying a high frequency voltage to the substrate dome 2 using the power supply mechanism 300, the introduced gas is ionized and plasma is generated inside the vacuum chamber 1. When the shutter 7 is opened, the vapor deposition material 6 scatters in the vacuum chamber and is assisted by ions and deposited on the film formation substrate 5 to form a dense thin film. When the film thickness reaches the target value, the shutter 7 is closed, the electron gun 8, the substrate heating heater 9, the power feeding mechanism 300, etc. are stopped, and after cooling, the atmosphere is introduced into the vacuum chamber and the thin film substrate is formed. 5 is taken out.
Said vacuum evaporation apparatus is disclosed by patent document 1, etc., for example.

  FIG. 6 is a detailed schematic diagram of the power feeding mechanism 300 and its peripheral devices. FIG. 5B is a schematic plan view of the power feeding mechanism 300, and FIG. 5B is a schematic cross-sectional view taken along the line Z-Z 'shown in FIG. The plan view shown in FIG. 5B is a view in which the power supply mechanism 300 mounted and arranged inside the vacuum chamber is looked up from the bottom plate direction to the top plate direction. Hereinafter, a conventional power feeding mechanism 300 will be described with reference to FIGS. 5 and 6.

  The power feeding mechanism 300 is in contact with a disc-shaped base 301 to which a high frequency power is applied by a copper plate 28 from a high frequency power source (not shown) installed outside the vacuum chamber 1 and electrically insulated from the vacuum chamber 1, and a rotating body. A contact 302 that is an electrode for supplying electric power, a contact base 303 that fixes and arranges the contact 302, two pins 307 that are fixedly arranged on the base and hold the contact base, and high-frequency power from the base 301 to the contact base 303 The power supply thin plate 304 assists the supply, and includes two springs 305 disposed between the base 301 and the contact base 303. The contact 302, the contact base 303, the power feeding thin plate 304, the spring 305, and the pin 307 form one contact unit, and a plurality of contact units are arranged on the base 301.

A rotating body constituted by the substrate dome 2, the dome catcher 51, the dome adapter 50, and the power feeding plate 52 is disposed in an electrically insulated state and freely rotatable inside the vacuum chamber 1, and rotates together. The power feeding plate 52 is fixedly disposed above the dome adapter 50, and the power feeding mechanism 300 is disposed above the power feeding plate 52. FIG. 8 schematically shows how the contact 302 contacts the power feeding plate 52. This figure is a view in which the power feeding plate 52 is looked down from the top plate direction to the bottom plate direction of the vacuum chamber. Four contact units are arranged and only the contacts 302 are shown. The power feeding plate 52 is formed in a disc shape having a concentric hole at the center, and the contacts 302 of each unit are attached so that the longitudinal direction is radially arranged from the rotation center of the power feeding plate 52.
The power feeding mechanism 300 is disposed on the vacuum chamber top plate in an electrically insulated state from the vacuum chamber via an insulator 27. The contact 302 as an electrode contacts the power feeding plate 52 and applies a high frequency voltage to the rotating body. Since the rotating body is disposed inside the vacuum chamber using an insulator or the like, electric power is supplied only to the rotating body that contacts the power feeding mechanism. As a result, a high frequency voltage is applied to the substrate dome 2 that is a rotating body, and film formation by IAD becomes possible.

  Two pins 307 are inserted into the two through holes 306 provided in the contact base 303, and the contact base 303 and the contacts 302 fixed thereto are held movably along the pins 307. A spring 305 is disposed on the outer periphery of the pin 307, and a force for pressing the power feeding plate 52 is applied to the contact 302 via the contact base 303 by the elastic force of the spring 305. The contact 302 has a circular arc cross section, and the circular arc curved surface contacts the power feeding plate 52.

