CN1842810A - 制造模块桥接器的方法 - Google Patents

制造模块桥接器的方法 Download PDF

Info

Publication number
CN1842810A
CN1842810A CN 200480024281 CN200480024281A CN1842810A CN 1842810 A CN1842810 A CN 1842810A CN 200480024281 CN200480024281 CN 200480024281 CN 200480024281 A CN200480024281 A CN 200480024281A CN 1842810 A CN1842810 A CN 1842810A
Authority
CN
China
Prior art keywords
chip module
travelling belt
contact layer
recess
connection element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200480024281
Other languages
English (en)
Chinese (zh)
Inventor
拉尔夫·戈德
沃尔克·布罗德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MILLBAUER AG (
Muehlbauer GmbH and Co KG
Original Assignee
MILLBAUER AG (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MILLBAUER AG ( filed Critical MILLBAUER AG (
Publication of CN1842810A publication Critical patent/CN1842810A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Combinations Of Printed Boards (AREA)
CN 200480024281 2003-08-26 2004-08-24 制造模块桥接器的方法 Pending CN1842810A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10339547.4 2003-08-26
DE10339547 2003-08-26
DE10358422.6 2003-12-13

Publications (1)

Publication Number Publication Date
CN1842810A true CN1842810A (zh) 2006-10-04

Family

ID=34258246

Family Applications (2)

Application Number Title Priority Date Filing Date
CN 200480024202 Pending CN1842809A (zh) 2003-08-26 2004-08-24 智能标签的模块桥接器
CN 200480024281 Pending CN1842810A (zh) 2003-08-26 2004-08-24 制造模块桥接器的方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN 200480024202 Pending CN1842809A (zh) 2003-08-26 2004-08-24 智能标签的模块桥接器

Country Status (2)

Country Link
CN (2) CN1842809A (de)
DE (2) DE10358422B3 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006008948B3 (de) * 2006-02-23 2007-10-04 Mühlbauer Ag Verfahren zum Aufbringen und elektrischen Kontaktieren von elektronischen Bauteilen auf eine Substratbahn
US7828217B2 (en) 2006-03-27 2010-11-09 Muhlbauer Ag Method and device for producing RFID smart labels or smart label inlays
DE102006014437B4 (de) * 2006-03-27 2010-03-11 Mühlbauer Ag Verfahren und Vorrichtung zur Herstellung von RFID-Smart-Labels oder Smart-Label-Inlays
DE102009022299B4 (de) * 2008-05-26 2014-07-17 Technische Universität Chemnitz Verfahren und Vorrichtung zum Aufbringen eines elektronischen Bauelements auf ein Substrat

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544989A (en) * 1980-06-30 1985-10-01 Sharp Kabushiki Kaisha Thin assembly for wiring substrate
FR2641102B1 (de) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
DE19912201C2 (de) * 1999-01-14 2000-12-14 Pav Card Gmbh Verfahren zur Herstellung einer flexiblen Ident-Anordung mit drahtloser Signalübertragung, insbesondere Smart-Label, sowie vorfertigbares streifenförmiges Modul für eine flexible Ident-Anordung, insbesondere Smart-Label
EP1039543B1 (de) * 1999-03-24 2014-02-26 Motorola Solutions, Inc. Schaltungschip-Verbinder und Verbindungsmethode eines solchen
DE19915765C2 (de) * 1999-04-08 2001-06-21 Cubit Electronics Gmbh Kontaktloser Transponder und Verfahren zu seiner Herstellung
DE19920593B4 (de) * 1999-05-05 2006-07-13 Assa Abloy Identification Technology Group Ab Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls
FR2795204B1 (fr) * 1999-06-17 2001-08-31 Gemplus Card Int Procede pour la fabrication d'un support de memorisation comportant une grille de metallisation tridimensionnelle support obtenu
DE10014620A1 (de) * 2000-03-24 2001-09-27 Andreas Plettner Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente
DE10105164A1 (de) * 2000-11-06 2002-05-16 Manfred Michalk Verfahren und Vorrichtung zum Kontaktieren von Halbleiterchips
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
DE10136359C2 (de) * 2001-07-26 2003-06-12 Muehlbauer Ag Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders

Also Published As

Publication number Publication date
DE10358423A1 (de) 2005-04-07
DE10358422B3 (de) 2005-04-28
DE10358423B4 (de) 2006-09-21
CN1842809A (zh) 2006-10-04

Similar Documents

Publication Publication Date Title
CN1214344C (zh) 电子模块或标签及其制造方法、包括这种模块或标签的介质
KR100967856B1 (ko) 알에프아이디 라벨 기술
CN100428434C (zh) Ic芯片安装方法
CN107293628B (zh) 半导体封装结构及制造其之方法
EP3314646B1 (de) Verfahren zur oberflächenmontage von komponenten
US20020042189A1 (en) Manufacturing method of semiconductor chip with adhesive agent
CN1350329A (zh) 半导体装置及其制造方法和安装方法
CN1183585C (zh) 半导体器件的制造方法
CN100410343C (zh) 用于制造供半导体生产使用的胶带的装置和方法
CN1092399C (zh) 半导体装置的制造方法
CN1842810A (zh) 制造模块桥接器的方法
TWI296392B (de)
CN1835001A (zh) 射频识别标签、模块组件及射频识别标签的制造方法
CN217554440U (zh) 贴标机
US20060289979A1 (en) Bridge modules for smart labels
CN1286172A (zh) 制造薄膜喷墨打印头的方法
US20060261957A1 (en) Method for producing bridge modules
CN1101597C (zh) 片上引线式半导体芯片封装及其制作方法
CN111696975B (zh) 一种led显示模组封装方法
CN219888434U (zh) 电子产品的一体转帖治具
CN100377374C (zh) 发光二极管引线架的制造方法
CN218004896U (zh) 一种led灯珠封装支架
CN111863772A (zh) 定位方法、封装组件及封装结构
CN102403241A (zh) Lga的双面塑封方法
TWI444121B (zh) 電路板的製作方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication