CN1674217A - 处理装置 - Google Patents
处理装置 Download PDFInfo
- Publication number
- CN1674217A CN1674217A CNA2005100517606A CN200510051760A CN1674217A CN 1674217 A CN1674217 A CN 1674217A CN A2005100517606 A CNA2005100517606 A CN A2005100517606A CN 200510051760 A CN200510051760 A CN 200510051760A CN 1674217 A CN1674217 A CN 1674217A
- Authority
- CN
- China
- Prior art keywords
- fine
- fluid injection
- substrate
- injection portion
- drop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Images
Classifications
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- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
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- B01L3/02—Burettes; Pipettes
- B01L3/0241—Drop counters; Drop formers
- B01L3/0268—Drop counters; Drop formers using pulse dispensing or spraying, eg. inkjet type, piezo actuated ejection of droplets from capillaries
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L13/00—Implements for cleaning floors, carpets, furniture, walls, or wall coverings
- A47L13/10—Scrubbing; Scouring; Cleaning; Polishing
- A47L13/50—Auxiliary implements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
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- B01L2400/04—Moving fluids with specific forces or mechanical means
- B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
- G01N2035/1027—General features of the devices
- G01N2035/1034—Transferring microquantities of liquid
- G01N2035/1041—Ink-jet like dispensers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
- G01N35/1009—Characterised by arrangements for controlling the aspiration or dispense of liquids
- G01N35/1016—Control of the volume dispensed or introduced
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004083961 | 2004-03-23 | ||
JP2004083961A JP4748503B2 (ja) | 2004-03-23 | 2004-03-23 | 処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1674217A true CN1674217A (zh) | 2005-09-28 |
CN100350556C CN100350556C (zh) | 2007-11-21 |
Family
ID=34858388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100517606A Expired - Fee Related CN100350556C (zh) | 2004-03-23 | 2005-03-01 | 处理装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7527692B2 (zh) |
EP (1) | EP1579926B1 (zh) |
JP (1) | JP4748503B2 (zh) |
KR (1) | KR100666409B1 (zh) |
CN (1) | CN100350556C (zh) |
TW (1) | TWI259543B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101396689B (zh) * | 2007-09-29 | 2011-03-02 | 比亚迪股份有限公司 | 一种三维涂胶系统和方法 |
CN101558480B (zh) * | 2006-11-30 | 2011-08-03 | 东京毅力科创株式会社 | 半导体器件制造装置和半导体器件制造方法 |
CN103464334A (zh) * | 2013-09-27 | 2013-12-25 | 如皋市易达电子有限责任公司 | 粘胶机 |
CN113543892A (zh) * | 2019-01-21 | 2021-10-22 | 诺信公司 | 用于分配器控制的系统和方法 |
CN113631280A (zh) * | 2019-07-12 | 2021-11-09 | 株式会社沃克斯 | 电子零部件粘接用喷嘴 |
TWI758699B (zh) * | 2019-04-17 | 2022-03-21 | 日商車樂美縫衣機工業股份有限公司 | 塗佈裝置 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070097162A1 (en) * | 2003-08-08 | 2007-05-03 | Konica Minolta Holdings, Inc. | Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board |
JP4489524B2 (ja) * | 2004-07-23 | 2010-06-23 | 株式会社ルネサステクノロジ | 半導体装置の製造方法およびペースト塗布装置 |
JP4400541B2 (ja) * | 2005-10-04 | 2010-01-20 | セイコーエプソン株式会社 | パターン形成方法及び液滴吐出装置 |
FR2904872B1 (fr) * | 2006-08-09 | 2008-10-10 | Neuroservice Sarl | Appareil pour la mesure des variations de potentiel membranaire extracellulaire au moyen de microelectrodes |
US7576000B2 (en) * | 2006-12-22 | 2009-08-18 | Palo Alto Research Center Incorporated | Molded dielectric layer in print-patterned electronic circuits |
US9156054B2 (en) | 2007-05-18 | 2015-10-13 | Musashi Engineering, Inc. | Method and apparatus for discharging liquid material |
US8073798B2 (en) * | 2007-05-24 | 2011-12-06 | Palo Alto Research Center Incorporated | Dynamic domain abstraction through meta-analysis |
US9602777B2 (en) | 2008-04-25 | 2017-03-21 | Roche Diagnostics Hematology, Inc. | Systems and methods for analyzing body fluids |
US9017610B2 (en) | 2008-04-25 | 2015-04-28 | Roche Diagnostics Hematology, Inc. | Method of determining a complete blood count and a white blood cell differential count |
JP5413826B2 (ja) * | 2009-02-17 | 2014-02-12 | 株式会社マイクロジェット | 吐出装置 |
JP5544462B2 (ja) * | 2009-04-15 | 2014-07-09 | 株式会社マイクロジェット | 吐出装置 |
WO2012078425A1 (en) * | 2010-12-07 | 2012-06-14 | University Of Florida Research Foundation, Inc. | Spraying system and methods of use thereof |
TWI573629B (zh) * | 2011-03-01 | 2017-03-11 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
KR101803008B1 (ko) * | 2011-05-04 | 2017-11-30 | 삼성디스플레이 주식회사 | 기판 처리 장치 및 그 동작 방법 |
CA2842685A1 (en) * | 2011-07-22 | 2013-01-31 | Roche Diagnostics Hematology, Inc. | Sample applicator sensing and positioning |
CN104541146B (zh) | 2012-07-13 | 2017-12-19 | 罗氏血液诊断股份有限公司 | 基片上的样品受控分配 |
CA2937084A1 (en) | 2014-01-17 | 2015-07-23 | William Eugene Campbell | Methods and systems for slide processing |
EP3020550B1 (de) * | 2014-11-13 | 2018-03-07 | multec GmbH | Druckkopf und extruderdüse für 3d-druck |
US10759188B2 (en) * | 2017-04-24 | 2020-09-01 | Xerox Corporation | System for providing multiple surface treatments to three-dimensional objects prior to printing |
JP7451972B2 (ja) * | 2019-11-29 | 2024-03-19 | 株式会社リコー | 液吐出ユニット、液吐出装置および液吐出方法 |
US20230014003A1 (en) * | 2019-12-20 | 2023-01-19 | Hewlett-Packard Development Company, L.P. | Integrated fluid ejection and imaging |
Family Cites Families (18)
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US4746935A (en) * | 1985-11-22 | 1988-05-24 | Hewlett-Packard Company | Multitone ink jet printer and method of operation |
US5412410A (en) * | 1993-01-04 | 1995-05-02 | Xerox Corporation | Ink jet printhead for continuous tone and text printing |
JPH11285661A (ja) | 1998-04-02 | 1999-10-19 | Toray Ind Inc | 塗装装置および塗装方法 |
JP2000006423A (ja) * | 1998-06-19 | 2000-01-11 | Sony Corp | インクジェット記録用ヘッドの製造方法 |
JP2000089019A (ja) * | 1998-09-10 | 2000-03-31 | Canon Inc | カラーフィルタとその製造方法、該カラーフィルタを用いた液晶素子 |
US6474573B1 (en) * | 1998-12-31 | 2002-11-05 | Charge Injection Technologies, Inc. | Electrostatic atomizers |
TWI264963B (en) * | 2001-03-29 | 2006-10-21 | Hitachi Ltd | Organic EL display and production device of color filter |
US20030029379A1 (en) * | 2001-07-11 | 2003-02-13 | Fuji Photo Film Co., Ltd. | Electrostatic coating device and electrostatic coating method |
EP1453600A1 (en) * | 2001-08-10 | 2004-09-08 | Oxford Genome Sciences (UK) Limited | Liquid delivery apparatus and method |
JP3808741B2 (ja) | 2001-10-01 | 2006-08-16 | 東京エレクトロン株式会社 | 処理装置 |
JP4612255B2 (ja) * | 2001-10-19 | 2011-01-12 | セイコーエプソン株式会社 | ヘッドユニットおよび電子機器、並びに液晶表示装置の製造方法、有機el装置の製造方法、電子放出装置の製造方法、pdp装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機elの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
JP3975272B2 (ja) | 2002-02-21 | 2007-09-12 | 独立行政法人産業技術総合研究所 | 超微細流体ジェット装置 |
JP2003318133A (ja) * | 2002-04-22 | 2003-11-07 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、半導体チップの実装構造、半導体装置、発光装置、電気光学装置、電子機器、並びに非接触型カード媒体 |
US7008209B2 (en) * | 2002-07-03 | 2006-03-07 | Therics, Llc | Apparatus, systems and methods for use in three-dimensional printing |
EP1548448A4 (en) * | 2002-09-27 | 2009-11-11 | Shimadzu Corp | FLUORITY SPORTS METHOD AND DEVICE |
KR100700176B1 (ko) * | 2002-12-18 | 2007-03-27 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널의 디스펜서 및 이를 이용한 노즐과 기판의갭 제어방법 |
JP4311050B2 (ja) * | 2003-03-18 | 2009-08-12 | セイコーエプソン株式会社 | 機能液滴吐出ヘッドの駆動制御方法および機能液滴吐出装置 |
US7393081B2 (en) * | 2003-06-30 | 2008-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Droplet jetting device and method of manufacturing pattern |
-
2004
- 2004-03-23 JP JP2004083961A patent/JP4748503B2/ja not_active Expired - Lifetime
-
2005
- 2005-01-19 TW TW094101507A patent/TWI259543B/zh not_active IP Right Cessation
- 2005-03-01 CN CNB2005100517606A patent/CN100350556C/zh not_active Expired - Fee Related
- 2005-03-09 KR KR1020050019431A patent/KR100666409B1/ko active IP Right Grant
- 2005-03-17 EP EP05005890A patent/EP1579926B1/en not_active Expired - Fee Related
- 2005-03-22 US US11/086,969 patent/US7527692B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101558480B (zh) * | 2006-11-30 | 2011-08-03 | 东京毅力科创株式会社 | 半导体器件制造装置和半导体器件制造方法 |
CN101396689B (zh) * | 2007-09-29 | 2011-03-02 | 比亚迪股份有限公司 | 一种三维涂胶系统和方法 |
CN103464334A (zh) * | 2013-09-27 | 2013-12-25 | 如皋市易达电子有限责任公司 | 粘胶机 |
CN113543892A (zh) * | 2019-01-21 | 2021-10-22 | 诺信公司 | 用于分配器控制的系统和方法 |
US11975351B2 (en) | 2019-01-21 | 2024-05-07 | Nordson Corporation | System and method for dispenser control |
TWI758699B (zh) * | 2019-04-17 | 2022-03-21 | 日商車樂美縫衣機工業股份有限公司 | 塗佈裝置 |
CN113631280A (zh) * | 2019-07-12 | 2021-11-09 | 株式会社沃克斯 | 电子零部件粘接用喷嘴 |
Also Published As
Publication number | Publication date |
---|---|
TWI259543B (en) | 2006-08-01 |
US7527692B2 (en) | 2009-05-05 |
JP2005274177A (ja) | 2005-10-06 |
CN100350556C (zh) | 2007-11-21 |
KR20060043551A (ko) | 2006-05-15 |
JP4748503B2 (ja) | 2011-08-17 |
KR100666409B1 (ko) | 2007-01-10 |
EP1579926A2 (en) | 2005-09-28 |
EP1579926A3 (en) | 2009-06-03 |
US20050212837A1 (en) | 2005-09-29 |
TW200532820A (en) | 2005-10-01 |
EP1579926B1 (en) | 2012-02-01 |
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