CN108071962A - A kind of method for strengthening LED light bar heat dissipation - Google Patents

A kind of method for strengthening LED light bar heat dissipation Download PDF

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Publication number
CN108071962A
CN108071962A CN201710450366.2A CN201710450366A CN108071962A CN 108071962 A CN108071962 A CN 108071962A CN 201710450366 A CN201710450366 A CN 201710450366A CN 108071962 A CN108071962 A CN 108071962A
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CN
China
Prior art keywords
heat dissipation
substrate
glue
led light
light bar
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Pending
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CN201710450366.2A
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Chinese (zh)
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不公告发明人
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Individual
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Priority to CN201710450366.2A priority Critical patent/CN108071962A/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention discloses a kind of methods for strengthening LED light bar heat dissipation, provide a kind of thermal paste and preparation method thereof, a kind of lamp bar structure for strengthening LED light bar heat dissipation using the thermal paste is provided simultaneously, the lamp bar structure includes a strip substrate, the end of strip substrate is provided with metal pins, two or more LED luminescence units are provided on a surface of the strip substrate, it is realized between the LED luminescence units by metallic circuit and is electrically connected and is connected with the metal pins of strip substrate end, the thermal paste is coated on another surface at the strip substrate back.The heat dissipation area of lamp bar is effectively increased by applying heat dissipation glue-line on lamp bar substrate, the heat that LED chip is sent simultaneously is quickly transferred on heat dissipation glue-line to be dispersed into space by substrate, the surface temperature of lamp bar is effectively reduced, reaches good heat dissipation effect；Since thermal diffusivity is good, LED light bar can be driven by higher electric current and obtain higher luminous flux or lumen value, so that the cost of per unit lumen is substantially reduced.

Description

A kind of method for strengthening LED light bar heat dissipation
Technical field
The present invention relates to lighting technical field more particularly to a kind of methods for strengthening LED light bar heat dissipation.
Background technology
Light emitting diode (LED) is a kind of semiconductor light source, and compared with conventional incandescent lights, LED has specular removal, length The features such as service life, LED gradually substitute incandescent lamp and increasingly go deep into people’s lives as light source of new generation.Occur on the market at present It is a kind of that linear LED illuminator (or being LED light bar) is assembled in glass bulb, and heat-conducting gas is filled in glass bulb Illuminating product, which uses narrow strip substrate to obtain the lamp bar by two ways for carrier：First, will be more LED chip is obtained on this substrate by techniques such as die bond, bonding wire, coated fluorescent glues；2nd, by packaged LED lamp bead, such as 2835th, 5630,3030,4014 etc., it is directly mounted on the strip substrate with circuit and obtains.It is sent out since the LED light bar is powered Elongated luminous characteristics are presented after light, a kind of shining for approximate incandescent lamp can be obtained by being assembled in bulb lamp or candle lamp Effect is derived from the favor in market.
However, just because of LED light bar it is elongated luminous the characteristics of, heat dissipation area is very limited, and LED light bar is assembled in In glass bulb for a long time using light decay it is larger, it is impossible to large driven current density, to meet the brightness requirement of illuminating product, need to use compared with More LED light bars can just realize that this to assemble difficulty raising, production efficiency reduction, while cost substantially increases.It if can Solve the heat dissipation problem of LED light bar, it is possible to effectively extend the service life of illuminating product, and can subtract with large driven current density The usage quantity of few LED light bar, greatly improves production efficiency and effectively reduces cost.
The content of the invention
Based on the above problem, the present invention provides a kind of method for strengthening LED light bar heat dissipation.
Technical scheme is as follows：
First, the present invention provides a kind of thermal paste and preparation method thereof, and conduction powder is mixed in colloidal stroma, and stirring is equal Obtained thermal paste after even.
Further, the conduction powder selected as alumina powder, aluminum nitride powder, boron nitride powder, silicon nitride powder, zinc oxide One or both of powder, carborundum powder, silica flour, carbon dust, copper powder, silver powder, aluminium powder and above mixing.
Further, 20 nanometers~100 microns of the grain size selected as in conduction powder ground, it is highly preferred that 1 micron of selected as ~50 microns.
Further, the colloidal stroma includes one kind in silica gel, epoxide-resin glue, UV glue high molecular materials.
Further, the conduction powder is uniformly mixed with the colloidal stroma, the two mixed weight ratio selected as, Colloidal stroma: conduction powder=1: 0.5~99, it is highly preferred that colloidal stroma: conduction powder=1: 1~30.
Secondly, the present invention provides a kind of lamp bar structure for strengthening LED light bar heat dissipation using the thermal paste, the lamp bar structure Including a strip substrate, the end of strip substrate is provided with metal pins, on a surface of the strip substrate Two or more LED luminescence units are provided with, is realized and is electrically connected by metallic circuit between the LED luminescence units And be connected with the metal pins of strip substrate end, coat the heat dissipation on another surface at the strip substrate back Glue.
Further, the material selected as Metal Substrate plate of the strip substrate, such as iron substrate or copper base, the length The material of strip substrate can also selected as PCB circuit board material, as aluminum-based circuit board plate, ceramic base circuit board, FR4 wiring boards, One kind in Chem3 wiring boards, FPC wiring boards.
Further, the substrate of the strip, length h are 20mm~500mm, and width w is 0.5mm~10mm, thick Degree t is 0.1mm~1.5mm.
Further, the LED luminescence units can be with selected as packed LED chip, flip LED chips or LED lamp bead.
Further, the LED chip is by fluorescent glue or transparent adhesive tape covering protection.
Further, back surfaces of the thermal paste coated on strip substrate form heat dissipation glue-line, the painting for the glue-line that radiates It is 0.8w≤a≤1.2w to apply width a, and the coating height b for the glue-line that radiates is 0.1mm~5mm.Preferably, radiate the coating of glue-line Width a is 1.0w≤a≤1.2w, and the coating height b for the glue-line that radiates is 0.5mm~3mm.
Further, the heat dissipation glue-line can be applied by a kind of thermal paste form or two kinds and more than thermal paste replace It applies.
This method for strengthening LED light bar heat dissipation provided by the invention has by applying heat dissipation glue-line on lamp bar substrate Effect increases the heat dissipation area of lamp bar, while the heat that LED chip is sent quickly is transferred on heat dissipation glue-line to be dissipated by substrate It is dealt into space, effectively reduces the surface temperature of lamp bar, reach good heat dissipation effect；Since thermal diffusivity is good, LED light bar It can be driven by higher electric current and obtain higher luminous flux or lumen value, so that the cost of per unit lumen obtains significantly It reduces.
Description of the drawings
Fig. 1 is the LED lamp strip structure schematic diagram that the embodiment of the present invention 1 provides.
Fig. 2 is the LED lamp strip structure cross-sectional view that the embodiment of the present invention 1 provides.
Fig. 3 is the LED lamp strip structure schematic diagram that the embodiment of the present invention 3 provides.
Specific embodiment
Below in conjunction with the accompanying drawings, presently preferred embodiments of the present invention is described in further detail.
Embodiment 1
The present invention provides a kind of method for strengthening LED light bar heat dissipation, includes the following steps：
Step 1：Thermal paste is prepared, 150 gram of 30 micron grain size alumina powder is taken, takes 100 grams of silica gel, the two is put into beaker Middle mixing, stirring 1 it is small when after be uniformly mixed, be made thermal paste it is spare.
Step 2：Make LED light bar, with reference to Fig. 1 and Fig. 2, LED lamp strip structure provided by the invention, including a strip base Plate 1, the end of strip substrate are provided with metal pins 2, the LED luminescence units 3, LED being fixed on 1 surface of strip substrate It is realized between luminescence unit 3 by metallic circuit 4 and is electrically connected and is connected with the metal pins 2 of 1 end of strip substrate, LED Fluorescent adhesive layer 5 is applied on 3 surface of luminescence unit, heat dissipation glue-line 6 is coated on the back side of strip substrate 1.
In the present embodiment, the strip substrate 1 uses iron substrate, and iron substrate length h is 40mm, and width w is 1mm, Thickness t is 0.4mm, and the generally separated two parts of substrate, two parts connect by PPA, and LED luminescence units 3 are forward LED core Piece, quantity are 24, and straight line is arranged on the surface of strip substrate 1, are sequentially connected in series between LED chip by the realization of gold thread 4 Electrical connection, and gold thread 4 is electrically connected simultaneously with the realization of the metal pins 2 at substrate both ends, is then coated in fluorescent adhesive layer 5 In LED chip, finally, thermal paste obtained in step 1 is coated in the back side of substrate 1, heat dissipation glue-line is formed after being heating and curing 6.The width of the heat dissipation glue-line 6 of coating is 1mm, is highly 1.2mm.
By the embodiment be made LED light bar 13mA electric currents driving under light to stable state, test its fluorescent adhesive layer 5 After test, heat dissipation glue-line 6 is peeled off, then above-mentioned test process is repeated under similarity condition by surface temperature T1, measures fluorescent glue The surface temperature T2 of layer 5, related data are shown in Table 1.Meanwhile filament is assembled into whole lamp, test its photooptical data, correlated results It is given in Table 1.
Table 1
Test sample Test electric current (mA) LED light bar surface temperature (DEG C) Whole luminous flux (lm) Whole light imitates (lm/w)
Lamp bar is without heat dissipation glue-line 13 93.2 918.6 115.5
Lamp bar has heat dissipation glue-line 13 87.1 939.3 118.0
From the data in table 1 it will be seen that introducing by the glue-line that radiates, hence it is evident that reduce on LED light bar surface Temperature, 6.1 DEG C are decreased by, simultaneously as the reduction of temperature so that with thermal paste layer LED light bar make it is whole The light efficiency and luminous flux of lamp are also obviously improved, and promotion amplitude reaches 2.2% or so.
Embodiment 2
Step 1：Thermal paste is prepared, 500 gram of 40 micron grain size boron nitride powder is taken, takes 100 grams of UV glue, the two is put into beaker Middle mixing, stirring 1 it is small when after be uniformly mixed, be made thermal paste it is spare.
Step 2：LED light bar is made, using aluminum base PCB wiring board as substrate, length h is 250mm, and width w is 4mm, thickness t are 0.3mm, and LED luminescence units are 2835 lamp beads, and quantity is 30, and straight line is arranged in PCB circuit board, 2835 Lamp bead realizes electrical connection by the circuit in PCB substrate, and the both ends of PCB substrate are welded with metal pins, the metal pins It is realized and is electrically connected with lamp bead by the circuit in PCB substrate, thermal paste obtained in step 1 is coated in the back of the body of PCB substrate Face, by forming heat dissipation glue-line after UV photocurings.The width of the heat dissipation glue-line of coating is 4mm, is highly 0.8mm.
By the embodiment be made LED light bar 25mA electric currents driving under light to stable state, test the surface of its lamp bead After test, heat dissipation glue-line is peeled off, then above-mentioned test process is repeated under similarity condition by temperature T3, measures the surface of lamp bead Related data is shown in Table 2 by temperature T4.
Table 2
Test sample Test electric current (mA) 2835 lamp bead surface temperatures (DEG C)
Lamp bar is without heat dissipation glue-line 25 110
Lamp bar has heat dissipation glue-line 25 98
From the data in table 2 it will be seen that introducing by the glue-line that radiates, hence it is evident that reduce 2835 in LED light bar Temperature on lamp bead surface decreases by 12 DEG C.
Embodiment 3
Step 1：Thermal paste is prepared, 2000 gram of 5 micron grain size copper powder is taken, takes 100 grams of UV glue, the two is put into beaker and is mixed Close, stirring 1 it is small when after be uniformly mixed, be made thermal paste 1 it is spare.
Step 2：1500 gram of 50 micron grain size alumina powder is taken, 100 grams of UV glue is taken, the two is put into beaker and is mixed, is stirred Mix 1 it is small when after be uniformly mixed, be made thermal paste 2 it is spare.
Step 3：LED light bar is made, using FR4 wiring boards as substrate, length h is 60mm, and width w is 3mm, thickness T is 1.0mm, and LED luminescence units are 2835 lamp beads, and quantity is 8, and straight line is arranged in PCB circuit board, and 2835 lamp beads pass through Circuit in PCB substrate realizes electrical connection, and the both ends of PCB substrate are welded with metal pins, and the metal pins are also by PCB bases Circuit on plate is realized with lamp bead to be electrically connected, and thermal paste 1 obtained in step 1 is coated in the back side of FR4 substrates first, is led to Heat dissipation glue-line 1 is formed after crossing UV photocurings, width 1.5mm is highly 0.5mm.Then in cured heat dissipation glue-line 1 Thermal paste 2 obtained in applying step 2 again on surface, by forming thermal paste on the surface of heat dissipation glue-line 1 after UV photocurings Layer 2, the width of heat dissipation glue-line 2 is 3mm, is highly 1.5mm, the structure diagram of the LED light bar is shown in Fig. 3.
LED light bar made from the method for reinforcement LED light bar heat dissipation based on above-mentioned offer, is applied to and is steeped with light transmission In the LED illumination lamp of shell, since the LED light bar possesses good heat dissipation characteristics, the reliability of LED illumination lamp is greatly improved, together When, which can be driven by higher electric current and obtain higher luminous flux or lumen value, so that per unit lumen Cost is substantially reduced.
It should be appreciated that the above-mentioned statement for present pre-ferred embodiments is more detailed, can not therefore think It is the limitation to scope of patent protection of the present invention, scope of patent protection of the invention should be determined by the appended claims.

