CN102157668A - Phosphor powder encapsulation structure and encapsulation method of light-emitting diode - Google Patents
Phosphor powder encapsulation structure and encapsulation method of light-emitting diode Download PDFInfo
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- CN102157668A CN102157668A CN2011100820026A CN201110082002A CN102157668A CN 102157668 A CN102157668 A CN 102157668A CN 2011100820026 A CN2011100820026 A CN 2011100820026A CN 201110082002 A CN201110082002 A CN 201110082002A CN 102157668 A CN102157668 A CN 102157668A
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- 239000000843 powder Substances 0.000 title claims abstract description 110
- 238000000034 method Methods 0.000 title claims abstract description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 17
- 238000005538 encapsulation Methods 0.000 title claims description 15
- 238000002834 transmittance Methods 0.000 claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 claims abstract description 29
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract 5
- 239000010408 film Substances 0.000 claims description 126
- 239000000463 material Substances 0.000 claims description 79
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000741 silica gel Substances 0.000 claims description 13
- 229910002027 silica gel Inorganic materials 0.000 claims description 13
- 239000003086 colorant Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000000084 colloidal system Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 239000011159 matrix material Substances 0.000 abstract description 5
- 238000012856 packing Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000009877 rendering Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000009193 crawling Effects 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
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- 230000036632 reaction speed Effects 0.000 description 1
- 206010042772 syncope Diseases 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The invention discloses a fluorescent powder packaging structure of a light emitting diode and a packaging method thereof, wherein the packaging method comprises the following steps: a) providing a package substrate having at least one carrying surface thereon; a light emitting diode chip is further arranged on the bearing surface; b) providing a high light-transmitting film, and forming a plurality of unit concave holes on the high light-transmitting film; c) filling at least one fluorescent powder into the unit concave holes, and sealing and storing the fluorescent powder in the unit concave holes to form a fluorescent film layer with a full light transmission area and a fluorescent powder area; and d) stacking the fluorescent film layer on the LED chip to form a fluorescent powder packaging structure of the LED. Controlling the distribution and the dosage of the fluorescent powder by introducing a semi-through hole matrix on the high-light-transmittance film; the quality stability and color uniformity of the LED can be controlled more precisely.
Description
Technical field
The present invention refers to a kind of fluorescent material encapsulating structure and method for packing thereof of light-emitting diode especially about a kind of encapsulating structure and method thereof of light-emitting diode.
Background technology
In recent years, LED has just like become the new trend of domestic lighting.But it has, and volume is little, caloric value is low, power consumption is few, the life-span is long, reaction speed is fast, can become compact product etc. excellent at high-frequency operation planar package, easy exploiting, and, applications such as automobile, illumination, consumer electronics and display backlight module also have been widely applied to along with the development of emerging application technology.In early days, the manufacture of white light emitting diode mainly is to be one group with three chips, is mixed into white light with three primary colors, but because encapsulation is difficult for, and cost is too high, is not widely used.So far the main flow white light emitting diode on the market then is to excite a fluorescent powder that is coated on the top by the blue light that a blue LED chip sends, and convert the part blue light to gold-tinted, and to make it be white light with the blue light of this blue light-emitting diode again.
Yet when practical application, because the quality stability and the color uniformity of white light emitting diode mainly are subject to concentration, volume and the position that this fluorescent powder is coated with on this light-emitting diode chip for backlight unit.In addition known fluorescent material encapsulation technology adopts the mode of a glue or coating more, coating one fluorescent powder on a light-emitting diode chip for backlight unit; And these prior art also can't be controlled the shape and the CONCENTRATION DISTRIBUTION of this fluorescent powder coating accurately; and significantly influence the optical color quality of white light emitting diode; and then causing on the market white light emitting diode on many illuminations are used, regular meeting finds can produce the uneven phenomenon of color temperature distribution (the promptly yellow phenomenon of swooning) in the space.Moreover along with the selection range of application of fluorescent material increases day by day, the hybrid package of the fluorescent material of variable grain size is more difficult, and very easily because of fluorescent material precipitation when mixing glue, and cause colour temperature (the Color Temperature of every light-emitting diode, be called for short CT) deviation, cause the difficulty of light-emitting diode on illumination is used.
On the other hand, light-emitting diode also need focus on its color rendering.So-called color rendering is meant the degree that light source presents the object intrinsic colour, represents it with color rendering index (Ra value) usually.Color rendering is high more, and is good more to the performance of color.With the blue LED is example, for obtaining better color rendering.The light-emitting diode polar body must import the fluorescent material of different colours, to improve its color rendering.Yet the fluorescent material that how to make different colours, variable grain size evenly distributes and effectively encapsulation, satisfies and becomes the problem that technology now faces.Since after prior art is evenly mixed fluorescent material and silica gel again the mode with a glue or coating be packaged on the light-emitting diode chip for backlight unit, the fluorescent powder that very easily causes different colours, variable grain size crawling on this light-emitting diode chip for backlight unit is even and can't carry out polynary application encapsulation, and then influences the quality stability and the color uniformity of this light-emitting diode.
Summary of the invention
The fluorescent material encapsulating structure and the method for packing thereof that the purpose of this invention is to provide a kind of light-emitting diode, it can effectively control the distribution and the consumption of fluorescent material, to control the light-emitting diode quality of stability and the color uniformity.
For achieving the above object, solution of the present invention is:
A kind of fluorescent material encapsulating structure of light-emitting diode, it comprises one and has at least one load-bearing surface base plate for packaging, disposes light-emitting diode chip for backlight unit on this load-bearing surface; And be arranged at least one fluorescent film layer on the light-emitting diode chip for backlight unit; This fluorescent film layer includes at least one high light transmittance film, has full transparent area and several unit shrinkage pools on it; And at least one fluorescent powder, be filled in these several unit shrinkage pools, be used to form on this high light transmittance film a fluorescent material tagma.
Described high light transmittance film is made of glass, silica gel, epoxy resin or other light-transmitting materials; And half through hole that these several unit shrinkage pools are laser moulding or ejection formation.
Described fluorescent film layer more includes a high light transmittance coverlay, be arranged on the high light transmission film, seal up for safekeeping in these several unit shrinkage pools this fluorescent powder is airtight, this high light transmittance coverlay is made of glass, silica gel, epoxy resin or other light-transmitting materials again.
Described fluorescent film layer has more a printing opacity immobilization material, fills out and establishes in these several unit shrinkage pools, and this fluorescent powder is airtight to be sealed up for safekeeping in these several unit shrinkage pools, and this printing opacity immobilization material is silica gel, epoxy resin or other light transmission colloids again.
The aperture of described several unit shrinkage pools and the degree of depth correspond to the particle size of this fluorescent powder; The relative size in this full transparent area and fluorescent material district again forms the density decision by these several unit shrinkage pools on this high light transmittance film.
A kind of fluorescent material encapsulating structure of light-emitting diode, it comprises one and has at least one load-bearing surface base plate for packaging, disposes light-emitting diode chip for backlight unit on this load-bearing surface; And overlapping heap is located at several fluorescent film layer on the light-emitting diode chip for backlight unit; Wherein each this fluorescent film layer all includes: a high light transmittance film has full transparent area and several unit shrinkage pools on it; And a fluorescent powder, be filled in these several unit shrinkage pools, be used to form on this high light transmittance film a fluorescent material tagma, the overlapping heap of the fluorescent powder of the full transparent area of arbitrary fluorescent film layer and another fluorescent film layer part is established again.
The aperture of described several unit shrinkage pools and the degree of depth correspond to the particle size of this fluorescent powder; The relative size in this full transparent area and fluorescent material district again forms the density decision by these several unit shrinkage pools on this high light transmittance film.
A kind of fluorescent material method for packing of light-emitting diode, its step comprises at least:
A) provide a base plate for packaging, have at least one load-bearing surface on it; And more dispose a light-emitting diode chip for backlight unit on this load-bearing surface;
B) provide a high light transmittance film, and form several unit shrinkage pools thereon;
C) at least one fluorescent powder is inserted these several unit shrinkage pools, and airtight sealing up for safekeeping in these several unit shrinkage pools, in order to form the fluorescent film layer in tool one a full transparent area and a fluorescent material tagma; And
D) this fluorescent film layer heap is located on this light-emitting diode chip for backlight unit, in order to form the fluorescent material encapsulating structure of this light-emitting diode.
A kind of fluorescent material method for packing of light-emitting diode, its step comprises at least:
A) provide a base plate for packaging, have at least one load-bearing surface on it; And more dispose a light-emitting diode chip for backlight unit on this load-bearing surface;
B) provide one first high light transmittance film, and form several first module shrinkage pools thereon;
C) one first fluorescent powder is inserted this several first module shrinkage pools, and airtight sealing up for safekeeping in these several first module shrinkage pools, in order to form first fluorescent film layer in tool one first full transparent area and one first fluorescent material tagma;
D) provide one second high light transmittance film, and form several Unit second shrinkage pools thereon;
E) one second fluorescent powder is inserted this several second unit shrinkage pool, and airtight sealing up for safekeeping in this several second unit shrinkage pool, in order to form second fluorescent film layer in tool one second full transparent area and one second fluorescent material tagma; And
F) in regular turn this first fluorescent film layer and this second fluorescent film layer heap are located on this light-emitting diode chip for backlight unit, in order to form the fluorescent material encapsulating structure of this light-emitting diode; Wherein this fluorescent film layer have the first full transparent area and this second fluorescent film layer have second fluorescent powder and this two fluorescent film layer have the second full transparent area and this first fluorescent film layer have first fluorescent powder can partly be overlapping the heap establish, in order to adjust the different colours fluorescent powder conversion efficiency is arranged, and then control the LED package element accurately optical characteristics is arranged.
The fluorescent material method for packing of light-emitting diode more includes step:
G) provide one the 3rd high light transmittance film, and form several Unit the 3rd shrinkage pools thereon;
H) one the 3rd fluorescent powder is inserted this several the 3rd unit shrinkage pool, and airtight sealing up for safekeeping in this several the 3rd unit shrinkage pool, in order to form the 3rd fluorescent film layer in tool 1 the 3rd full transparent area and one the 3rd fluorescent material tagma; And
I) this 3rd fluorescent film layer heap is located on this first fluorescent film layer and this second fluorescent film layer, in order to form the fluorescent material encapsulating structure of this light-emitting diode.
After adopting such scheme, the present invention sees through the distribution and the consumption of the half via matrix control fluorescent material at least one floor height transparent thin-film, controls the quality stability and the color uniformity of light-emitting diode effectively; See through and on one deck high light transmittance film, form half via matrix in advance, and insert fluorescent material, to control its distribution and consumption, then be stacked over according to need again on this light-emitting diode chip for backlight unit, with the quality stability and the color uniformity of controlling light-emitting diode effectively.
Fluorescence membrane structure of the present invention also can be finished assembling in advance, the fluorescent powder of different colours constitutes different fluorescent film layer, thereafter be overlapping in light-emitting diode chip for backlight unit again, can finish the encapsulation of fluorescent powders of light emitting diode, but modulation is controlled its optical characteristics in the lump simultaneously, in order to adjusting the conversion efficiency of different colours fluorescent powder, and then control the optical characteristics of LED package element accurately.
Description of drawings
Fig. 1 is the fluorescent powders of light emitting diode encapsulating structure schematic diagram of first embodiment of the invention;
Fig. 2 is the fluorescent powders of light emitting diode encapsulating structure schematic diagram of second embodiment of the invention;
Fig. 3 is the fluorescent powders of light emitting diode encapsulating structure schematic diagram of third embodiment of the invention;
Fig. 4 is the fluorescent powders of light emitting diode encapsulating structure schematic diagram of fourth embodiment of the invention.
The main element symbol description
1 base plate for packaging, 11 load-bearing surfaces, 12 light-emitting diode chip for backlight unit
2 fluorescent film layer, 21 high light transmittance films, 211 full transparent areas
212 unit shrinkage pools, 213 fluorescent material tagmas, 214 printing opacity immobilization materials
215 high light transmittance coverlays, 22 fluorescent powders, 21 first fluorescent powders
222 second fluorescent powders 223 the 3rd fluorescent powder, 3 first fluorescent film layer
31 first high light transmittance films, 311 first full transparent area 312 first module shrinkage pools
313 first fluorescent material tagmas, 4 second fluorescent film layer, 41 second high light transmittance films
411 second full transparent area 412 second unit shrinkage pools, 413 second fluorescent material tagmas
5 the 3rd fluorescent film layer 51 the 3rd high light transmittance film 511 the 3rd full transparent area
512 the 3rd unit shrinkage pools 513 the 3rd fluorescent material tagma.
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations on different aspects, its neither departing from the scope of the present invention, and explanation wherein and graphic be when the usefulness that explain in itself, but not in order to restriction the present invention.
The present invention is a kind of fluorescent material encapsulating structure and method for packing thereof of light-emitting diode.Its overall structure and encapsulation step are simplified, control the distribution and the consumption of fluorescent material through half via matrix on the high light transmittance film by introducing one, solved shortcoming and the problem of prior art, controlled the quality stability and the color uniformity of light-emitting diode effectively for the fluorescent powder encapsulation.Below will further specify content of the present invention with embodiment, and be not limited to the embodiment that carried yet can use the fluorescent material encapsulating structure of the technology of the present invention and method thereof, the structure of other any suitable the technology of the present invention all can be incorporated reference at this.
See also Fig. 1, it discloses the fluorescent material encapsulating structure of the light-emitting diode of preferred embodiment of the present invention, and its structure comprises a base plate for packaging 1 at least, has at least one load-bearing surface 11 on it; And more dispose a light-emitting diode chip for backlight unit 12 on this load-bearing surface.In embodiments of the present invention, this light-emitting diode chip for backlight unit is a blue LED chip, can radiate blue light, utilizes the blue-light excited fluorescent powder that penetrates simultaneously.The most characteristic fluorescent material encapsulating structure of the present invention then comprises a fluorescent film layer 2 structures at least, is arranged on this light-emitting diode chip for backlight unit 12, can be in order to form the fluorescent material encapsulating structure of this light-emitting diode.Wherein this fluorescent film layer 2 more includes: at least one high light transmittance film 21 has full transparent area 211 and several unit shrinkage pools 212 on it; And at least one fluorescent powder 22, be filled in these several unit shrinkage pools 212, be used to form on this high light transmittance film 21 a fluorescent material tagma 213.
