CN1755999A - 镀锡产品 - Google Patents

镀锡产品 Download PDF

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CN1755999A
CN1755999A CNA200510108497XA CN200510108497A CN1755999A CN 1755999 A CN1755999 A CN 1755999A CN A200510108497X A CNA200510108497X A CN A200510108497XA CN 200510108497 A CN200510108497 A CN 200510108497A CN 1755999 A CN1755999 A CN 1755999A
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tin
plated product
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coating
thickness
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CN1755999B (zh
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竹井宏文
宮泽宽
浅井健太郎
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Dowa Metaltech Co Ltd
Yazaki Corp
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/324Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal matrix material layer comprising a mixture of at least two metals or metal phases or a metal-matrix material with hard embedded particles, e.g. WC-Me
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/347Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with layers adapted for cutting tools or wear applications
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    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02Combined electrolytic and electrophoretic processes with charged materials
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
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    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
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    • Y10S428/929Electrical contact feature
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    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • Y10T428/12715Next to Group IB metal-base component

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Abstract

提供一种镀锡产品,该产品的接触电阻随时间变差很小、具有优良的耐磨性和低的摩擦系数。形成一种复合材料的镀层作为基材的最外层,该镀层含有0.1-1.0重量%分散于锡层中的碳颗粒,该镀层厚度为1.0-60微米。因此,同类镀锡产品之间的动态摩擦系数小于或等于0.20,而该镀锡产品与通过流回处理的产品之间的动态摩擦系数小于或等于0.20,同时,接触电阻小于或等于1mΩ。

Description

镀锡产品
发明领域
本发明涉及一种镀锡产品。更具体地,本发明涉及一种用作可插入的连接端件等的材料的镀锡产品。
发明背景
使用镀锡产品作为可插入的连接端件的常规材料,其中的锡镀层形成作为导电材料如铜或铜合金的最外层。具体是镀锡产品的接触电阻随时间变差很小,因此可用作在很大环境负荷中使用的汽车等设备的连接端件的材料。
然而,镀锡产品存在的一个问题是不能长期用作可插入的连接端件,因为这种产品是软的,容易磨损。为解决这一问题,提出过通过电镀在导电基材上形成一种复合材料的镀层,以提高镀锡产品的耐磨性,该镀层在作为主要组分的含锡金属基质中包含耐磨性或润滑性的固体颗粒(参见如日本专利公报54-45634、53-11131和63-145819),并提出过在连接端件上施加这样的复合镀层(参见,如日本专利未审查公报2001-526734)(PCT/US96/19768翻译文本的国家阶段公报)。还提出在导电基材上形成其中分散有锡或锡/铅和石墨的镀层,形成耐磨性优良的导电镀层(参见如日本专利公报61-227196)。
然而,采用上述方法制造的常规镀锡产品存在的一个问题是,尽管具有优良的耐磨性,但其摩擦系数相对较高。因此,如果使用这样的镀锡产品作为可插入连接端件的材料,会产生施加的插入力增大的问题。
发明概述
本发明的一个目的是解决上述问题并提供一种接触电阻随时间变差很小、具有优良耐磨性和低摩擦系数的镀锡产品。
为达到上述目的和其它目的,本发明人经过深入研究后发现,如果在基材上形成一层含分散在锡层中的碳颗粒的复合材料镀层,镀层厚度为0.5到10.0微米,较好1.0-5.0微米,就能够制造接触电阻随时间变差很小、具有优良耐磨性和低摩擦系数的镀锡产品。结果,本发明人完成了本发明。
本发明第一方面是一种镀锡产品,它包括:基材;在基材上形成的0.5-10.0微米厚,较好1.0-5.0微米厚的复合材料镀层,所述复合材料包含分散在锡层中的碳颗粒。这种镀锡产品中,所述镀层宜形成为镀锡产品的最外层。碳颗粒在镀层中的含量较好为0.1-1.0重量%。
本发明另一方面是连接端件,它包括:凹端件;能与凹端件配合的凸端件,凹端件和凸端件的至少一个的与另一端件接触的至少一部分是由上述镀锡产品制成。
根据本发明,可制造一种接触电阻随时间变差很小,具有优良耐磨性和低摩擦系数的镀锡产品。
附图简要说明
该附图说明使用本发明的镀锡产品的连接端件的一个例子。
本发明优选实施方式
在本发明镀锡产品的一个优选实施方式中,在基材上形成厚度为0.5-10.0微米,较好1.0-5.0微米厚的复合材料镀层,所述复合材料包含0.1-1.0重量%分散在锡层中的碳颗粒。如果镀层厚度大于10微米,镀锡产品在滑动时的磨损深度和磨损宽度增加,增加其磨损接触面积,使其接触电阻增加,其摩擦系数也增加。因此,复合材料的镀层厚度较好小于或等于10微米,更好小于或等于5微米。另一方面,如果复合材料的镀层厚度小于0.5微米,其摩擦系数虽下降,但是由于锡氧化等原因而使接触电阻随时间变差增大。因此,复合材料的镀层厚度较好为大于或等于0.5微米,更好大于或等于1.0微米。
如图所示,连接端件的凹端件10和与该凹端件10配合的凸端件12中的至少一个是由本发明的镀锡产品制成,就能够提供接触电阻随时间变差很小,具有优良耐磨性和低摩擦系数的连接端件。这种情况下,凹端件10和凸端件12中至少一个接触另一端件的仅一部分是由本发明的镀锡产品制成。
下面详细描述本发明的镀锡产品的例子。
实施例1-3和比较例1和2
使用厚度为0.3毫米的黄铜片(黄铜C2600)作为基材(原料)。首先,黄铜片放入镀镍溶液中,该溶液含有镍(90g/l)、氯化镍(20g/l)和硼(5g/l),在50℃和5A/dm2电流密度下进行镀镍,在黄铜基材上形成1微米厚的镍镀层。
此外,在镀锡溶液(包含烷基芳基磺酸(由German Shredder公司制备)(130ml/l)、烷基芳基磺酸锡(300ml/l)和MST-400(60ml/l))中加入80g/l鳞片状(或薄片形)石墨颗粒并进行分散,所述石墨颗粒的平均粒径为3.4微米,粒度分布为0.91-11微米。按照下面所述获得石墨颗粒的平均粒径。首先将0.5g石墨颗粒分散在50g含20重量%六偏磷酸钠的溶液,通过超声波进一步分散。然后用激光散射粒度分布测定装置测定石墨颗粒的粒径分布(以体积为基准),相应于累积分布中50%的粒径认为是平均粒径。
然后,将镀了镍的基材放入上述镀锡溶液,在25℃和2A/dm2电流密度下,使用锡板作为阳极进行电镀,同时用搅拌器搅拌该溶液,产生镀锡产品,在镍镀层上形成表2所列厚度的锡和石墨颗粒的复合镀层。用荧光卜射线分光法测定厚度,由测定的8个点的平均值计算出该复合镀层的厚度。
制成的镀锡产品通过超声波清洗除去粘附在其表面上的石墨颗粒后,计算镀锡产品的复合镀层中的碳含量,测定镀锡产品的摩擦系数、接触电阻和耐磨性。
从制成的各镀锡产品(包含基材)上切出测试片,分别进行Sn和C的分析。采用等离子体分光分析,由ICP装置(IRIS/AR,Jarrell Ash公司制造)获得测试片中的Sn重量%(X重量%)含量,采用燃烧近红外吸收分析法,由碳/硫微分析仪(EMIA-U150,HORIBA,Ltd.制造)获得该测试片的C重量%含量。然后,按Y/(X+Y)计算锡镀层中的C的重量%含量。
测定两个制成的镀锡产品所切出的试片之间的动态摩擦系数,以及该测试片和经过流回处理的镀锡产品之间的动态摩擦系数,作为镀锡产品的摩擦系数。而且,作为经过流回处理的镀锡产品,使用在0.25毫米厚的Cu-Ni-Sn合金基材(NB-109-EH,由Dowa Mining Co,Ltd.制造)上形成1微米厚的锡镀层后,再经过流回处理的镀锡产品。两个测试片之间的动态摩擦系数(μ)计算如下。对一个测试片进行压痕,用作压头(R:3毫米,三个压痕),另一测试片用作评价样品。使用测力计,用来以100mm/min的移动速度滑动该压头,同时以15N的力将该压头压向进行评价的试样。因此,测定水平方向施加的力(F),由μ=F/N计算出动态摩擦系数(μ)。类似地,测试片和经过流回处理的镀锡产品之间的动态摩擦系数是测定使压头滑动时在水平方向施加的力(F),由μ=F/N计算,具体是以100mm/min的移动速度,在经过流回处理的镀锡产品上进行压痕,同时以15N的力将该压头压向测试片。
作为镀锡产品的接触电阻,测定了最初的接触电阻、在160℃加热150小时后的接触电阻以及在85℃和85%相对湿度下保持14天后的接触电阻。采用根据JISC5402的交替四端点法,在200mV开路电压和10mA电流下,滑动负荷从0fg包含到100fg时,在100fg下测定上述接触电阻。
将直径10毫米的SUS球作为压头以100gf的力在镀锡产品上分别滑动一次和20次后,用超深显微镜(VK-8500,KEYENCE公司制造)观察该镀锡产品,测定其磨损宽度和磨损深度,用于评价各镀锡产品的耐磨性。
结果列于表1至表6。如这些表所示,当复合镀层厚度在1.1-6.6微米范围,如实施例1至实施例3,测试片和通过流回处理的镀锡产品之间的动态摩擦系数在0.13-0.15范围。特别是,当复合镀层厚度在1.1-4.0微米范围时,如实施例1和2,两个测试片之间的动态摩擦系数也在0.13-0.18范围,因此能获得低的动态摩擦系数,同时保持优良的耐磨性。然而,当复合镀层的厚度在11.8-16.7范围,如比较例1和2,动态摩擦系数都达到0.2或更高的值。
                           表1
形状   碳颗粒平均粒径(微米) 粒度分布(微米) 悬浮碳(g/L)
  实施例1实施例2实施例3比较例1比较例2实施例4比较例3实施例5实施例6实施例7实施例8比较例4实施例9实施例10比较例5比较例6比较例7   鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状鳞片状   3.43.43.43.43.43.43.45.85.85.85.85.88.38.38.38.38.3   0.9-110.9-110.9-110.9-110.9-110.9-110.9-111.1-18.51.1-18.51.1-18.51.1-18.51.1-18.51.1-311.1-311.1-311.1-311.1-31   8080808080808080808080808080808080
                                   表2
电镀溶液   电镀镀层 SnC层厚度(微米) C含量(重量%)
  实施例1实施例2实施例3比较例1比较例2实施例4比较例3实施例5实施例6实施例7实施例8比较例4实施例9实施例10比较例5比较例6比较例7   烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴   Ni/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/Sn/SnCNi/SnC/SnNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnC   1.14.06.611.816.7Sn:1SnC:1Sn:1SnC:11.24.05.69.212.71.53.45.78.713.7   0.700.690.540.700.95----0.860.240.230.221.050.570.170.090.190.87
                              表3
形状   碳颗粒平均粒径(微米) 粒度分布(微米) 悬浮碳(g/L)
  实施例11实施例12比较例8比较例9比较例10比较例11比较例12比较例13比较例14   土状土状土状土状土状--------   4.04.04.04.04.0--------   0.6-370.6-370.6-370.6-370.6-37--------   80808080800000
                                   表4
电镀溶液   电镀镀层 SnC层厚度(微米) C含量(重量%)
  实施例11实施例12比较例8比较例9比较例10比较例11比较例12比较例13比较例14   烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴烷基芳基磺酸浴   Ni/SnCNi/SnCNi/SnCNi/SnCNi/SnCNi/SnSnCu/SnNi/SnCu/SnNi/Sn   0.93.36.19.216.61.4(Sn)1.1(Sn)0.4(Sn)0.1(Sn)   0.600.400.280.420.75----
                                     表5
             摩擦系数           接触电阻(mΩ)
  同类之间   与经流回处理的Sn之间   最初   160℃5小时后   85℃,85%相对湿度14天后
  实施例1实施例2实施例3比较例1比较例2实施例4比较例3实施例5实施例6实施例7实施例8比较例4实施例9实施例10比较例5比较例6比较例7实施例11实施例12比较例8比较例9比较例10比较例11比较例12比较例13比较例14   0.130.180.240.280.38----0.170.190.370.440.570.180.200.410.460.560.120.190.250.440.54--------   0.130.170.150.200.300.160.280.120.180.180.170.370.130.130.210.290.390.130.180.230.330.330.240.200.170.29   0.710.50----0.730.680.720.940.61----0.640.610.47----0.420.740.58----0.440.680.610.780.88   1.570.60----0.80----1.521.20----0.861.200.25----0.571.220.74----0.511.012.441.23   1.320.68----0.620.930.640.760.70----0.670.660.62----0.600.840.56----0.480.780.75
                            表6
                 耐磨性,1次                   耐磨性,20次
  磨损宽度(微米)   磨损深度(微米)   磨损宽度(微米)   磨损深度(微米)
  实施例1实施例2实施例3比较例1比较例2实施例4比较例3实施例5实施例6实施例7实施例8比较例4实施例9实施例10比较例5比较例6比较例7实施例11实施例12比较例8比较例9比较例10比较例11比较例12比较例13比较例14   66102111121126----99111119125186911151211892279110811114917870   0.52222.5----11.51.52511.51.5251111.522   84189194212224----1581491992222938717919822526292169149224320213   26668----5666101.556661.5668102
实施例4比较例3
采用和实施例1-3相同的方法制得一种镀锡产品(实施例4),不同的是镍镀层和1微米厚的复合镀层之间形成1微米的锡镀层。采用和实施例1于相同的方法制得一种镀锡产品(比较例3),不同的是在镍镀层和1微米厚的锡镀层之间形成1微米厚度的复合镀层,采用和实施例1-3相同的方法评价摩擦系数和接触电阻。其结果列于表1至表6。如这些表所示,在实施例4中,测试片和通过流回处理的镀锡产品之间的动态摩擦系数为0.16,在160℃加热150小时后的接触电阻为0.67mΩ。如果锡镀层作为底层形成在复合镀层的下面,与实施例1中没有形成锡镀层的底层相比,可以降低接触电阻,同时保持低的动态摩擦系数。另一方面,在比较例3中,测试片和通过流回处理的镀锡产品之间的动态摩擦系数较高,为0.28,因为最外层是锡镀层。
实施例5-8和比较例4
采用和实施例1-3相同的方法,制造镀锡产品,这些产品具有锡和石墨颗粒的复合镀层,厚度列于表2,不同之处是,使用鳞片状石墨颗粒,其平均粒径为5.8微米,粒度分布为1.1-18.5微米。采用和实施例1-3相同的方法,计算各镀锡产品的复合镀层中的碳含量,并评价产品的动态摩擦系数、接触电阻和耐磨性。结果列于表1至表6。如这些表所示,当复合镀层厚度在1.2-9.2微米范围时,如实施例5至8,测试片和通过流回处理的镀锡产品之间的动态摩擦系数在0.12-0.18范围。特别是当复合镀层厚度在1.2-4.0微米范围时,如实施例5和6,两个测试片之间的动态摩擦系数在0.17-0.19范围,因此可以获得低的摩擦系数,同时保持优良的耐磨性。然而,当复合镀层厚度为12.7微米时,如比较例4,测试片和通过流回处理的镀锡产品之间以及两个测试片之间的动态摩擦系数分别为0.37和0.54。
实施例9、10和比较例5-7
采用和实施例1-3相同的方法,制造镀锡产品,这些产品具有锡和石墨颗粒的复合镀层,厚度列于表2,不同之处是,使用鳞片状石墨颗粒,其平均粒径为8.3微米,粒度分布为1.1-31微米。采用和实施例1-3相同的方法,计算各镀锡产品的复合镀层中的碳含量,并评价产品的动态摩擦系数、接触电阻和耐磨性。结果列于表1至表6。如这些表所示,当复合镀层厚度在1.5-3.4微米范围时,如实施例9和10,测试片和通过流回处理的镀锡产品之间的动态摩擦系数为0.13,两个测试片之间的动态摩擦系数在0.18-0.20范围,因此可以获得低的摩擦系数,同时保持优良的耐磨性。但是,当复合镀层厚度在5.7-13.7微米范围时,如比较例5至7,测试片和通过流回处理的镀锡产品之间的动态摩擦系数较高,为0.21-0.39,两个测试片之间的动态摩擦系数也较高,为0.41-0.56。
实施例11和12,比较例8-10
采用和实施例1-3相同的方法,制造镀锡产品,这些产品具有锡和石墨颗粒的复合镀层,厚度列于表2,不同之处是,使用土状形石墨颗粒,其平均粒径为4.0微米,粒度分布为0.6-37微米。采用和实施例1-3相同的方法,计算各镀锡产品的复合镀层中的碳含量,并评价产品的动态摩擦系数、接触电阻和耐磨性。结果列于表1至表6。如这些表所示,当复合镀层厚度在0.9-3.3微米范围时,如实施例11和12,测试片和通过流回处理的镀锡产品之间的动态摩擦系数在0.13-0.18范围,两个测试片之间的动态摩擦系数在0.12-0.19范围,因此可以获得低的摩擦系数,同时保持优良的耐磨性。但是,当复合镀层厚度在6.1-16.6微米范围时,如比较例8至10,测试片和通过流回处理的镀锡产品之间的动态摩擦系数较高,为0.23-0.33,两个测试片之间的动态摩擦系数也较高,为0.25-0.54。
比较例11
类似于实施例1-3,进行镀镍,形成1微米厚度的镍镀层后,采用和实施例1-3相同的方法,使用和实施例1-3相同的烷基芳基磺酸浴,形成1.4微米厚的无光锡镀层,制得镀锡产品,但是其中没有加入石墨。采用和实施例1-3相同的方法,评价产品的动态摩擦系数、接触电阻和耐磨性。结果列于表1至表6。如这些表所示,在这一比较例中,尽管锡镀层厚度较小,为1.4微米,测试片和通过流回处理的镀锡产品之间的动态摩擦系数较高,为24。
比较例12
将厚0.25毫米的Cu-Ni-Sn合金(NB-109-EH材料,Dowa Mining Co,Ltd制造)的基材放入镀浴中,该镀浴包含硫酸(60g/l)、硫酸锡(60g/l)、甲酚磷酸(30g/l)和表面活性剂(1ml/l)在50℃和2A/dm2电流密度下进行电镀,在该合金基村上形成1.1微米厚的锡镀层。然后进行流回处理,制得镀锡产品。采用和实施例1-3相同的方法,评价产品的动态摩擦系数、接触电阻和耐磨性。结果列于表1至表6。如这些表所示,在此比较例中,两个测试片(在此比较例中,是两个经过流回处理的镀锡产品)之间的动态摩擦系数为0.2,实施例1-12的各镀锡产品的动态摩擦系数等于或低于在此比较例中经过流回处理的镀锡产品的动态摩擦系数。
比较例13
在和比较例12相同的基材上,顺序形成1微米厚的光亮铜镀层、0.2微米厚的SnNi合金镀层和0.4微米厚的锡镀层,制得镀锡产品,采用和实施例1-3相同的方法,评价摩擦系数、接触电阻和耐磨性。结果列于表1至表6。如这些表所示,在此比较例中,测试片和通过流回处理的镀锡产品之间的动态摩擦系数较低,为0.17,但是,在160℃加热150小时后的接触电阻较高,为2.44mΩ。
比较例14
采用和比较例12相同的方法,制造镀锡产品,但是,锡镀层厚度为0.1微米,采用和实施例1-3相同的方法,评价摩擦系数、接触电阻和耐磨性。结果列于表1至表6。如这些表所示,在此比较例中,在160℃加热150小时后的接触电阻较低,为1.23mΩ,但是,测试片和通过流回处理的镀锡产品之间的动态摩擦系数较高,为0.29。
如上面所述,实施例1至实施例12的镀锡产品的动态摩擦系数小于比较例11的流回处理镀锡产品以及比较例10的无光镀锡产品,因此该产品可用作在其上施加的插入力较小的端件的材料。
虽然以较好实施方式揭示了本发明,以便更好地理解本发明,但应知道,在不偏离本发明原理下可以以各种方式实施本发明。因此,应当理解,在不偏离权利要求书提出的本发明原理、条件下,所有可能的实施方式以及对所示实施方式可以进行的修改都包括在内。

Claims (5)

1.一种镀锡产品,包括:
基材;和
复合材料的镀层,该镀层包含分散在锡层中的碳颗粒,所述镀层形成在基材上,厚度为0.5-10.0微米。
2.如权利要求1所述的镀锡产品,其特征在于,所述镀层的厚度在1.0-5.0微米范围。
3.如权利要求1所述的镀锡产品,其特征在于,所述镀层成形作为所述镀锡产品的最外层。
4.如权利要求1所述的镀锡产品,其特征在于,所述碳颗粒在所述镀层中的含量在0.1-1.0重量%范围。
5.一种连接端件,包括:
凹端件;和
与所述凹端件配合的凸端件,
其特征在于,所述凹端件和凸端件中的至少一个与另一端件接触的至少一部分由权利要求1所述的镀锡产品制成。
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