JP2011168844A - Sputtering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sputtering apparatus in which insertion of a generated foreign matter between contact surfaces of a feeding terminal and a connection terminal can be reduced even if the feeding terminal repeats touch to and separation from the connection terminal and as a result, temperature increase due to increase in contact resistance can be avoided. <P>SOLUTION: In the connection terminal of the sputtering apparatus, a recessed part having a prescribed tapered angle in its depth direction is formed and the bottom part of the recessed part has such a space that the tip part of the feeding terminal can not come in contact with the bottom part when the feeding terminal 22 advances to the recessed part and electrically connected. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a sputtering apparatus that can stably supply power to a target.

  Currently, sputtering is performed with a target (or cathode) disposed at a predetermined angle with respect to a substrate on which a film is formed. Thus, it is known that the film quality of the film formed on the substrate can be improved. An example of such a film forming apparatus is Japanese Patent Application Laid-Open No. 2003-147519 (Patent Document 1).

  In addition, for example, in a sputtering apparatus that forms a film on a substrate such as a large glass exceeding 1 m, a plurality of targets may be opposed to the substrate. In this case, in order to adjust the film thickness distribution, a technique of adjusting each target to a predetermined angle with respect to the substrate is becoming important.

FIG. 2 is a top view (a plan view seen from the direction along the rotation axis) of a sputtering apparatus in which a target (or cathode) can be arranged at a predetermined angle with respect to a substrate on which a film is formed as an example. .
In the sputtering apparatus shown in FIG. 2, four rotating members 20 a, 20 b, 20 c, and 20 d are arranged in the chamber 11. The four rotating members 20a, 20b, 20c, and 20d are arranged side by side. One of the cathodes provided in each of the rotating members 20 a, 20 b, 20 c, and 20 d can face the base holder 13.
In FIG. 2, there are four rotating members, but any number of rotating members may be used.

FIG. 3 is a cross-sectional view centered on a rotating member on which a target is mounted in the sputtering apparatus shown in FIG.
The sputtering apparatus shown in FIG. 3 includes a chamber 11, a rotatable rotating member 20, and a substrate holder 13 that holds a substrate (not shown).
The rotating member 20 has, for example, a substantially regular triangular prism shape, and the central axis of the triangular prism is the rotational axis 10 of rotation. Each of the three side surfaces of the rotating member 20 along the rotating shaft 10 serves as a cathode. On these side surfaces, a target 12, which is a material to be sputtered, and targets 12b, 12c (not shown) (hereinafter, three targets are referred to as targets 12, etc.) are detachably attached.

  Further, in the sputtering apparatus shown in FIG. 3, a magnetron sputtering magnet 14 is arranged inside the rotating member 20. The magnet 14 is located on the back side of the target 12 attached to the side surface of the rotating member 20 and facing the substrate holder 13 (that is, the side opposite to the surface to be sputtered).

  The target 12 and the like are attached to the side surface along the rotation axis 10 of the rotating member 20. The rotating member 20 is rotated by a plurality of gears 18 and bearings 15 using the motor 19 as a power source. As a result, the target 12 and the like rotate around the rotation shaft 10 of the rotating member 20. Then, sputtering is performed in a state where any one of the targets 12 and the like attached to the rotating member 20 is opposed to a base (not shown) attached to the base holder 13.

JP 2003-147519 A

  With respect to the sputtering apparatus shown in FIG. 3, a structure for supplying power from the power supply 16 to the target 12 and the like from the rotating member 20 will be further described.

The target 12 and the like are electrically connected to three electrodes corresponding to the three targets, respectively (the target 12a is electrically connected to the electrode 26). However, the electrodes are insulated from each other by the insulator 29.
A connection terminal that is electrically connected to each electrode (the electrode 26 is electrically connected to the connection terminal 25) is exposed at the end of the rotating member 20 in the direction along the rotation axis 10.

  Of the three connection terminals, the connection terminal 25 is exposed at the end of the rotation member 20 in the direction along the rotation axis 10. Each set of connection terminals is electrically connected to a target 12 or the like attached to the rotating member 20. Different sets of connection terminals are not connected simultaneously with the power supply terminal 22. That is, the power supply terminal 22 supplies power to only one target at a time. Then, power is supplied from the power supply terminal 22 to the target via a connection terminal connected to the power supply terminal 22.

The power supply terminal 22 is configured to be able to reciprocate in the direction along the rotation axis 10 by the cylinder 21, and can be brought into contact with and separated from the end of the rotation member 20.
Specifically, the power of the cylinder 21 is transmitted to the power supply terminal fixing plate 24, so that the power supply terminal 22 can move in the direction along the rotation shaft 10.
The power supply terminal fixing plate 24 fixed to the cylinder 21 is provided with two power supply terminals 22 at positions facing each other with the rotating shaft 10 therebetween. The power supply terminal 22 is connected to the power source 16 by a high voltage line 17.

As described above, power supply to the target is performed by repeatedly contacting the power supply terminal and the connection terminal. However, in such a sputtering apparatus, there is still room for improvement in terms of stable power supply to the cathode. .
That is, there is no possibility that foreign matter generated due to wear, for example, will be caught between the contact surfaces of the two, so that there is a possibility that the contact resistance is increased and the temperature of the portion is increased.

  An object of the present invention is to provide a sputtering apparatus that solves the problems of the background art. The object is to provide a sputtering apparatus that can stably supply power to a target.

In order to solve the above problems, a sputtering apparatus according to the present invention includes a rotatable rotating member to which a target is attached, and an end of the rotating member that is electrically connected to the target and extends along the rotation axis of the rotating member. A sputtering apparatus having a connection terminal disposed on the movable terminal and a movable power supply terminal that supplies power to the target via the connection terminal,
The contact terminal is formed with a recess having a predetermined taper angle in the depth direction, and when the power supply terminal enters the recess and is electrically connected, the bottom of the recess is the tip of the power supply terminal. It has a space that cannot be touched.

  According to the present invention, the power supply terminal and the connection terminal that are in contact each time power is supplied to the target are excluded from the contact surface even if foreign matter generated due to wear occurs on the contact surface. Since the space that can be recovered is formed on the contact terminal side, instability of power supply at this point can be improved.

It is an enlarged view of the edge part of the rotating member which concerns on one Embodiment of this invention in the area | region shown with the dotted line of FIG. It is a top view of the sputtering device which concerns on one conventional embodiment. It is sectional drawing of the sputtering device which concerns on one conventional embodiment.

  Hereinafter, an embodiment of the present invention will be described with reference to FIG.

  FIG. 1 is an enlarged view of a region indicated by a dotted circle in the sputtering apparatus of FIG. In FIG. 1, elements that are substantially the same as those described in FIG. 3 are denoted by the same reference numerals.

  FIG. 1 shows the end of the rotating member 20 in the direction of the rotation axis in the sputtering apparatus of FIG. A connection terminal 25 that is electrically connected to the electrode 26 is exposed at the end of the rotating member 20. Connection terminals other than the connection terminal 25 are arranged on a circumference centering on the rotation shaft 10 of the rotation member 20. The end of the rotating member 20 where the three sets of connection terminals are arranged is, for example, arranged under atmospheric pressure separated from the chamber 11 that can be decompressed by the bearing 15 (shown in FIG. 3).

  FIG. 1 shows a state in which the power supply terminal 22 is connected to the connection terminal 25 and supplies power to the connection terminal that is in conduction with the target.

  The connection terminal 25 is formed of a conductor that conducts with the electrode 26, and has a concave shape that narrows the opening while maintaining a predetermined inclination (taper angle) in the depth direction. However, the shape of the recess is not limited to the shape of the truncated cone, and may be a groove-like recess having a depth in the circumferential direction of the rotating shaft 10 of the rotating member 20. In addition, the shape of the power supply terminal 22 is adapted to the shape of the concave portion of the connection terminal 25 for that purpose.

  Here, the connection terminal 25 is characterized in that when the power supply terminal enters and is electrically connected, the bottom of the recess has a space 50 where the tip of the power supply terminal 22 cannot contact. Yes.

  By forming such a space 50 at the bottom of the connection terminal 25, the power supply terminal 22 and the connection terminal 25 are connected, and even if one of them wears out and the foreign material 40 is generated, the foreign material 40 is connected to the connection terminal 25. It is eliminated by dropping into the space 50 due to the inclination of the terminal 25 and the action of gravity, and it is difficult to stay on the connection surface between the power supply terminal 22 and the connection terminal 25 and is easily removed.

  Therefore, in order to change the target, even if the power supply terminal repeatedly contacts and separates from each connection terminal, it is possible to reduce the occurrence of foreign matter generated on the contact surface between the power supply terminal and the connection terminal. As a result, an increase in temperature due to an increase in contact resistance can be avoided.

  As described above, the preferred embodiment of the present invention has been presented and described in detail, but the present invention is not limited to the above-described embodiment, for example, the number of targets arranged on the rotating member, for example, unless departing from the gist. It should be understood that various changes and modifications are possible.

DESCRIPTION OF SYMBOLS 10 Rotating shaft 12 Target 16 Power supply 17 High voltage line 20 Rotating member 22 Feeding terminal 25 Connection terminal 26 Electrode 29 Insulator 40 Foreign object 50 Space

Claims (1)

A rotatable rotating member to which a target is attached; a connection terminal electrically connected to the target; and disposed at an end of the rotating member in a direction along a rotation axis of the rotating member; via the connection terminal And a movable power supply terminal for supplying power to the target, wherein the connection terminal is formed with a recess having a predetermined taper angle in the depth direction, and the power supply terminal is the recess. A sputtering apparatus characterized by having a space where the tip of the power supply terminal cannot come into contact at the bottom of the recess when entering and electrically connecting.