JP2008202145A - Substrate supporting/rotating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate supporting/rotating device which receives a substrate without moving a carried substrate holder, and can rotate the substrate on that spot, and to provide a substrate supporting mechanism. <P>SOLUTION: The substrate supporting/rotating mechanism includes: a hollow columnar member; a central axis fitted to the hollow part so as to be energized to either of the axial directions by a first spring, and in which a taper part is formed at one end part; and radial direction moving members as a plurality of moving members provided at one end face of the columnar member and moving to the radial direction, provided with a claw supporting the inner circumferential edge face of a substrate at the outer circumferential side, and energized to the central axis direction by a second spring, wherein the movement in the axial direction of the central axis is transformed into the movement in the radial direction of the radial direction moving members, so as to perform the support and release of the substrate. Furthermore, a mechanism of allowing the substrate supporting mechanism to move to the axial direction and to rotate, and a mechanism of allowing the central axis to move to the axial direction are provided. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate support mechanism and a substrate support rotation device having an opening at the center, and more particularly to a substrate support mechanism and a substrate support rotation device that are preferably used in a vacuum processing apparatus that performs processing such as thin film formation on a substrate.

  Some recording media represented by magnetic disks and optical discs have been remarkably increasing in recent years, but development of high-performance recording media for the purpose of further increasing recording density and reliability and examination of mass production It is also actively performed.

  The magnetic disk generally has a laminated structure comprising a base film such as Cr, a multi-element magnetic recording film such as CoCrTa, and a protective film such as a carbon film on an aluminum or glass disk-shaped substrate having an opening. It has been. In such a laminated magnetic disk, a substrate holder that supports the outer peripheral end surface of the substrate with claws or the like is sequentially transferred to a heating chamber, a Cr sputtering chamber, a magnetic recording film sputtering chamber, and a plasma CVD chamber to form each film. It is produced by forming each thin film in a chamber.

  In each film formation chamber, a substrate holder is installed at a position facing the target or the discharge electrode, and film formation is performed with the substrate stationary. For the formation of the multi-element magnetic recording film, an alloy target having a predetermined composition ratio is used, and a bias is applied to the substrate during sputtering for the purpose of obtaining a thin film with high magnetic properties. Bias application is also essential in the case of a diamond-like carbon film used as a protective film.

  As described above, in order to produce a magnetic disk with better recording density and reliability, the magnetic characteristics of the magnetic recording film are further improved, and the film thickness and composition uniformity within the disk surface are increased. Although it is necessary to improve the in-plane uniformity such as holding force, it is difficult to further improve the film thickness and the composition uniformity with the above-described conventional sputtering apparatus. For example, as a method of improving the film thickness uniformity, a method of adjusting the arrangement and shape of magnets arranged on the back surface of the target and optimizing the target surface magnetic field is used. However, this method has a problem that although the film thickness uniformity is improved, it takes time and cost.

  In addition, in order to obtain a high-performance magnetic recording film, it is necessary to study the composition ratios of various materials and constituent elements, but it is practically not easy to perform these with a conventional sputtering apparatus. For example, depending on the composition, alloying of the target may be difficult, and even if alloying is possible, targets of various materials and compositions are prepared for each sputtering apparatus and used to form a target. Since it is necessary to go through a procedure of optimizing the film conditions and determining a target that obtains desired characteristics, the time and cost required for this process become enormous. In addition, a magnetic recording film or the like that suppresses the long-term decrease rate of the coercive force by changing the composition ratio in the film thickness direction has been proposed, but changing the film composition in the thickness direction This is not possible with the device configuration.