Claims (10)

  1. A kind of a kind of 1. method for strengthening LED light bar heat dissipation, which is characterized in that lamp for strengthening LED light bar heat dissipation using thermal paste Structure, the lamp bar structure include a strip substrate, and the end of strip substrate is provided with metal pins, in the strip Two or more LED luminescence units are provided on one surface of substrate, pass through metal between the LED luminescence units Circuit, which is realized, to be electrically connected and is connected with the metal pins of strip substrate end, in another of the strip substrate back Surface coating heat dissipation glue-line.
  2. 2. thermal paste according to claim 1, its preparation method is special for conduction powder is uniformly mixed with colloidal stroma Sign is, the two mixed weight ratio selected as, colloidal stroma: conduction powder=1: 0.5~99, it is highly preferred that colloidal stroma: Conduction powder=1: 1~30.
  3. 3. thermal paste preparation method according to claim 2, which is characterized in that the conduction powder selected as aluminium oxide In powder, aluminum nitride powder, boron nitride powder, silicon nitride powder, oxide powder and zinc, carborundum powder, silica flour, carbon dust, copper powder, silver powder, aluminium powder One or two kinds of and above mixing.
  4. 4. thermal paste preparation method according to claim 2, which is characterized in that the grain size selected as 20 of the conduction powder Nanometer~100 microns, it is highly preferred that 1 micron~50 microns of selected as.
  5. 5. thermal paste preparation method according to claim 2, which is characterized in that the colloidal stroma includes silica gel, epoxy One kind in resin glue, UV glue high molecular materials.
  6. 6. the method according to claim 1 for strengthening LED light bar heat dissipation, which is characterized in that the material of the strip substrate Matter selected as Metal Substrate plate, such as iron substrate or copper base, the material of the strip substrate can also selected as PCB circuit board Material, such as one kind in aluminum-based circuit board plate, ceramic base circuit board, FR4 wiring boards, Chem3 wiring boards, FPC wiring boards.
  7. 7. the method according to claim 1 for strengthening LED light bar heat dissipation, which is characterized in that the substrate of the strip, Length h is 20mm~500mm, and width w is 0.5mm~10mm, and thickness t is 0.1mm~1.5mm.
  8. 8. the method according to claim 1 for strengthening LED light bar heat dissipation, which is characterized in that the thermal paste is coated on length The back surfaces of substrate form heat dissipation glue-line, and the application width a for the glue-line that radiates is 0.8w≤a≤1.2w, the painting for the glue-line that radiates It is 0.1mm~5mm to apply height b.Preferably, the application width a of glue-line of radiating is 1.0w≤a≤1.2w, the coating for the glue-line that radiates Height b is 0.5mm~3mm.
  9. 9. the method according to claim 1 for strengthening LED light bar heat dissipation, which is characterized in that the heat dissipation glue-line can lead to Cross that a kind of coating of thermal paste forms or two kinds and more than thermal paste alternately apply.
  10. 10. the method according to claim 1 for strengthening LED light bar heat dissipation, which is characterized in that the LED luminescence units can With selected as packed LED chip, flip LED chips or LED lamp bead.
CN201710450366.2A 2017-06-13 2017-06-13 A kind of method for strengthening LED light bar heat dissipation Pending CN108071962A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710450366.2A CN108071962A (en) 2017-06-13 2017-06-13 A kind of method for strengthening LED light bar heat dissipation

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Application Number Priority Date Filing Date Title
CN201710450366.2A CN108071962A (en) 2017-06-13 2017-06-13 A kind of method for strengthening LED light bar heat dissipation

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109722180A (en) * 2019-01-28 2019-05-07 深圳市睿晖新材料有限公司 A kind of mucilage materials with heating conduction and the radiator being made of it
CN112063315A (en) * 2020-09-04 2020-12-11 江苏锦星商贸有限公司 Layer is pasted to lamp strip

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1770487A (en) * 2005-10-12 2006-05-10 李学霖 White light LED package radiating structure
CN203810164U (en) * 2014-03-13 2014-09-03 梁倩 Thermal-conductive LED light emitting body and LED lighting lamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1770487A (en) * 2005-10-12 2006-05-10 李学霖 White light LED package radiating structure
CN203810164U (en) * 2014-03-13 2014-09-03 梁倩 Thermal-conductive LED light emitting body and LED lighting lamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109722180A (en) * 2019-01-28 2019-05-07 深圳市睿晖新材料有限公司 A kind of mucilage materials with heating conduction and the radiator being made of it
CN112063315A (en) * 2020-09-04 2020-12-11 江苏锦星商贸有限公司 Layer is pasted to lamp strip

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Application publication date: 20180525