CN1755999A - 镀锡产品 - Google Patents
镀锡产品 Download PDFInfo
- Publication number
- CN1755999A CN1755999A CNA200510108497XA CN200510108497A CN1755999A CN 1755999 A CN1755999 A CN 1755999A CN A200510108497X A CNA200510108497X A CN A200510108497XA CN 200510108497 A CN200510108497 A CN 200510108497A CN 1755999 A CN1755999 A CN 1755999A
- Authority
- CN
- China
- Prior art keywords
- tin
- plated product
- comparative examples
- coating
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/324—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal matrix material layer comprising a mixture of at least two metals or metal phases or a metal-matrix material with hard embedded particles, e.g. WC-Me
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/347—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with layers adapted for cutting tools or wear applications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
形状 | 碳颗粒平均粒径(微米) | 粒度分布(微米) | 悬浮碳(g/L) | |
实施例1实施例2实施例3比较例1比较例2实施例4比较例3实施例5实施例6实施例7实施例8比较例4实施例9实施例10比较例5比较例6比较例7 | 鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状 | 3.43.43.43.43.43.43.45.85.85.85.85.88.38.38.38.38.3 | 0.9-110.9-110.9-110.9-110.9-110.9-110.9-111.1-18.51.1-18.51.1-18.51.1-18.51.1-18.51.1-311.1-311.1-311.1-311.1-31 | 8080808080808080808080808080808080 |
电镀溶液 | 电镀镀层 | SnC层厚度(微米) | C含量(重量%) | |
实施例1实施例2实施例3比较例1比较例2实施例4比较例3实施例5实施例6实施例7实施例8比较例4实施例9实施例10比较例5比较例6比较例7 | 烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴 | Ni/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/Sn/SnCNi/SnC/SnNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnC | 1.14.06.611.816.7Sn:1SnC:1Sn:1SnC:11.24.05.69.212.71.53.45.78.713.7 | 0.700.690.540.700.95----0.860.240.230.221.050.570.170.090.190.87 |
形状 | 碳颗粒平均粒径(微米) | 粒度分布(微米) | 悬浮碳(g/L) | |
实施例11实施例12比较例8比较例9比较例10比较例11比较例12比较例13比较例14 | 土状土状土状土状土状-------- | 4.04.04.04.04.0-------- | 0.6-370.6-370.6-370.6-370.6-37-------- | 80808080800000 |
电镀溶液 | 电镀镀层 | SnC层厚度(微米) | C含量(重量%) | |
实施例11实施例12比较例8比较例9比较例10比较例11比较例12比较例13比较例14 | 烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴 | Ni/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnSnCu/SnNi/SnCu/SnNi/Sn | 0.93.36.19.216.61.4(Sn)1.1(Sn)0.4(Sn)0.1(Sn) | 0.600.400.280.420.75---- |
摩擦系数 | 接触电阻(mΩ) | ||||
同类之间 | 与经流回处理的Sn之间 | 最初 | 160℃5小时后 | 85℃,85%相对湿度14天后 | |
实施例1实施例2实施例3比较例1比较例2实施例4比较例3实施例5实施例6实施例7实施例8比较例4实施例9实施例10比较例5比较例6比较例7实施例11实施例12比较例8比较例9比较例10比较例11比较例12比较例13比较例14 | 0.130.180.240.280.38----0.170.190.370.440.570.180.200.410.460.560.120.190.250.440.54-------- | 0.130.170.150.200.300.160.280.120.180.180.170.370.130.130.210.290.390.130.180.230.330.330.240.200.170.29 | 0.710.50----0.730.680.720.940.61----0.640.610.47----0.420.740.58----0.440.680.610.780.88 | 1.570.60----0.80----1.521.20----0.861.200.25----0.571.220.74----0.511.012.441.23 | 1.320.68----0.620.930.640.760.70----0.670.660.62----0.600.840.56----0.480.780.75 |
耐磨性,1次 | 耐磨性,20次 | |||
磨损宽度(微米) | 磨损深度(微米) | 磨损宽度(微米) | 磨损深度(微米) | |
实施例1实施例2实施例3比较例1比较例2实施例4比较例3实施例5实施例6实施例7实施例8比较例4实施例9实施例10比较例5比较例6比较例7实施例11实施例12比较例8比较例9比较例10比较例11比较例12比较例13比较例14 | 66102111121126----99111119125186911151211892279110811114917870 | 0.52222.5----11.51.52511.51.5251111.522 | 84189194212224----1581491992222938717919822526292169149224320213 | 26668----5666101.556661.5668102 |
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004283071A JP4813785B2 (ja) | 2004-09-29 | 2004-09-29 | 錫めっき材 |
JP2004-283071 | 2004-09-29 | ||
JP2004283071 | 2004-09-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1755999A true CN1755999A (zh) | 2006-04-05 |
CN1755999B CN1755999B (zh) | 2010-10-06 |
Family
ID=35502712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510108497XA Active CN1755999B (zh) | 2004-09-29 | 2005-09-29 | 镀锡产品 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7651785B2 (zh) |
EP (1) | EP1643015B1 (zh) |
JP (1) | JP4813785B2 (zh) |
CN (1) | CN1755999B (zh) |
DE (1) | DE602005019009D1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101814615B (zh) * | 2009-02-19 | 2012-10-31 | 株式会社神户制钢所 | 燃料电池用隔板及其制造方法 |
CN103080381A (zh) * | 2010-09-09 | 2013-05-01 | 联邦-莫古尔威斯巴登股份有限公司 | 用于滑动元件的分层复合材料,用于生产该复合材料的方法以及其用途 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4749746B2 (ja) * | 2005-03-24 | 2011-08-17 | Dowaメタルテック株式会社 | 錫めっき材およびその製造方法 |
JP2008106290A (ja) * | 2006-10-23 | 2008-05-08 | Ricoh Co Ltd | 電気接点部材 |
JP5107117B2 (ja) * | 2008-03-31 | 2012-12-26 | Dowaメタルテック株式会社 | 複合めっき材およびその製造方法 |
JP5409401B2 (ja) * | 2010-01-05 | 2014-02-05 | 株式会社神戸製鋼所 | 嵌合型端子用錫めっき付き銅合金板材及びその製造方法 |
CN103703865B (zh) | 2011-08-09 | 2016-09-14 | 法国圣戈班玻璃厂 | 电接触复合材料,制造电接触复合材料的方法 |
WO2014099566A1 (en) * | 2012-12-20 | 2014-06-26 | 3M Innovative Properties Company | Electrical connectors and methods of making same |
JP6004121B2 (ja) * | 2013-12-04 | 2016-10-05 | 株式会社オートネットワーク技術研究所 | 電気接点およびコネクタ端子対 |
CN104223589B (zh) * | 2014-09-11 | 2015-12-30 | 东莞诚兴五金制品有限公司 | 一种金刚砂耐磨鞋钉及其制备方法 |
JP7111000B2 (ja) * | 2019-01-18 | 2022-08-02 | 株式会社オートネットワーク技術研究所 | 金属材および接続端子 |
KR20240132325A (ko) * | 2021-12-30 | 2024-09-03 | 독토르.-인제니오르 막스 슐뢰터 게엠베하 운트 코.카게 | 흑연-함유 층을 위한 분산 전해질 |
Family Cites Families (19)
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JPS5311131A (en) | 1976-07-19 | 1978-02-01 | Suzuki Motor Co | Composite alloy plating film having abrasion resistance and its production method |
JPS5445634A (en) | 1978-01-13 | 1979-04-11 | Suzuki Motor Co | Wearrresitant material |
JPS6013092A (ja) * | 1983-06-30 | 1985-01-23 | Heijiro Tarumoto | 金属被覆層形成方法 |
EP0195995B1 (de) * | 1985-03-29 | 1989-09-27 | Siemens Aktiengesellschaft | Verfahren zur Herstellung von Zinn-Graphit- oder Zinn/Blei-Graphit-Schichten und Bad zum galvanischen Abscheiden derartiger Dispersionsüberzüge |
JPS63145819A (ja) | 1986-12-04 | 1988-06-17 | Masayuki Otsuki | 軸受及び摺動用金属部材の製造方法 |
GB8808323D0 (en) * | 1988-04-08 | 1988-05-11 | T & N Technology Ltd | Improvements in/relating to coating of metal substrates |
JPH02170995A (ja) * | 1988-12-22 | 1990-07-02 | Nippon Mining Co Ltd | 錫および錫合金めっき材 |
JP2718793B2 (ja) | 1989-12-26 | 1998-02-25 | 株式会社神戸製鋼所 | 光沢錫めっきを有する銅又は銅合金 |
US5028492A (en) * | 1990-03-13 | 1991-07-02 | Olin Corporation | Composite coating for electrical connectors |
JPH05123772A (ja) * | 1991-10-29 | 1993-05-21 | Nippon Steel Corp | 印刷下地適性に優れたdi缶用表面処理鋼板 |
US5916695A (en) * | 1995-12-18 | 1999-06-29 | Olin Corporation | Tin coated electrical connector |
JP2971035B2 (ja) | 1996-07-31 | 1999-11-02 | 株式会社神戸製鋼所 | 多極端子用錫又は錫合金めっき銅合金及び多極端子 |
WO1998023444A1 (en) * | 1996-11-26 | 1998-06-04 | Learonal, Inc. | Lead-free deposits for bearing surfaces |
JP2000169996A (ja) * | 1998-09-28 | 2000-06-20 | Nippon Mining & Metals Co Ltd | 金属材料 |
DE60211808T2 (de) | 2001-07-31 | 2006-10-19 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe | Plattierte Kupferlegierung und Verfahren zu ihre Herstellung |
JP4090302B2 (ja) | 2001-07-31 | 2008-05-28 | 株式会社神戸製鋼所 | 接続部品成形加工用導電材料板 |
EP1369504A1 (en) * | 2002-06-05 | 2003-12-10 | Hille & Müller | Metal strip for the manufacture of components for electrical connectors |
DE10261303B3 (de) * | 2002-12-27 | 2004-06-24 | Wieland-Werke Ag | Verbundmaterial zur Herstellung elektrischer Kontakte und Verfahren zu dessen Herstellung |
JP4749746B2 (ja) * | 2005-03-24 | 2011-08-17 | Dowaメタルテック株式会社 | 錫めっき材およびその製造方法 |
-
2004
- 2004-09-29 JP JP2004283071A patent/JP4813785B2/ja not_active Expired - Lifetime
-
2005
- 2005-09-26 US US11/235,416 patent/US7651785B2/en active Active
- 2005-09-27 DE DE602005019009T patent/DE602005019009D1/de active Active
- 2005-09-27 EP EP05021111A patent/EP1643015B1/en active Active
- 2005-09-29 CN CN200510108497XA patent/CN1755999B/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101814615B (zh) * | 2009-02-19 | 2012-10-31 | 株式会社神户制钢所 | 燃料电池用隔板及其制造方法 |
CN103080381A (zh) * | 2010-09-09 | 2013-05-01 | 联邦-莫古尔威斯巴登股份有限公司 | 用于滑动元件的分层复合材料,用于生产该复合材料的方法以及其用途 |
CN103080381B (zh) * | 2010-09-09 | 2015-08-19 | 联邦-莫古尔威斯巴登股份有限公司 | 用于滑动元件的分层复合材料,用于生产该复合材料的方法以及其用途 |
Also Published As
Publication number | Publication date |
---|---|
US7651785B2 (en) | 2010-01-26 |
US20060068220A1 (en) | 2006-03-30 |
DE602005019009D1 (de) | 2010-03-11 |
EP1643015A2 (en) | 2006-04-05 |
EP1643015B1 (en) | 2010-01-20 |
JP4813785B2 (ja) | 2011-11-09 |
EP1643015A3 (en) | 2006-04-19 |
CN1755999B (zh) | 2010-10-06 |
JP2006097062A (ja) | 2006-04-13 |
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