  By the way, the conventional contact unit reciprocates along two pins arranged in the vertical direction with respect to the power feeding plate which is a rotating body, which causes a malfunction. With reference to FIG. 7, the external force applied to the contact which is a conventional mechanism will be described. A force f4 equal to the force applied from the contact 302 to the power feeding plate 52 due to its own weight or the elastic force of the spring is applied to the contact 302 from the power feeding plate 52. Further, as the substrate dome 2 rotates, a force f5 is applied from the power supply plate 52 in the direction of rotation (the direction of arrow c in the figure). A total force f6 obtained by adding these forces f4 and f5 is applied to the contact 302. However, in the conventional mechanism, the direction of the total force f6 applied to the contact 302 and the operation direction of the contact 302 (direction of arrow d in the figure) match. This was the cause of malfunction. Further, in the conventional mechanism, the longitudinal direction of the contact 302 is arranged radially with respect to the center of rotation, so that the force f5 in the rotational direction differs depending on the contact position between the contact 302 and the power feeding plate 52. FIG. 8 is a diagram schematically showing the direction and magnitude of the force applied to each point of the conventional contact 302. Since the force f5 in the rotation direction (arrow e direction in the figure) is proportional to the speed, the magnitude of the force differs between the slow speed center side f5 ′ and the fast speed outer circumference side f5 ″, and the force that twists the contact (same as above). An arrow f) has occurred.

Therefore, in order to cope with the above-described problem, Patent Document 2 has been devised so that a twisting force is not applied to the contact and the contact is movable in the direction of the force applied to the contact.
The embodiment of the power feeding mechanism disclosed in Patent Document 2 will be described with reference to FIGS. 9 to 11. However, the same parts as those in FIGS. FIG. 9 is a schematic diagram around the power feeding mechanism, and FIG. 10 is a schematic diagram of the power feeding mechanism and its peripheral mechanisms.

  The power supply mechanism 350 shown in FIG. 9 includes a unit base 351, a contact 352 that is an electrode that contacts the rotating body and supplies power, a spring base 354 that is fixedly disposed on the unit base 351, and has a recess, and a recess that is disposed on the unit base 351. A contact base 353, a pin 357 for attaching the contact base 353 to the unit base 351, a spring 355 fitted into the recess of the spring base 354 and the recess of the contact base 353, a power supply thin plate 356 for supplying power from the unit base 351 to the contact 352, A plate screw 358 that fixes the contact 352 and the contact base 353 with one end of the power feeding thin plate 356 sandwiched therebetween, and a power feeding thin plate retainer 360 that is secured to the spring base 354 with the other end of the power feeding thin plate 356 sandwiched therebetween. It is. FIG. 10 is a schematic side view, and FIG. 11 is a schematic plan view of the power feeding mechanism 350 mounted and arranged inside the vacuum chamber as viewed from the bottom plate direction to the top plate direction.

  The power feeding ring 20, the dome adapter 21, and the substrate dome 2 shown in FIG. 10 constitute a rotating body and are arranged in an electrically insulated state inside the vacuum chamber. Specifically, the power supply ring 20 is fixed to the rotation mechanism 4 via the insulator 25, and the dome adapter 21 is attached to the power supply ring 20 and the substrate dome 22 is fixed to the dome adapter 21. The rotating body is supplied with electric power from the power supply mechanism 350 in an electrically insulated state from the peripheral mechanism. The film forming substrate 5 is mounted on the substrate dome 2, and the operation of depositing a dense thin film by IAD by applying high-frequency power from the power supply mechanism 350 to the substrate dome 2 is the same as that of Patent Document 1.

  The power feeding mechanism 350 is attached to the base 31, and the base 31 is fixedly disposed in an electrically insulated state inside the vacuum chamber. In the embodiment, the unit base 351 is attached from below to the lower part of the base 31 fixedly arranged on the vacuum chamber top plate via the insulator 27. The high frequency power applied to the base 31 by the copper plate 28 connected to a high frequency power source (not shown) disposed outside the vacuum chamber is supplied to the power supply ring 20 via the unit base 351, the spring base 354, the power supply thin plate 356, and the contact 352. And applied to the substrate dome 2 through the dome adapter 21. In FIG. 10, the portion where RF (Radio Frequency, ie, high frequency) is applied inside the vacuum chamber is colored, and the insulator is represented by diagonal lines.

  The power supply from the power supply mechanism 350 to the rotating body is performed when the contact 352 of the power supply mechanism 350 contacts the rotating power supply ring 20. The power feeding ring 20 was formed in a cylindrical shape, and the contact 352 was brought into contact with the inner wall surface of the cylinder. The contact 352 has a shape in surface contact with the power feeding ring 20, thereby increasing the contact area and stabilizing power feeding.

  Further, by bringing the contact 352 into contact with the cylindrical wall surface of the power supply ring 20, no twisting force is generated in the contact 352 as in the configuration of FIG. 8, and malfunctions can be reduced. . This is because the rotational force applied from the power supply ring 20 to the contact 352 is equal at each contact surface between the power supply ring 20 and the contact 352.

  FIG. 9E shows a schematic cross-sectional view taken along the line YY ′ shown in FIG. The spring base 354 is fixed to the unit base 351 with screws or the like, and the contact base 353 is attached to the unit base 351 with flexibility. Specifically, a through hole 363 is formed in the contact base 353, and a pin 357 is inserted into the through hole 363 and attached to the unit base 351, so that the pin 357 is attached to the fulcrum so as to be rotatable. FIG. 9D is a schematic cross-sectional view taken along line XX ′ shown in FIG. The spring 355 is configured to press the contact 352 against the power supply ring 20 by being fitted into the recess while contracting and holding the elastic force.

The external force applied to the contact 352 will be described with reference to FIG.
Since the contact 352 is pressed against the power feeding ring 20 by the spring 355, a force f1 in a direction in which the contact 352 is pushed back from the power feeding ring 20 is applied. Further, when the substrate dome 2 starts to rotate, a force f <b> 2 in the rotational direction (direction of arrow “a”) is applied from the power supply ring 20 to the contact 352. A total force f3 obtained by adding these f1 and f2 is applied to the contact 352. In contrast, the movable direction of the contact 352 according to the embodiment (the direction of arrow b in the figure) substantially coincides with the direction of the total force f3 applied to the contact 352, so that a stable operation with respect to the rotation is always possible.
JP 2001-073136 A JP 2006-31952 A

Although the configuration of Patent Document 2 compensates for the drawbacks of the conventional contact mechanism, it only supports the case where the rotating electrode rotates in only one direction. In other words, the contact is movable in the resultant direction of (f1) and (f2) shown in FIG. 11, but added when the rotating electrode rotates in the opposite direction (f1) and (−f2). The contact is not movable in the resultant force direction.
Here, when considering mixed vapor deposition using three or more vapor deposition sources as shown in FIG. 1, the deposition material can be deposited in order by rotation. However, in Patent Document 2, the rotation direction of the substrate dome is constant. Can only be formed in order. For example, for the vapor deposition materials 6A, 6B and 6C in FIG. 1, a mixed vapor deposition film such as... → 6A → 6B → 6C → 6A → 6B →. Even though it can be formed easily, it is impossible to form a mixed vapor deposition film such as... → 6A → 6C → 6B → 6A → 6C →.

Therefore, in order to freely form a mixed vapor deposition film using three or more vapor deposition sources, a mechanism capable of appropriately controlling the force applied to the contact even when the substrate dome, that is, the rotating electrode is rotated in both directions, is required. Become.
Further, as described above, the power feeding mechanism must be configured to fit in a limited space near the center of the substrate dome. Moreover, it is desirable to have a simple configuration with a small number of parts in order to obtain high reliability.

  A first aspect of the present invention is a vacuum apparatus including a vacuum chamber, a rotating electrode disposed inside the vacuum chamber, and a power feeding mechanism that supplies power in contact with the rotating electrode. And a second rotation direction opposite to the first rotation direction and the second rotation direction. The power supply mechanism includes at least one contact that forms a contact portion with the rotation electrode. The first direction is defined as the narrow direction and the opposite direction between the normal direction or the normal direction and the direction in which the contact is present, and the tangential direction of the contact portion and the first rotation direction. A narrow-angle direction and a direction opposite to the second direction are a normal direction or a perpendicular direction to the rotating electrode in the contact portion and a direction in which the contact is present, and a tangential direction of the contact portion and a direction in which the second rotation direction faces. When defined as the direction of A vacuum device configured such that the contact is movable in a first direction around a first fulcrum on the power feeding mechanism and movable in a second direction around a second fulcrum on the power feeding mechanism. It is.

  Here, the base fixed directly or indirectly to the vacuum chamber, the first contact base rotatably supported on the base by the first fulcrum, and the first contact base rotatable by the second fulcrum And a second contact base supported by the second contact base so that the contact is held by the second contact base. Furthermore, at least one elastic body that presses the contact against the rotating electrode is provided. Moreover, the rotating electrode was made into a ring shape, and the contact portion was further arranged on the inner surface of the rotating electrode.

  Furthermore, the rotating electrode is composed of a substrate dome on which the film formation substrate is mounted and a rotating cylinder or a rotating plate that forms a contact portion with the contact, and the vacuum device further includes at least three evaporation sources for evaporating the vapor deposition material. In preparation for the position facing the substrate dome, at least three evaporation sources are arranged concentrically with respect to the rotation axis of the substrate dome.

  According to the present invention, it is possible to supply a stable power to a rotating body that rotates in both directions with a small and simple configuration, and to provide a vacuum apparatus that can form a film in a desired order using a plurality of vapor deposition materials. It became possible.

Example 1.
An embodiment of the power feeding mechanism according to the present invention will be described with reference to FIGS. 1 to 3, but the same reference numerals are given to the same parts as those in FIGS.

  FIG. 1 is a schematic view of a vacuum deposition apparatus for an optical thin film according to the present invention. The difference from FIG. 4 is that a plurality of vapor deposition materials 6 are arranged. Specifically, vapor deposition materials 6A, 6B, and 6C are arranged substantially concentrically on the bottom surface of the vacuum chamber 1, as shown in FIG. . Then, as shown in FIG. 2, the substrate dome 2 is rotated in two directions by the rotation mechanism 4. That is, if the substrate dome 2 is rotated in the direction of the left arrow in FIG. 2, the order of vapor deposition is as follows: → 6A → 6B → 6C → 6A →. When rotating in the direction, the order becomes .fwdarw.6C.fwdarw.6B.fwdarw.6A.fwdarw.6C.fwdarw .. However, the film can be formed in any order by appropriately reversing the direction of rotation. A configuration suitable for such bidirectional rotation will be described below.

FIG. 2A is a schematic view of the vicinity of the power feeding mechanism 3, and FIG. 2B is a diagram showing the relationship between the power feeding ring 20 and the power feeding mechanism 3 in a direction looking up from the bottom surface direction. The difference from FIG. 9 is the configuration of each contact unit.
As shown in FIG. 3, each contact unit includes a first contact base 32 that is rotatably supported by a base 31 with a first link shaft 34 as a fulcrum, and a second link shaft 35 that is supported by the first contact base 32. And a contact 30 fixed to the second contact base 33, and both ends thereof are fixed to the base 31 and the second contact base 33. The coil spring 36 is provided through the contact base 32. A power feeding thin plate 37 is connected between the base 31 and the contact 30, and power is supplied from the base 31 to the contact 30. The feeding thin plate 37 is connected in a state where it can be bent to some extent. It is desirable that the components constituting the high-frequency power application path be made of a highly conductive material such as copper. The coil spring 36 may be made of a metal having high heat resistance and corrosion resistance, such as Inconel.

Next, the operation of the contact unit will be described.
As shown in FIG. 3A, when the feed ring 20 rotates counterclockwise in the figure, the total force received by the contact 30 is based on the contact portion between the contact 30 and the feed ring 20 as in FIG. As a resultant force of the force (f1) in the direction toward the normal center of the feed ring and the force (f2) in the tangential counterclockwise direction (hereinafter referred to as “the resultant force (f1 + f2)”).
For the resultant force (f1 + f2), since the first contact base 32 can rotate with respect to the base 31 with the first link shaft 34 as a fulcrum, the contact 30 substantially coincides with the direction of the resultant force (f1 + f2). You can move in the direction you want.

  The effect of the present invention can be obtained even if the direction in which the contact 30 is movable does not exactly coincide with the direction of the resultant force (f1 + f2). FIG. 3C is a diagram for explaining the movable direction of the contact portion when the feed ring 20 rotates counterclockwise. In FIG. 3C, the feed ring 20 is shown linearly to show the contact portion locally. As shown in the figure, the contact 30 only needs to be movable in at least the narrow angle α direction sandwiched between the (f1) direction and the (f2) direction and the opposite (diagonal) direction, that is, the ± A direction.

On the other hand, as shown in FIG. 3B, when the feed ring 20 rotates clockwise in the figure, the total force received by the contact 30 is based on the contact portion between the contact 30 and the feed ring 20. The resultant force is a resultant force (hereinafter referred to as “the resultant force (f1-f2)”) of the force (f1) in the direction of the normal center and the force (−f2) in the tangential clockwise direction.
With respect to the resultant force (f1-f2), the second contact base 33 can rotate with respect to the first contact base 32 using the second link shaft 35 as a fulcrum, so that the contact 30 has a resultant force (f1). It can move in a direction substantially coincident with the direction of -f2).

  Note that the effect of the present invention can be obtained even when the rotation direction of the feed ring 20 is clockwise as in the case of counterclockwise, even if it does not exactly coincide with the direction of the resultant force (f1-f2). That is, as shown in FIG. 3D, the contact 30 has a narrow angle β direction sandwiched between at least the direction (f1) and the direction (−f2) and the opposite (diagonal) direction, that is, ± B direction. It may be movable.

  Accordingly, the contact 30 receives from the power supply ring 20 regardless of whether the relative rotation direction of the power supply link 20 and the contact 30, that is, the substrate dome 2 and the power supply mechanism 3, is clockwise or counterclockwise. It can move appropriately in the resultant force direction.

  As shown in FIG. 2B, the base 31 is provided with six contact units, but the number of contact units can be changed as appropriate. In FIG. 2B, all six contact units are provided in the same direction. For example, every other contact unit having an inverted structure (first link shaft 34 as viewed from the center of the base 31). May be provided on the left side with respect to the second ring shaft 35). Thereby, the mechanical and electrical action relationship between the power feeding ring 20 and the power feeding mechanism 3 is made more uniform in any rotation direction.

  In the embodiment, the horizontal cross-sectional shape of the contact 30 is a semicircular shape as shown in FIG. 3, but the cross-section in which a part of the rectangle is arcuate as shown in FIG. It may be. In any case, since the contact area between the contact 30 and the power supply ring 20 can be increased, the impedance can be lowered, and it contributes to stable power supply, improved discharge stability, and reduced burden on the power supply. .

  If phosphor bronze is used as the material of the contact 30, the heat resistance is high, and even if the shape of the contact 30 does not completely coincide with the power supply ring 20 when it is new, the protruding portion is abruptly scraped so that surface contact is immediately made. . Further, if Teflon (registered trademark) electroless nickel or a material subjected to electroless nickel surface treatment is used for stainless steel, the electrical conductivity can be maintained high and the slip resistance can be reduced. Alternatively, vacuum nitriding may be used to increase the surface hardness. Similarly, if the Teflon (registered trademark) electroless nickel or electroless nickel surface treatment is used for the power supply ring 20, the electric resistance and the frictional resistance are reduced, and the heat resistance and the heat resistance are improved. Can contribute. In the embodiment, wear resistance is increased by using stainless steel subjected to vacuum nitriding treatment for the power supply ring 20, which is larger in parts and expensive than the contact 30, and is consumed by using phosphor bronze for the contact 30. It was a product.

  In the above-described embodiment, it is used for high-frequency power supply in the vacuum apparatus, but may be used for DC power supply. Further, the material and surface treatment of the contact and the power supply ring may be other than those described above as long as they have similar characteristics.

Further, in the present embodiment, the contact 30 is brought into contact with the inner side surface of the power supply ring 20, but a configuration in which the contact 30 is brought into contact with the outer side surface is also possible.
Further, when the feed ring 20 is used as described above, the base 31 moves the contact 30, the first contact base 32, the second contact base 33, the spring 36, etc. (hereinafter referred to as “electrode unit”) in the horizontal direction. However, the base 31 may hold the electrode unit in the vertical direction by using a flat power supply plate (for example, the power supply plate 52) instead of the annular power supply ring 20. In this case, the contact 30 is movable in the direction perpendicular to the contact portion with the power supply plate and in the angle direction sandwiched between the side where the contact 30 is present and the rotation direction of the power supply plate, and in the opposite direction. As a result, the contact 30 can be made movable in a direction substantially coinciding with the resultant force direction of the force received from the rotating electrode, as in the case where the rotating electrode includes the power supply ring 20.

  In the above, the embodiment in which power is supplied to the substrate dome that is rotatably arranged in the vacuum apparatus has been described. However, the power supply mechanism of the present invention is not limited as long as it supplies power to the rotating electrode disposed in the vacuum apparatus. The present invention is not limited to the above embodiment and can be applied. For example, in the case of applying a voltage to a rotating film forming material in a film forming method using sputtering, a container or the like in which the film forming material is disposed may be a rotating electrode and power may be supplied by the power feeding mechanism of the present invention.

Vacuum device schematic Schematic diagram of power feeding mechanism of the present invention Schematic diagram of power feeding mechanism and peripheral mechanism of the present invention Schematic diagram of power feeding mechanism and peripheral mechanism of the present invention Schematic diagram of power feeding mechanism and peripheral mechanism of the present invention Schematic diagram of power feeding mechanism and peripheral mechanism of the present invention Vacuum device schematic Schematic diagram of conventional power supply mechanism Schematic diagram of conventional power supply mechanism and peripheral mechanism The figure explaining the conventional electric power feeding mechanism The figure explaining the conventional electric power feeding mechanism Overview of conventional power supply mechanism Schematic diagram of conventional power supply mechanism and peripheral mechanism The figure explaining the conventional electric power feeding mechanism

Explanation of symbols

1. Vacuum chamber 2. 2. Substrate dome 3. Power feeding mechanism 4. Rotating mechanism Deposition substrate 6. 6. Vapor deposition material Shutter 8. Electron gun 9. Substrate heating heater 20. Feeding ring 21. Dome adapter 25, 27. Isogo 28. Copper plate 30. Contact 31. Base 32. First contact base 33. Second contact base 34. First link shaft 35. Second link shaft 36. Coil spring 37. Power supply plate 50. Dome adapter 51. Dome catcher 52. Feeding plate 300. Power supply mechanism 301. Base 302. Contact 303. Contact base 304. Feeding thin plate 305. Spring 306. Through hole 307. Pin 350. Power supply mechanism 351. Unit base 352. Contact 353. Contact base 354. Spring base 355. Spring 356. Feeding thin plate 357. Pin 358. Countersunk screw 360. Feed plate holder 363. Through hole

Claims (6)

A vacuum apparatus comprising a vacuum chamber, a rotating electrode disposed inside the vacuum chamber, and a power feeding mechanism that supplies power in contact with the rotating electrode,
The rotating electrode is configured to horizontally rotate in a first rotation direction and a second rotation direction opposite to the first rotation direction;
The power supply mechanism includes at least one contact that forms a contact portion with the rotating electrode;
A narrow-angle direction between a normal direction or a perpendicular direction to the rotating electrode in the contact portion and a direction in which the contact is present, and a tangential direction of the contact portion and a direction in which the first rotation direction faces and Define the opposite direction as the first direction,
A narrow-angle direction between a direction normal to or perpendicular to the rotating electrode at the contact portion and the direction in which the contact is present, and a direction tangential to the contact portion and the second rotation direction is directed, and If we define the opposite direction as the second direction,
The contact is movable in the first direction about the first fulcrum on the power supply mechanism, and is movable in the second direction about the second fulcrum on the power supply mechanism. A vacuum device configured to. The vacuum apparatus according to claim 1, wherein
The power supply mechanism further includes a base fixed directly or indirectly to the vacuum chamber, a first contact base rotatably supported on the base by the first fulcrum, and the second fulcrum. A second contact base rotatably supported by the first contact base;
A vacuum apparatus in which the contact is held by the second contact base. The vacuum apparatus according to claim 2, wherein
The vacuum apparatus, wherein the power supply mechanism further includes at least one spring that presses the contact against the rotating electrode.   4. The vacuum apparatus according to claim 1, wherein the rotating electrode has a ring shape. 5. The vacuum apparatus according to claim 4, wherein
The vacuum apparatus which has the said contact part in the inner surface of the said rotating electrode. The vacuum apparatus according to any one of claims 1 to 5,
The rotating electrode comprises a substrate dome on which a film forming substrate is mounted and a rotating cylinder or a rotating plate that forms a contact portion with the contact,
The vacuum apparatus further includes at least three evaporation sources for evaporating the vapor deposition material at positions facing the substrate dome, and the at least three evaporation sources are arranged concentrically with respect to the rotation axis of the substrate dome. Vacuum device.

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