CN1799793B - 高压液喷射式切断装置以及高压液喷射式切断方法 - Google Patents

高压液喷射式切断装置以及高压液喷射式切断方法 Download PDF

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CN1799793B
CN1799793B CN 200610051340 CN200610051340A CN1799793B CN 1799793 B CN1799793 B CN 1799793B CN 200610051340 CN200610051340 CN 200610051340 CN 200610051340 A CN200610051340 A CN 200610051340A CN 1799793 B CN1799793 B CN 1799793B
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mentioned
cut
machined object
substrate
high pressure
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CN1799793A (zh
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立岩聪
木村谦
矢岛兴一
松原政幸
山本昌明
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Disco Corp
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Disco Corp
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CN 200610051340 2005-01-05 2006-01-05 高压液喷射式切断装置以及高压液喷射式切断方法 Active CN1799793B (zh)

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JP2005000972A JP4690051B2 (ja) 2005-01-05 2005-01-05 高圧液噴射式切断装置および高圧液噴射式切断方法
JP2005-000972 2005-01-05
JP2005000972 2005-01-05

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CN1799793A CN1799793A (zh) 2006-07-12
CN1799793B true CN1799793B (zh) 2010-08-04

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2997880B1 (fr) * 2012-11-13 2015-09-04 Christophe Ribot Procede de decoupe de rectangles
CN103640053A (zh) * 2013-11-20 2014-03-19 苏州蓝王机床工具科技有限公司 新型掏孔机床
CN109411160B (zh) * 2017-08-16 2023-09-12 厦门海普锐科技股份有限公司 一种多管径自动穿套号码管装置
CN109571643A (zh) * 2018-12-29 2019-04-05 肇庆鼎晟电子科技有限公司 热敏电阻芯片水刀划切工艺
CN112780208B (zh) * 2021-01-06 2021-10-26 中国矿业大学 一种瓦斯抽采钻井错断变形区域修复系统及修复方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005230994A (ja) * 2004-02-20 2005-09-02 Disco Abrasive Syst Ltd ウォータージェット加工方法および被加工物の保護部材

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JPH0219500U (ja) * 1988-07-26 1990-02-08
FR2647049B1 (fr) * 1989-05-18 1995-04-14 Grudzinski Richard Procede de decoupe de materiaux utilisant un jet de liquide volatil
JPH04372400A (ja) * 1991-06-14 1992-12-25 Furukawa Electric Co Ltd:The 積層された金属薄板の切断加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005230994A (ja) * 2004-02-20 2005-09-02 Disco Abrasive Syst Ltd ウォータージェット加工方法および被加工物の保護部材

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JP2006187829A (ja) 2006-07-20
JP4690051B2 (ja) 2011-06-01
CN1799793A (zh) 2006-07-12

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