CN1753172A - 散热装置制造方法 - Google Patents

散热装置制造方法 Download PDF

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CN1753172A
CN1753172A CNA2004100516702A CN200410051670A CN1753172A CN 1753172 A CN1753172 A CN 1753172A CN A2004100516702 A CNA2004100516702 A CN A2004100516702A CN 200410051670 A CN200410051670 A CN 200410051670A CN 1753172 A CN1753172 A CN 1753172A
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heat pipe
radiator
groove
pedestal
welding rod
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CN100377343C (zh
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李学坤
陈俊吉
周世文
符猛
梁驰
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing heat exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/06—Tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y10T29/49368—Sheet joined to sheet with inserted tubes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y10T29/49369—Utilizing bond inhibiting material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49373—Tube joint and tube plate structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means
    • Y10T29/49378—Finned tube
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置制造方法，包括以下步骤：1)提供至少一热管；2)提供一散热器，该散热器包括一基座，在该基座一侧设有沟槽，用以容置热管的至少一部分；3)提供一焊条，并将焊条、热管依次置于沟槽内，使焊条夹置于热管与散热器之间；4)加热使焊条熔化，并以一平面压向基座上设有沟槽的一侧。由于焊条流动性较差，熔化后可将热管与散热器之间的间隙填满，可避免由于空气的存在而产生的热阻。

Description

散热装置制造方法
【技术领域】
本发明是关于一种散热装置制造方法，尤其是指一种应用于电子元件的散热装置的制造方法。
【背景技术】
为确保电子元件能够正常工作，需将电子元件运行时产生的热量及时散失掉。
热管与散热器结合使用是目前常用的散热方式之一。通常以锡膏焊接方式将热管蒸发段固定于散热器底部的沟槽内，使热管的蒸发段设于散热器与电子元件之间，并将其冷凝段向外部延伸，且在热管的冷凝段外安装若干的散热片。使用时，通过热管的相变化与散热器的热扩散作用可将电子元件产生的热量迅速散失掉。但热管的蒸发段是通过锡膏焊接于散热器的沟槽内，无法完全填平焊接面的沟槽部分，使散热器与电子元件之间无法平整的贴置在一起，从而导致电子元件与散热器之间的空气热阻增大，影响散热效果。
为使散热器与电子元件能够平整的贴置在一起，业界人士在热管与电子元件接触一侧焊接一金属片如铜板或铝板等，利用金属片与电子元件接触，相关技术如中国台湾专利公告第472919号。这种结构虽然可使散热器与电子元件平整接触，但不易于将锡膏均匀涂布在散热器沟槽内表面，且锡膏受热后易流动，从而导致热管与散热器沟槽之间的焊接面积降低即焊着率减小，影响散热效果；此外，金属片也具有一定的热阻，故这种改进仍未有效降低热管及散热器与电子元件之间的热阻，且使用金属片会增加制造成本。
【发明内容】
本发明的目的在于提供一种能有效降低热管及散热器与电子元件之间的热阻的散热装置制造方法。
本发明的目的是通过以下技术方案实现的：一种散热装置制造方法，包括以下步骤：1)提供至少一热管；2)提供一散热器，该散热器包括一基座，在该基座一侧设有沟槽，用以容置热管的至少一部分；3)提供一焊条，并将焊条、热管依次置于沟槽内，使焊条夹置于热管与散热器之间；4)加热使焊条熔化，并以一平面压向基座上设有沟槽的一侧。
由于焊条流动性较差，熔化后可将热管与散热器之间的间隙填满，可避免由于空气的存在而产生的热阻；而且，焊条熔化后通过压紧平面来调节热管与沟槽之间的位置关系，故可使热管与散热器的结合面具有良好的平面度，从而使本发明散热装置直接与电子元件接触，而省去习知技术所采用的金属片，可有效降低热管、散热器与电子元件之间的热阻。
下面参照附图结合实施例对本发明作进一步的描述。
【附图说明】
图1是本发明散热装置的立体分解示意图。
图2是本发明散热装置组装后的示意图。
图3是本发明散热装置的另一实施例的示意图。
【具体实施方式】
请参考图1及图2，本发明散热装置包括一散热器30及一热管10，其制造方法包括以下步骤：1)提供一热管10；2)提供一散热器30，其包括一基座32，在基座32一侧设有沟槽34，用以容置热管10；在基座32另一侧上设有若干散热片36；3)提供一焊条20如锡条等，并将焊条20、热管10依次置于沟槽34内，使焊条20夹置于热管10与散热器30之间；4)加热使焊条20熔化，并以一平面如金属板等压向基座32上设有沟槽34的一侧，从而将热管10固定在沟槽34内。
由于焊条20流动性较差，熔化后可将热管10与散热器30之间的间隙填满，可避免由于空气的存在而产生的热阻；而且，焊条20熔化后，通过平面压紧可调节热管10与沟槽34之间的位置关系，故可使热管10与散热器30的结合面具有良好的平面度，从而使本发明散热装置直接与电子元件40接触。
图3为根据本发明的方法制造的另一散热装置，其包括二弯曲状的热管10A及一散热器30A。散热器30A包括一基座32A，在基座32A一侧设有两个沟槽34A用以容置热管10A，且两沟槽34A对应热管10A的形状在基座32A一侧相对弯曲，从而形成“X”形；在基座32A另一侧设有若干散热片。该散热装置的制造方法与上述的制造方法基本一样，不同之处在仅在于将焊条的形状由直条形改为弯曲状。
上述为本发明散热装置的制造方法及按照该方法制造的两具体散热装置，但根据本方法制成的散热装置并不仅限于此，如可增加热管的数量、更改热管的形状、排列布置等。此外，根据需要，还可将热管的全部或一部分设置于沟槽内。

Claims (2)

1.一种散热装置制造方法，包括以下步骤：1)提供至少一热管；2)提供一散热器，该散热器包括一基座，在该基座一侧设有沟槽，用以容置热管的至少一部分；3)提供一焊条，并将焊条、热管依次置于沟槽内，使焊条夹置于热管与散热器之间；4)加热使焊条熔化，并以一平面压向基座上设有沟槽的一侧。
2.如权利要求1所述散热装置制造方法，其特征在于：该散热装置包括两弯曲的热管，该基座上的沟槽对应热管形状相对弯曲。
CNB2004100516702A 2004-09-21 2004-09-21 散热装置的制造方法 Expired - Fee Related CN100377343C (zh)

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US11/069,743 US7047640B2 (en) 2004-09-21 2005-03-01 Method of manufacturing a heat dissipating device

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Cited By (11)

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CN100463593C (zh) * 2006-05-16 2009-02-18 珍通科技股份有限公司 滚压式热管与传热基座的结合方法
CN101594764B (zh) * 2008-05-28 2011-05-11 富准精密工业(深圳)有限公司 散热装置及其制造方法
CN104551582A (zh) * 2014-12-08 2015-04-29 虞寿仁 微型微通道金属圆管换热器的生产方法
CN104551313A (zh) * 2014-12-08 2015-04-29 虞寿仁 用于微型微通道金属圆管换热器焊接支架
CN104813760A (zh) * 2014-03-18 2015-07-29 华为终端有限公司 一种散热组件及电子设备
CN109327997A (zh) * 2017-08-01 2019-02-12 东莞市普威玛精密工业有限公司 移动电子装置的热管与金属壳体的连结构造
CN111465294A (zh) * 2020-05-21 2020-07-28 福建捷联电子有限公司 高端显示器散热结构的连接方法
CN112201740A (zh) * 2020-11-02 2021-01-08 长丰吾道智能光电科技有限公司 散热鳍片的热管弯管组装设备
CN112201741A (zh) * 2020-11-02 2021-01-08 长丰吾道智能光电科技有限公司 散热鳍片的热管弯管装置
CN112207523A (zh) * 2020-11-02 2021-01-12 长丰吾道智能光电科技有限公司 散热鳍片的热管弯管组装方法
CN113412032A (zh) * 2021-06-22 2021-09-17 中国电子科技集团公司第九研究所 新型水冷式差相移式隔离器

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