CN1886993A - 导电衬垫 - Google Patents

导电衬垫 Download PDF

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Publication number
CN1886993A
CN1886993A CNA2004800352931A CN200480035293A CN1886993A CN 1886993 A CN1886993 A CN 1886993A CN A2004800352931 A CNA2004800352931 A CN A2004800352931A CN 200480035293 A CN200480035293 A CN 200480035293A CN 1886993 A CN1886993 A CN 1886993A
Authority
CN
China
Prior art keywords
aluminium foil
natural slurry
conducting strip
liner
hot melt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800352931A
Other languages
English (en)
Chinese (zh)
Inventor
金善基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Joinset Co Ltd
Original Assignee
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joinset Co Ltd filed Critical Joinset Co Ltd
Publication of CN1886993A publication Critical patent/CN1886993A/zh
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CNA2004800352931A 2003-11-28 2004-09-08 导电衬垫 Pending CN1886993A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020030085375 2003-11-28
KR1020030085375 2003-11-28
KR1020040060202 2004-07-30

Publications (1)

Publication Number Publication Date
CN1886993A true CN1886993A (zh) 2006-12-27

Family

ID=37248388

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800352931A Pending CN1886993A (zh) 2003-11-28 2004-09-08 导电衬垫

Country Status (2)

Country Link
KR (1) KR100692299B1 (ko)
CN (1) CN1886993A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100762854B1 (ko) * 2006-12-19 2007-10-02 주식회사 이송이엠씨 전자회로기판 표면 실장용 그라운드 폼 가스켓 및 그제조방법
KR200466484Y1 (ko) 2008-08-04 2013-04-17 홍성표 광접속함체용 메인 개스킷

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2710744B2 (ja) * 1993-06-08 1998-02-10 北川工業株式会社 電磁波シールド用ガスケット
JPH11354982A (ja) 1998-06-03 1999-12-24 Seiwa Electric Mfg Co Ltd 導電性繊維及び導電性布並びに導電性ガスケット

Also Published As

Publication number Publication date
KR20050052325A (ko) 2005-06-02
KR100692299B1 (ko) 2007-03-09

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Open date: 20061227