CN1901779A - 实装基板及电子部件的实装方法 - Google Patents

实装基板及电子部件的实装方法 Download PDF

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Publication number
CN1901779A
CN1901779A CNA2006101061370A CN200610106137A CN1901779A CN 1901779 A CN1901779 A CN 1901779A CN A2006101061370 A CNA2006101061370 A CN A2006101061370A CN 200610106137 A CN200610106137 A CN 200610106137A CN 1901779 A CN1901779 A CN 1901779A
Authority
CN
China
Prior art keywords
scolder
mark
electronic unit
printing
weld pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006101061370A
Other languages
English (en)
Chinese (zh)
Inventor
北田智史
海津雅洋
宇波义春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Fujikura Co Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of CN1901779A publication Critical patent/CN1901779A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
CNA2006101061370A 2005-07-19 2006-07-19 实装基板及电子部件的实装方法 Pending CN1901779A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005209036 2005-07-19
JP2005209036A JP2007027510A (ja) 2005-07-19 2005-07-19 実装基板及び電子部品の実装方法

Publications (1)

Publication Number Publication Date
CN1901779A true CN1901779A (zh) 2007-01-24

Family

ID=37657463

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006101061370A Pending CN1901779A (zh) 2005-07-19 2006-07-19 实装基板及电子部件的实装方法

Country Status (4)

Country Link
JP (1) JP2007027510A (ko)
KR (1) KR20070011168A (ko)
CN (1) CN1901779A (ko)
TW (1) TW200727757A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474768B (zh) * 2010-10-01 2015-02-21 Meiko Electronics Co Ltd A method of manufacturing a substrate having a built-in member, and a substrate for a built-in member manufactured by the method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300690A (ja) * 2007-05-31 2008-12-11 Icom Inc 表面部品実装方法および表面部品実装用基板
EP2624318A4 (en) 2010-09-30 2015-11-11 Dowa Electronics Materials Co GROUP III ELEMENT NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
CN103155728B (zh) * 2010-10-01 2016-01-20 名幸电子有限公司 元器件内置基板及元器件内置基板的制造方法
JP6127516B2 (ja) * 2013-01-08 2017-05-17 株式会社リコー 光学パッケージ、光学ユニット、光走査装置、画像形成装置
KR101302122B1 (ko) * 2013-02-08 2013-08-30 주식회사 케이엘테크 인쇄 회로 기판 제작 방법
JP2016134429A (ja) * 2015-01-16 2016-07-25 東芝キヤリア株式会社 プリント回路基板とプリント回路基板の製造方法
JP2023009751A (ja) 2021-07-08 2023-01-20 住友電装株式会社 回路構成体、及び電気接続箱

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474768B (zh) * 2010-10-01 2015-02-21 Meiko Electronics Co Ltd A method of manufacturing a substrate having a built-in member, and a substrate for a built-in member manufactured by the method

Also Published As

Publication number Publication date
TW200727757A (en) 2007-07-16
JP2007027510A (ja) 2007-02-01
KR20070011168A (ko) 2007-01-24

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PB01 Publication
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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication