KR101110905B1 - 과포화된 세정 용액을 사용한 메가소닉 세정 - Google Patents

과포화된 세정 용액을 사용한 메가소닉 세정 Download PDF

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Publication number
KR101110905B1
KR101110905B1 KR1020057023902A KR20057023902A KR101110905B1 KR 101110905 B1 KR101110905 B1 KR 101110905B1 KR 1020057023902 A KR1020057023902 A KR 1020057023902A KR 20057023902 A KR20057023902 A KR 20057023902A KR 101110905 B1 KR101110905 B1 KR 101110905B1
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KR
South Korea
Prior art keywords
gas
substrate
cleaning
solution
cleaning liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020057023902A
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English (en)
Korean (ko)
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KR20060037270A (ko
Inventor
콜 에스 프랭클린
이 우
브라이언 프레이저
Original Assignee
아크리온 테크놀로지즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of KR20060037270A publication Critical patent/KR20060037270A/ko
Application granted granted Critical
Publication of KR101110905B1 publication Critical patent/KR101110905B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020057023902A 2003-06-11 2004-06-10 과포화된 세정 용액을 사용한 메가소닉 세정 Expired - Lifetime KR101110905B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US47760203P 2003-06-11 2003-06-11
US60/477,602 2003-06-11
PCT/US2004/018464 WO2005006396A2 (en) 2003-06-11 2004-06-10 Megasonic cleaning using supersaturated cleaning solution

Publications (2)

Publication Number Publication Date
KR20060037270A KR20060037270A (ko) 2006-05-03
KR101110905B1 true KR101110905B1 (ko) 2012-02-20

Family

ID=34061915

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057023902A Expired - Lifetime KR101110905B1 (ko) 2003-06-11 2004-06-10 과포화된 세정 용액을 사용한 메가소닉 세정

Country Status (6)

Country Link
EP (1) EP1631396A4 (enrdf_load_stackoverflow)
JP (1) JP4643582B2 (enrdf_load_stackoverflow)
KR (1) KR101110905B1 (enrdf_load_stackoverflow)
CN (1) CN1849182A (enrdf_load_stackoverflow)
TW (1) TWI330552B (enrdf_load_stackoverflow)
WO (1) WO2005006396A2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108641A (ko) * 2000-05-30 2001-12-08 강병근 무우를 주재로한 건강음료 및 그 제조방법
KR20020037177A (ko) * 2000-11-13 2002-05-18 김용현 무를 첨가한 꿀음료

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100827618B1 (ko) * 2006-05-11 2008-05-07 한국기계연구원 세정용 초음파 장치 및 이를 이용한 초음파 세정시스템
US7969548B2 (en) * 2006-05-22 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and lithographic apparatus cleaning method
JPWO2008050832A1 (ja) * 2006-10-27 2010-02-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法、プログラム、および記録媒体
KR100748480B1 (ko) * 2007-06-27 2007-08-10 한국기계연구원 세정용 초음파 장치를 이용한 초음파 세정시스템
JP4532580B2 (ja) * 2008-08-20 2010-08-25 株式会社カイジョー 超音波洗浄装置
JP4915455B2 (ja) * 2010-02-25 2012-04-11 トヨタ自動車株式会社 車両等大型製品のマイクロバブルによる脱脂システム
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
JP6678448B2 (ja) * 2015-12-22 2020-04-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置
WO2020095091A1 (en) * 2018-11-06 2020-05-14 Arcelormittal Equipment improving the ultrasound cleaning
JP7233691B2 (ja) * 2019-03-28 2023-03-07 株式会社エアレックス 低温物品の除染方法及びこれに使用するパスボックス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015474A (ja) 1999-05-25 2001-01-19 Infineon Technol North America Corp 半導体ウエハの超音波洗浄用脱イオン水の脱ガス処理方法及びそのための装置
JP2001053051A (ja) 1999-08-10 2001-02-23 Pre-Tech Co Ltd 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
JPH1022246A (ja) 1996-07-04 1998-01-23 Tadahiro Omi 洗浄方法
CN1163946C (zh) * 1996-08-20 2004-08-25 奥加诺株式会社 清洗电子元件或其制造设备的元件的方法和装置
US5800626A (en) 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US5849091A (en) 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US6743301B2 (en) 1999-12-24 2004-06-01 mFSI Ltd. Substrate treatment process and apparatus
US6684890B2 (en) 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
US20030084916A1 (en) * 2001-10-18 2003-05-08 Sonia Gaaloul Ultrasonic cleaning products comprising cleaning composition having dissolved gas

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015474A (ja) 1999-05-25 2001-01-19 Infineon Technol North America Corp 半導体ウエハの超音波洗浄用脱イオン水の脱ガス処理方法及びそのための装置
JP2001053051A (ja) 1999-08-10 2001-02-23 Pre-Tech Co Ltd 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108641A (ko) * 2000-05-30 2001-12-08 강병근 무우를 주재로한 건강음료 및 그 제조방법
KR20020037177A (ko) * 2000-11-13 2002-05-18 김용현 무를 첨가한 꿀음료

Also Published As

Publication number Publication date
JP2007502032A (ja) 2007-02-01
EP1631396A2 (en) 2006-03-08
KR20060037270A (ko) 2006-05-03
CN1849182A (zh) 2006-10-18
TWI330552B (en) 2010-09-21
JP4643582B2 (ja) 2011-03-02
EP1631396A4 (en) 2013-08-14
WO2005006396A2 (en) 2005-01-20
WO2005006396A3 (en) 2005-09-15
TW200507954A (en) 2005-03-01

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