CN1637109A - 紫外光固化的保护密封剂 - Google Patents
紫外光固化的保护密封剂 Download PDFInfo
- Publication number
- CN1637109A CN1637109A CNA2004101047232A CN200410104723A CN1637109A CN 1637109 A CN1637109 A CN 1637109A CN A2004101047232 A CNA2004101047232 A CN A2004101047232A CN 200410104723 A CN200410104723 A CN 200410104723A CN 1637109 A CN1637109 A CN 1637109A
- Authority
- CN
- China
- Prior art keywords
- sealing compositions
- composition
- sealing
- weight percent
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H10W74/47—
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- H10W74/114—
-
- H10W76/47—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Sealing Material Composition (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/727951 | 2003-12-04 | ||
| US10/727,951 US7479653B2 (en) | 2003-12-04 | 2003-12-04 | UV curable protective encapsulant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1637109A true CN1637109A (zh) | 2005-07-13 |
Family
ID=34465776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004101047232A Pending CN1637109A (zh) | 2003-12-04 | 2004-12-03 | 紫外光固化的保护密封剂 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7479653B2 (enExample) |
| EP (1) | EP1538170A1 (enExample) |
| JP (1) | JP2005217393A (enExample) |
| KR (1) | KR20050054453A (enExample) |
| CN (1) | CN1637109A (enExample) |
| TW (1) | TW200535152A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593381A (zh) * | 2011-12-30 | 2012-07-18 | 友达光电股份有限公司 | 制作可挠式显示装置的方法 |
| CN101713921B (zh) * | 2008-09-30 | 2013-06-05 | 东京应化工业株式会社 | 感光性树脂组合物及密封剂 |
| CN105143045A (zh) * | 2013-04-15 | 2015-12-09 | 3M创新有限公司 | 半透明的密封顶盖 |
| CN107477182A (zh) * | 2013-04-15 | 2017-12-15 | 3M创新有限公司 | 轻质密封顶盖 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8617715B2 (en) * | 2003-12-06 | 2013-12-31 | Cpfilms Inc. | Fire retardant shades |
| US7371335B2 (en) * | 2004-10-21 | 2008-05-13 | E.I. Dupont De Nemours And Company | Curable thick film compositions for use in moisture control |
| JP2009531516A (ja) * | 2006-03-29 | 2009-09-03 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション | 放射線−硬化性ゴム系接着剤/シーラント |
| US20090181242A1 (en) * | 2008-01-11 | 2009-07-16 | Enniss James P | Exterior window film |
| US8999509B2 (en) | 2011-04-27 | 2015-04-07 | Cpfilms Inc. | Weather resistant exterior film composite |
| US9059580B2 (en) | 2011-11-10 | 2015-06-16 | Thomas & Betts International, Llc | Curing system for sealing an electrical fitting |
| US8728568B2 (en) | 2012-01-16 | 2014-05-20 | Itron, Inc. | Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier |
| US8481626B1 (en) * | 2012-01-16 | 2013-07-09 | Itron, Inc. | Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits |
| KR20150016878A (ko) * | 2013-08-05 | 2015-02-13 | 주식회사 엘지화학 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
| FR3068037B1 (fr) * | 2017-06-27 | 2020-09-11 | Valeo Systemes De Controle Moteur | Procede de synthese d'un materiau slicone/polyurethane |
| KR102789243B1 (ko) * | 2018-03-28 | 2025-04-01 | 헨켈 아게 운트 코. 카게아아 | 광경화성 조성물 및 광경화성 조성물을 사용하여 막 표면 상에 지형적 특징부를 형성하는 방법 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3896014A (en) * | 1973-06-14 | 1975-07-22 | Clairol Inc | UV Curable polyene-polythiol-surfactant compositions |
| US4073835A (en) * | 1976-01-30 | 1978-02-14 | Toyo Ink Manufacturing Co., Ltd. | Method of resin encapsulating electrical parts with UV curing of fire retardant resin |
| US4134175A (en) * | 1977-09-01 | 1979-01-16 | Liquid Controls Corporation | Non-rotating bushing |
| US4203792A (en) * | 1977-11-17 | 1980-05-20 | Bell Telephone Laboratories, Incorporated | Method for the fabrication of devices including polymeric materials |
| US4336311A (en) * | 1980-08-25 | 1982-06-22 | Sprague Electric Company | Humidity- and salt-resistant electronic component |
| US4349605A (en) * | 1980-09-09 | 1982-09-14 | National Distillers & Chemical Corp. | Flame retardant radiation curable polymeric compositions |
| EP0053442B2 (en) * | 1980-12-03 | 1993-05-19 | Imperial Chemical Industries Plc | Dental compositions |
| US4390401A (en) * | 1981-02-23 | 1983-06-28 | Celanese Corporation | Acrylate or methacrylate esters of alkylene oxide adducts of alkyl/aryl phenols as wetting agents for ultraviolet curable coating compositions |
| JPS59168033A (ja) | 1983-03-15 | 1984-09-21 | Matsushita Electric Works Ltd | 光硬化性樹脂組成物 |
| US4635356A (en) * | 1984-12-28 | 1987-01-13 | Kabushiki Kaisha Toshiba | Method of manufacturing a circuit module |
