CN1926679B - 在半导体装置制造中减少浅沟槽隔离凹陷区形成的方法 - Google Patents

在半导体装置制造中减少浅沟槽隔离凹陷区形成的方法 Download PDF

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Publication number
CN1926679B
CN1926679B CN2005800068145A CN200580006814A CN1926679B CN 1926679 B CN1926679 B CN 1926679B CN 2005800068145 A CN2005800068145 A CN 2005800068145A CN 200580006814 A CN200580006814 A CN 200580006814A CN 1926679 B CN1926679 B CN 1926679B
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China
Prior art keywords
stop layer
polish stop
nitride
forming
angstroms
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Expired - Fee Related
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CN2005800068145A
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English (en)
Chinese (zh)
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CN1926679A (zh
Inventor
D·J·邦瑟
J·格罗舍普弗
S·达克希那-穆尔蒂
J·G·佩尔兰
J·D·奇克
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GlobalFoundries Inc
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GlobalFoundries Inc
Advanced Micro Devices Inc
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Publication of CN1926679A publication Critical patent/CN1926679A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
CN2005800068145A 2004-03-04 2005-02-26 在半导体装置制造中减少浅沟槽隔离凹陷区形成的方法 Expired - Fee Related CN1926679B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/791,759 US7091106B2 (en) 2004-03-04 2004-03-04 Method of reducing STI divot formation during semiconductor device fabrication
US10/791,759 2004-03-04
PCT/US2005/006177 WO2005093825A1 (en) 2004-03-04 2005-02-26 Method of reducing sti divot formation during semiconductor device fabrication

Publications (2)

Publication Number Publication Date
CN1926679A CN1926679A (zh) 2007-03-07
CN1926679B true CN1926679B (zh) 2010-10-06

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CN2005800068145A Expired - Fee Related CN1926679B (zh) 2004-03-04 2005-02-26 在半导体装置制造中减少浅沟槽隔离凹陷区形成的方法

Country Status (8)

Country Link
US (1) US7091106B2 (cg-RX-API-DMAC7.html)
JP (1) JP2007526652A (cg-RX-API-DMAC7.html)
KR (1) KR20060129037A (cg-RX-API-DMAC7.html)
CN (1) CN1926679B (cg-RX-API-DMAC7.html)
DE (1) DE112005000512B4 (cg-RX-API-DMAC7.html)
GB (1) GB2426126B (cg-RX-API-DMAC7.html)
TW (1) TWI355678B (cg-RX-API-DMAC7.html)
WO (1) WO2005093825A1 (cg-RX-API-DMAC7.html)

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Publication number Priority date Publication date Assignee Title
US12002707B2 (en) 2020-08-06 2024-06-04 Changxin Memory Technologies, Inc. Semiconductor structure and manufacturing method thereof

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KR100568259B1 (ko) * 2004-12-14 2006-04-07 삼성전자주식회사 트렌치 소자 분리형 반도체 장치 및 그 형성 방법
US20080204580A1 (en) * 2007-02-28 2008-08-28 Micron Technology, Inc. Method, apparatus and system providing imaging device with color filter array
US20090053834A1 (en) * 2007-08-23 2009-02-26 Vladimir Alexeevich Ukraintsev Use of scatterometry for in-line detection of poly-si strings left in sti divot after gate etch
KR100880227B1 (ko) * 2007-10-09 2009-01-28 주식회사 동부하이텍 플래시 메모리 소자의 제조방법
US7745320B2 (en) * 2008-05-21 2010-06-29 Chartered Semiconductor Manufacturing, Ltd. Method for reducing silicide defects in integrated circuits
US8546268B2 (en) 2009-04-30 2013-10-01 X-Fab Semiconductor Foundries Ag Manufacturing integrated circuit components having multiple gate oxidations
US8274114B2 (en) * 2010-01-14 2012-09-25 Broadcom Corporation Semiconductor device having a modified shallow trench isolation (STI) region and a modified well region
US8283722B2 (en) 2010-06-14 2012-10-09 Broadcom Corporation Semiconductor device having an enhanced well region
US9123807B2 (en) 2010-12-28 2015-09-01 Broadcom Corporation Reduction of parasitic capacitance in a semiconductor device
US20120292735A1 (en) 2011-05-20 2012-11-22 GLOBALFOUNDRIES Singapore Pte.Ltd. Corner transistor suppression
US9263556B2 (en) * 2012-06-29 2016-02-16 Taiwan Semiconductor Manufacturing Company, Ltd. Silicide process using OD spacers
US8716102B2 (en) * 2012-08-14 2014-05-06 Globalfoundries Inc. Methods of forming isolation structures for semiconductor devices by performing a dry chemical removal process
US8603895B1 (en) 2012-09-11 2013-12-10 Globalfoundries Inc. Methods of forming isolation structures for semiconductor devices by performing a deposition-etch-deposition sequence
US9219059B2 (en) 2012-09-26 2015-12-22 International Business Machines Corporation Semiconductor structure with integrated passive structures
JP6591347B2 (ja) 2016-06-03 2019-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6629159B2 (ja) * 2016-09-16 2020-01-15 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN111341724B (zh) * 2018-12-19 2022-11-04 上海新微技术研发中心有限公司 浅沟槽隔离工艺及浅沟槽隔离结构
KR102821368B1 (ko) * 2019-06-21 2025-06-17 삼성전자주식회사 반도체 소자 및 그 제조 방법
CN113611604A (zh) * 2021-03-19 2021-11-05 联芯集成电路制造(厦门)有限公司 半导体元件的制作方法

Citations (4)

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US5177028A (en) * 1991-10-22 1993-01-05 Micron Technology, Inc. Trench isolation method having a double polysilicon gate formed on mesas
CN1356722A (zh) * 2000-12-01 2002-07-03 三星电子株式会社 具有浅沟槽隔离结构的半导体器件及其制造方法
US6555476B1 (en) * 1997-12-23 2003-04-29 Texas Instruments Incorporated Silicon carbide as a stop layer in chemical mechanical polishing for isolation dielectric
US6673695B1 (en) * 2002-02-01 2004-01-06 Chartered Semiconductor Manufacturing Ltd. STI scheme to prevent fox recess during pre-CMP HF dip

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US98661A (en) * 1870-01-11 Ikank l
US5234535A (en) * 1992-12-10 1993-08-10 International Business Machines Corporation Method of producing a thin silicon-on-insulator layer
US5665633A (en) * 1995-04-06 1997-09-09 Motorola, Inc. Process for forming a semiconductor device having field isolation
US5616513A (en) * 1995-06-01 1997-04-01 International Business Machines Corporation Shallow trench isolation with self aligned PSG layer
JPH098135A (ja) * 1995-06-26 1997-01-10 Toshiba Corp 半導体装置の製造方法
JP3125719B2 (ja) * 1997-07-28 2001-01-22 日本電気株式会社 半導体装置及びその製造方法
JP3053009B2 (ja) * 1997-09-29 2000-06-19 日本電気株式会社 半導体装置の製造方法
CN1219328C (zh) * 1998-02-19 2005-09-14 国际商业机器公司 具有改善了注入剂的场效应晶体管及其制造方法
JP3178416B2 (ja) * 1998-05-22 2001-06-18 日本電気株式会社 半導体装置の製造方法
US6599810B1 (en) * 1998-11-05 2003-07-29 Advanced Micro Devices, Inc. Shallow trench isolation formation with ion implantation
US6248641B1 (en) * 1999-02-05 2001-06-19 United Microelectronics Corp. Method of fabricating shallow trench isolation
JP2001185731A (ja) * 1999-12-24 2001-07-06 Toshiba Corp 半導体装置及びその製造方法
US6432797B1 (en) 2001-01-25 2002-08-13 Chartered Semiconductor Manufacturing Ltd. Simplified method to reduce or eliminate STI oxide divots
US20020142531A1 (en) * 2001-03-29 2002-10-03 Hsu Sheng Teng Dual damascene copper gate and interconnect therefore
JP4318892B2 (ja) * 2002-05-30 2009-08-26 富士通マイクロエレクトロニクス株式会社 電子装置の設計方法および製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177028A (en) * 1991-10-22 1993-01-05 Micron Technology, Inc. Trench isolation method having a double polysilicon gate formed on mesas
US6555476B1 (en) * 1997-12-23 2003-04-29 Texas Instruments Incorporated Silicon carbide as a stop layer in chemical mechanical polishing for isolation dielectric
CN1356722A (zh) * 2000-12-01 2002-07-03 三星电子株式会社 具有浅沟槽隔离结构的半导体器件及其制造方法
US6673695B1 (en) * 2002-02-01 2004-01-06 Chartered Semiconductor Manufacturing Ltd. STI scheme to prevent fox recess during pre-CMP HF dip

Non-Patent Citations (2)

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Title
US 5177028 A,说明书第5栏第32行-第6栏第29行，权利要求20，图14-20.
US 6673695 B1,全文.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12002707B2 (en) 2020-08-06 2024-06-04 Changxin Memory Technologies, Inc. Semiconductor structure and manufacturing method thereof

Also Published As

Publication number Publication date
JP2007526652A (ja) 2007-09-13
KR20060129037A (ko) 2006-12-14
TW200535945A (en) 2005-11-01
US20050196928A1 (en) 2005-09-08
GB0617207D0 (en) 2006-10-11
WO2005093825A1 (en) 2005-10-06
TWI355678B (en) 2012-01-01
DE112005000512B4 (de) 2011-09-08
CN1926679A (zh) 2007-03-07
DE112005000512T5 (de) 2007-01-11
GB2426126A (en) 2006-11-15
GB2426126B (en) 2008-07-23
US7091106B2 (en) 2006-08-15

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