TW200507954A - Megasonic cleaning using supersaturated cleaning solution - Google Patents

Megasonic cleaning using supersaturated cleaning solution

Info

Publication number
TW200507954A
TW200507954A TW093116958A TW93116958A TW200507954A TW 200507954 A TW200507954 A TW 200507954A TW 093116958 A TW093116958 A TW 093116958A TW 93116958 A TW93116958 A TW 93116958A TW 200507954 A TW200507954 A TW 200507954A
Authority
TW
Taiwan
Prior art keywords
megasonic
cleaning
substrates
carbon dioxide
supersaturated
Prior art date
Application number
TW093116958A
Other languages
Chinese (zh)
Other versions
TWI330552B (en
Inventor
Cole S Franklin
Yi Wu
Brian Fraser
Original Assignee
Goldfinger Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goldfinger Technologies Llc filed Critical Goldfinger Technologies Llc
Publication of TW200507954A publication Critical patent/TW200507954A/en
Application granted granted Critical
Publication of TWI330552B publication Critical patent/TWI330552B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.
TW093116958A 2003-06-11 2004-06-11 Megasonic cleaning using supersaturated cleaning solution TWI330552B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47760203P 2003-06-11 2003-06-11

Publications (2)

Publication Number Publication Date
TW200507954A true TW200507954A (en) 2005-03-01
TWI330552B TWI330552B (en) 2010-09-21

Family

ID=34061915

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116958A TWI330552B (en) 2003-06-11 2004-06-11 Megasonic cleaning using supersaturated cleaning solution

Country Status (6)

Country Link
EP (1) EP1631396A4 (en)
JP (1) JP4643582B2 (en)
KR (1) KR101110905B1 (en)
CN (1) CN1849182A (en)
TW (1) TWI330552B (en)
WO (1) WO2005006396A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564112B (en) * 2012-12-28 2017-01-01 荏原製作所股份有限公司 Polishing apparatus

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108641A (en) * 2000-05-30 2001-12-08 강병근 Healthy beverage with radish and manufacturing method thereof
KR20020037177A (en) * 2000-11-13 2002-05-18 김용현 Honey drink added radish
KR100827618B1 (en) * 2006-05-11 2008-05-07 한국기계연구원 Ultrasonic device for cleaning and ultrasonic cleaning system using the same
US7969548B2 (en) * 2006-05-22 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and lithographic apparatus cleaning method
WO2008050832A1 (en) * 2006-10-27 2008-05-02 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, program and recording medium
KR100748480B1 (en) * 2007-06-27 2007-08-10 한국기계연구원 Ultrasonic device for cleaning and ultrasonic cleaning system using the same
JP4532580B2 (en) 2008-08-20 2010-08-25 株式会社カイジョー Ultrasonic cleaning equipment
JP4915455B2 (en) * 2010-02-25 2012-04-11 トヨタ自動車株式会社 Degreasing system using microbubbles for large products such as vehicles
JP6678448B2 (en) * 2015-12-22 2020-04-08 株式会社Ｓｃｒｅｅｎホールディングス Substrate cleaning method and substrate cleaning apparatus
WO2020095091A1 (en) * 2018-11-06 2020-05-14 Arcelormittal Equipment improving the ultrasound cleaning
JP7233691B2 (en) * 2019-03-28 2023-03-07 株式会社エアレックス Decontamination method for low-temperature goods and pass box used for this

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
JPH1022246A (en) 1996-07-04 1998-01-23 Tadahiro Omi Cleaning method
CN1299333C (en) * 1996-08-20 2007-02-07 奥加诺株式会社 Method and device for cleaning electronic element or its mfg. equipment element
US5800626A (en) 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US5849091A (en) 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US6167891B1 (en) 1999-05-25 2001-01-02 Infineon Technologies North America Corp. Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers
JP3322853B2 (en) * 1999-08-10 2002-09-09 株式会社プレテック Substrate drying device and cleaning device, and drying method and cleaning method
US6743301B2 (en) * 1999-12-24 2004-06-01 mFSI Ltd. Substrate treatment process and apparatus
US6684890B2 (en) 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
US20030084916A1 (en) * 2001-10-18 2003-05-08 Sonia Gaaloul Ultrasonic cleaning products comprising cleaning composition having dissolved gas

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564112B (en) * 2012-12-28 2017-01-01 荏原製作所股份有限公司 Polishing apparatus

Also Published As

Publication number Publication date
TWI330552B (en) 2010-09-21
WO2005006396A2 (en) 2005-01-20
KR20060037270A (en) 2006-05-03
KR101110905B1 (en) 2012-02-20
CN1849182A (en) 2006-10-18
JP2007502032A (en) 2007-02-01
WO2005006396A3 (en) 2005-09-15
EP1631396A2 (en) 2006-03-08
EP1631396A4 (en) 2013-08-14
JP4643582B2 (en) 2011-03-02

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