CN1849182A - 用过饱和清洁溶液进行强超声波清洁 - Google Patents

用过饱和清洁溶液进行强超声波清洁 Download PDF

Info

Publication number
CN1849182A
CN1849182A CNA2004800205237A CN200480020523A CN1849182A CN 1849182 A CN1849182 A CN 1849182A CN A2004800205237 A CNA2004800205237 A CN A2004800205237A CN 200480020523 A CN200480020523 A CN 200480020523A CN 1849182 A CN1849182 A CN 1849182A
Authority
CN
China
Prior art keywords
solution
gas
cleaning
substrate
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800205237A
Other languages
English (en)
Chinese (zh)
Inventor
C·S·弗兰克林
Y·吴
B·弗雷泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goldfinger Technologies LLC
Original Assignee
Goldfinger Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goldfinger Technologies LLC filed Critical Goldfinger Technologies LLC
Publication of CN1849182A publication Critical patent/CN1849182A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CNA2004800205237A 2003-06-11 2004-06-10 用过饱和清洁溶液进行强超声波清洁 Pending CN1849182A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47760203P 2003-06-11 2003-06-11
US60/477,602 2003-06-11

Publications (1)

Publication Number Publication Date
CN1849182A true CN1849182A (zh) 2006-10-18

Family

ID=34061915

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800205237A Pending CN1849182A (zh) 2003-06-11 2004-06-10 用过饱和清洁溶液进行强超声波清洁

Country Status (6)

Country Link
EP (1) EP1631396A4 (https=)
JP (1) JP4643582B2 (https=)
KR (1) KR101110905B1 (https=)
CN (1) CN1849182A (https=)
TW (1) TWI330552B (https=)
WO (1) WO2005006396A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102119060A (zh) * 2008-08-20 2011-07-06 株式会社海上 超声波清洗装置
CN102781596A (zh) * 2010-02-25 2012-11-14 丰田自动车株式会社 用于诸如车辆的大型产品的微气泡清洁系统
CN119376198A (zh) * 2023-11-10 2025-01-28 深圳市昇维旭技术有限公司 光刻胶去除方法和系统

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108641A (ko) * 2000-05-30 2001-12-08 강병근 무우를 주재로한 건강음료 및 그 제조방법
KR20020037177A (ko) * 2000-11-13 2002-05-18 김용현 무를 첨가한 꿀음료
KR100827618B1 (ko) * 2006-05-11 2008-05-07 한국기계연구원 세정용 초음파 장치 및 이를 이용한 초음파 세정시스템
US7969548B2 (en) * 2006-05-22 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and lithographic apparatus cleaning method
JPWO2008050832A1 (ja) * 2006-10-27 2010-02-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法、プログラム、および記録媒体
KR100748480B1 (ko) * 2007-06-27 2007-08-10 한국기계연구원 세정용 초음파 장치를 이용한 초음파 세정시스템
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
JP6678448B2 (ja) * 2015-12-22 2020-04-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置
WO2020095091A1 (en) * 2018-11-06 2020-05-14 Arcelormittal Equipment improving the ultrasound cleaning
JP7233691B2 (ja) * 2019-03-28 2023-03-07 株式会社エアレックス 低温物品の除染方法及びこれに使用するパスボックス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368054A (en) 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
JPH1022246A (ja) 1996-07-04 1998-01-23 Tadahiro Omi 洗浄方法
CN1299333C (zh) * 1996-08-20 2007-02-07 奥加诺株式会社 清洗电子元件或其制造设备的元件的方法和装置
US5800626A (en) 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US5849091A (en) 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US6167891B1 (en) * 1999-05-25 2001-01-02 Infineon Technologies North America Corp. Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers
JP3322853B2 (ja) 1999-08-10 2002-09-09 株式会社プレテック 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法
US6743301B2 (en) * 1999-12-24 2004-06-01 mFSI Ltd. Substrate treatment process and apparatus
US6684890B2 (en) 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
US20030084916A1 (en) * 2001-10-18 2003-05-08 Sonia Gaaloul Ultrasonic cleaning products comprising cleaning composition having dissolved gas

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102119060A (zh) * 2008-08-20 2011-07-06 株式会社海上 超声波清洗装置
CN102119060B (zh) * 2008-08-20 2014-07-16 株式会社海上 超声波清洗装置
CN102781596A (zh) * 2010-02-25 2012-11-14 丰田自动车株式会社 用于诸如车辆的大型产品的微气泡清洁系统
CN102781596B (zh) * 2010-02-25 2014-10-22 丰田自动车株式会社 用于诸如车辆的大型产品的微气泡清洁系统
CN119376198A (zh) * 2023-11-10 2025-01-28 深圳市昇维旭技术有限公司 光刻胶去除方法和系统
CN119376198B (zh) * 2023-11-10 2026-01-06 深圳市昇维旭技术有限公司 光刻胶去除方法和系统

Also Published As

Publication number Publication date
JP2007502032A (ja) 2007-02-01
WO2005006396A3 (en) 2005-09-15
JP4643582B2 (ja) 2011-03-02
EP1631396A2 (en) 2006-03-08
KR20060037270A (ko) 2006-05-03
KR101110905B1 (ko) 2012-02-20
WO2005006396A2 (en) 2005-01-20
EP1631396A4 (en) 2013-08-14
TW200507954A (en) 2005-03-01
TWI330552B (en) 2010-09-21

Similar Documents

Publication Publication Date Title
US6457478B1 (en) Method for treating an object using ultra-violet light
CN102725824B (zh) 改进的超声波清洁液，方法及其设备
JP4603542B2 (ja) 腐食液を使用する超音波補助式エッチング
EP0839586B1 (en) A cleaning apparatus and a cleaning method
CN1849182A (zh) 用过饱和清洁溶液进行强超声波清洁
US6272768B1 (en) Apparatus for treating an object using ultra-violet light
JPH1027771A (ja) 洗浄方法及び洗浄装置
JPH0653193A (ja) プラズマ反応容器のクリーニングに有用なオゾンを用いた炭素系ポリマー残留物の除去
CN1276271A (zh) 特超声清洗半导体晶片中的去离子水温控去气
WO2008008921A2 (en) Tranducer assembly incorporating a transmitter having through holes, and method of cleaning
US7682457B2 (en) Frontside structure damage protected megasonics clean
KR20000063022A (ko) 다공질체의 세정방법 및 다공질체, 비다공질막 및접합기판의 제작방법
US12062556B2 (en) Methods and apparatus for cleaning semiconductor wafers
US7578302B2 (en) Megasonic cleaning using supersaturated solution
TWI732450B (zh) 基板處理方法、半導體製造方法以及基板處理裝置
JP2007502032A5 (https=)
JP2010118498A (ja) 基板処理方法および基板処理装置
JPH01200628A (ja) ドライエッチング方法
JPS62165938A (ja) 処理方法
CN1291921A (zh) 一种利用控制气体浓度的处理液湿法处理电子元件的方法
JP2006073902A (ja) 基板表面の異物検出方法及び基板表面処理方法
JPH08276163A (ja) 板状試料表面の処理方法
TW202603872A (zh) 基板處理方法及基板處理裝置
CN103223405A (zh) 清洗方法
Kumari Control of cavitation using dissolved carbon dioxide for damage-free megasonic cleaning of wafers

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20061018