TW200727757A - Mounting board and electronic parts mounting method - Google Patents

Mounting board and electronic parts mounting method

Info

Publication number
TW200727757A
TW200727757A TW095126256A TW95126256A TW200727757A TW 200727757 A TW200727757 A TW 200727757A TW 095126256 A TW095126256 A TW 095126256A TW 95126256 A TW95126256 A TW 95126256A TW 200727757 A TW200727757 A TW 200727757A
Authority
TW
Taiwan
Prior art keywords
electronic parts
mounting
soldering
mounting method
position mark
Prior art date
Application number
TW095126256A
Other languages
English (en)
Chinese (zh)
Inventor
Tomofumi Kitada
Masahiro Kaizu
Yoshiharu Unami
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200727757A publication Critical patent/TW200727757A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
TW095126256A 2005-07-19 2006-07-18 Mounting board and electronic parts mounting method TW200727757A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005209036A JP2007027510A (ja) 2005-07-19 2005-07-19 実装基板及び電子部品の実装方法

Publications (1)

Publication Number Publication Date
TW200727757A true TW200727757A (en) 2007-07-16

Family

ID=37657463

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126256A TW200727757A (en) 2005-07-19 2006-07-18 Mounting board and electronic parts mounting method

Country Status (4)

Country Link
JP (1) JP2007027510A (ko)
KR (1) KR20070011168A (ko)
CN (1) CN1901779A (ko)
TW (1) TW200727757A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300690A (ja) * 2007-05-31 2008-12-11 Icom Inc 表面部品実装方法および表面部品実装用基板
EP2624318A4 (en) 2010-09-30 2015-11-11 Dowa Electronics Materials Co GROUP III ELEMENT NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
CN103155728B (zh) * 2010-10-01 2016-01-20 名幸电子有限公司 元器件内置基板及元器件内置基板的制造方法
JP5525618B2 (ja) * 2010-10-01 2014-06-18 株式会社メイコー 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板
JP6127516B2 (ja) * 2013-01-08 2017-05-17 株式会社リコー 光学パッケージ、光学ユニット、光走査装置、画像形成装置
KR101302122B1 (ko) * 2013-02-08 2013-08-30 주식회사 케이엘테크 인쇄 회로 기판 제작 방법
JP2016134429A (ja) * 2015-01-16 2016-07-25 東芝キヤリア株式会社 プリント回路基板とプリント回路基板の製造方法
JP2023009751A (ja) 2021-07-08 2023-01-20 住友電装株式会社 回路構成体、及び電気接続箱

Also Published As

Publication number Publication date
JP2007027510A (ja) 2007-02-01
KR20070011168A (ko) 2007-01-24
CN1901779A (zh) 2007-01-24

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