| CH665060A5 (en) | 1985-10-16 | 1988-04-15 | Valtronic S A | Electronic module for integrated circuit mounting on PCB - has space provided between rows of connector pins for chips mounted on board through which pins pass |
| DE3702999C2 (de) * | 1987-02-02 | 2003-03-06 | Siemens Ag | Vorrichtung zur Verarbeitung von UV-härtbaren Reaktionsharzmassen und deren Anwendung |
| US4843036A (en) | 1987-06-29 | 1989-06-27 | Eastman Kodak Company | Method for encapsulating electronic devices |
| US5180757A (en) * | 1987-12-16 | 1993-01-19 | Michael Lucey | Photopolymerizable compositions used in electronics |
| US5134175A (en) | 1987-12-16 | 1992-07-28 | Michael Lucey | Curable composition for electrical and electronic components |
| US5017406A (en) | 1988-12-08 | 1991-05-21 | Dow Corning Corporation | UV curable compositions cured with polysilane and peroxide initiators |
| CA2009274A1 (en) | 1989-02-22 | 1990-08-22 | Manuel Buentello Iii | Method for making electronic components using a masking material and a masking material therefor |
| US5098766A (en) * | 1989-03-03 | 1992-03-24 | Ibm Corporation | Encapsulated wire circuit board |
| US5085924A (en) * | 1990-03-23 | 1992-02-04 | General Electric Company | UV-curable pre-crosslinked epoxy functional silicones |
| DE4017941A1 (de) | 1990-06-05 | 1991-12-12 | Univ Schiller Jena | Haertbare zusammensetzung |
| JPH04279089A (ja) | 1990-09-04 | 1992-10-05 | Dow Corning Corp | 加工中の電子デバイスのマスキング方法及び該方法用の紫外線硬化性マスカント |
| US5246979A (en) | 1991-05-31 | 1993-09-21 | Dow Corning Corporation | Heat stable acrylamide polysiloxane composition |
| JPH05218276A (ja) | 1991-11-12 | 1993-08-27 | Motorola Inc | 割れにくい半導体装置およびその作製方法 |
| CA2131358A1 (en) * | 1993-09-02 | 1995-03-03 | Jack S. Treger | Battery tester adhesive and system |
| CH684528A5 (de) | 1994-02-05 | 1994-10-14 | Hans Auer | Verfahren zur Herstellung von bedruckten Smart Cards. |
| DE4434382A1 (de) | 1994-09-16 | 1996-03-21 | Thomas Voges | Verfahren zum Einkapseln oder Versiegeln mit allseitigem hermetischem Abschluß von mikroelektronischen Hybrid-Halbleiterschaltungen |
| DE4435120C2 (de) | 1994-09-30 | 2000-08-03 | Siemens Ag | Schutzschicht für Wafer und Verfahren zu deren Herstellung |
| JP2740943B2 (ja) * | 1994-10-31 | 1998-04-15 | 大日本印刷株式会社 | 耐摩耗性を有する化粧材 |
| DE4444812C1 (de) | 1994-12-15 | 1996-05-15 | Ods Gmbh & Co Kg | Verfahren zum Verkappen eines Chipkartenmoduls und Vorrichtung zum Durchführen des Verfahrens |
| AU1687197A (en) | 1995-12-19 | 1997-07-14 | Midwest Research Institute | Encapsulating material for photovoltaic devices |
| US6034441A (en) * | 1997-11-26 | 2000-03-07 | Lucent Technologies, Inc. | Overcast semiconductor package |
| US6674158B2 (en) | 1998-09-03 | 2004-01-06 | Micron Technology, Inc. | Semiconductor die package having a UV cured polymeric die coating |
| US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
| US6775451B1 (en) * | 1999-12-30 | 2004-08-10 | Corning Incorporated | Secondary coating composition for optical fibers |
| JP2002194039A (ja) * | 2000-10-19 | 2002-07-10 | Toagosei Co Ltd | 光硬化性組成物 |
| DE10054873C2 (de) | 2000-11-06 | 2002-10-17 | Mada Marx Datentechnik Gmbh | Kontaktlose Chipkarte und Verfahren zur Herstellung einer solchen Chipkarte |
| US6553169B2 (en) * | 2000-11-29 | 2003-04-22 | Corning Incorporated | Optical fiber coating compositions and coated optical fibers |
-
2003
- 2003-12-04 US US10/727,951 patent/US7479653B2/en not_active Expired - Fee Related
-
2004
- 2004-11-29 JP JP2004344103A patent/JP2005217393A/ja active Pending
- 2004-11-30 EP EP04028323A patent/EP1538170A1/en not_active Withdrawn
- 2004-12-02 KR KR1020040100281A patent/KR20050054453A/ko not_active Withdrawn
- 2004-12-03 TW TW093137262A patent/TW200535152A/zh unknown
- 2004-12-03 CN CNA2004101047232A patent/CN1637109A/zh active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101713921B (zh) * | 2008-09-30 | 2013-06-05 | 东京应化工业株式会社 | 感光性树脂组合物及密封剂 |
| CN102593381A (zh) * | 2011-12-30 | 2012-07-18 | 友达光电股份有限公司 | 制作可挠式显示装置的方法 |
| CN105143045A (zh) * | 2013-04-15 | 2015-12-09 | 3M创新有限公司 | 半透明的密封顶盖 |
| CN107477182A (zh) * | 2013-04-15 | 2017-12-15 | 3M创新有限公司 | 轻质密封顶盖 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005217393A (ja) | 2005-08-11 |
| KR20050054453A (ko) | 2005-06-10 |
| EP1538170A1 (en) | 2005-06-08 |
| TW200535152A (en) | 2005-11-01 |
| US20050121665A1 (en) | 2005-06-09 |
| US7479653B2 (en) | 2009-01-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |