JP2021086915A - 載置台、及び、検査装置 - Google Patents
載置台、及び、検査装置 Download PDFInfo
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- JP2021086915A JP2021086915A JP2019214675A JP2019214675A JP2021086915A JP 2021086915 A JP2021086915 A JP 2021086915A JP 2019214675 A JP2019214675 A JP 2019214675A JP 2019214675 A JP2019214675 A JP 2019214675A JP 2021086915 A JP2021086915 A JP 2021086915A
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- 238000007689 inspection Methods 0.000 title claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 239000000523 sample Substances 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 17
- 239000003507 refrigerant Substances 0.000 claims description 48
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 15
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000005498 polishing Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 description 26
- 238000012546 transfer Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000004088 simulation Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
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- 239000006185 dispersion Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/44—Modifications of instruments for temperature compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
Abstract
Description
図1から図3を参照して、検査装置1について説明する。図1は、検査装置1の構成例を示す図である。図2は、図1の検査装置1の平面図である。図3は、図1の検査装置1のウェハ搬送機構の構成例を示す図である。
110 ベースプレート
120、220 ミドルプレート
130 LEDモジュール
130A LED
135 レンズ
150 ガラス板
160、260 トッププレート
160A 載置面
163 真空チャック
195 黒色コーティング
Claims (7)
- 検査装置のプローブカードの接触端子が荷重を掛けて押し付けられる電子デバイスを有する被検査体が載置される載置台であって、
第1の冷媒流路が形成された第1の冷却プレートと、
前記第1の冷却プレートに搭載され、前記被検査体を加熱する加熱源と、
前記加熱源の上に設けられ、前記加熱源が出力する光を透過する透過部材と、
前記透過部材の上に設けられ、前記被検査体を真空吸着する載置面と、第2の冷媒流路とを有する第2の冷却プレートであって、セラミックスで構成され、前記載置面に鏡面研磨加工が施された第2の冷却プレートと、
を含む、載置台。 - 前記第2の冷却プレートの前記被検査体を真空吸着する載置面の最大高さRmaxは、0.025μm〜0.2μmである、請求項1に記載の載置台。
- 前記第2の冷却プレートの厚さは、3mm〜10mmである、請求項1又は2に記載の載置台。
- 前記第2の冷媒流路は、前記第2の冷却プレートの下面又は内部に形成されている、請求項1乃至3のいずれか一項に記載の載置台。
- 前記第2の冷却プレートを構成するセラミックスは、炭化珪素製、炭化珪素と珪素の複合材料製、又は、窒化アルミニウム製である、請求項1乃至4のいずれか一項に記載の載置台。
- 前記第2の冷却プレートの下面に設けられる吸熱膜をさらに含む、請求項1乃至5のいずれか一項に記載の載置台。
- 被検査体にプローブカードの接触端子を荷重を掛けて押し付けて、前記被検査体の電子デバイスを検査する検査装置であって、
前記被検査体が載置される載置台を含み、
前記載置台は、
第1の冷媒流路が形成された第1の冷却プレートと、
前記第1の冷却プレートに搭載され、前記被検査体を加熱する加熱源と、
前記加熱源の上に設けられ、前記加熱源が出力する光を透過する透過部材と、
前記透過部材の上に設けられ、前記被検査体を真空吸着する載置面と、第2の冷媒流路とを有する第2の冷却プレートであって、セラミックスで構成され、前記載置面に鏡面研磨加工が施された第2の冷却プレートと、
を有する、検査装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019214675A JP7353150B2 (ja) | 2019-11-27 | 2019-11-27 | 載置台、及び、検査装置 |
KR1020200153577A KR102571606B1 (ko) | 2019-11-27 | 2020-11-17 | 적재대 및 검사 장치 |
EP20208444.8A EP3828563A1 (en) | 2019-11-27 | 2020-11-18 | Polished temperature-controlled stage |
TW109140228A TW202138812A (zh) | 2019-11-27 | 2020-11-18 | 載置台及檢查裝置 |
CN202011306861.4A CN112864074A (zh) | 2019-11-27 | 2020-11-20 | 载置台和检查装置 |
US16/953,814 US20210156890A1 (en) | 2019-11-27 | 2020-11-20 | Stage and inspection apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019214675A JP7353150B2 (ja) | 2019-11-27 | 2019-11-27 | 載置台、及び、検査装置 |
Publications (2)
Publication Number | Publication Date |
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JP2021086915A true JP2021086915A (ja) | 2021-06-03 |
JP7353150B2 JP7353150B2 (ja) | 2023-09-29 |
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JP2019214675A Active JP7353150B2 (ja) | 2019-11-27 | 2019-11-27 | 載置台、及び、検査装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210156890A1 (ja) |
