CN1856875A - 半导体器件及其制造方法、识别标签和信息载体 - Google Patents

半导体器件及其制造方法、识别标签和信息载体 Download PDF

Info

Publication number
CN1856875A
CN1856875A CNA2004800275808A CN200480027580A CN1856875A CN 1856875 A CN1856875 A CN 1856875A CN A2004800275808 A CNA2004800275808 A CN A2004800275808A CN 200480027580 A CN200480027580 A CN 200480027580A CN 1856875 A CN1856875 A CN 1856875A
Authority
CN
China
Prior art keywords
substrate
contact
layer
semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800275808A
Other languages
English (en)
Chinese (zh)
Inventor
罗纳德·德克尔
特奥多鲁斯·M·米希尔森
安东·M·H·汤姆博
约翰－海因里希·福克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN1856875A publication Critical patent/CN1856875A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
CNA2004800275808A 2003-09-24 2004-09-02 半导体器件及其制造方法、识别标签和信息载体 Pending CN1856875A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03103525 2003-09-24
EP03103525.6 2003-09-24

Publications (1)

Publication Number Publication Date
CN1856875A true CN1856875A (zh) 2006-11-01

Family

ID=34354579

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800275808A Pending CN1856875A (zh) 2003-09-24 2004-09-02 半导体器件及其制造方法、识别标签和信息载体

Country Status (5)

Country Link
EP (1) EP1668694A1 (fr)
JP (1) JP2007507101A (fr)
KR (1) KR20060098432A (fr)
CN (1) CN1856875A (fr)
WO (1) WO2005029578A1 (fr)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
JP2008502151A (ja) 2004-06-04 2008-01-24 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 印刷可能半導体素子を製造して組み立てるための方法及びデバイス
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
JP4956128B2 (ja) 2006-10-02 2012-06-20 ルネサスエレクトロニクス株式会社 電子装置の製造方法
JP2008091638A (ja) 2006-10-02 2008-04-17 Nec Electronics Corp 電子装置およびその製造方法
JP2008091639A (ja) 2006-10-02 2008-04-17 Nec Electronics Corp 電子装置およびその製造方法
CN105826345B (zh) 2007-01-17 2018-07-31 伊利诺伊大学评议会 通过基于印刷的组装制造的光学系统
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 伸縮可能な集積回路およびセンサアレイを有する装置
WO2010132552A1 (fr) 2009-05-12 2010-11-18 The Board Of Trustees Of The University Of Illinois Ensembles imprimés de diodes électroluminescentes inorganiques microscopiques ultraminces pour dispositifs d'affichage déformables et semi-transparents
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
WO2011084450A1 (fr) 2009-12-16 2011-07-14 The Board Of Trustees Of The University Of Illinois Électrophysiologie in vivo faisant intervenir des équipements électroniques conformes
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
CN102892356B (zh) 2010-03-17 2016-01-13 伊利诺伊大学评议会 基于生物可吸收基质的可植入生物医学装置
WO2012097163A1 (fr) 2011-01-14 2012-07-19 The Board Of Trustees Of The University Of Illinois Réseau de composants optiques ayant une courbure réglable
WO2012158709A1 (fr) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Barrettes de del à gestion thermique assemblées par impression
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
WO2012167096A2 (fr) 2011-06-03 2012-12-06 The Board Of Trustees Of The University Of Illinois Réseau d'électrodes de surface conformables, multiplexées de manière active et à haute densité, pour un interfaçage avec le cerveau
JP6231489B2 (ja) 2011-12-01 2017-11-15 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ プログラム可能な変化を被るように設計された遷移デバイス
EP2830492B1 (fr) 2012-03-30 2021-05-19 The Board of Trustees of the University of Illinois Dispositifs électroniques montables sur des appendices et conformables à des surfaces et procédé de fabrication correspondant
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
MX2017015587A (es) 2015-06-01 2018-08-23 Univ Illinois Metodo alternativo para sensor uv.
WO2016196675A1 (fr) 2015-06-01 2016-12-08 The Board Of Trustees Of The University Of Illinois Systèmes électroniques miniaturisés ayant des capacités de puissance sans fil et de communication en champ proche
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256562A (en) * 1990-12-31 1993-10-26 Kopin Corporation Method for manufacturing a semiconductor device using a circuit transfer film
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
JP3462166B2 (ja) * 2000-09-08 2003-11-05 富士通カンタムデバイス株式会社 化合物半導体装置

Also Published As

Publication number Publication date
EP1668694A1 (fr) 2006-06-14
KR20060098432A (ko) 2006-09-18
JP2007507101A (ja) 2007-03-22
WO2005029578A1 (fr) 2005-03-31

Similar Documents

Publication Publication Date Title
CN1856875A (zh) 半导体器件及其制造方法、识别标签和信息载体
CN1167131C (zh) 基底基板及制作用来装载多个半导体裸芯片器件的构造体的方法
TWI363437B (en) Light emitting diode package capable of providing electrostatic discharge circuit protection and process of making the same
CN1068546C (zh) 半导体器件
US7193263B2 (en) Electronic component having an integrated passive electronic component and associated production method
CN1191628C (zh) 具有交替的长焊盘和短焊盘的半导体器件
US7432133B2 (en) Plastic packaged device with die interface layer
CN1384543A (zh) 柔性集成单片电路
CN1753153A (zh) 半导体装置的制造方法
US20050161756A1 (en) Package of a semiconductor device with a flexible wiring substrate and method for the same
CN1893077A (zh) 半导体装置
JP4538107B2 (ja) 半導体素子及び金属化層を有する絶縁層が接着剤により取付られているガラス支持体を有する半導体装置
CN1591475A (zh) 半导体装置及其制造方法
CN1691342A (zh) 半导体器件
CN1862790A (zh) 半导体器件的制造方法以及半导体器件
CN1160290A (zh) 半导体晶片、半导体器件和半导体器件的制造方法
US20080079134A1 (en) Chip package, chip structure and manufacturing process thereof
US5753537A (en) Method of manufacturing a semiconductor device for surface mounting
EP1298725A3 (fr) Dispositif semi-conducteur ayant une métallisation d'interconnexion multicouche et son procédé de fabrication
CN1809919A (zh) 电子器件、组件及制造电子器件的方法
WO2007038343A9 (fr) Dispositif semi-conducteur de puissance presentant un composant passif integre
CN1550042A (zh) 具有变薄前挖空的接触孔的彩色图像传感器的制造方法
CN1550041A (zh) 位于透明基片上的彩色图像传感器及其制造方法
EP2866258A3 (fr) Dispositif de semi-conducteurs et son procédé de fabrication
CN1790703A (zh) 半导体装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication