CN1770487A - White light LED package radiating structure - Google Patents

White light LED package radiating structure Download PDF

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Publication number
CN1770487A
CN1770487A CN 200510100253 CN200510100253A CN1770487A CN 1770487 A CN1770487 A CN 1770487A CN 200510100253 CN200510100253 CN 200510100253 CN 200510100253 A CN200510100253 A CN 200510100253A CN 1770487 A CN1770487 A CN 1770487A
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CN
China
Prior art keywords
line
white light
led package
fluorescent material
glue
Prior art date
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Granted
Application number
CN 200510100253
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Chinese (zh)
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CN100414728C (en
Inventor
李学霖
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to CNB2005101002537A priority Critical patent/CN100414728C/en
Priority to PCT/CN2005/001802 priority patent/WO2007041902A1/en
Publication of CN1770487A publication Critical patent/CN1770487A/en
Application granted granted Critical
Publication of CN100414728C publication Critical patent/CN100414728C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

This invention discloses one white LED sealed dissipation structure, which comprises Two metal lead legs with one top as rack cup with blue lighting crystal and fluorescence glue layer stretching out two wires connected to two lead legs, wherein, the two racks top ends are sealed with transparent resin; the top and down sides of crystal are set with one dissipation glue layer. The invention adopts the above structure to get two dissipation glue layer in work for lead legs rapidly and then through rack to outside to make the LED light work under temperature of 65 degrees and fluorescent powder life of 40000 hours.

