CN1614052A - 耐热性优良的铜合金及铜合金板的制法 - Google Patents
耐热性优良的铜合金及铜合金板的制法 Download PDFInfo
- Publication number
- CN1614052A CN1614052A CN200410090355.0A CN200410090355A CN1614052A CN 1614052 A CN1614052 A CN 1614052A CN 200410090355 A CN200410090355 A CN 200410090355A CN 1614052 A CN1614052 A CN 1614052A
- Authority
- CN
- China
- Prior art keywords
- copper alloy
- rolling
- cold rolling
- annealing
- final
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005097 cold rolling Methods 0.000 claims abstract description 51
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000005098 hot rolling Methods 0.000 claims abstract description 20
- 238000000137 annealing Methods 0.000 claims description 38
- 239000002245 particle Substances 0.000 claims description 15
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 abstract description 25
- 239000013078 crystal Substances 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 6
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000007669 thermal treatment Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 7
- 239000011701 zinc Substances 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000013507 mapping Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001887 electron backscatter diffraction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Conductive Materials (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003376122 | 2003-11-05 | ||
| JP2003376122A JP4041452B2 (ja) | 2003-11-05 | 2003-11-05 | 耐熱性に優れた銅合金の製法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1614052A true CN1614052A (zh) | 2005-05-11 |
Family
ID=34544313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200410090355.0A Pending CN1614052A (zh) | 2003-11-05 | 2004-11-04 | 耐热性优良的铜合金及铜合金板的制法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20050092404A1 (de) |
| JP (1) | JP4041452B2 (de) |
| KR (1) | KR20050043655A (de) |
| CN (1) | CN1614052A (de) |
| DE (1) | DE102004053346B4 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4441467B2 (ja) * | 2004-12-24 | 2010-03-31 | 株式会社神戸製鋼所 | 曲げ加工性及び耐応力緩和特性を備えた銅合金 |
| CN101693960B (zh) * | 2005-06-08 | 2011-09-07 | 株式会社神户制钢所 | 铜合金、铜合金板及其制造方法 |
| CN101180412B (zh) | 2005-07-07 | 2010-05-19 | 株式会社神户制钢所 | 具备高强度和优异的弯曲加工性的铜合金及铜合金板的制造方法 |
| EP2426225B1 (de) | 2006-05-26 | 2015-12-02 | Kabushiki Kaisha Kobe Seiko Sho | Kupferlegierung mit hoher Festigkeit, hoher elektrischer Leitfähigkeit und herausragender Biegbarkeit |
| WO2008010378A1 (en) | 2006-07-21 | 2008-01-24 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheets for electrical/electronic part |
| JP4950584B2 (ja) | 2006-07-28 | 2012-06-13 | 株式会社神戸製鋼所 | 高強度および耐熱性を備えた銅合金 |
| EP2088214B1 (de) | 2006-10-02 | 2011-08-03 | Kabushiki Kaisha Kobe Seiko Sho | Kupferlegierungsplatte für elektrische und elektronische bauteile |
| KR101227315B1 (ko) | 2007-08-07 | 2013-01-28 | 가부시키가이샤 고베 세이코쇼 | 구리 합금판 |
| JP4630323B2 (ja) | 2007-10-23 | 2011-02-09 | 株式会社コベルコ マテリアル銅管 | 破壊強度に優れた熱交換器用銅合金管 |
| JP2009179864A (ja) * | 2008-01-31 | 2009-08-13 | Kobe Steel Ltd | 耐応力緩和特性に優れた銅合金板 |
| JP5312920B2 (ja) * | 2008-11-28 | 2013-10-09 | Ｊｘ日鉱日石金属株式会社 | 電子材料用銅合金板又は条 |
| JP5436349B2 (ja) * | 2010-01-30 | 2014-03-05 | 三菱伸銅株式会社 | Ｌｅｄチップとリードフレームとの接合方法 |
| JP5525369B2 (ja) * | 2010-03-11 | 2014-06-18 | 三菱伸銅株式会社 | 樹脂密着性に優れた電子機器用Ｃｕ−Ｆｅ−Ｐ系銅合金条材 |
| JP4608025B1 (ja) * | 2010-06-03 | 2011-01-05 | 三菱伸銅株式会社 | 放熱性及び樹脂密着性に優れた電子機器用銅合金条材 |
| JP5690170B2 (ja) * | 2011-02-25 | 2015-03-25 | 株式会社神戸製鋼所 | 銅合金 |
| EP3128036B1 (de) * | 2014-03-31 | 2020-07-01 | Furukawa Electric Co. Ltd. | Gewalzte kupferfolie, verfahren zur herstellung einer gewalzten kupferfolie, flexibles flachkabel und verfahren zur herstellung eines flachkabels |
| JP6172368B1 (ja) | 2016-11-07 | 2017-08-02 | 住友電気工業株式会社 | 被覆電線、端子付き電線、銅合金線、及び銅合金撚線 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3522112A (en) * | 1967-06-26 | 1970-07-28 | Olin Corp | Process for treating copper base alloy |
| JP4329967B2 (ja) * | 2000-04-28 | 2009-09-09 | 古河電気工業株式会社 | プラスチック基板に設けられるピングリッドアレイ用ｉｃリードピンに適した銅合金線材 |
| JP2002226929A (ja) * | 2001-01-30 | 2002-08-14 | Nippon Mining & Metals Co Ltd | 高周波回路用銅合金箔 |
| JP3798260B2 (ja) * | 2001-05-17 | 2006-07-19 | 株式会社神戸製鋼所 | 電気電子部品用銅合金及び電気電子部品 |
| JP3962291B2 (ja) * | 2001-07-17 | 2007-08-22 | 日鉱金属株式会社 | 銅張積層板用圧延銅箔およびその製造方法 |
-
2003
- 2003-11-05 JP JP2003376122A patent/JP4041452B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-01 US US10/976,818 patent/US20050092404A1/en not_active Abandoned
- 2004-11-04 DE DE102004053346.6A patent/DE102004053346B4/de not_active Expired - Fee Related
- 2004-11-04 KR KR1020040089127A patent/KR20050043655A/ko active Search and Examination
- 2004-11-04 CN CN200410090355.0A patent/CN1614052A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005139501A (ja) | 2005-06-02 |
| DE102004053346B4 (de) | 2017-12-28 |
| JP4041452B2 (ja) | 2008-01-30 |
| DE102004053346A1 (de) | 2005-07-21 |
| US20050092404A1 (en) | 2005-05-05 |
| KR20050043655A (ko) | 2005-05-11 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |