TWI720373B - Power feeding mechanism, rotating base device and semiconductor processing equipment - Google Patents
Power feeding mechanism, rotating base device and semiconductor processing equipment Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Abstract
本發明提供的功率饋入機構、旋轉基座裝置及半導體加工設備,該功率饋入機構用於將功率源的輸出功率饋入旋轉部件,包括:導電固定件,其與功率源電連接;導電旋轉件,其與旋轉部件電連接,且隨旋轉部件同步旋轉;導電連接結構,分別與導電固定件和導電旋轉件電接觸,且不影響導電旋轉件的旋轉運動。本發明提供的功率饋入機構,其不僅可以提高功率傳輸效率,而且可以避免先前技術中存在的打火風險。The power feeding mechanism, the rotating base device and the semiconductor processing equipment provided by the present invention are used to feed the output power of the power source into the rotating component, and include: a conductive fixing member which is electrically connected to the power source; and conductive The rotating part is electrically connected with the rotating part and rotates synchronously with the rotating part; the conductive connection structure is respectively in electrical contact with the conductive fixed part and the conductive rotating part, and does not affect the rotational movement of the conductive rotating part. The power feeding mechanism provided by the present invention can not only improve the power transmission efficiency, but also avoid the risk of ignition in the prior art.
Description
本發明涉及半導體製造技術領域,具體地,涉及一種功率饋入機構、旋轉基座裝置及半導體加工設備。The present invention relates to the technical field of semiconductor manufacturing, in particular to a power feeding mechanism, a rotating base device and semiconductor processing equipment.
在PVD(Physical Vapor Deposition,物理氣相沉積)製程中,濺射電源輸出的功率通過電極耦合至製程腔室中,並激發腔室中的製程氣體形成電漿,在電漿中電子和離子的作用下,完成薄膜沉積。In the PVD (Physical Vapor Deposition) process, the power output by the sputtering power supply is coupled to the process chamber through the electrode, and the process gas in the chamber is excited to form a plasma. The electrons and ions in the plasma Under the action, the film deposition is completed.
隨著晶片(wafer)尺寸的增加,為了提高產品良率,PVD製程對薄膜沉積均勻性的要求也越來越高。通過基座旋轉的方式可以顯著提高沉積薄膜的均勻性,現已被廣泛採用。但是,為了提高電漿中帶電離子的能量,增強離子的轟擊作用,通常採用向基座饋入射頻的方式來實現,而在基座旋轉的過程中,如何保持良好穩定的射頻連接非常具有挑戰性。As the size of the wafer increases, in order to improve the product yield, the PVD process requires higher and higher film deposition uniformity. The method of rotating the susceptor can significantly improve the uniformity of the deposited film, and has been widely used. However, in order to increase the energy of the charged ions in the plasma and enhance the bombardment of the ions, it is usually achieved by feeding radio frequency to the base, and it is very challenging to maintain a good and stable radio frequency connection during the rotation of the base. Sex.
在先前技術中,通常是在可旋轉的基座支撐件的周圍環繞設置有相互嵌套的兩個電感線圈,利用電感線圈產生的磁場,可以通過磁場耦合的方式將射頻能量耦合至基座支撐件,從而實現向旋轉中的基座傳輸射頻功率。但是,這在實際應用中不可避免地存在以下問題: 其一,射頻功率通過電感線圈採用電感耦合方式進行傳輸會存在漏磁問題,功率傳輸效率較低。 其二,為了提高向基座支撐件饋入的射頻功率,就需要提高電感線圈的電壓,當電壓升高至某一臨界值時會存在打火風險。In the prior art, two inductance coils nested in each other are usually arranged around a rotatable base support. The magnetic field generated by the inductance coils can couple the radio frequency energy to the base support by means of magnetic field coupling. Parts, so as to realize the transmission of radio frequency power to the rotating base. However, this inevitably has the following problems in practical applications: First, the radio frequency power is transmitted through the inductive coil in the inductive coupling mode, there will be a problem of magnetic leakage, and the power transmission efficiency is low. Second, in order to increase the RF power fed to the base support, it is necessary to increase the voltage of the inductor coil. When the voltage rises to a certain critical value, there is a risk of ignition.
本發明旨在至少解決先前技術中存在的技術問題之一,提出了一種功率饋入機構、旋轉基座裝置及半導體加工設備,其不僅可以提高功率傳輸效率,而且可以避免先前技術中存在的打火風險。The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a power feeding mechanism, a rotating base device and a semiconductor processing equipment, which not only can improve the power transmission efficiency, but also can avoid the interference in the prior art. Fire risk.
為實現本發明的目的而提供一種功率饋入機構,用於將功率源的輸出功率饋入旋轉部件,包括: 導電固定件,其與該功率源電連接; 導電旋轉件,其與該旋轉部件電連接,且隨該旋轉部件同步旋轉; 導電連接結構,分別與該導電固定件和該導電旋轉件電接觸,且不影響該導電旋轉件的旋轉運動。In order to achieve the objective of the present invention, a power feeding mechanism is provided for feeding the output power of a power source into a rotating part, including: a conductive fixing part, which is electrically connected to the power source; a conductive rotating part, which is connected to the rotating part It is electrically connected and rotates synchronously with the rotating part; the conductive connection structure is respectively in electrical contact with the conductive fixing part and the conductive rotating part, and does not affect the rotational movement of the conductive rotating part.
可選的,該導電旋轉件與該導電固定件相對,且間隔設置;該導電連接結構設置在該導電旋轉件與該導電固定件之間的間隔中。Optionally, the conductive rotating part is opposite to the conductive fixing part and arranged at intervals; the conductive connection structure is arranged in the interval between the conductive rotating part and the conductive fixing part.
可選的,該間隔的垂直長度大於或等於1mm。Optionally, the vertical length of the interval is greater than or equal to 1 mm.
可選的,該導電旋轉件與該導電固定件的兩個相對面相互平行或者相互嵌套。Optionally, the two opposite surfaces of the conductive rotating member and the conductive fixing member are parallel to each other or nested with each other.
可選的,該導電連接結構包括第一彈性導電部件。Optionally, the conductive connection structure includes a first elastic conductive component.
可選的,該第一彈性導電部件為環體、平面螺旋體或者柱狀螺旋體。Optionally, the first elastic conductive member is a ring body, a plane spiral body or a cylindrical spiral body.
可選的,該第一彈性導電部件包括軟質合金。Optionally, the first elastic conductive component includes a soft alloy.
可選的,在該導電旋轉件與該導電固定件的兩個相對面中的至少一個相對面上設置有安裝槽,該第一彈性導電部件的一部分設置在該安裝槽中。Optionally, a mounting groove is provided on at least one of the two opposite surfaces of the conductive rotating member and the conductive fixing member, and a part of the first elastic conductive member is disposed in the mounting groove.
可選的,該導電連接結構包括第二彈性導電部件、第三彈性導電部件和彈簧,其中, 該彈簧的兩端分別與該導電固定件和其上方的該第二彈性導電部件連接; 該第三彈性導電部件設置在該第二彈性導電部件上,且在該彈簧的彈力作用下,與該導電旋轉件保持電接觸; 該第二彈性導電部件的硬度低於第三彈性導電部件的硬度。Optionally, the conductive connection structure includes a second elastic conductive member, a third elastic conductive member, and a spring, wherein two ends of the spring are respectively connected to the conductive fixing member and the second elastic conductive member above it; Three elastic conductive parts are arranged on the second elastic conductive part and maintain electrical contact with the conductive rotating part under the elastic force of the spring; the hardness of the second elastic conductive part is lower than that of the third elastic conductive part.
可選的,在該導電旋轉件上設置有凹部,該第二彈性導電部件的至少一部分位於該凹部中。Optionally, a recess is provided on the conductive rotating member, and at least a part of the second elastic conductive member is located in the recess.
可選的,該導電連接結構還包括固定座,該固定座與該彈簧連接; 在該固定座上設置有安裝槽,該第二彈性導電部件可拆卸的固定在該安裝槽中。Optionally, the conductive connection structure further includes a fixing seat connected to the spring; a mounting groove is provided on the fixing seat, and the second elastic conductive component is detachably fixed in the mounting groove.
可選的,該導電連接結構包括: 第二彈性導電部件,其與該導電固定件連接,且為環體,該環體環繞在該導電旋轉件的周圍; 第三彈性導電部件,其與該導電旋轉件連接,且位於該環體的內周面與該導電旋轉件的外周面之間,並且分別與二者電接觸; 該第二彈性導電部件的硬度低於第三彈性導電部件的硬度。Optionally, the conductive connection structure includes: a second elastic conductive member, which is connected to the conductive fixing member and is a ring body, the ring body surrounds the conductive rotating member; and the third elastic conductive member is connected to the conductive rotating member. The conductive rotating part is connected and located between the inner peripheral surface of the ring body and the outer peripheral surface of the conductive rotating part, and is in electrical contact with both; the hardness of the second elastic conductive part is lower than the hardness of the third elastic conductive part .
可選的,該第二彈性導電部件包括石墨或者軟質合金。Optionally, the second elastic conductive component includes graphite or a soft alloy.
可選的,該第三彈性導電部件為環體、平面螺旋體或者柱狀螺旋體。Optionally, the third elastic conductive member is a ring body, a plane spiral body or a cylindrical spiral body.
可選的,該第三彈性導電部件包括軟質合金。Optionally, the third elastic conductive component includes a soft alloy.
可選的,該功率饋入機構還包括導電液體容器,該導電固定件和該導電旋轉件各自的一部分浸入該導電液體容器的導電溶液中,以使該導電固定件與該導電旋轉件通過該導電溶液電導通。Optionally, the power feeding mechanism further includes a conductive liquid container, and a part of each of the conductive fixing member and the conductive rotating member is immersed in the conductive solution of the conductive liquid container, so that the conductive fixing member and the conductive rotating member can pass through the conductive liquid container. The conductive solution conducts electricity.
可選的,該導電液體容器與該導電固定件或者該導電旋轉件連接。Optionally, the conductive liquid container is connected to the conductive fixing part or the conductive rotating part.
可選的,該功率饋入機構還包括導電液體容器,該導電固定件和該導電旋轉件各自的一部分浸入該導電液體容器的導電液體中,以使該導電固定件與該導電旋轉件通過該導電液體電導通。Optionally, the power feeding mechanism further includes a conductive liquid container, and a part of each of the conductive fixing member and the conductive rotating member is immersed in the conductive liquid of the conductive liquid container, so that the conductive fixing member and the conductive rotating member pass through the conductive liquid container. The conductive liquid conducts electricity.
可選的,該旋轉部件包括基座、靶材或者線圈。Optionally, the rotating component includes a base, a target, or a coil.
作為另一個技術方案,本發明還提供一種旋轉基座裝置,包括可旋轉的基座、偏壓功率源和功率饋入機構,該功率饋入機構用於將該偏壓功率源的輸出功率饋入該基座,該功率饋入機構採用本發明提供的上述功率饋入機構。As another technical solution, the present invention also provides a rotating base device, which includes a rotatable base, a bias power source, and a power feeding mechanism for feeding the output power of the bias power source. Into the base, the power feeding mechanism adopts the above-mentioned power feeding mechanism provided by the present invention.
可選的,還包括: 旋轉軸,其垂直設置,且該旋轉軸的上端與該基座連接,該旋轉軸的下端與該功率饋入機構連接; 旋轉驅動機構,其與位於該旋轉軸的上端和下端之間的中間位置連接,用於驅動該旋轉軸旋轉。Optionally, it further includes: a rotating shaft, which is arranged vertically, and the upper end of the rotating shaft is connected with the base, and the lower end of the rotating shaft is connected with the power feeding mechanism; The middle position between the upper end and the lower end is connected for driving the rotating shaft to rotate.
作為另一個技術方案,本發明還提供一種半導體加工設備,包括反應腔室,在該反應腔室中設置有本發明提供的上述旋轉基座裝置。As another technical solution, the present invention also provides a semiconductor processing equipment, including a reaction chamber, in which the above-mentioned rotating base device provided by the present invention is provided.
本發明具有以下有益效果: 本發明提供的功率饋入機構、旋轉基座裝置及半導體加工設備的技術方案中,導電連接結構滿足:分別與導電固定件與導電旋轉件電接觸,且不影響導電旋轉件的旋轉運動,從而實現向旋轉中的旋轉部件傳輸功率。同時,由於導電連接結構分別與導電固定件與導電旋轉件電接觸,這與先前技術中採用電感耦合方式傳輸功率的方式相比,功率傳輸效率更高,而且可以避免先前技術中存在的打火風險。The present invention has the following beneficial effects: In the technical solutions of the power feeding mechanism, the rotating base device and the semiconductor processing equipment provided by the present invention, the conductive connection structure satisfies: electrical contact with the conductive fixed part and the conductive rotating part, and does not affect the conductivity The rotating movement of the rotating part realizes the transmission of power to the rotating rotating part. At the same time, since the conductive connection structure is in electrical contact with the conductive fixed part and the conductive rotating part, compared with the inductive coupling method used in the prior art to transmit power, the power transmission efficiency is higher and the sparking in the prior art can be avoided. risk.
為使本領域的技術人員更好地理解本發明的技術方案,下面結合附圖來對本發明提供的功率饋入機構、旋轉基座裝置及半導體加工設備進行詳細描述。In order to enable those skilled in the art to better understand the technical solutions of the present invention, the power feeding mechanism, the rotating base device and the semiconductor processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.
本發明提供的功率饋入機構,用於將功率源的輸出功率饋入旋轉部件。該旋轉部件可以為基座、靶材或者線圈等等。功率源通常為匹配器和電源,其中,匹配器用於在製程過程中,通過動態調節匹配電路中的可變電容,使得負載阻抗與電源的輸出阻抗相匹配,從而保證電源的輸出功率最大程度地施加到腔室內部的電漿上。電源包括射頻電源、低頻電源、中頻電源或者直流電源等等。The power feeding mechanism provided by the present invention is used to feed the output power of the power source into the rotating component. The rotating part can be a base, a target, a coil, or the like. The power source is usually a matcher and a power supply. The matcher is used to dynamically adjust the variable capacitor in the matching circuit during the manufacturing process to match the load impedance with the output impedance of the power supply, thereby ensuring that the output power of the power supply is maximized. Applied to the plasma inside the chamber. The power supply includes radio frequency power supply, low frequency power supply, intermediate frequency power supply or DC power supply and so on.
具體地,功率饋入機構包括:導電固定件、導電旋轉件和導電連接結構,其中,導電固定件與功率源電連接;導電旋轉件與旋轉部件電連接,且同該旋轉部件同步旋轉;導電連接結構分別與導電固定件與導電旋轉件電接觸,且不影響導電旋轉件的旋轉運動。這樣,可以實現將功率源的輸出功率饋入旋轉中的旋轉部件。同時,由於導電連接結構分別與導電固定件與導電旋轉件電接觸,這與先前技術中採用電感耦合方式傳輸功率的方式相比,功率傳輸效率更高,而且可以避免先前技術中存在的打火風險。Specifically, the power feeding mechanism includes: a conductive fixing part, a conductive rotating part, and a conductive connecting structure, wherein the conductive fixing part is electrically connected to the power source; the conductive rotating part is electrically connected to the rotating part, and rotates synchronously with the rotating part; The connection structure is respectively in electrical contact with the conductive fixing part and the conductive rotating part, and does not affect the rotational movement of the conductive rotating part. In this way, the output power of the power source can be fed into the rotating rotating part. At the same time, since the conductive connection structure is in electrical contact with the conductive fixed part and the conductive rotating part, compared with the inductive coupling method used in the prior art to transmit power, the power transmission efficiency is higher and the sparking in the prior art can be avoided. risk.
下面對導電連接結構的具體實施方式進行詳細描述。具體地,請參閱第1圖,在本發明第一實施例提供的功率饋入機構中,導電旋轉件2與導電固定件1相對,且間隔設置。導電連接結構設置在導電旋轉件2與導電固定件1之間的間隔中,從而將導電旋轉件2與導電固定件1的電導通,以實現功率傳輸。The specific implementation of the conductive connection structure will be described in detail below. Specifically, referring to Fig. 1, in the power feeding mechanism provided by the first embodiment of the present invention, the conductive rotating
在本實施例中,導電旋轉件2包括第一表面21,導電固定件1包括第二表面11,該第一表面21與第二表面11相對,且間隔設置,較佳的,導電旋轉件2與導電固定件1之間的間隔的垂直長度大於或等於1mm,即,第一表面21與第二表面11之間設置有間距D,且D大於或等於1mm。這樣,可以保證導電旋轉件2的旋轉運動不受影響。導電固定件1和導電旋轉件2較佳採用諸如紫銅等的導電性能良好的材料製作。In this embodiment, the conductive rotating
在本實施例中,導電旋轉件2與導電固定件1的兩個相對面(第一表面21和第二表面11)相互平行或者相互嵌套,這樣可以提高結構的穩定性。在本實施例中,在第一表面21上設置有凹部211,且對應地在第二表面11上設置有凸部111;並且,凸部111位於凹部211內,從而導電旋轉件2和導電固定件1形成相互嵌套的結構。當然,在實際應用中,也可以在第一表面21上設置有凸部,且對應地在第二表面11上設置有凹部。In this embodiment, the two opposite surfaces (the
在本實施例中,導電連接結構包括第一彈性導電部件3,由於其具有彈性,第一彈性導電部件3能夠在導電旋轉件2旋轉的過程中,始終保持與導電旋轉件2電接觸,從而確保功率的正常傳輸,同時第一彈性導電部件3不會影響導電旋轉件的旋轉運動。第一彈性導電部件3可以採用軟質材料製作,例如諸如鋁合金、不銹鋼合金等的軟質合金。In this embodiment, the conductive connection structure includes the first elastic
需要說明的是,在本實施例中,第一彈性導電部件3位於凹部211的底面和凸部111的頂面之間,但是本發明並不局限於此,在實際應用中,如第2圖所示,第一彈性導電部件3還可以位於凹部211的內周面和凸部111的外周面之間。It should be noted that in this embodiment, the first elastic
還需要說明的是,在本實施例中,導電旋轉件2和導電固定件1借助凹部211和凸部111形成相互嵌套的結構,但是本發明並不局限於此,在實際應用中,如第3圖所示,第一表面21’和第二表面11’還可以均為平面;第一彈性導電部件3設置在第一表面21’和第二表面11’之間。It should also be noted that in this embodiment, the conductive rotating
在本實施例中,第一彈性導電部件3為環體。當然,在實際應用中,第一彈性導電部件3也可以為諸如平面螺旋體(類似盤香型的螺旋體)或者柱狀螺旋體等的其他任意結構。In this embodiment, the first elastic
在本實施例中,在第一表面21上設置有安裝槽22,第一彈性導電部件3的一部分設置在安裝槽22中,以實現對第一彈性導電部件3的安裝。容易理解,第一彈性導電部件3具有位於安裝槽22之外的部分,以保證能夠與導電固定件1的第二表面11電接觸。當然, 實際應用中,也可以在第二表面11上設置安裝槽,或者還可以對應地分別在第一表面21和第二表面11上設置安裝槽。In this embodiment, a mounting
需要說明的是,在本實施例中,第一彈性導電部件3為一個,但是本發明並不局限於此,在實際應用中,環形的第一彈性導電部件3也可以為多個,且相互嵌套。當然,對於其他結構的第一彈性導電部件3,還可以採用其他任意排布方式。It should be noted that, in this embodiment, there is one first elastic
本發明第二實施例提供的功率饋入機構,其與上述第一實施例提供的功率饋入機構相比,同樣包括導電固定件、導電旋轉件和導電連接結構,區別在於導電連接結構的結構不同。下面僅對本實施例與上述第一實施例之間的不同點進行描述。Compared with the power feeding mechanism provided in the first embodiment, the power feeding mechanism provided in the second embodiment of the present invention also includes a conductive fixing member, a conductive rotating member, and a conductive connection structure. The difference lies in the structure of the conductive connection structure different. Only the differences between this embodiment and the above-mentioned first embodiment will be described below.
具體地,請參閱第4圖,導電連接結構包括:彈簧7、第二彈性導電部件4和第三彈性導電部件5,其中,彈簧7的第一端(第4圖中彈簧7的下端)與導電固定件1連接。彈簧7的第二端(第4圖中彈簧7的上端)與第二彈性導電部件4連接。第三彈性導電部件5設置在第二彈性導電部件4上,且在彈簧7的彈力作用下,與導電旋轉件2保持電接觸。Specifically, referring to Figure 4, the conductive connection structure includes: a
