CN1914309B - 改进的用于cmp后清洗的酸性化学处理剂 - Google Patents
改进的用于cmp后清洗的酸性化学处理剂 Download PDFInfo
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- CN1914309B CN1914309B CN2005800040440A CN200580004044A CN1914309B CN 1914309 B CN1914309 B CN 1914309B CN 2005800040440 A CN2005800040440 A CN 2005800040440A CN 200580004044 A CN200580004044 A CN 200580004044A CN 1914309 B CN1914309 B CN 1914309B
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- metal
- cleaning
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- cleaning solution
- wafer
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Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/267—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3263—Amides or imides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3272—Urea, guanidine or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3481—Organic compounds containing sulfur containing sulfur in a heterocyclic ring, e.g. sultones or sulfolanes
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Molecular Biology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
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| US55099704P | 2004-03-05 | 2004-03-05 | |
| US60/550,997 | 2004-03-05 | ||
| US10/956,272 US7087564B2 (en) | 2004-03-05 | 2004-10-01 | Acidic chemistry for post-CMP cleaning |
| US10/956,272 | 2004-10-01 | ||
| PCT/IB2005/000165 WO2005093031A1 (en) | 2004-03-05 | 2005-01-24 | Improved acidic chemistry for post-cmp cleaning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1914309A CN1914309A (zh) | 2007-02-14 |
| CN1914309B true CN1914309B (zh) | 2011-03-23 |
Family
ID=34915711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2005800040440A Expired - Fee Related CN1914309B (zh) | 2004-03-05 | 2005-01-24 | 改进的用于cmp后清洗的酸性化学处理剂 |
Country Status (9)
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| US20070225186A1 (en) * | 2006-03-27 | 2007-09-27 | Matthew Fisher | Alkaline solutions for post CMP cleaning processes |
| US20070232511A1 (en) * | 2006-03-28 | 2007-10-04 | Matthew Fisher | Cleaning solutions including preservative compounds for post CMP cleaning processes |
| WO2007146680A1 (en) * | 2006-06-06 | 2007-12-21 | Florida State University Research Foundation , Inc. | Stabilized silica colloid |
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| US9659796B2 (en) * | 2008-07-24 | 2017-05-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Rinsing wafers using composition-tunable rinse water in chemical mechanical polish |
| CN102197124B (zh) | 2008-10-21 | 2013-12-18 | 高级技术材料公司 | 铜清洁及保护调配物 |
| US7763577B1 (en) * | 2009-02-27 | 2010-07-27 | Uwiz Technology Co., Ltd. | Acidic post-CMP cleaning composition |
| WO2011000758A1 (en) | 2009-06-30 | 2011-01-06 | Basf Se | Aqueous alkaline cleaning compositions and methods of their use |
| KR101855538B1 (ko) | 2010-07-19 | 2018-05-04 | 바스프 에스이 | 수성 알칼리 세정 조성물 및 이의 사용 방법 |
| CN102453637B (zh) * | 2010-10-29 | 2016-01-20 | 安集微电子（上海）有限公司 | 一种清洗液 |
| CN102485424B (zh) * | 2010-12-03 | 2015-01-21 | 中芯国际集成电路制造(北京)有限公司 | 抛光装置及其异常处理方法 |
| CN102689265B (zh) * | 2011-03-22 | 2015-04-29 | 中芯国际集成电路制造(上海)有限公司 | 化学机械抛光的方法 |
| WO2013118042A1 (en) * | 2012-02-06 | 2013-08-15 | Basf Se | A post chemical-mechanical-polishing (post-cmp) cleaning composition comprising a specific sulfur-containing compound and comprising no significant amounts of specific nitrogen-containing compounds |
| EP3385363B1 (en) * | 2012-02-06 | 2022-03-16 | Basf Se | A post chemical-mechanical-polishing (post-cmp) cleaning composition comprising a specific sulfur-containing compound |
| CN105097425A (zh) * | 2014-04-18 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 一种化学机械研磨的方法 |
| US10301580B2 (en) * | 2014-12-30 | 2019-05-28 | Versum Materials Us, Llc | Stripping compositions having high WN/W etching selectivity |
| CN106757110A (zh) * | 2016-12-05 | 2017-05-31 | 郑州丽福爱生物技术有限公司 | 一种铝合金加工用表面处理剂 |
| US11560533B2 (en) | 2018-06-26 | 2023-01-24 | Versum Materials Us, Llc | Post chemical mechanical planarization (CMP) cleaning |
| US11091727B2 (en) * | 2018-07-24 | 2021-08-17 | Versum Materials Us, Llc | Post etch residue cleaning compositions and methods of using the same |
| JP6682593B2 (ja) * | 2018-09-27 | 2020-04-15 | 株式会社Adeka | 自動食器洗浄機用濃縮液体洗浄剤組成物及び自動食器洗浄機による食器類の洗浄方法 |
| KR102397700B1 (ko) | 2019-09-06 | 2022-05-17 | 엘티씨 (주) | 세정제 조성물 |
| US20230090216A1 (en) * | 2020-01-29 | 2023-03-23 | Huntsman Advanced Materials Switzerland Gmbh | Functionalized particles |
| CN113186539B (zh) * | 2021-04-27 | 2022-12-06 | 上海新阳半导体材料股份有限公司 | 一种化学机械抛光后清洗液及其制备方法 |
| CN117987644A (zh) * | 2024-02-18 | 2024-05-07 | 中国标准化研究院 | 一种萃取剂及其在复杂基体中萃取金属的应用 |
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2004
- 2004-10-01 US US10/956,272 patent/US7087564B2/en not_active Expired - Lifetime
-
2005
- 2005-01-24 KR KR1020067016063A patent/KR101140970B1/ko not_active Expired - Fee Related
- 2005-01-24 DE DE602005014094T patent/DE602005014094D1/de not_active Expired - Lifetime
- 2005-01-24 CN CN2005800040440A patent/CN1914309B/zh not_active Expired - Fee Related
- 2005-01-24 EP EP05702325A patent/EP1725647B1/en not_active Expired - Lifetime
- 2005-01-24 AT AT05702325T patent/ATE429480T1/de not_active IP Right Cessation
- 2005-01-24 JP JP2007501361A patent/JP2007526647A/ja active Pending
- 2005-01-24 WO PCT/IB2005/000165 patent/WO2005093031A1/en not_active Application Discontinuation
- 2005-01-31 TW TW094102888A patent/TWI364455B/zh not_active IP Right Cessation
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2006
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2007
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| 表I |
Also Published As
| Publication number | Publication date |
|---|---|
| US20050197266A1 (en) | 2005-09-08 |
| US7087564B2 (en) | 2006-08-08 |
| KR20070003854A (ko) | 2007-01-05 |
| CN1914309A (zh) | 2007-02-14 |
| TWI364455B (en) | 2012-05-21 |
| DE602005014094D1 (de) | 2009-06-04 |
| EP1725647A1 (en) | 2006-11-29 |
| US20060234888A1 (en) | 2006-10-19 |
| WO2005093031A1 (en) | 2005-10-06 |
| KR101140970B1 (ko) | 2012-05-23 |
| ATE429480T1 (de) | 2009-05-15 |
| US20080125341A1 (en) | 2008-05-29 |
| EP1725647B1 (en) | 2009-04-22 |
| TW200530394A (en) | 2005-09-16 |
| US7297670B2 (en) | 2007-11-20 |
| JP2007526647A (ja) | 2007-09-13 |
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