CN1933169A - 降低串扰的cmos图像传感器 - Google Patents
降低串扰的cmos图像传感器 Download PDFInfo
- Publication number
- CN1933169A CN1933169A CNA2006101038463A CN200610103846A CN1933169A CN 1933169 A CN1933169 A CN 1933169A CN A2006101038463 A CNA2006101038463 A CN A2006101038463A CN 200610103846 A CN200610103846 A CN 200610103846A CN 1933169 A CN1933169 A CN 1933169A
- Authority
- CN
- China
- Prior art keywords
- epitaxial loayer
- barrier layer
- image sensor
- cmos image
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/184—Infrared image sensors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/197,004 US7307327B2 (en) | 2005-08-04 | 2005-08-04 | Reduced crosstalk CMOS image sensors |
| US11/197,004 | 2005-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1933169A true CN1933169A (zh) | 2007-03-21 |
Family
ID=36950808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101038463A Pending CN1933169A (zh) | 2005-08-04 | 2006-08-04 | 降低串扰的cmos图像传感器 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7307327B2 (https=) |
| EP (1) | EP1750308B1 (https=) |
| JP (1) | JP2007067393A (https=) |
| CN (1) | CN1933169A (https=) |
| TW (1) | TW200721468A (https=) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101304035B (zh) * | 2007-05-08 | 2010-06-09 | 中芯国际集成电路制造(上海)有限公司 | 图像传感器及其形成方法 |
| CN101764103A (zh) * | 2008-12-24 | 2010-06-30 | 硅绝缘体技术有限公司 | 半导体衬底及其制造方法 |
| CN102222678A (zh) * | 2011-06-22 | 2011-10-19 | 格科微电子(上海)有限公司 | Cmos图像传感器及其形成方法 |
| TWI407782B (zh) * | 2008-05-30 | 2013-09-01 | Omnivision Tech Inc | 具有聚焦互連之影像感測器,及有效率地捕捉入射光之方法與裝置 |
| TWI455298B (zh) * | 2011-10-25 | 2014-10-01 | Pixart Imaging Inc | 感光元件及量測入射光的方法 |
| CN104637966A (zh) * | 2013-11-08 | 2015-05-20 | 瑞萨电子株式会社 | 半导体器件及其制造方法 |
| CN104065853B (zh) * | 2014-06-16 | 2017-02-15 | 北京航空航天大学 | 一种红外相机串扰消除方法 |
| CN114008475A (zh) * | 2019-06-18 | 2022-02-01 | ams国际有限公司 | 带有导光元件的飞行时间传感器 |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060049464A1 (en) | 2004-09-03 | 2006-03-09 | Rao G R Mohan | Semiconductor devices with graded dopant regions |
| US7307327B2 (en) | 2005-08-04 | 2007-12-11 | Micron Technology, Inc. | Reduced crosstalk CMOS image sensors |
| US7728277B2 (en) * | 2005-11-16 | 2010-06-01 | Eastman Kodak Company | PMOS pixel structure with low cross talk for active pixel image sensors |
| KR100719361B1 (ko) * | 2005-11-22 | 2007-05-17 | 삼성전자주식회사 | 씨모스 이미지 센서 및 그 형성 방법 |
| KR100809323B1 (ko) * | 2006-01-31 | 2008-03-05 | 삼성전자주식회사 | 크로스토크가 감소하고 감도가 증가한 이미지 센서 |
| KR100703987B1 (ko) * | 2006-05-17 | 2007-04-09 | 삼성전자주식회사 | 이미지 센서의 제조 방법 및 그에 의해 제조된 이미지 센서 |
| KR100853788B1 (ko) * | 2006-11-27 | 2008-08-25 | 동부일렉트로닉스 주식회사 | 이미지 센서에서의 층 두께 측정 방법 및 이를 위한 이미지센서의 두께 측정 패턴 |
| US8440495B2 (en) * | 2007-03-06 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for reducing crosstalk in image sensors using implant technology |
| WO2009047716A1 (en) * | 2007-10-08 | 2009-04-16 | Insiava (Pty) Limited | Silicon light emitting device with carrier injection |
| US9076921B2 (en) * | 2008-07-18 | 2015-07-07 | Massachusetts Institute Of Technology | Dark current reduction for large area photodiodes |
| US8237206B2 (en) * | 2008-08-12 | 2012-08-07 | United Microelectronics Corp. | CMOS image sensor, method of making the same, and method of suppressing dark leakage and crosstalk for CMOS image sensor |
| US8229255B2 (en) | 2008-09-04 | 2012-07-24 | Zena Technologies, Inc. | Optical waveguides in image sensors |
| US8546742B2 (en) | 2009-06-04 | 2013-10-01 | Zena Technologies, Inc. | Array of nanowires in a single cavity with anti-reflective coating on substrate |
| US8890271B2 (en) | 2010-06-30 | 2014-11-18 | Zena Technologies, Inc. | Silicon nitride light pipes for image sensors |
| US9343490B2 (en) | 2013-08-09 | 2016-05-17 | Zena Technologies, Inc. | Nanowire structured color filter arrays and fabrication method of the same |
| US9515218B2 (en) | 2008-09-04 | 2016-12-06 | Zena Technologies, Inc. | Vertical pillar structured photovoltaic devices with mirrors and optical claddings |
| US9000353B2 (en) | 2010-06-22 | 2015-04-07 | President And Fellows Of Harvard College | Light absorption and filtering properties of vertically oriented semiconductor nano wires |
| US9478685B2 (en) | 2014-06-23 | 2016-10-25 | Zena Technologies, Inc. | Vertical pillar structured infrared detector and fabrication method for the same |
| US8748799B2 (en) | 2010-12-14 | 2014-06-10 | Zena Technologies, Inc. | Full color single pixel including doublet or quadruplet si nanowires for image sensors |
| US9406709B2 (en) | 2010-06-22 | 2016-08-02 | President And Fellows Of Harvard College | Methods for fabricating and using nanowires |
| US8791470B2 (en) | 2009-10-05 | 2014-07-29 | Zena Technologies, Inc. | Nano structured LEDs |
| US9299866B2 (en) | 2010-12-30 | 2016-03-29 | Zena Technologies, Inc. | Nanowire array based solar energy harvesting device |
| US8866065B2 (en) | 2010-12-13 | 2014-10-21 | Zena Technologies, Inc. | Nanowire arrays comprising fluorescent nanowires |
| US8384007B2 (en) | 2009-10-07 | 2013-02-26 | Zena Technologies, Inc. | Nano wire based passive pixel image sensor |
| US8269985B2 (en) | 2009-05-26 | 2012-09-18 | Zena Technologies, Inc. | Determination of optimal diameters for nanowires |
| US9082673B2 (en) | 2009-10-05 | 2015-07-14 | Zena Technologies, Inc. | Passivated upstanding nanostructures and methods of making the same |
| US8507840B2 (en) | 2010-12-21 | 2013-08-13 | Zena Technologies, Inc. | Vertically structured passive pixel arrays and methods for fabricating the same |
| US8299472B2 (en) | 2009-12-08 | 2012-10-30 | Young-June Yu | Active pixel sensor with nanowire structured photodetectors |
| US8735797B2 (en) | 2009-12-08 | 2014-05-27 | Zena Technologies, Inc. | Nanowire photo-detector grown on a back-side illuminated image sensor |
| US8274039B2 (en) | 2008-11-13 | 2012-09-25 | Zena Technologies, Inc. | Vertical waveguides with various functionality on integrated circuits |
| US8835831B2 (en) | 2010-06-22 | 2014-09-16 | Zena Technologies, Inc. | Polarized light detecting device and fabrication methods of the same |
| US8889455B2 (en) | 2009-12-08 | 2014-11-18 | Zena Technologies, Inc. | Manufacturing nanowire photo-detector grown on a back-side illuminated image sensor |
| US8519379B2 (en) | 2009-12-08 | 2013-08-27 | Zena Technologies, Inc. | Nanowire structured photodiode with a surrounding epitaxially grown P or N layer |
| US20100148230A1 (en) * | 2008-12-11 | 2010-06-17 | Stevens Eric G | Trench isolation regions in image sensors |
| JP5569153B2 (ja) * | 2009-09-02 | 2014-08-13 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
| JP5564874B2 (ja) * | 2009-09-25 | 2014-08-06 | ソニー株式会社 | 固体撮像装置、及び電子機器 |
| US8502271B2 (en) * | 2009-10-23 | 2013-08-06 | Lockheed Martin Corporation | Barrier photodetector with planar top layer |
| KR101829480B1 (ko) * | 2010-04-09 | 2018-02-14 | 씬트-엑스 에이비 | x-선 센서 시스템 및 x-선 영상화 시스템 |
| JP5536517B2 (ja) * | 2010-04-14 | 2014-07-02 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| US8692198B2 (en) * | 2010-04-21 | 2014-04-08 | Sionyx, Inc. | Photosensitive imaging devices and associated methods |
| US8482090B2 (en) | 2010-07-15 | 2013-07-09 | Exelis, Inc. | Charged particle collector for a CMOS imager |
| JP5726005B2 (ja) * | 2010-08-02 | 2015-05-27 | アイメックImec | Cmos撮像装置アレイの製造方法 |
| US8507962B2 (en) | 2010-10-04 | 2013-08-13 | International Business Machines Corporation | Isolation structures for global shutter imager pixel, methods of manufacture and design structures |
| TWI459547B (zh) | 2010-11-04 | 2014-11-01 | 聯詠科技股份有限公司 | 影像感測器 |
| US8786023B2 (en) * | 2011-12-08 | 2014-07-22 | Contour Semiconductor, Inc. | Embedded non-volatile memory |
| US9093373B2 (en) * | 2013-08-13 | 2015-07-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Conductive diffusion barrier structure for ohmic contacts |
| JP2015056622A (ja) * | 2013-09-13 | 2015-03-23 | 株式会社リコー | 半導体装置 |
| US9331116B2 (en) * | 2014-01-15 | 2016-05-03 | Omnivision Technologies, Inc. | Back side illuminated single photon avalanche diode imaging sensor with high short wavelength detection efficiency |
| US9312408B2 (en) | 2014-06-12 | 2016-04-12 | Stmicroelectronics Sa | Imager having a reduced dark current through an increased bulk doping level |
| KR102268712B1 (ko) | 2014-06-23 | 2021-06-28 | 삼성전자주식회사 | 자동 초점 이미지 센서 및 이를 포함하는 디지털 영상 처리 장치 |
| US9209320B1 (en) | 2014-08-07 | 2015-12-08 | Omnivision Technologies, Inc. | Method of fabricating a single photon avalanche diode imaging sensor |
| WO2017149521A1 (en) * | 2016-03-04 | 2017-09-08 | Vuereal Inc. | Micro device integration into system substrate |
| CN113410146A (zh) | 2015-01-23 | 2021-09-17 | 维耶尔公司 | 到受体衬底的选择性微型器件转移 |
| US10847571B2 (en) | 2015-01-23 | 2020-11-24 | Vuereal Inc. | Micro device integration into system substrate |
| US10700120B2 (en) | 2015-01-23 | 2020-06-30 | Vuereal Inc. | Micro device integration into system substrate |
| US10134803B2 (en) | 2015-01-23 | 2018-11-20 | Vuereal Inc. | Micro device integration into system substrate |
| US12402466B2 (en) | 2015-01-23 | 2025-08-26 | Vuereal Inc. | Micro device integration into system substrate |
| US20170215280A1 (en) | 2016-01-21 | 2017-07-27 | Vuereal Inc. | Selective transfer of micro devices |
| CA2994359C (en) | 2016-01-28 | 2020-01-07 | Saint-Gobain Glass France | Positive pressure-supported glass bending method and device suitable therefor |
| CN107293559A (zh) * | 2016-04-05 | 2017-10-24 | 格科微电子(上海)有限公司 | Rgbir图像传感器 |
| US10672934B2 (en) * | 2017-10-31 | 2020-06-02 | Taiwan Semiconductor Manufacturing Company Ltd. | SPAD image sensor and associated fabricating method |
| US10418402B2 (en) * | 2017-11-30 | 2019-09-17 | Stmicroelectronics (Research & Development) Limited | Near ultraviolet photocell |
| US10892295B2 (en) * | 2018-01-10 | 2021-01-12 | Microsoft Technology Licensing, Llc | Germanium-modified, back-side illuminated optical sensor |
| JP7039411B2 (ja) | 2018-07-20 | 2022-03-22 | 株式会社東芝 | 光検出器、光検出システム、ライダー装置及び車 |
| JP2021034423A (ja) * | 2019-08-19 | 2021-03-01 | コーデンシ株式会社 | 分割フォトダイオード、及び、分割フォトダイオードの製造方法 |
| US20240153983A1 (en) * | 2022-11-08 | 2024-05-09 | Samsung Electronics Co., Ltd. | Device structure for high fill-factor spad pixel with cmos in-pixel circuits |
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| CN100466270C (zh) * | 2003-06-30 | 2009-03-04 | 罗姆股份有限公司 | 图像传感器及光电二极管的分离结构的形成方法 |
| KR100630679B1 (ko) * | 2003-12-17 | 2006-10-02 | 삼성전자주식회사 | 포토 다이오드 및 이의 제조 방법 |
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| US7307327B2 (en) | 2005-08-04 | 2007-12-11 | Micron Technology, Inc. | Reduced crosstalk CMOS image sensors |
-
2005
- 2005-08-04 US US11/197,004 patent/US7307327B2/en not_active Expired - Lifetime
-
2006
- 2006-07-24 EP EP06015356A patent/EP1750308B1/en not_active Ceased
- 2006-07-27 TW TW095127523A patent/TW200721468A/zh unknown
- 2006-08-04 CN CNA2006101038463A patent/CN1933169A/zh active Pending
- 2006-08-04 JP JP2006212759A patent/JP2007067393A/ja not_active Withdrawn
-
2007
- 2007-11-15 US US11/940,569 patent/US7592654B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101304035B (zh) * | 2007-05-08 | 2010-06-09 | 中芯国际集成电路制造(上海)有限公司 | 图像传感器及其形成方法 |
| TWI407782B (zh) * | 2008-05-30 | 2013-09-01 | Omnivision Tech Inc | 具有聚焦互連之影像感測器,及有效率地捕捉入射光之方法與裝置 |
| CN101764103A (zh) * | 2008-12-24 | 2010-06-30 | 硅绝缘体技术有限公司 | 半导体衬底及其制造方法 |
| CN102222678A (zh) * | 2011-06-22 | 2011-10-19 | 格科微电子(上海)有限公司 | Cmos图像传感器及其形成方法 |
| TWI455298B (zh) * | 2011-10-25 | 2014-10-01 | Pixart Imaging Inc | 感光元件及量測入射光的方法 |
| CN104637966A (zh) * | 2013-11-08 | 2015-05-20 | 瑞萨电子株式会社 | 半导体器件及其制造方法 |
| CN104065853B (zh) * | 2014-06-16 | 2017-02-15 | 北京航空航天大学 | 一种红外相机串扰消除方法 |
| CN114008475A (zh) * | 2019-06-18 | 2022-02-01 | ams国际有限公司 | 带有导光元件的飞行时间传感器 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1750308B1 (en) | 2011-02-23 |
| EP1750308A3 (en) | 2009-03-11 |
| US7592654B2 (en) | 2009-09-22 |
| JP2007067393A (ja) | 2007-03-15 |
| US20070029589A1 (en) | 2007-02-08 |
| TW200721468A (en) | 2007-06-01 |
| US20080079045A1 (en) | 2008-04-03 |
| US7307327B2 (en) | 2007-12-11 |
| EP1750308A2 (en) | 2007-02-07 |
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