並且,第二彈性導電部件4的硬度低於第三彈性導電部件5的硬度。在實際使用的過程中,導電旋轉件2會帶動第三彈性導電部件5隨之一起旋轉,導致第三彈性導電部件5與第二彈性導電部件4之間產生相對運動。由於第二彈性導電部件4的硬度低於第三彈性導電部件5的硬度,這使得質地更軟的第二彈性導電部件4更容易被第三彈性導電部件5磨損,從而減少了第三彈性導電部件5的損耗,提高了第三彈性導電部件5的壽命。In addition, the hardness of the second elastic
同時,即使第二彈性導電部件4因磨損而變薄,在彈簧7的彈力作用下,也仍然能夠保持第三彈性導電部件5與導電旋轉件2電接觸良好,從而保證功率的穩定傳輸。At the same time, even if the second elastic
在實際應用中,在滿足第二彈性導電部件4的硬度低於第三彈性導電部件5的硬度的前提下,第二彈性導電部件4可以採用諸如石墨或者軟質合金等的軟質材料製作。第三彈性導電部件5可以採用諸如軟質合金等的軟質材料製作。其中,石墨在運行過程中產生的石墨粉還可以對第三彈性導電部件5起到潤滑作用,從而可以進一步減少第三彈性導電部件5的損耗。In practical applications, provided that the hardness of the second elastic
與上述第一實施例中的第一彈性導電部件3相類似的,第三彈性導電部件5可以包括環體、平面螺旋體或者柱狀螺旋體等等。Similar to the first elastic
可選的,上述彈簧7可以為柱狀螺旋彈簧等彈性件。Optionally, the above-mentioned
在本實施例中,在導電旋轉件2上設置有凹部23,第二彈性導電部件4的至少一部分位於凹部23中,從而可以使導電旋轉件2與第二彈性導電部件4相互嵌套,進而提高了結構穩定性。In this embodiment, a
可選的,導電連接結構還包括固定座6,該固定座6與彈簧7連接;並且,在固定座6上設置有安裝槽,第二彈性導電部件4可拆卸的固定在安裝槽中。這樣,在第二彈性導電部件4磨損到一定程度之後,可以通過下壓固定座6,使第二彈性導電部件4與導電旋轉件2分離,然後將第二彈性導電部件4自安裝槽中取出,並更換新的第二彈性導電部件4,這相比於更換第三彈性導電部件5更容易,從而可以提高工作效率。Optionally, the conductive connection structure further includes a fixing seat 6 connected to the
本發明第三實施例提供的功率饋入機構,其與上述第二實施例提供的功率饋入機構相比,同樣包括導電固定件、導電旋轉件和導電連接結構,除了導電連接結構的結構不同。下面僅對本實施例與上述第二實施例之間的不同點進行描述。Compared with the power feeding mechanism provided in the second embodiment, the power feeding mechanism provided by the third embodiment of the present invention also includes a conductive fixing member, a conductive rotating member, and a conductive connection structure, except that the structure of the conductive connection structure is different . Only the differences between this embodiment and the above-mentioned second embodiment will be described below.
具體地,請參閱第5圖,導電連接結構包括:第二彈性導電部件4’和第三彈性導電部件5’,其中,第二彈性導電部件4’與導電固定件1連接,且為環體,該環體環繞在導電旋轉件2的周圍。第三彈性導電部件5’與導電旋轉件2連接,且位於環體的內周面與導電旋轉件2的外周面之間,並且分別與二者電接觸。並且,第二彈性導電部件4’的硬度低於第三彈性導電部件5’的硬度。Specifically, referring to Figure 5, the conductive connection structure includes: a second elastic conductive member 4'and a third elastic conductive member 5', wherein the second elastic conductive member 4'is connected to the conductive fixing
第三彈性導電部件5’隨導電旋轉件2同步旋轉。在此過程中,第三彈性導電部件5’與第二彈性導電部件4’之間產生相對運動。由於第二彈性導電部件4’的硬度低於第三彈性導電部件5’的硬度,這使得質地更軟的第二彈性導電部件4’更容易被第三彈性導電部件5’磨損,從而減少了第三彈性導電部件5’的損耗,提高了第三彈性導電部件5’的壽命。The third elastic conductive member 5'rotates synchronously with the conductive rotating
本發明第四實施例提供的功率饋入機構,其是在上述第各個實施例提供的功率饋入機構的基礎上所做的改進。The power feeding mechanism provided in the fourth embodiment of the present invention is an improvement made on the basis of the power feeding mechanism provided in the above-mentioned respective embodiments.
具體地,請參閱第6圖,導電連接結構包括導電液體容器8,導電容器8內盛放有導電液體9,導電固定件1和導電旋轉件2各自的一部分浸入導電液體容器8的導電溶液9中,以使導電固定件1和導電旋轉件2通過導電液體電導通。由於導電液體具有良好的導電性能,而且在長時間的使用過程中既不會沉降和凝聚,又能夠保持穩定的導電性能。導電液體可以為水銀、導電碳基類溶劑、導電離子溶液或者其他任意的可導電液體。Specifically, referring to Figure 6, the conductive connection structure includes a conductive liquid container 8 in which a conductive liquid 9 is contained, and a part of each of the conductive fixing
在實際應用中,導電液體容器8可以與導電固定件1連接,此時導電液體容器8相對於旋轉中的導電旋轉件2固定不動;或者,導電液體容器8也可以與導電旋轉件2連接,此時導電液體容器8隨導電旋轉件2同步旋轉。In practical applications, the conductive liquid container 8 can be connected to the conductive fixing
在本實施例中,導電液體容器8與上述第一至第三實施例中的導電連接結構結合使用。以第一實施例為例,如第1圖所示,在第一表面21和第二表面11之間設置第一彈性導電部件3的同時,可以設置上述導電液體容器8,以使第一表面21和第二表面11之間充滿導電溶液。In this embodiment, the conductive liquid container 8 is used in combination with the conductive connection structures in the first to third embodiments described above. Taking the first embodiment as an example, as shown in Figure 1, while the first elastic
但是,本發明並不局限於此,在實際應用中,導電連接結構也可以僅為導電液體容器8,即,單獨使用導電液體容器8將導電固定件1和導電旋轉件2電導通。例如,將第一實施例中的第一彈性導電部件3替換為導電液體容器8。可選的,導電固定件1和導電旋轉件2採用上述第一實施例採用的相互嵌套的結構,以使導電液體9能夠充滿導電固定件1和導電旋轉件2之間的間隔中,從而可以使導電溶液9均勻地分佈在導電固定件1和導電旋轉件2之間。However, the present invention is not limited to this. In practical applications, the conductive connection structure can also be only the conductive liquid container 8, that is, the conductive liquid container 8 is used alone to electrically conduct the conductive fixing
綜上所述,本發明上述各個實施例提供的功率饋入機構,可以分別與導電固定件與導電旋轉件電接觸,且不影響導電旋轉件的旋轉運動,從而實現向旋轉中的旋轉部件傳輸功率。同時,由於導電連接結構分別與導電固定件與導電旋轉件電接觸,這與先前技術中採用電感耦合方式傳輸功率的方式相比,功率傳輸效率更高,而且可以避免先前技術中存在的打火風險。In summary, the power feeding mechanism provided by the above-mentioned embodiments of the present invention can be in electrical contact with the conductive fixed part and the conductive rotating part, and does not affect the rotational movement of the conductive rotating part, thereby realizing transmission to the rotating rotating part. power. At the same time, since the conductive connection structure is in electrical contact with the conductive fixed part and the conductive rotating part, compared with the inductive coupling method used in the prior art to transmit power, the power transmission efficiency is higher and the sparking in the prior art can be avoided. risk.
作為另一個技術方案,請參閱第7圖,本發明第五實施例提供的旋轉基座裝置,其包括可旋轉的基座101、靶材102、上射頻電源103、偏壓功率源和功率饋入機構105,其中,基座101設置在反應腔室100中,其即為上述實施例中的旋轉部件。靶材102設置在基座101的上方,其與上射頻電源103電連接。偏壓功率源包括匹配器106和電源107,其中,匹配器106用於在製程過程中,通過動態調節匹配電路中的可變電容,使得負載阻抗與電源107的輸出阻抗相匹配,從而保證電源107的輸出功率最大程度地施加到腔室內部的電漿上。電源107包括射頻電源、低頻電源、中頻電源或者直流電源等等。As another technical solution, please refer to Figure 7. The rotating base device provided by the fifth embodiment of the present invention includes a
功率饋入機構105用於將偏壓功率源的輸出功率饋入基座101,該功率饋入機構105採用本發明上述各個實施例提供的功率饋入機構。The
在本實施例中,旋轉基座裝置還包括:旋轉軸104和旋轉驅動機構108,其中,旋轉軸104垂直設置,且旋轉軸104的上端與基座101連接,旋轉軸104的下端與功率饋入機構105連接,這裡,旋轉軸104用作上述導電旋轉件與基座101電連接,旋轉軸104的下部與上述導電固定件相對,且間隔設置。上述導電連接結構設置在旋轉軸104與導電固定件之間的間隔中,從而將旋轉軸104與導電固定件的電導通,以實現功率傳輸。旋轉驅動機構108與位於旋轉軸104的上端和下端之間的中間位置連接,用於驅動旋轉軸104旋轉。 上述旋轉驅動機構108可以包括電機和傳動機構,電機通過傳動結構與旋轉軸104連接。傳動機構例如為皮帶傳動機構,齒輪傳動機構等等。需要說明的是,旋轉驅動機構108承受旋轉軸104及其上的基座101的重量。In this embodiment, the rotating base device further includes: a rotating
本發明實施例提供的旋轉基座裝置,其通過採用本發明上述各個實施例提供的功率饋入機構,不僅可以提高功率傳輸效率,而且可以避免先前技術中存在的打火風險。The rotating base device provided by the embodiments of the present invention can not only improve the power transmission efficiency, but also avoid the risk of ignition in the prior art by using the power feeding mechanism provided in the above-mentioned embodiments of the present invention.
作為另一個技術方案,請參閱第7圖,本發明實施例還提供一種半導體加工設備,其包括反應腔室100,且在該反應腔室100中設置有本發明上述各個實施例提供的旋轉基座裝置。As another technical solution, please refer to FIG. 7. An embodiment of the present invention also provides a semiconductor processing equipment, which includes a
本發明實施例提供的半導體加工設備,其通過採用本發明實施例提供的上述旋轉基座裝置,不僅可以提高功率傳輸效率,而且可以避免先前技術中存在的打火風險。The semiconductor processing equipment provided by the embodiment of the present invention can not only improve the power transmission efficiency, but also avoid the risk of ignition in the prior art by using the above-mentioned rotating base device provided by the embodiment of the present invention.
可以理解的是,以上實施方式僅僅是為了說明本發明的原理而採用的示例性實施方式,然而本發明並不局限於此。對於本領域內的普通技術人員而言,在不脫離本發明的精神和實質的情況下,可以做出各種變型和改進,這些變型和改進也視為本發明的保護範圍。It can be understood that the above implementations are merely exemplary implementations used to illustrate the principle of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also deemed to be within the protection scope of the present invention.
D‧‧‧間距1‧‧‧導電固定件2‧‧‧導電旋轉件3‧‧‧第一彈性導電部件4、4’‧‧‧第二彈性導電部件5、5’‧‧‧第三彈性導電部件6‧‧‧固定座 7‧‧‧彈簧8‧‧‧導電液體容器9‧‧‧導電液體11、11’‧‧‧第二表面21、21’‧‧‧第一表面22‧‧‧安裝槽100‧‧‧反應腔室101‧‧‧基座102‧‧‧靶材103‧‧‧上射頻電源105‧‧‧偏壓功率源和功率饋入機構106‧‧‧匹配器107‧‧‧電源108‧‧‧旋轉驅動機構111‧‧‧凸部211‧‧‧凹部D‧‧‧
第1圖為本發明第一實施例提供的功率饋入機構的一種結構圖; 第2圖為本發明第一實施例提供的功率饋入機構的另一種結構圖; 第3圖為本發明第一實施例提供的功率饋入機構的又一種結構圖; 第4圖為本發明第二實施例提供的功率饋入機構的結構圖; 第5圖為本發明第三實施例提供的功率饋入機構的結構圖; 第6圖為本發明第四實施例提供的功率饋入機構的結構圖; 第7圖為本發明第五實施例提供的半導體加工設備的結構圖。Figure 1 is a structural diagram of the power feeding mechanism provided by the first embodiment of the present invention; Figure 2 is another structural diagram of the power feeding mechanism provided by the first embodiment of the present invention; Figure 3 is a structural diagram of the power feeding mechanism provided by the first embodiment of the present invention Another structural diagram of a power feeding mechanism provided by an embodiment; Figure 4 is a structural diagram of a power feeding mechanism provided by a second embodiment of the present invention; Figure 5 is a power feeding provided by a third embodiment of the present invention Structural diagram of the mechanism; Figure 6 is a structural diagram of a power feeding mechanism provided by a fourth embodiment of the present invention; Figure 7 is a structural diagram of a semiconductor processing equipment provided by a fifth embodiment of the present invention.
D‧‧‧間距 D‧‧‧Pitch
1‧‧‧導電固定件 1‧‧‧Conductive fixing parts
2‧‧‧導電旋轉件 2‧‧‧Conductive rotating parts
3‧‧‧第一彈性導電部件 3‧‧‧The first elastic conductive part
11‧‧‧第二表面 11‧‧‧Second Surface
21‧‧‧第一表面 21‧‧‧First surface
22‧‧‧安裝槽 22‧‧‧Mounting slot
111‧‧‧凸部 111‧‧‧Protrusion
211‧‧‧凹部 211‧‧‧Concave
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CN110277298A (en) * | 2019-07-26 | 2019-09-24 | 江苏鲁汶仪器有限公司 | A kind of radio frequency rotary joint and the ion etching system for being provided with radio frequency rotary joint |
CN112323036B (en) * | 2020-11-03 | 2022-10-21 | 北京北方华创微电子装备有限公司 | Power feed-in mechanism, rotating base device and semiconductor processing equipment |
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