Description

White light LED package radiating structure
Technical field
The present invention relates to the LED encapsulating structure, be specifically related to a kind of white light LED package radiating structure.
Background technology
LED has plurality of advantages such as energy consumption is low, caloric value is lower, long service life as a kind of illuminating source, has been applied to more and more widely in illumination and the decorative lamp.Wherein, the appearance of white light LEDs more makes the high-brightness LED application stride foot to high efficiency lighting source market.
Existing white light LEDs is to adopt blue-light-emitting crystal and fluorescent material cooperation to utilize lens principle to send the required white light of naked eyes again.But, present white light LEDs light fixture adopts the version of white light LED array that the overall luminosity of light fixture is provided more, though therefore the caloric value of single white light LEDs is lower, but a fairly large number of white light LEDs device is in the limited light fixture inner chamber in relatively sealing and space, the heat that produces during its work still gathers because of being difficult to effectively lead loose to form, and then occurs the bigger problem of the whole caloric value of light fixture inevitably.According to present white light LEDs encapsulation technology, its working temperature is in case above 65 ℃, then can cause the fluorescent material burning on the white light LEDs luminous element to give up, and then have influence on the result of use and the life-span of light fixture.Also have, owing to existing fluorescent material blending technology reason, the white light LEDs life-span of producing encapsulation at present on the market was very short, decay or discoloration problem generally just occurred at 600～800 hours.At present, still there is not efficient ways to solve the heat dissipation problem of leading of white light LEDs.
Summary of the invention
The objective of the invention is at the problems referred to above, a kind of white light LED package radiating structure simple in structure is provided, it produces the heat dissipation problem of leading of heat in the time of can effectively solving the work of LED white light-emitting diodes.
For achieving the above object, technical scheme of the present invention is as follows: white light LED package radiating structure, comprise two metal pins framves, wherein the upper end of a pin frame is a carrier cup, be provided with blue-light-emitting crystal and fluorescent material glue-line in the cup, the blue-light-emitting crystal is drawn two leads and is connected with the two pins frame respectively, and colourless transparent resin is sealed in the upper end of two pins frame; The above and below of blue-light-emitting crystal is respectively equipped with one and leads the heat radiation glue-line, two lead the heat radiation glue-line blue-light-emitting crystal is sealed, and the fluorescent material glue-line be located at lead the heat radiation glue-line above.
The above-mentioned heat radiation glue-line of leading is formed by rubber silica gel and mixed with resin stirring, and the weight proportion of rubber silica gel and resin is 1: 0.001～1.
For further prolonging the damped cycle of fluorescent material and improving its discoloration problem, above-mentioned fluorescent material glue-line is mixed together by resin, fluorescent material, yellow toner, bleaching powder, and the weight proportion of resin, fluorescent material, yellow toner and bleaching powder is 1: 0.001～1: 0.001～1: 0.001～1.
The above-mentioned thickness of heat radiation glue-line of leading is between 0.001 millimeter～3 millimeters.
The thickness of above-mentioned fluorescent material glue-line is between 0.001 millimeter～5 millimeters.
The present invention is by adopting said structure, the heat that white light LEDs work the time is sent is able to lead the heat radiation glue-line through two and promptly leads and be dissipated on the pin frame, lead via the foot of pin frame again and shed, the working temperature of white light LEDs is controlled at below 65 ℃, and then the useful life that makes fluorescent material reach more than 40000 hours, efficiently solve the fluorescent material problem in useful life of white light LEDs.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is STRUCTURE DECOMPOSITION figure of the present invention.
Now the invention will be further described in conjunction with the accompanying drawings and embodiments:
Embodiment
As shown in Figure 1 and Figure 2, white light LED package radiating structure of the present invention has two metal pins framves 1, and wherein the upper end of a pin frame is a carrier cup 11, be provided with blue-light-emitting crystal 2 and fluorescent material glue-line 3 in the cup, the blue-light-emitting crystal 2 is drawn two leads 21 and is connected with two pins frame 1 respectively; The above and below of blue-light-emitting crystal be respectively equipped with one lead the heat radiation glue-line 5, two lead the heat radiation glue-line 5 the blue-light-emitting crystal 2 is sealed, and fluorescent material glue-line 3 be located at lead the heat radiation glue-line above.Colourless transparent resin 4 is sealed in the upper end of two pins frame.
Packaging technology step of the present invention is: at first go into one deck in the cup rising pouring of carrier cup and lead thermal paste, lead solid blue luminescent crystal above the thermal paste at this layer then, the lead of burn-oning, inject the second layer again and lead thermal paste on the blue-light-emitting crystal, integral body was sealed up epoxy resin after the second layer was led the deployed fluorescent powder glue-line of injection above the thermal paste.
The above-mentioned thermal paste of leading is to be stirred by rubber silica gel and mixed with resin to form, and according to different requirements, the weight proportion of rubber silica gel and resin is 1: 0.001～1.
The allotment of above-mentioned fluorescent material glue-line is to be mixed together by resin, fluorescent material, yellow toner, bleaching powder, and according to different requirements, the weight proportion of resin, fluorescent material, yellow toner, bleaching powder is 1: 0.001～1: 0.001～1: 0.001～1.
The above-mentioned thickness of heat radiation glue-line of leading is between 0.001 millimeter～3 millimeters.
The thickness of above-mentioned fluorescent material arogel layer is between 0.001 millimeter～5 millimeters.
When the present invention works, the heat that the blue-light-emitting crystal sends is led the heat radiation glue-line via two and is led diffusing on carrier cup and pin frame, lead through the foot of pin frame again and shed, therefore, the heat that white light LEDs integral body is sent is led quickly and effectively and is shed, guaranteed that the fluorescent material glue-line can not burn useless and variable color, has guaranteed that the fluorescent powder life-span of white light LEDs reached more than 40000 hours.

