CN1703327B - 由印刷电路板剥离银的方法 - Google Patents

由印刷电路板剥离银的方法 Download PDF

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Publication number
CN1703327B
CN1703327B CN038066629A CN03806662A CN1703327B CN 1703327 B CN1703327 B CN 1703327B CN 038066629 A CN038066629 A CN 038066629A CN 03806662 A CN03806662 A CN 03806662A CN 1703327 B CN1703327 B CN 1703327B
Authority
CN
China
Prior art keywords
silver
printed circuit
circuit board
stripping
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN038066629A
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English (en)
Chinese (zh)
Other versions
CN1703327A (zh
Inventor
丹娜·M·寇罗格
雷蒙德·A·里提兹
布莱恩·赖森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of CN1703327A publication Critical patent/CN1703327A/zh
Application granted granted Critical
Publication of CN1703327B publication Critical patent/CN1703327B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/40—Alkaline compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
CN038066629A 2002-03-25 2003-02-18 由印刷电路板剥离银的方法 Expired - Fee Related CN1703327B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/106,522 2002-03-25
US10/106,522 US6783690B2 (en) 2002-03-25 2002-03-25 Method of stripping silver from a printed circuit board
PCT/US2003/004784 WO2003082605A1 (en) 2002-03-25 2003-02-18 Method of stripping silver from a printed circuit board

Publications (2)

Publication Number Publication Date
CN1703327A CN1703327A (zh) 2005-11-30
CN1703327B true CN1703327B (zh) 2010-06-09

Family

ID=28452509

Family Applications (1)

Application Number Title Priority Date Filing Date
CN038066629A Expired - Fee Related CN1703327B (zh) 2002-03-25 2003-02-18 由印刷电路板剥离银的方法

Country Status (8)

Country Link
US (1) US6783690B2 (cg-RX-API-DMAC7.html)
EP (1) EP1487646B1 (cg-RX-API-DMAC7.html)
JP (1) JP3683896B2 (cg-RX-API-DMAC7.html)
CN (1) CN1703327B (cg-RX-API-DMAC7.html)
AU (1) AU2003217557A1 (cg-RX-API-DMAC7.html)
ES (1) ES2410811T3 (cg-RX-API-DMAC7.html)
TW (1) TWI256423B (cg-RX-API-DMAC7.html)
WO (1) WO2003082605A1 (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4268515B2 (ja) * 2003-12-26 2009-05-27 新光電気工業株式会社 電解剥離方法
KR100712879B1 (ko) * 2005-04-06 2007-04-30 주식회사 잉크테크 에칭액 조성물
US20070232510A1 (en) * 2006-03-29 2007-10-04 Kucera Alvin A Method and composition for selectively stripping silver from a substrate
KR20100136544A (ko) * 2008-04-10 2010-12-28 월드 프로퍼티즈 인코퍼레이티드 접합이 향상된 회로 재료, 그 회로 재료의 제조 방법 및 그 제조 방법으로부터 생성된 물품
US8753561B2 (en) * 2008-06-20 2014-06-17 Baxter International Inc. Methods for processing substrates comprising metallic nanoparticles
US8178120B2 (en) * 2008-06-20 2012-05-15 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
US8277826B2 (en) * 2008-06-25 2012-10-02 Baxter International Inc. Methods for making antimicrobial resins
US20090324738A1 (en) * 2008-06-30 2009-12-31 Baxter International Inc. Methods for making antimicrobial coatings
US20100227052A1 (en) * 2009-03-09 2010-09-09 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
WO2010128094A1 (en) * 2009-05-08 2010-11-11 Basf Se Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization
CN103237419B (zh) * 2013-04-22 2016-04-20 胜华电子（惠阳）有限公司 一种化银线路板银面剥除方法
WO2015095664A2 (en) 2013-12-20 2015-06-25 Greene Lyon Group, Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
WO2016210051A1 (en) 2015-06-24 2016-12-29 Greene Lyon Group, Inc. Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions
JP7691369B2 (ja) 2019-03-11 2025-06-11 ショルダー・イノベーションズ・インコーポレイテッド 全リバースショルダーシステムおよび方法
CN114074492B (zh) * 2020-08-18 2024-06-25 光群雷射科技股份有限公司 去除转印滚轮的拆版线的方法
TWI755229B (zh) * 2020-12-30 2022-02-11 力橋國際有限公司 無氰之電解剝銀劑及電解剝銀方法
CN113846326A (zh) * 2021-09-23 2021-12-28 江苏富乐德半导体科技有限公司 一种陶瓷覆铜基板表面化学镀银退镀方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615950A (en) * 1968-04-19 1971-10-26 Philips Corp Method of etching silver-tin-lead contacts on a nickel coated base
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
JPH07316845A (ja) 1994-05-19 1995-12-05 Hitachi Cable Ltd 銀めっき部材の表面処理液
US6126720A (en) * 1997-06-16 2000-10-03 Mitsubishi Materials Corporation Method for smelting noble metal

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3860423A (en) 1973-08-24 1975-01-14 Rca Corp Etching solution for silver
US4448637A (en) 1981-12-28 1984-05-15 Daicel Chemical Industries, Ltd. Etching method of conductive film
US4960490A (en) 1983-06-13 1990-10-02 Minnesota Mining And Manufacturing Company Method of making multiple-connector adhesive tape
US5002649A (en) 1988-03-28 1991-03-26 Sifco Industries, Inc. Selective stripping apparatus
JPH03232980A (ja) * 1990-02-06 1991-10-16 Shinko Electric Ind Co Ltd 銅もしくは銅合金上の銀剥離液
DE4031609A1 (de) 1990-03-16 1991-09-19 Kodak Ag Verfahren und vorrichtung zur aufbereitung von fluessigen rueckstaenden aus photographischen prozessen
USH1136H (en) 1991-11-29 1993-02-02 The United States Of America As Represented By The Secretary Of The Air Force Electrolytic deposition and recovery of silver
US5611905A (en) * 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process
US6200451B1 (en) 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
WO1998004406A1 (en) * 1996-07-26 1998-02-05 Asahi Glass Company Ltd. Transparent conductive film and method for forming transparent electrode
US6238592B1 (en) 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615950A (en) * 1968-04-19 1971-10-26 Philips Corp Method of etching silver-tin-lead contacts on a nickel coated base
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
JPH07316845A (ja) 1994-05-19 1995-12-05 Hitachi Cable Ltd 銀めっき部材の表面処理液
US6126720A (en) * 1997-06-16 2000-10-03 Mitsubishi Materials Corporation Method for smelting noble metal

Also Published As

Publication number Publication date
TW200304507A (en) 2003-10-01
JP2005520936A (ja) 2005-07-14
JP3683896B2 (ja) 2005-08-17
TWI256423B (en) 2006-06-11
CN1703327A (zh) 2005-11-30
EP1487646B1 (en) 2013-05-22
WO2003082605A1 (en) 2003-10-09
EP1487646A1 (en) 2004-12-22
EP1487646A4 (en) 2010-01-13
ES2410811T3 (es) 2013-07-03
US6783690B2 (en) 2004-08-31
AU2003217557A1 (en) 2003-10-13
US20030183598A1 (en) 2003-10-02

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100609

Termination date: 20220218

CF01 Termination of patent right due to non-payment of annual fee