EP (1) | EP3828563A1 (ja) |
JP (1) | JP7353150B2 (ja) |
KR (1) | KR102571606B1 (ja) |
CN (1) | CN112864074A (ja) |
TW (1) | TW202138812A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111223786B (zh) * | 2018-11-27 | 2023-10-27 | 东京毅力科创株式会社 | 检查装置系统 |
JP7398935B2 (ja) * | 2019-11-25 | 2023-12-15 | 東京エレクトロン株式会社 | 載置台、及び、検査装置 |
US11262401B2 (en) * | 2020-04-22 | 2022-03-01 | Mpi Corporation | Wafer probe station |
JP7474678B2 (ja) * | 2020-10-28 | 2024-04-25 | 東京エレクトロン株式会社 | 載置台、検査装置及び検査方法 |
CN114361093B (zh) * | 2022-03-11 | 2022-05-27 | 立川(深圳)智能科技设备有限公司 | 一种晶圆上下料及预定位装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007227441A (ja) * | 2006-02-21 | 2007-09-06 | Sumitomo Electric Ind Ltd | ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ |
JP2011124466A (ja) * | 2009-12-14 | 2011-06-23 | Sumitomo Electric Ind Ltd | ウェハ保持体およびそれを搭載したウェハプローバ |
JP2018151369A (ja) * | 2016-11-29 | 2018-09-27 | 東京エレクトロン株式会社 | 載置台及び電子デバイス検査装置 |
JP2019106491A (ja) * | 2017-12-13 | 2019-06-27 | 東京エレクトロン株式会社 | 検査装置 |
CN109983350A (zh) * | 2016-11-29 | 2019-07-05 | 东京毅力科创株式会社 | 载置台和电子器件测试装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06112302A (ja) * | 1992-09-25 | 1994-04-22 | Kobe Steel Ltd | プラズマ処理装置及びその取扱方法 |
JP2001267403A (ja) * | 2000-03-21 | 2001-09-28 | Nhk Spring Co Ltd | 半導体ウェハの加熱/冷却装置 |
JP4344835B2 (ja) * | 2002-10-24 | 2009-10-14 | 東京エレクトロン株式会社 | 枚葉式の処理装置 |
JP4049172B2 (ja) * | 2005-07-13 | 2008-02-20 | 住友電気工業株式会社 | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ |
US20090045829A1 (en) * | 2005-08-04 | 2009-02-19 | Sumitomo Electric Industries, Ltd. | Wafer holder for wafer prober and wafer prober equipped with same |
JP2007042908A (ja) * | 2005-08-04 | 2007-02-15 | Sumitomo Electric Ind Ltd | ウェハ保持体およびそれを搭載したウェハプローバ |
JP4950688B2 (ja) | 2006-03-13 | 2012-06-13 | 東京エレクトロン株式会社 | 載置装置 |
JP6003060B2 (ja) * | 2012-01-06 | 2016-10-05 | 住友電気工業株式会社 | ウエハプローバ用ウエハ保持体 |
US20180061684A1 (en) * | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Optical heating of light absorbing objects in substrate support |
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2019
- 2019-11-27 JP JP2019214675A patent/JP7353150B2/ja active Active
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2020
- 2020-11-17 KR KR1020200153577A patent/KR102571606B1/ko active IP Right Grant
- 2020-11-18 TW TW109140228A patent/TW202138812A/zh unknown
- 2020-11-18 EP EP20208444.8A patent/EP3828563A1/en active Pending
- 2020-11-20 CN CN202011306861.4A patent/CN112864074A/zh active Pending
- 2020-11-20 US US16/953,814 patent/US20210156890A1/en not_active Abandoned
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007227441A (ja) * | 2006-02-21 | 2007-09-06 | Sumitomo Electric Ind Ltd | ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ |
JP2011124466A (ja) * | 2009-12-14 | 2011-06-23 | Sumitomo Electric Ind Ltd | ウェハ保持体およびそれを搭載したウェハプローバ |
JP2018151369A (ja) * | 2016-11-29 | 2018-09-27 | 東京エレクトロン株式会社 | 載置台及び電子デバイス検査装置 |
CN109983350A (zh) * | 2016-11-29 | 2019-07-05 | 东京毅力科创株式会社 | 载置台和电子器件测试装置 |
JP2019106491A (ja) * | 2017-12-13 | 2019-06-27 | 東京エレクトロン株式会社 | 検査装置 |
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US20210156890A1 (en) | 2021-05-27 |
KR20210065851A (ko) | 2021-06-04 |
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KR102571606B1 (ko) | 2023-08-29 |
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