CN1820371A - 用于显示设备的封装结构 - Google Patents
用于显示设备的封装结构 Download PDFInfo
- Publication number
- CN1820371A CN1820371A CNA2004800197334A CN200480019733A CN1820371A CN 1820371 A CN1820371 A CN 1820371A CN A2004800197334 A CNA2004800197334 A CN A2004800197334A CN 200480019733 A CN200480019733 A CN 200480019733A CN 1820371 A CN1820371 A CN 1820371A
- Authority
- CN
- China
- Prior art keywords
- encapsulating structure
- display device
- arbitrary
- stabilizing layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 230000000087 stabilizing effect Effects 0.000 claims description 58
- 238000010276 construction Methods 0.000 claims description 51
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 238000007641 inkjet printing Methods 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
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- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 4
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 4
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- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 abstract 2
- 230000003678 scratch resistant effect Effects 0.000 abstract 2
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- 229920002120 photoresistant polymer Polymers 0.000 description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 18
- 239000004922 lacquer Substances 0.000 description 12
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 238000003384 imaging method Methods 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
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- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03102120.7 | 2003-07-11 | ||
EP03102120 | 2003-07-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1820371A true CN1820371A (zh) | 2006-08-16 |
CN100550401C CN100550401C (zh) | 2009-10-14 |
Family
ID=34042945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800197334A Expired - Lifetime CN100550401C (zh) | 2003-07-11 | 2004-07-09 | 用于显示设备的封装结构 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7710032B2 (zh) |
EP (1) | EP1647056B1 (zh) |
JP (1) | JP5138930B2 (zh) |
KR (1) | KR101315080B1 (zh) |
CN (1) | CN100550401C (zh) |
TW (1) | TWI349343B (zh) |
WO (1) | WO2005006441A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102341431A (zh) * | 2009-03-04 | 2012-02-01 | 思研(Sri)国际顾问与咨询公司 | 用于有机电装置的封装方法和介电层 |
CN104241206A (zh) * | 2013-06-13 | 2014-12-24 | 财团法人工业技术研究院 | 基板结构 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070164673A1 (en) * | 2006-01-18 | 2007-07-19 | Au Optronics Corporation | Organic electro-luminescent display device and method for making same |
EP1994577A1 (en) | 2006-03-03 | 2008-11-26 | Philips Intellectual Property & Standards GmbH | Electroluminescent arrangement |
CN102084515A (zh) * | 2007-05-24 | 2011-06-01 | 皇家飞利浦电子股份有限公司 | 用于电子薄膜器件的封装 |
US8644011B2 (en) * | 2009-02-06 | 2014-02-04 | Kevin Parkinson | Electronic device cover and method of making same |
US20110008525A1 (en) * | 2009-07-10 | 2011-01-13 | General Electric Company | Condensation and curing of materials within a coating system |
KR101569406B1 (ko) * | 2009-08-19 | 2015-11-17 | 주성엔지니어링(주) | 유기 발광 소자 및 이의 제조 방법 |
US9853245B2 (en) | 2011-10-14 | 2017-12-26 | Samsung Display Co., Ltd. | Organic light emitting diode display and method for manufacturing the same |
JP5798886B2 (ja) * | 2011-10-27 | 2015-10-21 | 株式会社カネカ | 有機el装置の製造方法 |
KR101772135B1 (ko) | 2013-06-29 | 2017-09-12 | 아익스트론 에스이 | 고성능 코팅들을 증착하기 위한 방법 및 캡슐화된 전자 디바이스들 |
DE102014223367A1 (de) * | 2014-11-17 | 2016-05-19 | Osram Oled Gmbh | Organische Leuchtiode, organisches Leuchtmodul und Verfahren zur Herstellung einer organischen Leuchtiode |
KR20210075727A (ko) | 2019-12-13 | 2021-06-23 | 삼성전자주식회사 | 하프늄 산화물을 포함하는 박막 구조체, 이를 포함하는 전자 소자 및 그 제조 방법 |
Family Cites Families (26)
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EP0449478A3 (en) * | 1990-03-29 | 1992-11-25 | Microtime Inc. | 3d video special effects system |
US6384859B1 (en) * | 1995-03-29 | 2002-05-07 | Sanyo Electric Co., Ltd. | Methods for creating an image for a three-dimensional display, for calculating depth information and for image processing using the depth information |
DE19603746A1 (de) * | 1995-10-20 | 1997-04-24 | Bosch Gmbh Robert | Elektrolumineszierendes Schichtsystem |
US6114186A (en) | 1996-07-30 | 2000-09-05 | Texas Instruments Incorporated | Hydrogen silsesquioxane thin films for low capacitance structures in integrated circuits |
JP3278386B2 (ja) * | 1996-09-11 | 2002-04-30 | キヤノン株式会社 | 配線基板の製造方法及び液晶素子の製造方法。 |
US5872355A (en) * | 1997-04-09 | 1999-02-16 | Hewlett-Packard Company | Electroluminescent device and fabrication method for a light detection system |
US6356297B1 (en) * | 1998-01-15 | 2002-03-12 | International Business Machines Corporation | Method and apparatus for displaying panoramas with streaming video |
US6504569B1 (en) * | 1998-04-22 | 2003-01-07 | Grass Valley (U.S.), Inc. | 2-D extended image generation from 3-D data extracted from a video sequence |
GB9810553D0 (en) | 1998-05-15 | 1998-07-15 | Tricorder Technology Plc | Method and apparatus for 3D representation |
GB2352901A (en) | 1999-05-12 | 2001-02-07 | Tricorder Technology Plc | Rendering three dimensional representations utilising projected light patterns |
US6275253B1 (en) * | 1998-07-09 | 2001-08-14 | Canon Kabushiki Kaisha | Stereographic image compression with image moment normalization |
US6069087A (en) * | 1998-08-25 | 2000-05-30 | Micron Technology, Inc. | Highly selective dry etching process |
GB9823689D0 (en) | 1998-10-30 | 1998-12-23 | Greenagate Limited | Improved methods and apparatus for 3-D imaging |
EP1524708A3 (en) * | 1998-12-16 | 2006-07-26 | Battelle Memorial Institute | Environmental barrier material and methods of making. |
GB2354389A (en) | 1999-09-15 | 2001-03-21 | Sharp Kk | Stereo images with comfortable perceived depth |
US6573652B1 (en) * | 1999-10-25 | 2003-06-03 | Battelle Memorial Institute | Encapsulated display devices |
US6413645B1 (en) * | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
US6674484B1 (en) | 2000-01-10 | 2004-01-06 | Koninklijke Philips Electronics N.V. | Video sample rate conversion to achieve 3-D effects |
CA2418089A1 (en) * | 2000-08-04 | 2002-02-14 | Dynamic Digital Depth Research Pty Ltd. | Image conversion and encoding technique |
JP3405335B2 (ja) * | 2000-11-27 | 2003-05-12 | 株式会社デンソー | 有機el素子 |
US6624568B2 (en) * | 2001-03-28 | 2003-09-23 | Universal Display Corporation | Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices |
US6692326B2 (en) | 2001-06-16 | 2004-02-17 | Cld, Inc. | Method of making organic electroluminescent display |
JP2003017244A (ja) * | 2001-07-05 | 2003-01-17 | Sony Corp | 有機電界発光素子およびその製造方法 |
KR100413450B1 (ko) * | 2001-07-20 | 2003-12-31 | 엘지전자 주식회사 | 표시소자의 보호막 구조 |
US7071613B2 (en) * | 2001-10-10 | 2006-07-04 | Lg.Philips Lcd Co., Ltd. | Organic electroluminescent device |
EP1459394B1 (en) * | 2001-12-13 | 2014-10-29 | Koninklijke Philips N.V. | Sealing structure for display devices |
-
2004
- 2004-07-09 JP JP2006518483A patent/JP5138930B2/ja not_active Expired - Lifetime
- 2004-07-09 WO PCT/IB2004/051182 patent/WO2005006441A1/en active Application Filing
- 2004-07-09 TW TW093120777A patent/TWI349343B/zh not_active IP Right Cessation
- 2004-07-09 CN CNB2004800197334A patent/CN100550401C/zh not_active Expired - Lifetime
- 2004-07-09 US US10/563,931 patent/US7710032B2/en active Active
- 2004-07-09 EP EP04744542.4A patent/EP1647056B1/en not_active Expired - Lifetime
- 2004-07-09 KR KR1020067000398A patent/KR101315080B1/ko active IP Right Grant
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102341431A (zh) * | 2009-03-04 | 2012-02-01 | 思研(Sri)国际顾问与咨询公司 | 用于有机电装置的封装方法和介电层 |
CN102341431B (zh) * | 2009-03-04 | 2014-04-30 | 思研(Sri)国际顾问与咨询公司 | 用于有机电装置的封装方法和介电层 |
CN104241206A (zh) * | 2013-06-13 | 2014-12-24 | 财团法人工业技术研究院 | 基板结构 |
CN104241206B (zh) * | 2013-06-13 | 2017-12-01 | 财团法人工业技术研究院 | 基板结构 |
Also Published As
Publication number | Publication date |
---|---|
JP2007528018A (ja) | 2007-10-04 |
WO2005006441A1 (en) | 2005-01-20 |
US7710032B2 (en) | 2010-05-04 |
TWI349343B (en) | 2011-09-21 |
EP1647056B1 (en) | 2017-04-12 |
KR101315080B1 (ko) | 2013-10-08 |
TW200511533A (en) | 2005-03-16 |
US20060159862A1 (en) | 2006-07-20 |
JP5138930B2 (ja) | 2013-02-06 |
EP1647056A1 (en) | 2006-04-19 |
KR20060028742A (ko) | 2006-03-31 |
CN100550401C (zh) | 2009-10-14 |
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