CN1849182A - 用过饱和清洁溶液进行强超声波清洁 - Google Patents

用过饱和清洁溶液进行强超声波清洁 Download PDF

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Publication number
CN1849182A
CN1849182A CNA2004800205237A CN200480020523A CN1849182A CN 1849182 A CN1849182 A CN 1849182A CN A2004800205237 A CNA2004800205237 A CN A2004800205237A CN 200480020523 A CN200480020523 A CN 200480020523A CN 1849182 A CN1849182 A CN 1849182A
Authority
CN
China
Prior art keywords
solution
gas
substrate
dissolved
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800205237A
Other languages
English (en)
Chinese (zh)
Inventor
C·S·弗兰克林
Y·吴
B·弗雷泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goldfinger Technologies LLC
Akrion Inc
Original Assignee
Akrion Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akrion Inc filed Critical Akrion Inc
Publication of CN1849182A publication Critical patent/CN1849182A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CNA2004800205237A 2003-06-11 2004-06-10 用过饱和清洁溶液进行强超声波清洁 Pending CN1849182A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47760203P 2003-06-11 2003-06-11
US60/477,602 2003-06-11

Publications (1)

Publication Number Publication Date
CN1849182A true CN1849182A (zh) 2006-10-18

Family

ID=34061915

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800205237A Pending CN1849182A (zh) 2003-06-11 2004-06-10 用过饱和清洁溶液进行强超声波清洁

Country Status (6)

Country Link
EP (1) EP1631396A4 (enrdf_load_stackoverflow)
JP (1) JP4643582B2 (enrdf_load_stackoverflow)
KR (1) KR101110905B1 (enrdf_load_stackoverflow)
CN (1) CN1849182A (enrdf_load_stackoverflow)
TW (1) TWI330552B (enrdf_load_stackoverflow)
WO (1) WO2005006396A2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102119060A (zh) * 2008-08-20 2011-07-06 株式会社海上 超声波清洗装置
CN102781596A (zh) * 2010-02-25 2012-11-14 丰田自动车株式会社 用于诸如车辆的大型产品的微气泡清洁系统

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108641A (ko) * 2000-05-30 2001-12-08 강병근 무우를 주재로한 건강음료 및 그 제조방법
KR20020037177A (ko) * 2000-11-13 2002-05-18 김용현 무를 첨가한 꿀음료
KR100827618B1 (ko) * 2006-05-11 2008-05-07 한국기계연구원 세정용 초음파 장치 및 이를 이용한 초음파 세정시스템
US7969548B2 (en) * 2006-05-22 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and lithographic apparatus cleaning method
JPWO2008050832A1 (ja) * 2006-10-27 2010-02-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法、プログラム、および記録媒体
KR100748480B1 (ko) * 2007-06-27 2007-08-10 한국기계연구원 세정용 초음파 장치를 이용한 초음파 세정시스템
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
JP6678448B2 (ja) * 2015-12-22 2020-04-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置
WO2020095091A1 (en) * 2018-11-06 2020-05-14 Arcelormittal Equipment improving the ultrasound cleaning
JP7233691B2 (ja) * 2019-03-28 2023-03-07 株式会社エアレックス 低温物品の除染方法及びこれに使用するパスボックス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
JPH1022246A (ja) 1996-07-04 1998-01-23 Tadahiro Omi 洗浄方法
CN1163946C (zh) * 1996-08-20 2004-08-25 奥加诺株式会社 清洗电子元件或其制造设备的元件的方法和装置
US5800626A (en) 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US5849091A (en) 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US6167891B1 (en) 1999-05-25 2001-01-02 Infineon Technologies North America Corp. Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers
JP3322853B2 (ja) * 1999-08-10 2002-09-09 株式会社プレテック 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法
US6743301B2 (en) 1999-12-24 2004-06-01 mFSI Ltd. Substrate treatment process and apparatus
US6684890B2 (en) 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
US20030084916A1 (en) * 2001-10-18 2003-05-08 Sonia Gaaloul Ultrasonic cleaning products comprising cleaning composition having dissolved gas

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102119060A (zh) * 2008-08-20 2011-07-06 株式会社海上 超声波清洗装置
CN102119060B (zh) * 2008-08-20 2014-07-16 株式会社海上 超声波清洗装置
CN102781596A (zh) * 2010-02-25 2012-11-14 丰田自动车株式会社 用于诸如车辆的大型产品的微气泡清洁系统
CN102781596B (zh) * 2010-02-25 2014-10-22 丰田自动车株式会社 用于诸如车辆的大型产品的微气泡清洁系统

Also Published As

Publication number Publication date
JP2007502032A (ja) 2007-02-01
EP1631396A2 (en) 2006-03-08
KR20060037270A (ko) 2006-05-03
TWI330552B (en) 2010-09-21
JP4643582B2 (ja) 2011-03-02
EP1631396A4 (en) 2013-08-14
WO2005006396A2 (en) 2005-01-20
WO2005006396A3 (en) 2005-09-15
TW200507954A (en) 2005-03-01
KR101110905B1 (ko) 2012-02-20

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20061018