CN1734709A - 用于将保护膜贴敷在半导体晶片上的方法和装置 - Google Patents

用于将保护膜贴敷在半导体晶片上的方法和装置 Download PDF

Info

Publication number
CN1734709A
CN1734709A CNA2005100844650A CN200510084465A CN1734709A CN 1734709 A CN1734709 A CN 1734709A CN A2005100844650 A CNA2005100844650 A CN A2005100844650A CN 200510084465 A CN200510084465 A CN 200510084465A CN 1734709 A CN1734709 A CN 1734709A
Authority
CN
China
Prior art keywords
diaphragm
wafer
cutting
semiconductor wafer
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005100844650A
Other languages
English (en)
Chinese (zh)
Inventor
斋藤博
栗田刚
冈本光司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN1734709A publication Critical patent/CN1734709A/zh
Pending legal-status Critical Current

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CNA2005100844650A 1997-05-30 1998-05-29 用于将保护膜贴敷在半导体晶片上的方法和装置 Pending CN1734709A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP157830/97 1997-05-30
JP157831/97 1997-05-30
JP15783197A JP3919292B2 (ja) 1997-05-30 1997-05-30 半導体ウェハ保護フィルムの切断方法および装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB03107748XA Division CN1254847C (zh) 1997-05-30 1998-05-29 用于将保护膜贴敷在半导体晶片上的方法和装置

Publications (1)

Publication Number Publication Date
CN1734709A true CN1734709A (zh) 2006-02-15

Family

ID=15658291

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005100844650A Pending CN1734709A (zh) 1997-05-30 1998-05-29 用于将保护膜贴敷在半导体晶片上的方法和装置

Country Status (2)

Country Link
JP (1) JP3919292B2 (enExample)
CN (1) CN1734709A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109534078A (zh) * 2018-11-27 2019-03-29 北京金风科创风电设备有限公司 自动粘贴及自动裁剪装置
CN113613824A (zh) * 2019-03-19 2021-11-05 东洋制罐株式会社 激光刻印装置及激光刻印方法、带拉环的罐盖的制造装置及制造方法
CN114872103A (zh) * 2022-06-06 2022-08-09 无锡沃格自动化科技股份有限公司 一种胶条吸板、胶条分切机构及贴胶方法
TWI898127B (zh) * 2021-03-25 2025-09-21 日商迪思科股份有限公司 保護片黏貼裝置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
JP4642002B2 (ja) * 2006-11-14 2011-03-02 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
JP7351090B2 (ja) * 2019-03-19 2023-09-27 東洋製罐株式会社 レーザー刻印装置
JP7360812B2 (ja) * 2019-05-17 2023-10-13 リンテック株式会社 シート支持装置およびシート支持方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109534078A (zh) * 2018-11-27 2019-03-29 北京金风科创风电设备有限公司 自动粘贴及自动裁剪装置
CN109534078B (zh) * 2018-11-27 2020-12-01 北京金风科创风电设备有限公司 自动粘贴及自动裁剪装置
CN113613824A (zh) * 2019-03-19 2021-11-05 东洋制罐株式会社 激光刻印装置及激光刻印方法、带拉环的罐盖的制造装置及制造方法
TWI898127B (zh) * 2021-03-25 2025-09-21 日商迪思科股份有限公司 保護片黏貼裝置
CN114872103A (zh) * 2022-06-06 2022-08-09 无锡沃格自动化科技股份有限公司 一种胶条吸板、胶条分切机构及贴胶方法

Also Published As

Publication number Publication date
JPH10329087A (ja) 1998-12-15
JP3919292B2 (ja) 2007-05-23

Similar Documents

Publication Publication Date Title
CN1254847C (zh) 用于将保护膜贴敷在半导体晶片上的方法和装置
US7598156B2 (en) Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension
JP3737118B2 (ja) 半導体ウエハの保護粘着テープの剥離方法およびその装置
CN1734709A (zh) 用于将保护膜贴敷在半导体晶片上的方法和装置
CN104203471B (zh) 夹持装置
KR20070004073A (ko) 초박형 실리콘 웨이퍼 절단방법 및 장치
TW200905741A (en) Methods and apparatus for polishing a notch of a substrate by substrate vibration
US20060180136A1 (en) Tape expansion apparatus
JPH10330022A (ja) 半導体ウェハ保護フィルムの貼付方法および装置
CN101602446A (zh) 粘结膜带馈送机构
JP2004082282A (ja) 半導体ブロックのスライス方法
JP3545758B2 (ja) 半導体ウェハ保護フィルムの切断方法および装置
KR100954242B1 (ko) 접착막 첩부장치 및 접착막 테이프 이송기구
CN111844492A (zh) 晶体切割装置
JPH05220731A (ja) ウエーハ切り離し方法及びワイヤーソー装置
JPH11198018A (ja) 固定砥粒付エンドレスワイヤソー
JPH09155858A (ja) ワイヤソーのワーク切断装置
JP3223780B2 (ja) チップの実装装置
JPH06216242A (ja) 半導体ウエハに貼着する粘着テープの貼着方法
CN115719732A (zh) 基板的分割方法
JPH01264236A (ja) ウエハブレーク装置
JPH10337648A (ja) ワイヤソー
JP2614343B2 (ja) ワイヤーソー
JP2023151168A (ja) 半導体装置の製造方法
CN116638650A (zh) 边皮加工方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned
C20 Patent right or utility model deemed to be abandoned or is abandoned