When practical application, this high light transmittance film 21 can be made of a glass, silica gel, epoxy resin or other light-transmitting materials.Utilize laser moulding or ejection formation can obtain half through hole shape structure of these several unit shrinkage pools 212 simultaneously.At present embodiment, because the light that the light-emitting diode chip for backlight unit 12 that uses is sent is blue light, can be redness, blueness and green emitting phosphor, the visual demand of its proportioning and allocating so insert these several unit shrinkage pools 212 interior fluorescent powders 22.And at fluorescent powder 22 after assisting to insert these several unit shrinkage pools 212 with scraper or brush, this fluorescent film layer 21 more can be introduced a printing opacity immobilization material 214, fill out and establish in these several unit shrinkage pools 212, in order to being closed, seals up for safekeeping in these several unit shrinkage pools 212 this fluorescent powder close 22, i.e. structure as shown in Figure 1.Wherein this printing opacity immobilization material 214 can be a silica gel, epoxy resin or other light transmission colloids.And the main characteristic of fluorescent material encapsulating structure of the present invention is the aperture of these several unit shrinkage pools 212 and the particle size that the degree of depth can correspond to this fluorescent powder 22, and then in order to control the consumption of this fluorescent powder 22.For instance, the powder when this fluorescent powder 22 directly is 20um; And half through-hole aperture that utilizes these several unit shrinkage pools 212 of laser moulding is for 38um, the shrinkage pool degree of depth during for 80um, when then each unit shrinkage pool 212 powder that can insert 3 * 4=12 fluorescent powder 22(20um size was isosceles triangle and arranges, its circumcircle was about 37.32um).Therefore, utilize simple mathematical to calculate, can estimate the consumption of fluorescent powder 22 accurately.On the other hand, see through the formation density distribution of these several unit shrinkage pools 212 on this high light transmittance film 21 of control, also can further control the conversion efficiency of adjusting this fluorescent powder 22, and then control the optical characteristics of LED package element accurately, these characteristics are prior art and can't reach.
See also Fig. 2, it discloses the fluorescent material encapsulating structure of the light-emitting diode of the present invention's second preferred embodiment, and its structure includes a base plate for packaging 1 equally, has at least one load-bearing surface 11 on it; And more dispose a light-emitting diode chip for backlight unit 12 on this load-bearing surface.In embodiments of the present invention, this light-emitting diode chip for backlight unit also is a blue LED chip.This fluorescent material encapsulating structure then comprises a fluorescent film layer 2 structures equally at least, is arranged on this light-emitting diode chip for backlight unit 12, can be in order to form the fluorescent material encapsulating structure of this light-emitting diode.Wherein this fluorescent film layer 2 more includes: at least one high light transmittance film 21 has full transparent area 211 and several unit shrinkage pools 212 on it; And at least one fluorescent powder 22, be filled in these several unit shrinkage pools 212, be used to form on this high light transmittance film 21 a fluorescent material tagma 213.Be different from previous embodiment, present embodiment is inserted redness and yellow fluorescent powder in these several unit shrinkage pools 212.And at fluorescent powder 22 after assisting to insert these several unit shrinkage pools 212 with scraper or brush, introduce a high light transmittance coverlay 215 again, be arranged on the high light transmission film 21, in order to seal in these several unit shrinkage pools 212 structure as shown in Figure 2 up for safekeeping with this fluorescent powder 22 is airtight.Wherein this high light transmittance coverlay 215 can be made of a glass, silica gel, epoxy resin or other light-transmitting materials.
According to the above, the present invention also provides a kind of fluorescent material method for packing of light-emitting diode, and its step comprises at least:
A) provide a base plate for packaging 1, have at least one load-bearing surface 11 on it; And more dispose a light-emitting diode chip for backlight unit 12 on this load-bearing surface;
B) provide a high light transmittance film 21, and form several unit shrinkage pools 212 thereon;
C) at least one fluorescent powder 22 is inserted this several unit shrinkage pools 212, and airtight sealing up for safekeeping in these several unit shrinkage pools 212, in order to form the fluorescent film layer 2 in tool one a full transparent area 211 and a fluorescent material tagma 213;
And d) these fluorescent film layer 2 heaps is located on this light-emitting diode chip for backlight unit 12, in order to form the fluorescent material encapsulating structure of this light-emitting diode, promptly as shown in Figures 1 and 2.
When practical application, this high light transmittance film 21 can be made of a glass, silica gel, epoxy resin or other light-transmitting materials.And these several unit shrinkage pools 212 are half through hole that laser moulding or ejection formation constitute in this step b).Wherein this step c) more can comprise step c1) on this high light transmission film 21, form a high light transmittance coverlay 215, in order to being closed, seals up for safekeeping in these several unit shrinkage pools 212, as shown in Figure 2 this fluorescent powder close 22; And this high light transmittance coverlay 215 can be made of a glass, silica gel, epoxy resin or other light-transmitting materials.Certainly this step c) also can comprise step c2) in these several unit shrinkage pools 212, insert a printing opacity immobilization material 214, in order to these fluorescent powder 22 airtight sealing up for safekeeping in these several unit shrinkage pools 212, as shown in Figure 1; This printing opacity immobilization material 214 then can be a silica gel, epoxy resin or other light transmission colloids.