  Therefore, a plurality of disk substrates are mounted on the same diameter of a disk-shaped large substrate holder, the target is also arranged on the same diameter on the sputtering apparatus side, and the substrate holder is rotated so that each substrate revolves and passes over the target. Thus, a method of forming a film has been studied. The apparatus of this configuration can use a target of a single constituent element, and has an advantage that thin films having various compositions can be obtained by adjusting the RF power supplied to each target. Therefore, there is a problem that the substrate holder must be rotated at an extremely high rotational speed in order to obtain a homogeneous film. Furthermore, when a series of film formation of a Cr underlayer film, a magnetic recording film, and a protective film is continuously performed, each film forming apparatus needs to have a structure capable of rotating a large substrate holder as long as the same substrate holder is used. As a whole, the hard disk manufacturing system becomes very large and expensive. In addition, the substrate holder needs to be periodically blasted to remove the attached film, so that it is desirable to have a simple structure and an inexpensive one, but such a structure is complicated and an expensive substrate holder. End up.

  In addition, as described above, bias application is indispensable when forming a magnetic recording film or carbon film. However, in the case of a glass substrate, the contact resistance between the nail that holds the substrate and the glass substrate is large, even if a Cr film is formed. However, since the claw and the Cr film are often electrically separated, a uniform bias is not applied to the film formation surface when forming the magnetic recording film and the carbon film, and the high-performance film is stable with good reproducibility. There was a problem that could not be obtained.

  The inventor examined the structures of the film forming apparatus and the substrate holder in order to solve the above problems of the prior art. For example, in the case of a sputtering apparatus for forming a magnetic recording film, as shown in FIG. Constituent element targets 55, 55 ′, 55 ″ are arranged around the substrate 100, and in some cases, a distribution correction plate for further improving the radial film thickness distribution is arranged between the target and the substrate to rotate the substrate. It was found that a magnetic recording film having a uniform film thickness and magnetic characteristics within the disk surface can be obtained by forming the film, and magnetic thin films having various composition ratios can be obtained. It was found that a film having a composition whose composition is changed in the direction can be easily obtained.To perform such film formation, a substrate is received from a substrate holder transported to a film formation chamber, and a target as shown in FIG. Facing A substrate support rotating device capable of rotating the substrate is indispensable, and in order to prevent an increase in the size of the film forming apparatus, the space for moving the substrate from the substrate holder to the substrate support rotating device needs to be as small as possible. Therefore, a mechanism for transferring the substrate without moving the substrate holder is required, and further, a support rotation device that enables double-sided film formation is required to increase productivity.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate support rotating device that can receive a disk substrate and rotate the substrate in that state without moving the substrate holder that has been transported. In addition, in the formation of a series of laminated films including the formation of a metal film, it is possible to apply a bias uniformly to the entire thin film formation surface, and further, the film thickness without interfering with simultaneous film formation on both surfaces of the substrate. It is an object of the present invention to provide a compact substrate support rotating device capable of forming a highly uniform thin film. Still another object of the present invention is to provide a compact substrate support mechanism capable of supporting a substrate firmly and safely in realizing such a substrate support rotating device.

  The substrate support mechanism of the present invention is a substrate support mechanism for supporting an inner peripheral end surface of a disk-shaped substrate having an opening at the center, and a hollow columnar member and a hollow portion of the columnar member are pivoted by a first spring. A shaft that is urged and attached to one side of the direction, and has a central axis in which a tapered portion whose diameter increases toward the tip end is formed at one end thereof, and one end surface on the one end side of the columnar member A plurality of moving members that move in the radial direction, provided on the outer peripheral side thereof with a claw that supports the inner peripheral end surface of the substrate, and are urged in the direction of the central axis by a second spring. The substrate is supported and released by converting the axial movement of the central axis into the radial movement of the radial movement member. As described above, since the substrate is supported by pressing the inner peripheral end surface of the substrate outward by a spring having a desired strength, the substrate can be reliably supported, and the substrate can be rotated even when the substrate is rotated. Will not shake or shift. In addition, since the axial movement of the central axis is converted into the radial direction to support and release the substrate, the entire substrate support mechanism can be reduced in size.

