CN1652318A - 批量晶片可靠性评价装置及批量晶片可靠性评价方法 - Google Patents
批量晶片可靠性评价装置及批量晶片可靠性评价方法 Download PDFInfo
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- CN1652318A CN1652318A CNA2005100064521A CN200510006452A CN1652318A CN 1652318 A CN1652318 A CN 1652318A CN A2005100064521 A CNA2005100064521 A CN A2005100064521A CN 200510006452 A CN200510006452 A CN 200510006452A CN 1652318 A CN1652318 A CN 1652318A
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- wafer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/0616—Random array, i.e. array with no symmetry
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004025965 | 2004-02-02 | ||
JP2004025965 | 2004-02-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1652318A true CN1652318A (zh) | 2005-08-10 |
CN100386858C CN100386858C (zh) | 2008-05-07 |
Family
ID=34805820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100064521A Active CN100386858C (zh) | 2004-02-02 | 2005-02-01 | 批量晶片可靠性评价装置及批量晶片可靠性评价方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7187002B2 (zh) |
CN (1) | CN100386858C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102565652A (zh) * | 2010-12-30 | 2012-07-11 | 展晶科技(深圳)有限公司 | 发光二极管封装结构检测装置及检测方法 |
CN106896842A (zh) * | 2015-11-13 | 2017-06-27 | 鸿劲科技股份有限公司 | 电子元件接合装置的温控机构、方法及其应用的测试设备 |
CN106909186A (zh) * | 2015-10-16 | 2017-06-30 | 鸿劲科技股份有限公司 | 测试设备接合器的温控装置及其温控方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090106407A (ko) * | 2007-02-01 | 2009-10-08 | 후지쯔 가부시끼가이샤 | 모니터 번인 시험 장치 및 모니터 번인 시험 방법 |
CN102043329A (zh) * | 2009-10-16 | 2011-05-04 | 联华电子股份有限公司 | 整合式光刻机台及光刻工艺 |
CN102338846B (zh) * | 2010-07-22 | 2013-08-14 | 中国科学院微电子研究所 | 一种GaN基HEMT器件的可靠性评估方法 |
US20130008602A1 (en) * | 2011-07-07 | 2013-01-10 | Lam Research Ag | Apparatus for treating a wafer-shaped article |
CN102508143A (zh) * | 2011-10-26 | 2012-06-20 | 常州天合光能有限公司 | 一种光伏组件的可靠性测试方法 |
CN103824839B (zh) * | 2012-11-16 | 2016-06-29 | 中芯国际集成电路制造(上海)有限公司 | 集成电路中可靠性分析的测试结构及其测试方法 |
US10295591B2 (en) * | 2013-01-02 | 2019-05-21 | Texas Instruments Incorporated | Method and device for testing wafers |
US9460771B2 (en) | 2014-09-25 | 2016-10-04 | Kilopass Technology, Inc. | Two-transistor thyristor SRAM circuit and methods of operation |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57102009A (en) | 1980-12-17 | 1982-06-24 | Nec Corp | Semiconductor device |
JPH06151537A (ja) | 1992-10-30 | 1994-05-31 | Toshiba Corp | 配線寿命の評価方法 |
JPH11126807A (ja) | 1997-10-23 | 1999-05-11 | Matsushita Electric Ind Co Ltd | 半導体集積回路の検査方法 |
JPH11150166A (ja) | 1997-11-17 | 1999-06-02 | Orion Mach Co Ltd | 半導体ウェーハの温度調節プレート |
JP3500299B2 (ja) | 1998-03-06 | 2004-02-23 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
US20030112025A1 (en) * | 2001-12-13 | 2003-06-19 | Harold E. Hamilton | Temperature control system for burn-in boards |
-
2005
- 2005-01-12 US US11/033,390 patent/US7187002B2/en active Active
- 2005-02-01 CN CNB2005100064521A patent/CN100386858C/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102565652A (zh) * | 2010-12-30 | 2012-07-11 | 展晶科技(深圳)有限公司 | 发光二极管封装结构检测装置及检测方法 |
CN106909186A (zh) * | 2015-10-16 | 2017-06-30 | 鸿劲科技股份有限公司 | 测试设备接合器的温控装置及其温控方法 |
CN106896842A (zh) * | 2015-11-13 | 2017-06-27 | 鸿劲科技股份有限公司 | 电子元件接合装置的温控机构、方法及其应用的测试设备 |
Also Published As
Publication number | Publication date |
---|---|
US20050167783A1 (en) | 2005-08-04 |
US7187002B2 (en) | 2007-03-06 |
CN100386858C (zh) | 2008-05-07 |
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Owner name: INTELLECTUAL PROPERTY BRIDGE NO. 1 CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20140605 |
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Address after: Osaka Japan Patentee after: Matsushita Electric Industrial Co.,Ltd. Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co.,Ltd. |
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Effective date of registration: 20140605 Address after: Tokyo, Japan Patentee after: Godo Kaisha IP Bridge 1 Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co.,Ltd. |