Fluorescent material encapsulating structure of the present invention sees through the introducing of this fluorescent film layer 2, makes the aperture of these several unit shrinkage pools 212 and the particle size that the degree of depth can correspond to this fluorescent powder 22, and then in order to control the consumption of this fluorescent powder 22.Utilize the formation density distribution of these several unit shrinkage pools 212 on this high light transmittance film 21 of control simultaneously, more can further control the conversion efficiency of adjusting this fluorescent powder 22, and then control the optical characteristics of LED package element accurately, these characteristics are prior art and can't reach.
See also Fig. 3, it discloses the fluorescent material encapsulating structure of the light-emitting diode of the present invention's the 3rd preferred embodiment, and its structure comprises a base plate for packaging 1 at least, has at least one load-bearing surface 11 on it; And more dispose a light-emitting diode chip for backlight unit 12 on this load-bearing surface; And first fluorescent film layer 3 and second fluorescent film layer 4, overlapping heap is located on this light-emitting diode chip for backlight unit 12, in order to form the fluorescent material encapsulating structure of this light-emitting diode.Wherein this first fluorescent film layer 3 and second fluorescent film layer 4 include the one first high light transmittance film 31 and the second high light transmittance film 41 respectively.This first high light transmittance film 31 and the second high light transmittance film 41 then have first and second full transparent area 311,411 and several first and second unit shrinkage pools 312,412 respectively.In the present embodiment, this light-emitting diode chip for backlight unit 12 is a blue chip, so can cooperate redness, and yellow fluorescent powder.But the embodiment of different Fig. 2, present embodiment is inserted this several first module shrinkage pools 312 with one first fluorescent powder 221 (yellow fluorescent powder), and airtight sealing up for safekeeping in these several first module shrinkage pools 312, in order to form first fluorescent film layer 3 in the tool first full transparent area 311 and the first fluorescent material tagma 313; Then one second fluorescent powder 222 (red fluorescence powder) is inserted this several second unit shrinkage pool 412 on the other hand, and airtight sealing up for safekeeping in this several second unit shrinkage pool 412, in order to form second fluorescent film layer 4 in the tool second full transparent area 411 and the second fluorescent material tagma 413.Because the encapsulation consumption difference of different fluorescent powders, and have the different size particle diameter respectively, carry out overlapping heap again behind each fluorescent powder and establish, optical characteristics that can more accurate control LED package element if evenly distribute in advance with different fluorescent film layer.Overlapping again heap was established after other fluorescent film layer of different layers can be inserted fluorescent powder in advance, introduce a high light transmittance coverlay 215 at last in the top, be arranged at high light transmission film layer, in order to seal up for safekeeping in these several unit shrinkage pools this fluorescent powder is airtight, the present invention is not limited to this method.
And be the conversion efficiency of adjusting the different colours fluorescent powder, the fluorescent powder of the full transparent area of arbitrary fluorescent film layer and another fluorescent film layer more can be established by the overlapping heap of part in fluorescent material encapsulating structure of the present invention, and is not limited.Please consult Fig. 4 again, it discloses the fluorescent material encapsulating structure of the light-emitting diode of the present invention's the 4th preferred embodiment.Its structure has a base plate for packaging 1 at least, has at least one load-bearing surface 11 on it; And more dispose a light-emitting diode chip for backlight unit 12 on this load-bearing surface 11.In the present embodiment, this light-emitting diode chip for backlight unit 12 is a blue chip, can cooperate redness, blueness and green emitting phosphor to do application.The embodiment that is different from Fig. 1, present embodiment provide one first high light transmittance film 31, and form several first module shrinkage pools 312 thereon; And one first fluorescent material 221 (blue colour fluorescent powder) body is inserted this several first module shrinkage pools 312, and airtight sealing up for safekeeping in these several first module shrinkage pools 312, in order to form first fluorescent film layer 3 in tool one first full transparent area 311 and one first fluorescent material tagma 313.One second high light transmittance film 4 is provided simultaneously, and forms several Unit second shrinkage pools 412 thereon; And one second fluorescent powder 222 (red fluorescence powder) inserted this several second unit shrinkage pool 412, and airtight sealing up for safekeeping in this several second unit shrinkage pool 412, in order to form second fluorescent film layer 4 in tool one second full transparent area 411 and one second fluorescent material tagma 413.One the 3rd high light transmittance film 51 also is provided, and forms several Unit the 3rd shrinkage pools 512 thereon; And one the 3rd fluorescent powder 223 (green emitting phosphor) inserted this several the 3rd unit shrinkage pool 512, and airtight sealing up for safekeeping in this several the 3rd unit shrinkage pool 512, in order to form the 3rd fluorescent film layer 5 in tool 1 the 3rd full transparent area 511 and one the 3rd fluorescent material tagma 513.In regular turn this first fluorescent film layer 3, this second fluorescent film layer 4 and the 3rd fluorescent film layer 5 heaps are located on this light-emitting diode chip for backlight unit 12 at last, in order to form the fluorescent material encapsulating structure of this light-emitting diode.Wherein the fluorescent powder of the full transparent area of arbitrary fluorescent film layer and another fluorescent film layer partly overlapping heap establish, in order to adjusting the conversion efficiency of different colours fluorescent powder, and then control the optical characteristics of LED package element accurately.And when practical application, the present invention's fluorescence membrane structure also can be finished assembling in advance, the fluorescent powder of different colours constitutes different fluorescent film layer, thereafter be overlapping in light-emitting diode chip for backlight unit again, can finish the encapsulation of fluorescent powders of light emitting diode, but modulation is controlled its optical characteristics in the lump simultaneously, and this can't reach for prior art.
In sum, the invention provides a kind of fluorescent material encapsulating structure and method thereof of light-emitting diode.Its overall structure and encapsulation step are simplified, and see through distribution and the consumption that half via matrix on the high light transmittance film is controlled fluorescent material by introducing one, have solved shortcoming and the problem of prior art for the fluorescent powder encapsulation.While is at the fluorescent powder of different colours or particle diameter specification, more adopt the structure of multilayer fluorescence membrane to encapsulate, processing procedure is more simple and easy, effectively reduces cost, more can accurately control the quality stability and the color uniformity of light-emitting diode, these effects are prior art and can't reach.
Claims (10)
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Cited By (6)
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| CN107431113A (en) * | 2015-04-16 | 2017-12-01 | 欧库勒斯虚拟现实有限责任公司 | Color-conversion structure part for LED array |
| CN107731993A (en) * | 2016-08-11 | 2018-02-23 | 三星电子株式会社 | The method for manufacturing semiconductor package |
| CN109545945A (en) * | 2018-11-28 | 2019-03-29 | 上海应用技术大学 | A kind of preparation method of white light LEDs interlayer fluorescent glass |
| CN110082959A (en) * | 2019-04-30 | 2019-08-02 | 京东方科技集团股份有限公司 | A kind of fluorescent film and preparation method thereof and lamp bar |
| CN111403575A (en) * | 2020-03-09 | 2020-07-10 | 华中科技大学 | Photonic crystal film suitable for single-chip high-power white light L ED and application thereof |
| JP2023083306A (en) * | 2018-04-26 | 2023-06-15 | パナソニックＩｐマネジメント株式会社 | Wavelength conversion element, phosphor wheel, light source device, and projection type image display device |
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