  The substrate support rotation device of the present invention is a substrate support rotation device that receives and rotates a substrate from a substrate holder that supports an outer peripheral end surface of a disc-shaped substrate having an opening at the center with a claw in a processing chamber in which air is prevented from being mixed. A hollow cylindrical member, and a shaft attached to the hollow portion of the cylindrical member by being biased in one of the axial directions by a first spring, with one end portion having a diameter closer to the tip side. A plurality of moving members that are provided on a central axis on which an increasing taper portion is formed and one end surface on the one end portion side of the columnar member and that moves in the radial direction; A radial movement member provided with a claw for supporting the end face and biased in the direction of the central axis by a second spring, wherein the axial movement of the central axis is changed to the radial movement of the radial movement member Substrate support that converts and supports and releases the substrate A mechanism for moving the structure part and the cylindrical member in the axial direction, and a mechanism for causing the plurality of radial movement members to enter the openings of the substrate until the claws are at least substantially the same as the position of the substrate. And a mechanism for moving the central axis in the axial direction, and a mechanism for rotating the cylindrical member while the claw supports the substrate.

  With this configuration, the substrate holder itself is stationary and only the substrate is rotated, so that the structure of the rotating device is simple and small. Also, since the substrate support is inserted into the opening of the substrate, the substrate is delivered at a position supported by the substrate holder, and the substrate is rotated at that position, there is no need to consider the space necessary for substrate delivery. There is no interference with processing equipment components such as holders and shields. As a result, downsizing of the processing apparatus can also be achieved. Furthermore, for example, it is possible to cope with double-sided simultaneous sputtering in which targets are arranged on the front and back sides of the substrate.

  Further, the other end surface of the columnar member is connected to one end surface of the second hollow columnar member, and is disposed in an opening provided in the wall of the processing chamber, and is disposed on the outer peripheral surface of the second columnar member. A rotary seal is provided, the rotary seal and the wall are connected by a first bellows, and a driving shaft for moving the central axis in the axial direction protrudes from the other end surface of the second cylindrical member in the hollow portion. The other end surface of the second cylindrical member and the projecting end surface of the drive shaft are connected by a second bellows. With such a configuration, even in a high vacuum processing apparatus or the like, the substrate can be supported and rotated while the internal airtightness is reliably maintained, and various high-performance thin films can be manufactured.

  In addition, an insulator is provided between the second hollow columnar member, a mechanism for moving the substrate support mechanism portion in the axial direction, a mechanism for rotating the substrate support mechanism, and the rotary seal, and the second hollow columnar member is Thus, it is preferable that a bias can be applied to the substrate during rotation. As described above, when the substrate is carried into the processing chamber, the conductive film is formed in the previous step in order to resupport the inner peripheral end surface of the substrate. Conductivity is ensured, a uniform bias can be applied to the entire thin film formation surface of the substrate, and a higher performance thin film can be stably produced.

  According to the present invention, it is possible to realize a substrate support mechanism that reliably supports a substrate and does not shake or shift even when the substrate is rotated, and can be downsized. In addition, as a result of the structure in which the substrate holder itself is stationary and only the substrate is rotated, it is possible to provide a substrate rotating apparatus with a simple structure and a small size, and to realize a substrate rotating apparatus that can support simultaneous film formation on both sides. Can do. Further, the substrate holder itself has a simple structure, and the transport mechanism can be simplified. The present invention particularly contributes to high performance of magnetic disks, optical disks, etc. and downsizing of the entire manufacturing system.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a configuration example of a substrate support rotating apparatus according to the present invention, in which a substrate support rotating apparatus is attached to a side wall 20 of a vacuum chamber.

  The substrate support rotating device moves in the axial direction for supporting and releasing the substrate, the substrate supporting mechanism 1 for supporting the substrate, the columnar member (second hollow cylindrical member) 2 that can be rotated and moved in the axial direction, and the substrate. The first bellows 4 and the second bellows 5 are provided in order to allow the cylindrical member 2 and the drive shaft 3 to move in the axial direction while maintaining airtightness in the vacuum chamber. In order to make the cylindrical member 2 rotatable, a magnetic fluid seal 6 is provided. Reference numeral 16 denotes an o-ring.

  A gear 10 is attached to the outer periphery of the cylindrical member 2, and the rotation of the motor 19 is transmitted to the cylindrical member 2 through the spline shaft 12, the gear 11, and the gear 10. Note that a resin insulating material is used for the gear 10, and electrical insulation between the cylindrical member 2 and the motor 19 is ensured. Further, the columnar member 2 can be moved in the axial direction by the shaft 13 of the air cylinder 17 fixed to the support plate 9. In the illustrated example, the gears 10 and 11 also move in the axial direction along with the cylindrical member 2, and the bellows 4 expands and contracts by the axial movement of the cylindrical member 2. An insulator (made of ceramic) 7 is arranged between the cylindrical member 2 and the magnetic fluid seal 6, and between the cylindrical member, the magnetic fluid seal 6 and the air cylinder 17 together with the ceramic member 8. Insulation is ensured. By disposing the insulating material in this manner, it is possible to apply a voltage to the cylindrical member 2, and it is possible to apply a bias uniformly to the substrate film formation surface via the substrate support mechanism that is electrically connected thereto. . The bias voltage may be applied via the bearing 15 using, for example, an RF or DC power source.

  The drive shaft 3 is moved by the advance of the shaft 14 of the air cylinder 18, and the substrate is supported and released by the axial movement of the drive shaft 3 as will be described later. The drive shaft 3 and the cylinder shaft 14 are separated when the columnar member 2 rotates. Further, the bellows 5 expands and contracts with the axial movement of the drive shaft 3. Each component described above is also supported by columns, guides and the like (not shown) connected to the side plates 21 and 22.

  Next, the substrate support mechanism 1 will be described with reference to FIG. 2A is a schematic cross-sectional view showing a state where the substrate 100 is supported, FIG. 2B is a view taken along the line AA, and FIG. 2C is a cross-sectional view showing a state before (or after) the substrate is supported. It is. The substrate support mechanism 1 includes a hollow cylindrical member 30, a central shaft 31 that passes through the hollow cylindrical member 30, and a radial movement member 34 provided on one end surface of the cylindrical member 30. The other end surface is fixed to one end surface of the second cylindrical member 2 by a bolt 43.

  The radial movement member 34 is a rectangular parallelepiped block in which a long cylindrical space hollowed up and down is formed, and a V-groove claw 37 that supports the inner peripheral end surface of the substrate is provided at one end thereof. A spring 36 is inserted into the space so that the pin 35 fixed to the columnar member 30 is fitted into the long columnar space and the block is biased toward the central axis 31. In this way, a plurality of (three in the illustrated example) radial movement members are attached. Further, a guide 38 is provided to prevent the member 34 from rotating and perform only a reciprocating motion in the radial direction, and is fixed to the columnar member 30 with a screw 40. Further, in order to ensure a smooth reciprocating motion, a resin with high lubricity is suitably used for the guide 38 and copper is suitably used for the member 34.

  A block 32 having a tapered portion 33 whose cross-sectional diameter increases toward the tip is fixed to one end of the central shaft 31 by a screw 39, and the whole is biased toward the columnar member 2 by a compression spring 41. In the state where the block 32 is pushed in, the radial moving member 34 is pushed out in the outer peripheral direction by the taper portion 33 of the block 32, and the V groove claw portion 37 at the front end abuts on the inner peripheral end surface of the substrate, thereby I will support it. Conversely, when releasing the substrate, the air cylinder 18 is driven, the drive shaft 3 is advanced, and the center shaft 31 is pressed against the force of the compression spring 41. As a result, as shown in FIG. 2 (c), the block 32 also moves, and the radial moving member 34 pushed to the outer peripheral side by the tapered portion 33 moves to the central axis side by the force of the spring 36, and the substrate The inner peripheral end face and the claw 37 are separated from each other, and the support of the substrate is released.

  If comprised as mentioned above, the axial direction motion of the center axis | shaft 31 will be converted into the reciprocating motion of the radial direction movement member 34 by the effect | action of a taper part, and, thereby, a board | substrate will be supported and released.

  Next, a series of operations for receiving a substrate from the substrate holder, performing a desired process while rotating the substrate, and then returning the substrate to the substrate holder will be described with reference to FIG. 3A to 3I, the right side is a side view showing the substrate holder 50 and the substrate 100, and the left side is a side sectional view showing the positional relationship between the substrate support mechanism 1 and the substrate. is there. The substrate holder 50 is composed of an outer frame 51 surrounding the substrate and two arms 52 attached to the outer frame 51, and two claws 53 having a V-groove shape are attached to the tip of the arm. The arm 52 is formed of an elastic member such as a leaf spring, for example, and a force is applied in a direction in which the claw 53 presses the outer peripheral end surface of the substrate. The substrate holder supports the outer peripheral end surface of the substrate with claws 53 and is transported between the processing apparatuses in this state.

  FIG. 3A shows a state in which, for example, the substrate holder has been carried into the sputtering chamber for the magnetic recording film after the Cr underlayer is formed. The target, the substrate support rotating device shown in FIG. Is placed on a substrate holder support (not shown) provided between the two. At this time, in the substrate support apparatus, the air cylinder 18 is driven and the drive shaft 3 moves forward, and the central shaft 31 and the block 32 are pressed leftward (in the direction of arrow A in FIG. 1), that is, in the radial direction. The moving member 34 is in the retracted state in the central axis direction.

  Next, when the air cylinder 17 is driven, the columnar member 2 moves forward, the tip of the substrate support mechanism 1 is inserted into the opening of the substrate, and the center of the V groove of the claw 37 and the substrate 100 are at the same position. Stop moving forward at position (b). Subsequently, the driving of the air cylinder 18 is stopped. When the drive shaft 3 moves backward and the drive shaft 3 and the end surface of the central shaft 31 are separated from each other, the block 32 is moved backward by the force of the compression spring 41, and the radial moving member 34 is pushed to the outside accordingly. Support (c). Here, since the claw 37 grips the Cr forming portion, conduction between the substrate surface and the claw is ensured.

  Next, the substrate support release mechanism 54 of the substrate holder is operated, the two arms 52 of the substrate holder are spread outward, the claw 53 and the substrate outer peripheral end surface are separated, and the substrate support by the substrate holder is released (d). . The motor 19 is driven, the columnar member 2 is rotated, and the substrate is rotated at a desired number of rotations. In this state, gas is introduced and electric power is supplied to each cathode to generate plasma to form a magnetic recording film on the Cr underlayer. During the film formation, a uniform bias can be applied to the thin film forming surface of the substrate by simultaneously applying a direct current or RF voltage to the bearing 15 and applying a bias to the substrate (e).

  After the film formation is completed, the supply of power to the cathode is stopped, the drive of the motor is stopped, and the substrate rotation is stopped (f). Subsequently, the substrate support release mechanism 54 of the substrate holder is retracted, and the outer peripheral end surface of the substrate is again supported by the claw 53 of the substrate holder (g). Thereafter, the cylinder 18 is driven, the block 32 is pressed to the left, the radial moving member 34 is retracted in the center direction, the claw 37 is separated from the inner periphery of the substrate, and the substrate support is released (h). Further, the cylindrical member 2 is retracted, and the block 32 is retracted from the opening of the substrate (i).

  As described above, a series of steps of substrate support, release, and rotation according to the substrate support rotating apparatus is completed, and the substrate holder that supports the processed substrate is carried out to the processing chamber of the next step. On the other hand, a substrate holder that supports an unprocessed substrate is carried into the sputtering chamber, and processing is performed in the same procedure.

  In the above, the case of single-sided film formation has been described. However, another set of targets is arranged on the side wall 20 so as to surround the cylindrical member 2, and power is supplied to each of the cathodes attached to the two side walls. By simultaneously generating plasma, both sides of the front and back surfaces can be sputtered simultaneously.

  In the substrate support rotating device having the configuration shown in FIG. 1, the compression spring 41 is arranged so as to urge the central shaft 31 in the direction of the second columnar member, but may be arranged so as to be urged in the opposite direction. . In this case, as shown in FIG. 4, the drive shaft 3 on the substrate support mechanism side and the cylinder 18 that moves the shaft in the axial direction are arranged on the opposite side of the central axis 31 of the block 32. As shown in FIGS. 4A and 4B, the block 32 is normally pushed outward by a spring, and the radial movement member 34 is in a state of being retracted in the central direction. Therefore, in order to support the substrate, the block 32 may be pressed by the drive shaft 3 as shown in FIG. In this case, the drive shaft 3 rotates simultaneously with the substrate rotation. The drive shaft 3 may be entered from the center position of the three cathodes shown in FIG.

  The above is an example of a configuration in which the substrate support rotation device is arranged horizontally, but it goes without saying that it may be arranged vertically. Further, although the substrate support rotating device mainly used in the sputtering apparatus has been described, the present invention is not limited to these, and can be suitably applied to a film forming apparatus and a processing apparatus such as a plasma CVD apparatus and a dry etching apparatus. Further, for example, it is also used for rotating the substrate during the heating and cooling processes, thereby improving the temperature uniformity within the substrate surface.

It is the schematic which shows an example of the board | substrate support rotation apparatus of this invention. It is the schematic which shows an example of the board | substrate support mechanism of this invention. It is the schematic explaining operation | movement of a board | substrate support rotary machine apparatus. It is the schematic which shows the other example of the board | substrate support rotation apparatus of this invention. It is the schematic which shows the example of target arrangement | positioning of the sputtering device with which the board | substrate support rotation apparatus of this invention is applied suitably.

Explanation of symbols

1 substrate support mechanism,
2 second cylindrical member,
3 Drive shaft,
4, 5 bellows,
6 Magnetic fluid seal,
7,8 insulator,
10,11 gear,
12 spline shaft,
17, 18 Air cylinder,
19 motor,
30 cylindrical member,
31 central axis,
32 blocks,
33 taper part,
34 radially moving member,
35 pins,
36 Spring,
37 claw,
38 guides,
41 compression spring,
50 substrate holder,
51 outer frame,
52 arms,
53 claws,
54 substrate support release mechanism,
55, 55 ', 55 "target,
56 cathode,
100 disc substrate.

Claims (2)

A substrate support rotation device that receives and rotates a substrate from a substrate holder that supports an outer peripheral end surface of a disk-shaped substrate having an opening in the center with a claw in a processing chamber that prevents air contamination,
A hollow cylindrical member, and a shaft attached to a hollow portion of the cylindrical member by being biased in one axial direction by a first spring, a taper whose diameter increases toward the distal end at one end thereof A plurality of moving members that move in the radial direction provided on one end surface on the one end portion side of the columnar member, and support the inner peripheral end surface of the substrate on the outer peripheral side And a radial movement member that is biased in the central axis direction by a second spring, and converts the axial movement of the central axis into the radial movement of the radial movement member. A substrate support mechanism for supporting and releasing the substrate;
A mechanism for moving the cylindrical member in the axial direction, and a mechanism for causing the plurality of radial movement members to enter the openings of the substrate until the claws are at least substantially the same as the position of the substrate;
A mechanism for moving the central axis in the axial direction;
A mechanism for rotating the cylindrical member in a state where the claw supports the substrate;
Have
The other end surface of the columnar member is connected to one end surface of the second hollow columnar member, and is disposed in an opening provided in the wall of the processing chamber, and is rotationally sealed on the outer peripheral surface of the second columnar member. The rotary seal and the wall are connected by a first bellows, and a drive shaft for moving the central axis in the axial direction protrudes from the other end surface of the second cylindrical member in the hollow portion. A substrate supporting and rotating device, wherein the substrate supporting rotating device is arranged and the other end surface of the second columnar member and the projecting end surface of the drive shaft are connected by a second bellows.   An insulator is provided between the second hollow cylindrical member, a mechanism for moving the substrate support mechanism portion in the axial direction, a mechanism for rotating the substrate support mechanism, and the rotary seal, and the second hollow cylindrical member is interposed via the second hollow cylindrical member. 2. The substrate supporting and rotating apparatus according to claim 1, wherein a bias can be applied to the substrate during rotation.

Images