Claims (7)

1, white light LED package radiating structure, comprise two metal pins framves, wherein the upper end of a pin frame is a carrier cup, be provided with blue-light-emitting crystal and fluorescent material glue-line in the cup, the blue-light-emitting crystal is drawn two leads and is connected with the two pins frame respectively, colourless transparent resin is sealed in the upper end of two pins frame, it is characterized in that: the above and below of blue-light-emitting crystal is respectively equipped with one and leads the heat radiation glue-line, two lead the heat radiation glue-line blue-light-emitting crystal is sealed, and the fluorescent material glue-line be located at lead the heat radiation glue-line above.
2, white light LED package radiating structure according to claim 1 is characterized in that: the described heat radiation glue-line of leading is formed by rubber silica gel and mixed with resin stirring.
3, white light LED package radiating structure according to claim 2 is characterized in that: the weight proportion of described rubber silica gel and resin is 1: 0.001～1.
4, white light LED package radiating structure according to claim 1 is characterized in that: described fluorescent material glue-line is mixed together by resin, fluorescent material, yellow toner, bleaching powder.
5, white light LED package radiating structure according to claim 4 is characterized in that: the weight proportion of described resin, fluorescent material, yellow toner and bleaching powder is 1: 0.001～1: 0.001～1: 0.001～1.
6, white light LED package radiating structure according to claim 1 is characterized in that: the described thickness of heat radiation glue-line of leading is between 0.001 millimeter～3 millimeters.
7, white light LED package radiating structure according to claim 1 is characterized in that: the thickness of described fluorescent material glue-line is between 0.001 millimeter～5 millimeters.
CNB2005101002537A 2005-10-12 2005-10-12 White light LED package radiating structure Expired - Fee Related CN100414728C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB2005101002537A CN100414728C (en) 2005-10-12 2005-10-12 White light LED package radiating structure
PCT/CN2005/001802 WO2007041902A1 (en) 2005-10-12 2005-10-31 A heat conducting and dissipating structure for white light led package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005101002537A CN100414728C (en) 2005-10-12 2005-10-12 White light LED package radiating structure

Publications (2)

Publication Number Publication Date
CN1770487A true CN1770487A (en) 2006-05-10
CN100414728C CN100414728C (en) 2008-08-27

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Country Status (2)

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CN (1) CN100414728C (en)
WO (1) WO2007041902A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105023988A (en) * 2014-04-25 2015-11-04 日月光半导体制造股份有限公司 Light-emitting semiconductor packaging and correlation method
CN108071962A (en) * 2017-06-13 2018-05-25 马文波 A kind of method for strengthening LED light bar heat dissipation

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102157668A (en) * 2011-04-01 2011-08-17 饶曼夫 Fluorescent powder packaging structure of light-emitting diode and packaging method thereof
CN104681698B (en) * 2015-01-06 2017-12-19 安徽康力节能电器科技有限公司 A kind of decoration LED encapsulation structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW471713U (en) * 2001-01-17 2002-01-01 Shing Chen Improved whit light LED
CN2590181Y (en) * 2002-09-10 2003-12-03 山西至诚科技有限公司 High power white light diode
JP4019993B2 (en) * 2003-03-31 2007-12-12 株式会社デンソー Semiconductor device
KR20040092512A (en) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 A semiconductor light emitting device with reflectors having a cooling function
US6921927B2 (en) * 2003-08-28 2005-07-26 Agilent Technologies, Inc. System and method for enhanced LED thermal conductivity
CN1652361A (en) * 2004-02-05 2005-08-10 李坤锥 Apparatus for emitting white light
CN1564330A (en) * 2004-03-16 2005-01-12 南亚塑胶工业股份有限公司 High radiation LED light emitting assembly and its mfg. method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105023988A (en) * 2014-04-25 2015-11-04 日月光半导体制造股份有限公司 Light-emitting semiconductor packaging and correlation method
CN105023988B (en) * 2014-04-25 2018-03-13 日月光半导体制造股份有限公司 Emitting semiconductor encapsulates and correlation technique
CN108071962A (en) * 2017-06-13 2018-05-25 马文波 A kind of method for strengthening LED light bar heat dissipation

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WO2007041902A1 (en) 2007-04-19
CN100414728C (en) 2008-08-27

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Granted publication date: 20080827

Termination date: 20111012